JPH04171790A - Part mounting board - Google Patents
Part mounting boardInfo
- Publication number
- JPH04171790A JPH04171790A JP29920590A JP29920590A JPH04171790A JP H04171790 A JPH04171790 A JP H04171790A JP 29920590 A JP29920590 A JP 29920590A JP 29920590 A JP29920590 A JP 29920590A JP H04171790 A JPH04171790 A JP H04171790A
- Authority
- JP
- Japan
- Prior art keywords
- land
- board
- insulating layer
- leadless
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 125000006850 spacer group Chemical group 0.000 abstract description 4
- 230000000737 periodic effect Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、プリント配線基板へのリードレス部品の実装
構造に関し、特にリードレス部品を、この部品とは熱膨
張係数が異なる基板上にはんだ継手により搭載する部品
実装基板に関するものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a structure for mounting leadless components on a printed wiring board, and particularly relates to a structure for mounting leadless components on a printed wiring board. This invention relates to a component mounting board that is mounted on different boards using solder joints.
（従来の技術）
第２図に示されるように、プリント配線基板１１にリー
ドレス部品１２を表面実装する技術は、基板１１のラン
ド１３上にペーストはんだを塗布し、このペーストはん
だを介してリードレス部品１２を搭載し、リフロー法に
よりペーストはんだを加熱溶融し、このはんだが凝固す
ることで、ランド１３と電極１４との間にはんだ継手１
５を形成するようにしている。なお、基板１１の表面に
はランド１３の厚みよりも薄い１０〜１５μｍのはんだ
レジスト１６が設けられている。(Prior Art) As shown in FIG. 2, the technique for surface mounting leadless components 12 on a printed wiring board 11 involves applying paste solder on the lands 13 of the board 11, and connecting leads through the paste solder. The solder joint 1 is mounted between the land 13 and the electrode 14 by heating and melting the paste solder using the reflow method and solidifying the solder.
5. Note that a solder resist 16 with a thickness of 10 to 15 μm, which is thinner than the thickness of the land 13, is provided on the surface of the substrate 11.
（発明が解決しようとする課題）
この従来の実装基板は、リードレス部品１２とランド１
３との間にあるはんだ継手１５の厚みが数１０μｍ程度
と薄いので、基板１１とリードレス部品１２との熱膨張
係数の相違に基づき、周期的な温度変化により繰返し発
生する剪断応力が、薄いはんだ継手１５に集中して、は
んだ継手１５に疲労破壊（クラック等）が発生しやすい
問題がある。(Problems to be Solved by the Invention) This conventional mounting board has a leadless component 12 and a land 1.
Since the thickness of the solder joint 15 between the board 11 and the leadless component 12 is as thin as several tens of micrometers, the shear stress repeatedly generated due to periodic temperature changes is reduced due to the difference in thermal expansion coefficient between the board 11 and the leadless component 12. There is a problem in that fatigue failure (cracks, etc.) tends to occur mainly in the solder joint 15.
本発明は、このような点に鑑みなされたものであり、は
んだ継手にかかる剪断応力を分散させ、はんだ継手の疲
労破壊に対する抵抗力を高めた部品実装基板を提供する
ことを目的とするものである。The present invention has been made in view of these points, and an object of the present invention is to provide a component mounting board that disperses the shear stress applied to the solder joints and increases the resistance of the solder joints to fatigue fracture. be.
［発明の構成］
（課題を解決するための手段）
本発明は、基板１１のランド１３上にリードレス部品１
２の電極１４がリフローはんだイて１けにより表面実装
された部品実装基板において、少なくとも基板１１とリ
ードレス部品１２の本体との間に、ランド厚よりも厚い
絶縁層２１ａが設けられた部品実装基板である。[Structure of the Invention] (Means for Solving the Problem) The present invention provides a leadless component 1 on the land 13 of the substrate 11.
In a component mounting board in which the second electrode 14 is surface mounted by reflow soldering, an insulating layer 21a thicker than the land thickness is provided at least between the board 11 and the main body of the leadless component 12. It is a board.
（作用）
本発明は、厚い絶縁層２１ａがスペーサとなって、基板
１１のランド１３とリードレス部品１２の電極１４との
間に十分な厚みのはんだ継手１５を確保でき、この十分
なはんだ継手厚によって、熱膨張係数の相違に基づく剪
断応力を分散低減できる。(Function) According to the present invention, the thick insulating layer 21a serves as a spacer, and a sufficiently thick solder joint 15 can be secured between the land 13 of the substrate 11 and the electrode 14 of the leadless component 12, and this sufficient solder joint Depending on the thickness, shear stress due to differences in thermal expansion coefficients can be distributed and reduced.
（実施例）
以下、本発明を第１図に示される実施例を参照して詳細
に説明する。(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG.
プリント配線基板１１にリードレス部品１２が表面実装
されている。すなわち、基板１１のランド１３上にリー
ドレス部品１２の電極１４が、リフローはんだ付けによ
り形成されたはんだ継手１５により接続されている。プ
リント配線基板１１の表面には、ランド１３等の導電パ
ターンを除いて、ランド１３の厚みよりも十分厚い絶縁
層２１が予め印刷により形成されている。A leadless component 12 is surface mounted on a printed wiring board 11. That is, the electrode 14 of the leadless component 12 is connected to the land 13 of the substrate 11 by a solder joint 15 formed by reflow soldering. On the surface of the printed wiring board 11, an insulating layer 21 which is sufficiently thicker than the land 13 is formed in advance by printing, excluding the conductive patterns such as the lands 13.
この絶縁層２ｊは、従来のはんだレジストに替わる絶縁
樹脂膜であり、特に基板１１とリードレス部品１２の本
体との間にある絶縁層２１ａが剪断応力に対し重要な働
きを行う。This insulating layer 2j is an insulating resin film that replaces the conventional solder resist, and in particular, the insulating layer 21a between the substrate 11 and the main body of the leadless component 12 plays an important role against shear stress.
すなわち、この厚い絶縁層２１ａがスペーサとなって、
基板１１とリードレス部品１２との間に十分なスタンド
オフ高さＨを得ることができ、基板１１のランド１３と
リードレス部品１２の電極１４との間に十分な厚みのは
んだ継手１５を確保できるから、この十分な厚みのはん
だ継手１５において、基板＋１とり一ドレス部品１２と
の熱膨張係数の相違に基づき周期的な温度変化により繰
返し発生する剪断応力を分散することができる。That is, this thick insulating layer 21a serves as a spacer,
A sufficient standoff height H can be obtained between the board 11 and the leadless component 12, and a sufficiently thick solder joint 15 can be secured between the land 13 of the board 11 and the electrode 14 of the leadless component 12. Therefore, in the sufficiently thick solder joint 15, the shear stress repeatedly generated due to periodic temperature changes can be dispersed based on the difference in coefficient of thermal expansion between the substrate +1 and the dress component 12.
［発明の効果］
本発明によれば、少なくとも基板とリードレス部品の本
体との間に、ランド厚よりも厚い絶縁層が設けられたか
ら、この厚い絶縁層がスペーサとなって、基板のランド
とリードレス部品の電極との間に十分な厚みのはんだ継
手を確保でき、この十分なはんだ継手厚によって、熱膨
張係数の相違に基づきはんだ継手にかかる剪断応力を分
散低減でき、これにより、はんだ継手の疲労破壊に対す
る抵抗力を高めることができ、はんだ継手の信頼性を向
上できる。[Effects of the Invention] According to the present invention, since an insulating layer thicker than the land thickness is provided at least between the board and the main body of the leadless component, this thick insulating layer acts as a spacer and is connected to the land of the board. It is possible to ensure a sufficiently thick solder joint between the electrode of the leadless component, and this sufficient solder joint thickness can reduce the shear stress applied to the solder joint due to the difference in the coefficient of thermal expansion, thereby reducing the solder joint. The resistance to fatigue fracture can be increased, and the reliability of solder joints can be improved.
第１図は本発明の部品実装基板の一実施例を示す断面図
、第２図は従来の部品実装基板を示す断面図である。
１１・・基板、１２・・リードレス部品、１３・・ラン
ト、１４・・電極、２１ａ ・・絶縁層。FIG. 1 is a sectional view showing an embodiment of a component mounting board of the present invention, and FIG. 2 is a sectional view showing a conventional component mounting board. 11... Board, 12... Leadless component, 13... Runt, 14... Electrode, 21a... Insulating layer.
Claims (1)
ーはんだ付けにより表面実装された部品実装基板におい
て、 少なくとも基板とリードレス部品の本体との間に、ラン
ド厚よりも厚い絶縁層が設けられたことを特徴とする部
品実装基板。(1) In a component mounting board in which the electrodes of a leadless component are surface-mounted on the land of the board by reflow soldering, an insulating layer thicker than the land thickness is provided at least between the board and the main body of the leadless component. A component mounting board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29920590A JPH04171790A (en) | 1990-11-05 | 1990-11-05 | Part mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29920590A JPH04171790A (en) | 1990-11-05 | 1990-11-05 | Part mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04171790A true JPH04171790A (en) | 1992-06-18 |
Family
ID=17869510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29920590A Pending JPH04171790A (en) | 1990-11-05 | 1990-11-05 | Part mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04171790A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0603739A1 (en) * | 1992-12-23 | 1994-06-29 | Rheinmetall Industrie GmbH | Stress resistant electronic assembly |
| JP2016077092A (en) * | 2014-10-07 | 2016-05-12 | 三菱電機株式会社 | Motor, air conditioner, and manufacturing method of motor |
-
1990
- 1990-11-05 JP JP29920590A patent/JPH04171790A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0603739A1 (en) * | 1992-12-23 | 1994-06-29 | Rheinmetall Industrie GmbH | Stress resistant electronic assembly |
| US5426568A (en) * | 1992-12-23 | 1995-06-20 | Rheinmetall Gmbh | Launch-protected electronic assembly |
| JP2016077092A (en) * | 2014-10-07 | 2016-05-12 | 三菱電機株式会社 | Motor, air conditioner, and manufacturing method of motor |
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