JPH04171826A - Bump bonding device - Google Patents
Bump bonding deviceInfo
- Publication number
- JPH04171826A JPH04171826A JP2300757A JP30075790A JPH04171826A JP H04171826 A JPH04171826 A JP H04171826A JP 2300757 A JP2300757 A JP 2300757A JP 30075790 A JP30075790 A JP 30075790A JP H04171826 A JPH04171826 A JP H04171826A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- ball
- wire
- bonding tool
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000009751 slip forming Methods 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はウェハーバンブ形成技術と装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to wafer bumping techniques and apparatus.
従来の技術
題３図に示すようにキャピラリ１０２の穴に通したＡｕ
ワイヤ１０３の先端に電気放電などによってＡｕワイヤ
１０３の径の２〜３倍の径のボール１０１をキャピラリ
１０２を介してＬＳＩチップの電極パッド１０４に固着
させてバンブ１０５の底部を形成する。さらにキャピラ
リ１０２をバンブ１０５の底部の上方で垂直方向にルー
プ状軌道を描いて移動した後、キャピラリ１０２を降下
させてＡｕワイヤ１０３を切欠してバンブ１０５の底部
の上部に頂部を形成するスタッドバンブ形成方法。Conventional Technical Problem 3 As shown in Figure 3, Au passed through the hole of the capillary 102.
A ball 101 having a diameter two to three times the diameter of the Au wire 103 is fixed to the tip of the wire 103 via a capillary 102 by electric discharge or the like to an electrode pad 104 of the LSI chip, thereby forming the bottom of a bump 105. Furthermore, after moving the capillary 102 vertically in a loop-like trajectory above the bottom of the bump 105, the capillary 102 is lowered to cut the Au wire 103 and form a stud bump above the bottom of the bump 105. Formation method.
発明が解決しようとする課題
スタッドバンブ方式では、ワイヤボンディング法を応用
し、キャピラリをループ状に作動させてバンブを形成す
るため、バンブ形成に２アクシヨンが必要でありその後
に電気放電等により、ボールを作成するという動作を繰
返すためタクトが長く、またループの高さのバラツキ、
センターズレといったものがあるため、配線との接続が
とれないものが発生し易いという課題を有している。Problems to be Solved by the Invention In the stud bump method, the wire bonding method is applied and the capillary is actuated in a loop to form the bump, so two actions are required to form the bump, and then the ball is bonded by electrical discharge, etc. The takt time is long because the operation of creating the loop is repeated, and the height of the loop is uneven.
Since there is a center shift, there is a problem in that it is easy to disconnect from the wiring.
本発明は上記従来の問題点に鑑み、１アクシヨンでバン
ブを形成し、バンブ形成中に金ボールを形成することに
よりタクトが短（、バンブ形状のバラツキが少ないバン
プボンディング装置の提供を目的とする。In view of the above-mentioned conventional problems, the present invention aims to provide a bump bonding device that forms a bump in one action and forms a gold ball while forming the bump, resulting in a short takt time (and less variation in bump shape). .
課題を解決するための手段
上記問題点を解決するために本発明は、Ａｕワイヤの先
端部に電気放電等によりボールを形成する手段と、その
ボールをワイヤと切り離す手段と、ボールをＬＳＩチッ
プの電極パッドに固着させる手段と被ボンディング材を
固定する手段を備えたものである。Means for Solving the Problems In order to solve the above problems, the present invention provides means for forming a ball at the tip of an Au wire by electrical discharge, means for separating the ball from the wire, and means for separating the ball from the wire. It is equipped with means for fixing to the electrode pad and means for fixing the material to be bonded.
作 用
本発明のバンプボンディング装置によれば、■アクショ
ンでバンブを形成し、バンブ形成中にボールを形成する
ことによりタクトが短く、バンブ形状のバラツキが少な
いバンブを形成することができる。Effects According to the bump bonding apparatus of the present invention, by forming bumps by (1) action and forming balls during bump formation, it is possible to form bumps with a short tact time and less variation in bump shape.
実施例
以下、本発明の一実施例を第１図、第２図を参照しなが
ら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.
第１図において、■は水平面上で互いに直交するＸ方向
をＹ方向に位置決め可能な図示されていないＸＹテーブ
ル上に搭載されたヒートブロックであり、バンプボンデ
ィングすべき半導体２を固定支持し、加熱するように構
成されている。３はワイヤで、４のワイヤ送り装置を介
してガイド５を通っている。６はワイヤ先端に放電によ
って形成したボール７を切り離すための装置である。バ
ンプボンディングツール８は、超音波ホーン９の先端に
装着されており、この超音波ホーン９の後端部は、ボン
ディングツール８が１８０°回転可能なように支持され
、かつ支持軸１０回りに上下揺動可能に支持された揺動
腕１１にて、前記支持軸１０と同一軸心回りに揺動可能
に支持されている。又、前記超音波ホーン９の後端から
は操作杆１２が延出され、その遊端部と前記揺動腕１１
との間に、前記超音波ホーン９の先端部を下方に向かつ
て付勢するためのりニアモータ１３が介装されている。In FIG. 1, ■ is a heat block mounted on an XY table (not shown) that can be positioned in the X direction and the Y direction, which are orthogonal to each other, on a horizontal plane. is configured to do so. A wire 3 passes through a guide 5 via a wire feeding device 4. 6 is a device for cutting off the ball 7 formed at the tip of the wire by electric discharge. The bump bonding tool 8 is attached to the tip of an ultrasonic horn 9, and the rear end of the ultrasonic horn 9 supports the bonding tool 8 so that it can rotate 180 degrees, and rotates up and down around the support shaft 10. It is supported so as to be swingable about the same axis as the support shaft 10 by a swinging arm 11 that is swingably supported. Further, an operating rod 12 extends from the rear end of the ultrasonic horn 9, and its free end and the swinging arm 11
A linear motor 13 for urging the tip of the ultrasonic horn 9 downward is interposed between the ultrasonic horn 9 and the ultrasonic horn 9.
