JPH04172189A - Lead composite copper plate and its manufacture - Google Patents
Lead composite copper plate and its manufactureInfo
- Publication number
- JPH04172189A JPH04172189A JP30032690A JP30032690A JPH04172189A JP H04172189 A JPH04172189 A JP H04172189A JP 30032690 A JP30032690 A JP 30032690A JP 30032690 A JP30032690 A JP 30032690A JP H04172189 A JPH04172189 A JP H04172189A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- copper plate
- plate
- layer
- composite layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 45
- 239000010949 copper Substances 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005096 rolling process Methods 0.000 claims abstract description 14
- 238000005304 joining Methods 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 33
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 7
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 20
- 238000011282 treatment Methods 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- 235000002639 sodium chloride Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- FZUJWWOKDIGOKH-UHFFFAOYSA-N sulfuric acid hydrochloride Chemical compound Cl.OS(O)(=O)=O FZUJWWOKDIGOKH-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野］
本発明は、海塩粒子や酸性雨等への耐候性に特に優れる
鉛と耐食性等に優れる鋼との複合板であり、屋根や壁な
どの各種建築用部材等に利用される。[Detailed Description of the Invention] (Industrial Application Field) The present invention is a composite plate of lead, which has particularly excellent weather resistance against sea salt particles and acid rain, and steel, which has excellent corrosion resistance. Used for various construction materials, etc.
（従来の技術λ
銅板と鉛板を複合した技術としては本願出願人において
、平成２年特許願第２０５，８０６号の「鉛複合銅板と
その製造方法」なる先願発明を有するものであり、該発
明ではめっき処理としてニッケル系めっき処理と鉛系め
っき処理を必須要件とするものであるか、追試の段階で
ニッケル系めっき処理を省いたものでも、サンプル評価
試験の結果が良好なものが続出することとなり、銅板に
対する鉛複合技術の見直しが要望された。(Prior art λ As for the technology of combining a copper plate and a lead plate, the present applicant has a prior invention called “Lead Composite Copper Plate and Method for Manufacturing the Same” in Patent Application No. 205,806 of 1990. Either the invention requires nickel-based plating and lead-based plating as plating treatments, or even if the nickel-based plating is omitted at the supplementary testing stage, the results of sample evaluation tests are increasing. Therefore, a review of the lead composite technology for copper plates was requested.
（発明が解決しようとする課題〉
本発明は上記事情により、工程を短縮して銅板に対して
鉛板を強固に接合被覆する鉛複合銅板とその製造方法を
提供するものである。(Problems to be Solved by the Invention) In view of the above circumstances, the present invention provides a lead composite copper plate and a method for manufacturing the same, in which a lead plate is firmly bonded and coated on a copper plate by shortening the process.
（課題を解決するための手段）
第１の発明は銅板の少なくとも一面に鉛系めっき層を介
在して鉛板を圧延接合して成るものである。(Means for Solving the Problems) The first invention is made by rolling and joining lead plates with a lead-based plating layer interposed on at least one surface of the copper plate.
第２の発明の鉛複合銅板の製造方法は銅板の少なくとも
一面に鉛めっき処理及び鉛−錫合金めっき処理のうち、
−のめっき処理を施す第１工程と該めっき層上に鉛板を
圧延被覆する第２工程力）ら成るものである。The method for producing a lead composite copper plate according to the second invention includes the steps of subjecting at least one surface of the copper plate to a lead plating process and a lead-tin alloy plating process.
- a first step of performing plating treatment; and a second step of rolling and coating a lead plate on the plating layer.
（作 用］
銅板と鉛板間に介在する鉛系めっき層は銅板に対しては
銅板上の安定な酸化膜を除去して密着し、複合する鉛板
に対しては圧延接合の際に界面に絶えず新生面を形成し
て強固に結合する。(Function) The lead-based plating layer interposed between the copper plate and the lead plate removes the stable oxide film on the copper plate and adheres to the copper plate, and the lead-based plating layer that is interposed between the copper plate and the lead plate adheres to the copper plate by removing the stable oxide film on the copper plate. It constantly forms new surfaces and bonds tightly.
