JPH04162733A - Manufacturing apparatus for tape carrier for tab - Google Patents
Manufacturing apparatus for tape carrier for tabInfo
- Publication number
- JPH04162733A JPH04162733A JP29012690A JP29012690A JPH04162733A JP H04162733 A JPH04162733 A JP H04162733A JP 29012690 A JP29012690 A JP 29012690A JP 29012690 A JP29012690 A JP 29012690A JP H04162733 A JPH04162733 A JP H04162733A
- Authority
- JP
- Japan
- Prior art keywords
- section
- film
- tape
- protective film
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 230000001681 protective effect Effects 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 238000005406 washing Methods 0.000 claims abstract description 8
- 238000005554 pickling Methods 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims description 12
- 230000003068 static effect Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000008030 elimination Effects 0.000 claims description 3
- 238000003379 elimination reaction Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 20
- 239000012535 impurity Substances 0.000 abstract description 16
- 238000004804 winding Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- -1 chlorine ions Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はＴＡＢ用テープキャリア製造装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a TAB tape carrier manufacturing apparatus.
第３図にはＴＡＢ用テープキャリア製造装置の従来例が
示されている。同図に示されているように製造装置は送
り出し部１、半田保護膜の印刷部２、乾燥炉３、巻取部
４から構成されている。フィルムキャリアテープ５はこ
のラインを通り半田保護膜の印刷部２で半田保護膜を塗
布し、乾燥部３で半田保護膜を乾燥しているが、事前に
付着した異物（例えば周辺のゴミ、服装の糸クズ）およ
びエツチング時に残ったエツチング液等の化学的不純物
はそのまま半田保護膜中に残り、フィルムキャリアテー
プ上にパターンの断線、接続等の不良原因となっていた
。FIG. 3 shows a conventional example of a TAB tape carrier manufacturing apparatus. As shown in the figure, the manufacturing apparatus is comprised of a delivery section 1, a solder protective film printing section 2, a drying oven 3, and a winding section 4. The film carrier tape 5 passes through this line, and a solder protective film is applied in the solder protective film printing section 2, and the solder protective film is dried in the drying section 3. Chemical impurities such as lint (lint) and etching solution left during etching remain in the solder protective film, causing pattern disconnections and connection defects on the film carrier tape.
［発明が解決しようとする課８］
上記従来技術では送り出し部からすぐに半田保護膜の印
刷部に行き半田保護膜を形成するため、フィルムキャリ
アテープに付着していた異物が半田保護膜の中に入って
しまう。また、導電パターン上に酸化膜があった場合に
はその上に半田保護膜を形成してしまう。[Problem 8 to be solved by the invention] In the above-mentioned conventional technology, since the solder protective film is printed immediately from the feeding unit to the solder protective film printing unit, foreign matter attached to the film carrier tape is absorbed into the solder protective film. I get into it. Furthermore, if there is an oxide film on the conductive pattern, a solder protective film is formed on it.
従って従来は、次のような問題があった。Therefore, conventionally, there have been the following problems.
（１〉 フィルムキャリアテープに付着していた異物
はそのまま半田保護膜中に残る。(1) Foreign matter attached to the film carrier tape remains in the solder protective film.
（２）化学的不純物（塩素イオン、硫酸イオン等）もそ
のまま半田保護膜中に残る。(2) Chemical impurities (chlorine ions, sulfate ions, etc.) also remain in the solder protective film.
従ってフィルムキャリアテープ上の微細パターンの接続
および腐食断線の原因となる。Therefore, it causes connection of fine patterns on the film carrier tape and disconnection due to corrosion.
本発明は以上の点に鑑みなされたものであり、フィルム
キャリアテープ上の異物、酸化膜および化学的不純物を
除去した上に半田保護膜を形成することを可能としたＴ
ＡＢ用テープキャリア製造装置を提供することを目的と
するものである。The present invention was made in view of the above points, and it is a T that makes it possible to remove foreign substances, oxide films, and chemical impurities on a film carrier tape and then form a solder protective film.
The object of the present invention is to provide an AB tape carrier manufacturing apparatus.
［課題を解決するための手段］
上記目的は、送り出し部と印刷部殿間に酸洗部、水洗部
および除電部を設けることにより、達成される。[Means for Solving the Problems] The above object is achieved by providing a pickling section, a water washing section, and a static elimination section between the feeding section and the printing section.
［作用コ
上記手段を設けたので、半田保護膜形成前にフィルムキ
ャリアテープ上の異物、化学的不純物等が除去されるよ
うになる。[Operation] Since the above means is provided, foreign matter, chemical impurities, etc. on the film carrier tape can be removed before forming the solder protective film.
「実施例］
以下、図示した実施例に基づいて本発明を説明する。第
１図には本発明の一実施例が示されている。なお、従来
と同じ部品には同じ符号を付したので説明を省略する。``Example'' The present invention will be explained below based on the illustrated example. FIG. The explanation will be omitted.
本実施例では送り出し部１と印刷部２との間に酸洗部６
、水洗部７および除電部８を設けた。このようにするこ
とにより、半田保護膜形成前にフィルムキャリアテープ
５上の異物、化学的不純物等が除去されるようになって
、フィルムキャリアテープ５上の異物、酸化膜および化
学的不純物を除去した上に半田保護膜を形成することを
可能としたＴＡＢ用テープキャリア製造装置を得ること
ができる。In this embodiment, a pickling section 6 is provided between the sending section 1 and the printing section 2.
