JPH04165692A - Organic substrate module - Google Patents

Abstract

PURPOSE:To obtain an organic substrate module, which is economically profitable, is made possible a mounting of a large chip of a high density, is made possible an increase in function and is high in reliability, by a method wherein an anisotropic conductive rubber connector is provided in an organic substrate and a semiconductor device is connected to a conductor wiring via the connector. CONSTITUTION:An anisotropic conductive rubber connector 4 is formed in almost the central part of an organic substrate 1 into a rectangular form and a semiconductor device 5 of a leadless chip carrier structure is inserted and installed in the interior of the connector 4. One end of a conductor wiring is connected to a position, which corresponds to an electrode 10 of the device 5, on the connector 4 and the other end of the conductor wiring is connected to lead-out electrodes 2 of a connector part 3. Thereby, as the need to discard an organic substrate module itself is eliminated, the module is economically profitable and as the effect of a thermal stress is eliminated, it becomes possible to mount a large chip of a high density and the mounting density of the module can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an organic substrate module, and more particularly to an organic substrate module mounting a semiconductor device having a dressless chip carrier structure.

[Conventional technology]

2. Description of the Related Art In recent years, there has been a remarkable trend toward higher functionality and higher density in electronic devices. Along with this, high functionality is required of the electronic components and modules that make up these devices, while their volumes and external shapes are shrinking.

As a way to achieve this, a COB as shown in Figure 5 is proposed.
An IC chip 7 having a structure, a semiconductor device 5 having a leadless chip carrier structure as shown in FIG. 6, a flat package 13 such as a TSOP structure as shown in FIG. There are electronic components and modules that are designed to be connected by soldering.

All of these are thin, so they are increasingly used in high-density electronic devices.

[Problem to be solved by the invention]

These conventional electronic components and modules have the following problems.

First, in the COB structure organic substrate module shown in Fig. 5, special inspection items are limited for a single IC chip.
It is necessary to inspect it as a comprehensive characteristic while incorporating it as a module. At this time, if either the IC chip or the organic substrate is defective, the IC chip cannot be transferred and the module itself must be discarded, which is economically disadvantageous.

In addition, the organic substrate modules shown in FIGS. 6 and 7 have an advantage over the COD structure organic substrate module shown in FIG. 5 in that the device can be inspected before being mounted, but the solder connection method is used. Therefore, the size of the device is restricted due to reliability problems such as package cracks due to thermal stress. This is disadvantageous for electronic devices aiming for high functionality.

An object of the present invention is to provide an organic substrate module that is economically advantageous, allows high-density and large chip mounting, is highly functional, and has high reliability. ] The present invention provides an organic substrate having an organic substrate, a conductor wiring formed on the organic substrate, and a semiconductor device and circuit components having a leadless chip carrier structure mounted on the organic substrate and connected to the conductor wiring. In the module, an anisotropic conductive rubber connector is provided on the organic substrate, and the semiconductor device is connected via the anisotropic conductive rubber connector.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a perspective view of the first embodiment of the present invention.
A sectional view taken along the line 1-A' in the figure, and FIG. 3 is a partially cutaway side view of an example of a semiconductor device having a leadless chip carrier structure.

In the first embodiment, as shown in FIGS. 1 to 3, a rectangular anisotropic conductive rubber connector 4 is formed approximately in the center of an organic substrate 1, and a dress chip carrier structure is formed inside the connector. The semiconductor device 5 is inserted and mounted.

Electrode of semiconductor device 5 of anisotropic conductive rubber connector 4]0
One end of a conductor wiring (not shown) is connected to the position corresponding to , and the other end is connected to the lead 7 electrode 2 of the connector section 3 .

Circuit components such as a chip conductor 6 are further mounted on the organic substrate 1 to form an organic substrate module.

FIG. 4 is a sectional view of a second embodiment of the invention.

In the second embodiment, as shown in FIG. 4, an anisotropic conductive rubber connector 4 is provided on an organic substrate 1, and an electrode 10 of a semiconductor device 5 is brought into contact with the anisotropic conductive rubber connector 4 for fixation. The semiconductor device 5 is fixed using the fixture 14 to form an organic substrate module.

〔Effect of the invention〕

As explained above, the present invention has an economically advantageous effect since it is not necessary to discard the organic substrate module itself by providing an anisotropic conductive rubber connector on an organic substrate and making it possible to attach and detach a semiconductor device. .

Furthermore, since the influence of thermal stress is eliminated, it becomes possible to mount large chips at high density, which has the effect of increasing the mounting density of the organic substrate module.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the first embodiment of the present invention, and FIG. 2 is a perspective view of the first embodiment of the present invention.
3 is a partially cutaway side view of an example of a semiconductor device with a leadless chip carrier structure;
The figure is a sectional view of the second embodiment of the present invention, and FIG.
FIG. 6 is a cross-sectional view of an example of an organic substrate module with an OB structure, FIG. 6 is a cross-sectional view of an example of an organic substrate module with a conventional glue-dressed chip carrier structure, and FIG. 7 is a cross-sectional view of an example of an organic substrate module with a flat package of a conventional TSOP structure. FIG. ]... Organic substrate, 2... Extraction electrode, 3... Connector portion, 4... Anisotropic conductive rubber connector, 5...
Semiconductor device, 6... Chip capacitor, 7... IC
Chip, 8... Bonding wire, 9... Filling resin, 10... Electrode, 11... Sealing resin, 12...
Solder, 13...Flat package, ]4... Fixing jig.

Claims (1)

[Claims] an organic substrate, a conductor wiring formed on the organic substrate,
In an organic substrate module having a semiconductor device and a circuit component having a leadless chip carrier structure mounted on the organic substrate and connected to the conductor wiring, an anisotropic conductive rubber connector is provided on the organic substrate and the anisotropic conductive rubber An organic substrate module characterized in that the semiconductor device is connected to the semiconductor device via a connector.