（実施例）
本発明の実施例として、第１工程におけるめっき処理【
鉛めっき処理として第２工程の鉛板圧延被覆処理により
鉛複合銅板としたものを「実施例１〜４」とし、第１工
程のめつき処理を鉛−錫合金めっき処理として第２工程
の鉛板圧延被覆処理により鉛複合銅板としたものを「実
施例５〜８」として以下説明する。(Example) As an example of the present invention, plating treatment in the first step [
"Examples 1 to 4" are lead composite copper plates obtained by rolling and covering the lead plate in the second step as lead plating treatment, and lead-tin alloy plating treatment in the first step and lead in the second step. Lead composite copper plates formed by plate rolling coating treatment will be described below as "Examples 5 to 8".
「実施例１〜４」
０、４ Ｍ厚の銅板を４５°０．５％オルソ硅硅酸型電
解脱脂た後、十分水洗し、５０”の塩酸−硫酸中で浸漬
酸洗した後、十分水洗し、下記の第１工程の鉛めっき処
理を施す。"Examples 1 to 4" A 0.4 M thick copper plate was subjected to 45° 0.5% ortho-silicic acid electrolytic degreasing, thoroughly washed with water, immersed in 50" hydrochloric acid-sulfuric acid, pickled, and then thoroughly degreased. Wash with water and perform lead plating in the first step below.
（１）第１工程、鉛めつき処理
温度２５０、電流密度１０ Ｘｒｎ ２ 下でめっき
時間及び該めっき時間に対応するめつき量を別表１に示
すように設定して鉛めっき処理をし、十分水洗後乾燥し
た。なお１ｆＲ板の前処理として、酸洗後の銅板は酸洗
液の残渣が板表面に付着しないように十分水洗いされ、
めっき液に対するぬれ性が確保ざｎていなければならな
い０
（２） 第２工程、鉛板圧延被覆処理２段冷間圧延機
（ロール径３００■）を用い、銅板の鉛めっき層上に厚
さ２．０簡の鋳造鉛板を冷間で、別表１に示すように圧
延荷重を変化させることにより鉛板の圧延率を変化させ
て圧延接合した。(1) First step, lead plating treatment at a temperature of 250 and a current density of 10 It was then dried. As a pretreatment for the 1fR plate, the copper plate after pickling is thoroughly washed with water to prevent the residue of the pickling solution from adhering to the plate surface.
(2) Second step, lead plate rolling coating treatment Using a two-high cold rolling mill (roll diameter 300 mm), the lead plated layer of the copper plate is coated with a thickness of Cast lead plates of 2.0 strips were cold rolled and joined by changing the rolling load and the rolling rate of the lead plates as shown in Attached Table 1.
「実施例５〜８」
０．４簡厚の銅板を４５８０．５％オルソ硅酸ソーダ中
で該銅板を陰極として１０Ａ％ｍ２Ｓ２ 間電解脱脂
した後、十分水洗し、５０°０の塩酸−硫酸中で浸漬酸
洗した後、十分水洗し、下記の第１工程の鉛−錫合金め
っき処理を施す。"Examples 5 to 8" After electrolytically degreasing a 0.4-thick copper plate in 4580.5% sodium orthosilicate with the copper plate as a cathode for 10A% m2S2, it was thoroughly washed with water, and then diluted with 50°0 hydrochloric acid-sulfuric acid. After immersion in pickling, the sample is thoroughly rinsed with water and subjected to the following first step of lead-tin alloy plating treatment.
（１）第１工程、鉛−錫合金めっき処理１０Ａ／／ｄｍ
ｚ下でめっき時間及び該めっき時間に対応するめっき量
を別表１に示すように設定して鉛−錫合金めっき処理を
し、十分水洗後乾燥した。(1) First step, lead-tin alloy plating treatment 10A//dm
Plating time and plating amount corresponding to the plating time were set as shown in Attached Table 1 under Z, and lead-tin alloy plating treatment was carried out, followed by thorough washing with water and drying.
（２）第２工程１鉛板圧延被覆処理
２段冷間圧延機（ロール径３００ｍ）を用い１銅板の鉛
−錫合金めっき層上に厚２２．０１１１１１の鋳造鉛板
を冷間で、圧延荷重を変化させることにより、別表１に
示すように鉛板の圧延率を変化させて圧延接合した。(2) 2nd step 1 Lead plate rolling coating treatment A cast lead plate with a thickness of 22.011111 mm is cold rolled on the lead-tin alloy plating layer of 1 copper plate using a two-stage cold rolling mill (roll diameter 300 m). By changing the load, the rolling ratio of the lead plates was changed as shown in Attached Table 1, and the lead plates were rolled and joined.
このようにして製造された鉛複合銅板は図面に示すよう
に、銅板１と鉛複合層６間に鉛系めっき層２を介在し、
鉛系めっき層２は銅板１に対しては銅板上の安定な酸化
膜を除去して用層し、複合する鉛複合層３に対しては圧
延接合の際に界面に絶えず新生面を形成して強固に結合
し、銅板１と鉛複合層６が十分な接着強度を有して複合
されるものである。As shown in the drawing, the lead composite copper plate manufactured in this way has a lead-based plating layer 2 interposed between the copper plate 1 and the lead composite layer 6,
The lead-based plating layer 2 is applied to the copper plate 1 by removing a stable oxide film on the copper plate, and the lead-based composite layer 3 is formed by continuously forming a new surface at the interface during rolling bonding. The copper plate 1 and the lead composite layer 6 are bonded together firmly and have sufficient adhesive strength.
次に本発明の効果を明らかにするため、銅板に対して鉛
系めっき処理を省略し、実施例に示した酸洗処理のみを
施し、別表１に示す圧延率で鉛板を圧延被覆処理した比
較例１．２を実施したものである。Next, in order to clarify the effects of the present invention, the lead-based plating treatment was omitted for the copper plate, and only the pickling treatment shown in the example was performed, and the lead plate was rolled and coated at the rolling rate shown in Attached Table 1. Comparative Example 1.2 was carried out.
以上のサンプルを、下記の方法で評価した。The above samples were evaluated by the following method.
１）剥離試験
２５ｇｍ幅、長さ１５０噸の鉛複合銅板（以下試験片と
いう。ンを切り出し、１８０°剥離試験で複合層と銅板
の密着力を評価した。1) Peel test A lead composite copper plate (hereinafter referred to as a test piece) with a width of 25 gm and a length of 150 gm was cut out, and the adhesion between the composite layer and the copper plate was evaluated using a 180° peel test.
２）ＯＴ曲げ試験
複合層が外及び内側になるようにＯＴ密着曲げを施し、
複合層と銅板との剥がれ状況を観察した。2) OT bending test Perform OT close bending so that the composite layer is on the outside and inside,
The peeling situation between the composite layer and the copper plate was observed.
６）塩水浸漬試験
０１曲げを施した試験片を、５％食塩水（４０’Ｏ）に
３週間浸漬し、端面での剥離進行状況を観察した。6) Salt water immersion test 01 The bent test piece was immersed in 5% saline (40'O) for 3 weeks, and the progress of peeling at the end surface was observed.
４）冷熱サイクルテスト
５０闘×１５０龍の試験片を、１２０°Ｃの熱シリコン
オイル浴に５分間浸漬後、ブロアーで送風冷却すること
により室温まで冷却して５分間保持する処理を１サイク
ルとし、該サイクルを１５００回まで繰り返し試験し、
端面での剥がｎ１鉛面のブリスター発生の有無、鉛複合
層のクラック発生の有無等を観察した。4) Cold/heat cycle test A test piece of 50×150 dragons was immersed in a hot silicone oil bath at 120°C for 5 minutes, then cooled to room temperature by cooling with a blower, and held for 5 minutes. One cycle consisted of , the cycle was repeated up to 1500 times,
The occurrence of blisters on the peeled n1 lead surface at the end face, the occurrence of cracks in the lead composite layer, etc. were observed.
ざらに、この試験終了後の試験片で１）の剥離試験を実
施した。Roughly speaking, the peel test described in 1) was conducted on the test piece after completing this test.
各サンプルの評価試験結果を別表１に示す。The evaluation test results for each sample are shown in Attached Table 1.
表１中、剥離試験における◎は、密着強度が十分で鉛複
合層自体の破断に至る事を示す。他の０１曲げ試験、塩
水浸漬試験における◎は、試験前に比し何らの異常や劣
化の認めらｎないもの、冷熱サイクル試験における◎は
、冷熱サイクル付与後の剥離試験でも初期と同様に何ら
の異常や劣化の認めらｎないことを示す。×は鉛複合層
の剥離がはっきりと認めらｎたことを示す。In Table 1, ◎ in the peel test indicates that the adhesion strength is sufficient and the lead composite layer itself breaks. In the other 01 bending tests and salt water immersion tests, ◎ indicates that no abnormality or deterioration was observed compared to before the test, and ◎ in the cold/heat cycle test indicates that the peeling test after applying the cold/hot cycle showed no change as in the initial stage. Indicates that no abnormality or deterioration is observed. × indicates that peeling of the lead composite layer was clearly observed.
（発明の効果ン
以上のように本発明は銅板に対する鉛複合層の複合工程
を短縮して省力化するとともに銅板と鉛複合層間に介在
する鉛系めっき層により両者を強固に密着接合し、安価
にして長期にわたって安定した耐火度を保証できる鉛複
合銅板を工業的に提供できる効果がある。(Effects of the Invention) As described above, the present invention shortens the process of forming a lead composite layer on a copper plate to save labor, and also provides a strong and close bond between the copper plate and the lead composite layer by means of a lead-based plating layer interposed between the two, resulting in a low cost. This has the effect of industrially providing a lead composite copper plate that can guarantee stable fire resistance over a long period of time.
図面は本発明に係る鉛複合銅板の部分拡大断面図である
。
図中、１は銅板、２をゴ鉛系めっき層、６は鉛複合層。
釆／
／ン徊販
２１議ｆめっき層
３］遵ｌThe drawing is a partially enlarged sectional view of a lead composite copper plate according to the present invention. In the figure, 1 is a copper plate, 2 is a gopherite plating layer, and 6 is a lead composite layer. Plating layer 3]
Claims (2)
鉛板を圧延接合して成る鉛複合銅板。(1) A lead composite copper plate formed by rolling and joining a lead plate with a lead-based plating layer interposed on at least one surface of the copper plate.
合金めっき処理のうち、一のめっき処理を施す第１工程
と該めっき層上に鉛板を圧延被覆する第２工程から成る
鉛複合銅板の製造方法。(2) A lead composite copper plate consisting of a first step of subjecting at least one surface of the copper plate to one of lead plating and lead-tin alloy plating, and a second step of rolling and coating a lead plate on the plating layer. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30032690A JPH04172189A (en) | 1990-11-05 | 1990-11-05 | Lead composite copper plate and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30032690A JPH04172189A (en) | 1990-11-05 | 1990-11-05 | Lead composite copper plate and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04172189A true JPH04172189A (en) | 1992-06-19 |
| JPH0518672B2 JPH0518672B2 (en) | 1993-03-12 |
Family
ID=17883428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30032690A Granted JPH04172189A (en) | 1990-11-05 | 1990-11-05 | Lead composite copper plate and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04172189A (en) |
-
1990
- 1990-11-05 JP JP30032690A patent/JPH04172189A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0518672B2 (en) | 1993-03-12 |
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