JPH0518671B2 - - Google Patents
Info
- Publication number
- JPH0518671B2 JPH0518671B2 JP30032590A JP30032590A JPH0518671B2 JP H0518671 B2 JPH0518671 B2 JP H0518671B2 JP 30032590 A JP30032590 A JP 30032590A JP 30032590 A JP30032590 A JP 30032590A JP H0518671 B2 JPH0518671 B2 JP H0518671B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- plating
- titanium plate
- plate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 86
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 41
- 239000010936 titanium Substances 0.000 claims description 41
- 229910052719 titanium Inorganic materials 0.000 claims description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000002131 composite material Substances 0.000 claims description 27
- 238000005096 rolling process Methods 0.000 claims description 20
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- 235000002639 sodium chloride Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000013535 sea water Substances 0.000 description 2
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- XWROUVVQGRRRMF-UHFFFAOYSA-N F.O[N+]([O-])=O Chemical compound F.O[N+]([O-])=O XWROUVVQGRRRMF-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 239000012611 container material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、海塩粒子や酸性雨等への耐候性に特
に優れる鉛と海水耐食性等に優れるチタンとの複
合板であり、屋根や壁などの各種建築用部材は勿
論のこと、海水耐食性や各種薬品に対する耐食性
の要求されるタンク、配管、容器材等に利用され
る。Detailed Description of the Invention (Field of Industrial Application) The present invention is a composite board of lead, which has particularly excellent weather resistance against sea salt particles and acid rain, and titanium, which has excellent seawater corrosion resistance. It is used not only for various construction materials such as, but also for tanks, piping, container materials, etc. that require corrosion resistance against seawater and various chemicals.
（従来の技術）
チタン板と鉛板を複合した技術としては本願出
願人において、平成２年特許願第205807号の「鉛
複合チタン板とその製造方法」なる先願発明を有
するものであり、該発明では接合媒介手段として
ニツケル系めつき処理と鉛系めつき処理を必須要
件とするものであるが、追試の段階でニツケル系
めつき処理に代えて銅めつき処理としたもので
も、サンプル評価試験の結果が先願技術と同等の
良好なものとなり、チタン板に対する鉛複合技術
の見直しが要望された。(Prior art) As a technology for combining titanium plates and lead plates, the present applicant has a prior invention entitled "Lead composite titanium plate and manufacturing method thereof" in Patent Application No. 205807 of 1990. Although this invention requires nickel-based plating and lead-based plating as bonding media, even if copper plating is used instead of nickel-based plating at the supplementary testing stage, the sample The results of the evaluation test were as good as the prior technology, and a review of the lead composite technology for titanium plates was requested.
（発明が解決しようとする課題）
本発明は上記事情に鑑み、ニツケル系めつきの
代わりに銅めつきを前処理法としてチタン板に対
して鉛板を強固に接合被覆する鉛複合チタン板と
その製造方法を提供するものである。(Problems to be Solved by the Invention) In view of the above circumstances, the present invention provides a lead composite titanium plate and a lead composite titanium plate in which a lead plate is firmly bonded and coated on a titanium plate using copper plating instead of nickel plating as a pretreatment method. A manufacturing method is provided.
（課題を解決するための手段）
第１の発明はチタン板の少なくとも一面に銅め
つき層と鉛めつき層及び鉛−錫合金めつき層のう
ち、一のめつき層とを介在して鉛板を圧延接合し
て成るものである。(Means for Solving the Problems) The first invention comprises interposing one of a copper plating layer, a lead plating layer and a lead-tin alloy plating layer on at least one surface of a titanium plate. It is made by rolling and joining lead plates.
第２の発明の鉛複合チタン板の製造方法は、チ
タン板の少なくとも一面に銅めつき処理を施す第
１工程と続いて該めつき層上に鉛めつき処理及び
鉛−錫合金めつき処理のうち、一のめつき処理を
施す第２工程と該めつき層上に鉛板を圧延被覆す
る第３工程から成るものである。 The method for producing a lead composite titanium plate according to the second invention includes a first step of subjecting at least one side of the titanium plate to copper plating, and then a lead plating process and a lead-tin alloy plating process on the plating layer. The method consists of a second step in which a plating process is performed and a third step in which a lead plate is rolled and coated on the plating layer.
（作用）
接合媒介手段の一である銅めつき層はチタン板
上の安定な酸化膜を除去してチタン板に密着し、
銅めつき層上にめつき処理される接合媒介手段の
鉛系めつき層は銅めつき層と密着して接合すると
ともに、複合する鉛板に対しては圧延接合の際に
界面に絶えず新生面を形成して強固に結合する。(Function) The copper plating layer, which is one of the bonding mediating means, removes the stable oxide film on the titanium plate and adheres to the titanium plate.
The lead-based plating layer, which is a bonding agent that is plated on the copper plating layer, adheres to the copper plating layer and joins with the copper plating layer, and for composite lead plates, new surfaces are constantly generated at the interface during rolling bonding. to form a strong bond.
（実施例）
本発明の実施例としては、第１工程の銅めつき
処理に続く第２工程におけるめつき処理を鉛めつ
き処理として第３工程の鉛板圧延被覆処理により
鉛複合チタン板としたものを「実施例１〜４」と
し、第１工程の銅めつき処理に続く第２工程にお
けるめつき処理を鉛−錫合金めつき処理として第
３工程の鉛板圧延被覆処理により鉛複合チタン板
としたものを「実施例５〜８」として以下説明す
る。(Example) As an example of the present invention, the plating process in the second process following the copper plating process in the first process is a lead plating process, and the lead plate rolling coating process in the third process produces a lead composite titanium plate. The results are referred to as "Examples 1 to 4", and the plating treatment in the second step following the copper plating treatment in the first step is lead-tin alloy plating treatment, and the lead plate rolling coating treatment in the third step produces a lead composite. The titanium plates will be described below as "Examples 5 to 8".
「実施例 １〜４」
0.4mm厚のチタン板を45℃，５％オルソ硅酸ソ
ーダ中で該チタン板を陰極として10A／dm2，
2″間電解脱脂した後、十分水洗し、50℃の硝酸−
フッ化水素酸中で浸漬酸洗した後、十分水洗し、
下記の第１工程の銅めつき処理を施す。"Examples 1 to 4" A 0.4 mm thick titanium plate was heated at 45°C in 5% sodium orthosilicate at 10 A/dm 2 using the titanium plate as a cathode.
After electrolytically degreasing for 2″, rinse thoroughly with water and soak in nitric acid at 50°C.
After pickling by immersion in hydrofluoric acid, rinse thoroughly with water,
Perform the following first step copper plating treatment.
(1) 第１工程、銅めつき処理
CuSO4・5H2Ｏ 200g／，H2SO4 50g／，
Ｃ-（塩素イオン）20〜80mg／、デキストリ
ン10mg／よりなる浴中で、温度30℃、電流密度
5A／dm2とし、めつき時間及び該めつき時間に
対応するめつき量を別表１に示すように設定して
銅めつき処理をし、十分水洗後、乾燥した。な
お、チタン板の前処理として、酸洗後のチタン板
は酸洗後の残渣が板表面に付着しないように十分
水洗いされ、めつき液に対するぬれ性が確保され
ていなければならない。(1) First step, copper plating treatment CuSO 4・5H 2 O 200g/, H 2 SO 4 50g/,
C - In a bath consisting of 20 to 80 mg/chloride ion and 10 mg/dextrin, at a temperature of 30°C and a current density.
Copper plating was carried out at 5 A/dm 2 and the plating time and the plating amount corresponding to the plating time were set as shown in Attached Table 1, and after thorough washing with water, it was dried. In addition, as a pretreatment of the titanium plate, the titanium plate after pickling must be sufficiently washed with water so that the residue after pickling does not adhere to the plate surface, and wettability with the plating solution must be ensured.
(2) 第２工程、鉛めつき処理
ほうふつ化鉛380g／、ほうふつ化水素酸
45g／、にかわ0.5g／よりなる浴中で、温度
25℃、電流密度10A／dm2下でめつき時間及び該
めつき時間に対応するめつき量を別表１に示すよ
うに設定して鉛めつき処理をし、前記の銅めつき
層上に鉛めつき層を形成する。この第２工程は第
１工程に対して必ずしも連続である必要はない
が、両層の密着性を確保するという観点からは出
来るだけ連続めつき工程とするのが望ましい。ま
た鉛系めつき層は次工程（第３工程）の鉛板との
圧延接合の際に、界面に新生面を形成するための
ものであるが、下層の銅めつき層の厚さに比し、
必要めつき厚はより大であり、そのめつき量は
1g／m2、望ましくは10g／m2以上のめつき量が適
当である。次に、十分水洗いし乾燥した後、第３
工程の鉛板圧延被覆処理を施す。(2) 2nd step, lead plating treatment 380g of lead borofusate/hydroborum acid
In a bath consisting of 45g/glue and 0.5g/glue, the temperature
At 25°C and a current density of 10A/ dm2 , lead plating is performed by setting the plating time and the plating amount corresponding to the plating time as shown in Attached Table 1, and then applying lead on the copper plating layer. Form a plating layer. This second step does not necessarily have to be continuous with the first step, but from the viewpoint of ensuring the adhesion between both layers, it is desirable that the plating step be as continuous as possible. In addition, the lead-based plating layer is used to form a new surface at the interface during rolling joining with the lead plate in the next step (third step), but the thickness of the lead-based plating layer is smaller than that of the copper plating layer below. ,
The required plating thickness is larger, and the amount of plating is
A suitable plating amount is 1 g/m 2 , preferably 10 g/m 2 or more. Next, after thoroughly washing with water and drying, the third
The lead plate is rolled and coated in the process.