さらに、前記リニアモータ１３は前記超音波ホーン９を
上方に揺動させるように収縮も可能に構成されている。Further, the linear motor 13 is configured to be able to contract so as to swing the ultrasonic horn 9 upward.
前記揺動腕１１は、後ろ端部に取付けられたカムローラ
１４がＡＣサーボモータ１５にて回転駆動可能なリニア
モーションカム１６に係合しており、ＡＣサーボモータ
１５の回転角に比例して上下揺動するように構成されて
いる。１７は前記ワイヤの先端との間でスパークを生じ
させる電気トーチである。A cam roller 14 attached to the rear end of the swing arm 11 is engaged with a linear motion cam 16 that can be rotated by an AC servo motor 15, and the swing arm 11 moves up and down in proportion to the rotation angle of the AC servo motor 15. It is configured to swing. 17 is an electric torch that generates a spark between it and the tip of the wire.
第２図は本発明のバンプボンディング装置の動作を示し
たもので、ワイヤ先端に電気トーチによりボールを作成
し、次にボンディングツールが反転してボールを取りに
行（と同時にワイヤとボールを切り離す。次に正規の位
置にボンディングツールを戻し、被ボンディング部にバ
ンブを形成すると同時に一方でワイヤの供給とボールの
形成を行う。この動作を繰返すことによりバンブの形成
を行う。Figure 2 shows the operation of the bump bonding device of the present invention, in which a ball is created at the tip of the wire using an electric torch, and then the bonding tool is reversed to pick up the ball (at the same time, the wire and ball are separated). Next, the bonding tool is returned to its normal position, and a bump is formed on the bonded portion, while at the same time supplying the wire and forming a ball.By repeating this operation, the bump is formed.
発明の効果
本発明のバンプボンディング装置によれば、■アクショ
ンでバンブを形成し、バンブ形成中に金ボールを形成す
ることによりタクトが短く、バンブ形状のバラツキが少
ないバンブ形成を行うことができる。Effects of the Invention According to the bump bonding apparatus of the present invention, bumps are formed by (1) action and gold balls are formed during bump formation, thereby making it possible to form bumps with a short tact time and less variation in bump shape.
第１図は本発明の一実施例の概略構成を示す斜視図、第
２図は本発明の一実施例の動作を表した図、第３図は従
来のバンブ形成方法を表した図である。
１・・・・・・ヒートブロック、２・・・・・・被ボン
ディング材＜ＩＣ）、３・・・・・・ワイヤ、４・・・
・・・ワイヤ送り装置、５・・・・・・ガイド、６・・
・・・・カッター、７・・・・・・金ボール、８・・・
・・・ボンディングツール、９・・・・・・超音波ホー
ン、１０・・・・・・支持軸、１１・・・・・・揺動腕
、１２・・・・・・操作杆、１３・・・・・・リニアモ
ータ、１４・・・・・・カムローラ、１５・・・・・・
ＡＣサーボモータ、１６・・・・・・リニアモーション
カム、１７・・・・・・電気トーチ。
代理人の氏名 弁理士小蝦治明ほか２名第１図
δ−オ・ノテ４／グソール
第２図
第３図
＼
＼
ｌθ／ −−’ｋ ホ′−ル
θＳFIG. 1 is a perspective view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is a diagram showing the operation of an embodiment of the present invention, and FIG. 3 is a diagram showing a conventional bump forming method. . DESCRIPTION OF SYMBOLS 1... Heat block, 2... Bonding material<IC), 3... Wire, 4...
...Wire feeding device, 5...Guide, 6...
...Cutter, 7...Gold ball, 8...
... Bonding tool, 9 ... Ultrasonic horn, 10 ... Support shaft, 11 ... Swing arm, 12 ... Operation rod, 13. ...Linear motor, 14...Cam roller, 15...
AC servo motor, 16... Linear motion cam, 17... Electric torch. Name of agent: Patent attorney Haruaki Koebi and 2 others Figure 1 δ-O Note 4/Gusall Figure 2 Figure 3\ \ lθ/ --'k Hole θS
Claims (1)
する手段と、そのボールをワイヤと切り離す手段を、ボ
ールをバンプボンディングすべき半導体の電極パッドに
固着させる手段と被ボンディング材を固定する手段から
なるバンプボディング装置。It consists of means for forming a ball on the tip of the Au wire by electrical discharge, means for separating the ball from the wire, means for fixing the ball to the electrode pad of the semiconductor to be bump-bonded, and means for fixing the material to be bonded. Bump boding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300757A JP2998195B2 (en) | 1990-11-05 | 1990-11-05 | Bump bonding apparatus and bump bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300757A JP2998195B2 (en) | 1990-11-05 | 1990-11-05 | Bump bonding apparatus and bump bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04171826A true JPH04171826A (en) | 1992-06-19 |
| JP2998195B2 JP2998195B2 (en) | 2000-01-11 |
Family
ID=17888734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300757A Expired - Fee Related JP2998195B2 (en) | 1990-11-05 | 1990-11-05 | Bump bonding apparatus and bump bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2998195B2 (en) |
-
1990
- 1990-11-05 JP JP2300757A patent/JP2998195B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2998195B2 (en) | 2000-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |