JPH041720Y2 - - Google Patents

Info

Publication number

JPH041720Y2

JPH041720Y2 JP11985685U JP11985685U JPH041720Y2 JP H041720 Y2 JPH041720 Y2 JP H041720Y2 JP 11985685 U JP11985685 U JP 11985685U JP 11985685 U JP11985685 U JP 11985685U JP H041720 Y2 JPH041720 Y2 JP H041720Y2

Authority

JP

Japan

Prior art keywords

hole

recess

lead wire

internal electrode

dielectric

Prior art date

1985-08-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
• 239000003990 capacitor Substances 0.000 claims description 9
• 230000002093 peripheral effect Effects 0.000 claims description 7
• 229910000679 solder Inorganic materials 0.000 description 11
• 239000003989 dielectric material Substances 0.000 description 3
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 230000001771 impaired effect Effects 0.000 description 1
• 229910052759 nickel Inorganic materials 0.000 description 1
• 230000035515 penetration Effects 0.000 description 1
• 238000007747 plating Methods 0.000 description 1