(3) 第３工程、鉛板圧延被覆処理
２段冷間圧延機（ロール径300mm）を用い、チ
タン板の鉛めつき層上に厚さ2.0の鋳造鉛板を冷
間で、別表１に示すように圧延荷重を変化させる
ことにより鉛板の圧延率を変化させて圧延接合し
た。(3) Third step, lead plate rolling coating treatment Using a two-stage cold rolling mill (roll diameter 300 mm), cold cast lead plates with a thickness of 2.0 mm are coated on the lead-plated layer of the titanium plate as shown in Attached Table 1. As shown, by changing the rolling load, the rolling ratio of the lead plates was changed to perform rolling joining.
「実施例 ５〜８」
0.4mm厚のチタン板を45℃，５％オルソ硅酸ソ
ーダ中でチタン板を陰極として10A／dm2，2″間
電解脱脂した後、十分水洗し、50℃の硝酸−フッ
化水素酸中で浸漬酸洗した後、十分水洗し、下記
の第１工程の銅めつき処理を施す。"Examples 5 to 8" A 0.4 mm thick titanium plate was electrolytically degreased at 45°C in 5% sodium orthosilicate at 10 A/dm 2 for 2 inches using the titanium plate as a cathode, then thoroughly washed with water, and then heated at 50°C. After pickling by immersion in nitric acid-hydrofluoric acid, it is thoroughly washed with water and subjected to the copper plating treatment of the first step below.
(1) 第１工程、銅めつき処理
前記の第１工程に示した条件で同様の銅めつき
処理をした後、十分水洗して乾燥した。なお、め
つき時間及び該めつき時間に対応するめつき量は
別表１に示すとおりである。(1) First step, copper plating treatment After performing the same copper plating treatment under the conditions shown in the first step above, it was thoroughly washed with water and dried. The plating time and the plating amount corresponding to the plating time are shown in Attached Table 1.
(2) 第２工程、鉛−錫合金めつき処理
ほうふつ化鉛380g／、ほうふつ化錫30g／
、ほうふつ化水素酸45g／にかわ0.5g／、
よりなる浴中で、温度25℃、電流密度10A／dm2
下めつき時間及び該めつき時間に対応するめつき
量を別表１に示すように設定して鉛−錫合金めつ
き処理をし、十分水洗後乾燥した。(2) 2nd step, lead-tin alloy plating treatment 380g of lead oxide/30g of tin oxide/
, 45g of hydroborosemic acid/0.5g of glue/,
in a bath with a temperature of 25℃ and a current density of 10A/dm 2
Lead-tin alloy plating treatment was carried out by setting the under plating time and the plating amount corresponding to the plating time as shown in Attached Table 1, followed by thorough washing with water and drying.
(3) 第３工程、鉛板圧延被覆処理
２段冷間圧延機（ロール径300mm）を用い、チ
タン板上の第２層、すなわち、鉛−錫合金めつき
層上に厚さ2.0mmの鋳造鉛板を冷間で、圧延荷重
を変化させることにより、別表１に示すように鉛
板の圧延率を変化させて圧延接合した。(3) Third step, lead plate rolling coating treatment Using a two-high cold rolling mill (roll diameter 300 mm), a layer of 2.0 mm thick is applied to the second layer on the titanium plate, that is, the lead-tin alloy plating layer. The cast lead plates were cold rolled and joined by varying the rolling load and the rolling rate of the lead plates as shown in Attached Table 1.
このようにして製造された鉛複合チタン板は図
面に示すとおりに、チタン板と鉛複合層間に第１
層の銅めつき層と第２層の鉛系めつき層を介在
し、第１層の銅めつき層はチタン板上の安定な酸
化膜を除去してチタン板に密着し、第２層の鉛系
めつき層は銅めつき層と密着して接合するととも
に、複合する鉛複合層に対しては圧延接合の際に
界面に絶えず新生面を形成して強固に結合し、チ
タン板と鉛複合層が十分な接着強度を有して複合
されるものである。 As shown in the drawing, the lead composite titanium plate manufactured in this way has a first layer between the titanium plate and the lead composite layer.
There is a copper plating layer in the first layer and a lead-based plating layer in the second layer, and the first copper plating layer removes the stable oxide film on the titanium plate and adheres to the titanium plate. The lead-based plating layer adheres closely to the copper plating layer, and the composite lead composite layer continuously forms a new surface at the interface during rolling bonding, creating a strong bond between the titanium plate and the lead. The composite layers are composited with sufficient adhesive strength.
次に本発明の効果を明らかにするため比較例１
〜３を下記に示す。 Next, in order to clarify the effect of the present invention, Comparative Example 1
-3 are shown below.
「比較例 １」
チタン板を十分酸洗処理し、水洗乾燥後、銅め
つき処理及び鉛系めつき処理の両工程を省いて第
３工程の鉛板圧延被覆処理を別表１に示す圧延率
で試みた。"Comparative Example 1" A titanium plate was sufficiently pickled, washed with water and dried, and the third process of rolling and covering the lead plate was carried out at the rolling rate shown in Attached Table 1 by omitting both the copper plating process and the lead plating process. I tried it.
「比較例 ２」
チタン板を十分酸洗処理し、水洗した後、第１
工程の銅めつき処理を省き、第２工程の鉛めつき
処理を別表１に示すめつき時間とめつき量により
施し、第３工程の鉛板圧延被覆処理を別表１に示
す圧延率で試みた。“Comparative Example 2” After the titanium plate was sufficiently pickled and washed with water, the first
The copper plating process in the process was omitted, the second process lead plating process was performed using the plating time and plating amount shown in Attached Table 1, and the third process lead plate rolling coating treatment was attempted at the rolling rate shown in Attached Table 1. .
「比較例 ３」
チタン板を十分酸洗処理し、水洗した後、第１
工程の銅めつき処理のみを別表１に示すめつき時
間とめつき量により施し、第２工程の鉛系めつき
処理を省き、第３工程の鉛板圧延被覆処理を別表
１に示す圧延率で試みた。“Comparative Example 3” After the titanium plate was sufficiently pickled and washed with water, the first
Only the copper plating treatment in the process is performed according to the plating time and plating amount shown in Attached Table 1, the lead-based plating treatment in the second step is omitted, and the lead plate rolling coating treatment in the third step is performed at the rolling rate shown in Attached Table 1. I tried.
以上のサンプルを下記の方法で評価した。 The above samples were evaluated by the following method.
１ 剥離試験
25mm幅、長さ150mmの鉛複合チタン板（以下、
試験片という。）を切り出し、180°剥離試験で鉛
複合層とチタン板の密着力を評価した。1 Peeling test A lead composite titanium plate with a width of 25 mm and a length of 150 mm (hereinafter referred to as
It is called a test piece. ) was cut out and the adhesion between the lead composite layer and the titanium plate was evaluated using a 180° peel test.
２ OT曲げ試験
鉛複合層が外及び内側になるようにOT密着曲
げを施し、鉛複合板とチタン板との剥がれ状況を
観察した。2 OT bending test OT close bending was performed so that the lead composite layer was on the outside and inside, and the peeling situation between the lead composite plate and the titanium plate was observed.
３ 塩水浸漬試験
OT曲げを施した試験片を、５％食塩水（40
℃）に３週間浸漬し、端面での剥離進行状況を観
察した。3 Salt water immersion test The test piece subjected to OT bending was soaked in 5% salt water (40
℃) for 3 weeks, and the progress of peeling at the end face was observed.
４ 冷熱サイクルテスト
50mm×150mmの試験片を、120℃の熱シリコンオ
イル浴に５分間浸漬後、ブロアーで送風冷却する
ことにより室温まで冷却して５分間保持する処理
を１サイクルとし、該サイクルを1500回まで繰り
返し試験し、端面での剥がれ、鉛面のブリスター
発生の有無、鉛複合層のクラツク発生の有無等を
観察した。さらに、この試験終了後の試験片で
１）の剥離試験を実施した。4 Cold/heat cycle test One cycle consists of immersing a 50 mm x 150 mm test piece in a hot silicone oil bath at 120°C for 5 minutes, cooling it to room temperature by blowing air with a blower, and holding it for 5 minutes. The test was repeated up to 1,500 times, and the presence or absence of peeling at the end face, the occurrence of blisters on the lead surface, and the presence or absence of cracks in the lead composite layer were observed. Furthermore, the peel test described in 1) was conducted using the test piece after completing this test.
各サンプルの評価試験結果を別表１に示す。 The evaluation test results for each sample are shown in Attached Table 1.
表１中、剥離試験における◎は、密着強度が十
分で鉛板自体の破断に至る事を示す。他のOT曲
げ試験、塩水浸漬試験における◎は、試験前に比
し何らの異常や劣化の認められないことを示す。
冷熱サイクル試験における◎は、冷熱サイクル付
与後の剥離試験でも試験前と同様に何らの異常や
劣化の認められないことを示すものである。全試
験における△は曲げ等の加工部位で鉛複合層の剥
離が若干発生していることを示し、×は鉛複合層
の剥離がはつきりと認められる状態であることを
示し、○は◎と△との中間的状態であることを示
したものである。 In Table 1, ◎ in the peel test indicates that the adhesion strength is sufficient and the lead plate itself breaks. ◎ in other OT bending tests and salt water immersion tests indicates that no abnormality or deterioration was observed compared to before the test.
◎ in the cold/heat cycle test indicates that no abnormality or deterioration was observed in the peel test after the cold/heat cycle was applied, as before the test. In all tests, △ indicates that some peeling of the lead composite layer occurs at the processed parts such as bending, × indicates that peeling of the lead composite layer is clearly recognized, and ○ indicates ◎ This shows that it is an intermediate state between and △.
（発明の効果）
以上のように本発明は、チタン板と鉛複合層間
に介在する銅めつき層と鉛系めつき層により両者
を強固に密着接合し、長期にわたつて安定した耐
久度を保証できる鉛複合チタン板を工業的に提供
できる効果がある。(Effects of the Invention) As described above, the present invention firmly and closely joins the titanium plate and the lead composite layer with the copper plating layer and the lead-based plating layer interposed between the two, thereby achieving stable durability over a long period of time. This has the effect of industrially providing a lead composite titanium plate that can be guaranteed.
図面は本発明に係る鉛複合チタン板の部分拡大
断面図である。
図中、１はチタン板、２は銅めつき層、３は鉛
系めつき層、４は鉛複合層。
The drawing is a partially enlarged sectional view of a lead composite titanium plate according to the present invention. In the figure, 1 is a titanium plate, 2 is a copper plating layer, 3 is a lead-based plating layer, and 4 is a lead composite layer.
【表】【table】
Claims (1)
めつき層及び鉛−錫合金めつき層のうち、一のめ
つき層とを介在して鉛板を圧延接合して成る鉛複
合チタン板。 ２ チタン板の少なくとも一面に銅めつき層処理
を施す第１工程と続いて該めつき層上に鉛めつき
処理及び鉛−錫合金めつきのうち、一のめつき処
理を施す第２工程と該めつき層上に鉛板を圧延被
覆する第３工程から成る鉛複合チタン板の製造方
法。[Claims] 1. A lead plate is rolled and bonded to at least one surface of a titanium plate with a copper plating layer, a lead plating layer, and a lead-tin alloy plating layer interposed therebetween. Made of lead composite titanium plate. 2. A first step of applying a copper plating layer treatment to at least one side of the titanium plate, followed by a second step of applying one of lead plating treatment and lead-tin alloy plating on the plating layer. A method for producing a lead composite titanium plate comprising a third step of rolling and coating a lead plate on the plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30032590A JPH04172188A (en) | 1990-11-05 | 1990-11-05 | Lead composite titanium plate and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30032590A JPH04172188A (en) | 1990-11-05 | 1990-11-05 | Lead composite titanium plate and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04172188A JPH04172188A (en) | 1992-06-19 |
| JPH0518671B2 true JPH0518671B2 (en) | 1993-03-12 |
Family
ID=17883417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30032590A Granted JPH04172188A (en) | 1990-11-05 | 1990-11-05 | Lead composite titanium plate and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04172188A (en) |
-
1990
- 1990-11-05 JP JP30032590A patent/JPH04172188A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04172188A (en) | 1992-06-19 |
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