, a water washing section 7 and a static elimination section 8 were provided. By doing this, foreign matter, chemical impurities, etc. on the film carrier tape 5 are removed before the solder protective film is formed, and the foreign matter, oxide film, and chemical impurities on the film carrier tape 5 are removed. Thus, it is possible to obtain a TAB tape carrier manufacturing apparatus that makes it possible to form a solder protective film on top of the solder protection film.
すなわち送り出し部１より送り出されたフィルムキャリ
アテープ５は酸洗部６、水洗部７、除電部８を通って、
テープ５上に付着していたゴミ等の異物および化学的不
純物を除去し、印刷部２で半田保護膜を塗布し、熱風乾
燥部９、赤外線乾燥部１０で乾燥後、巻取部４でフィル
ムキャリアテープ５を巻取る。このようにすることによ
り、事前に付着していた異物および化学的不純物はほと
んど除去することができ、異物および化学的不純物に起
因する不良率は１％以下にすることができた。That is, the film carrier tape 5 fed out from the feeding section 1 passes through a pickling section 6, a water washing section 7, a static eliminating section 8,
Foreign matter such as dust and chemical impurities adhering to the tape 5 are removed, a solder protective film is applied in the printing section 2, and after drying in the hot air drying section 9 and the infrared drying section 10, the film is removed in the winding section 4. Wind up carrier tape 5. By doing so, most of the foreign matter and chemical impurities that had adhered in advance could be removed, and the defective rate due to foreign matter and chemical impurities could be reduced to 1% or less.
以上本実施例によればフィルムキャリアテープの異物お
よび化学的不純物をほとんど除去することかでき、フィ
ルムキャリアテープの歩留まりが大幅に向上し、その工
業上におよぼす効果を非常に大きなものとすることがで
きる。As described above, according to this embodiment, most of the foreign substances and chemical impurities in the film carrier tape can be removed, the yield of the film carrier tape can be greatly improved, and its industrial effects can be greatly increased. can.
第２図には本発明の他の実施例が示されている。Another embodiment of the invention is shown in FIG.
本実施例は上述の場合とほぼ同じ構成であるが、装置全
体を帯電防止ビニルカバー１１で覆い、更にフィルムキ
ャリアテープ５が装置から出る部分の真上に、周辺のゴ
ミ等の異物を持ち込まないように高性能フィルタ１２を
取り付けた。このようにすることにより、周辺から持ち
込まれる異物を除去した空気を吹き付けることにより不
良率は０゜１％以下にすることが可能になった。従って
本実施例の装置を用いることにより、歩留まりは９９〜
９９．９％になり産業界に大幅に寄与することが可能と
なった。This embodiment has almost the same configuration as the above case, but the entire device is covered with an antistatic vinyl cover 11 to prevent foreign matter such as dust from being brought into the area directly above the part where the film carrier tape 5 exits the device. A high performance filter 12 was attached as shown. By doing this, it has become possible to reduce the defective rate to 0.1% or less by blowing air from which foreign substances brought in from the surrounding area have been removed. Therefore, by using the apparatus of this example, the yield can be increased from 99 to 99.
99.9%, making it possible to make a significant contribution to industry.
なお、印刷部の出口に除電部を追加することにより、更
に不良率が低下し歩留まりが大幅に向上する。Note that by adding a static eliminator at the outlet of the printing section, the defective rate is further reduced and the yield is significantly improved.
［発明の効果］
上述のように本発明は送り出し部と印刷部との間に酸洗
部、水洗部および除電部を設けたので、半田保護膜形成
前にフィルムキャリアテープ上の異物、化学的不純物等
が除去されるようになって、フィルムキャリアテープ上
の異物、酸化膜および化学的不純物を除去した上に半田
保護膜を形成することを可能としたＴＡＢ用テープキャ
リア製造装置を得ることができる。[Effects of the Invention] As described above, the present invention provides a pickling section, a water washing section, and a static eliminating section between the sending section and the printing section, so that foreign matter and chemical By removing impurities, it is possible to obtain a TAB tape carrier manufacturing apparatus that can remove foreign substances, oxide films, and chemical impurities on a film carrier tape, and then form a solder protective film. can.
第１図および第２図は本発明のＴＡＢ用テープキャリア
製造装置のそれぞれ異なる実施例を示す説明図、第３図
は従来のＴＡＢ用テープキャリア製造装置の説明図であ
る。
１：送り出し部、
２：印刷部、
５：フィルムキャリアテープ、
６：酸洗部、
７：水洗部、
苑 １ 目
第 ２ ｌ
第３ 目1 and 2 are explanatory diagrams showing different embodiments of the TAB tape carrier manufacturing apparatus of the present invention, and FIG. 3 is an explanatory diagram of a conventional TAB tape carrier manufacturing apparatus. 1: Feeding section, 2: Printing section, 5: Film carrier tape, 6: Pickling section, 7: Washing section, Garden 1 st 2 l 3 rd
Claims (1)
されたフィルムキャリアテープに印刷部で半田保護膜を
塗布するＴＡＢ用テープキャリア製造装置において、前
記送り出し部と印刷部との間に酸洗部、水洗部および除
電部を設けたことを特徴とするＴＡＢ用テープキャリア
製造装置。1. In a TAB tape carrier manufacturing apparatus that includes a feeding section and a printing section, and in which a solder protective film is applied to a film carrier tape fed out from the feeding section in the printing section, a pickling section is provided between the feeding section and the printing section. , a TAB tape carrier manufacturing device characterized by being provided with a water washing section and a static elimination section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29012690A JPH04162733A (en) | 1990-10-26 | 1990-10-26 | Manufacturing apparatus for tape carrier for tab |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29012690A JPH04162733A (en) | 1990-10-26 | 1990-10-26 | Manufacturing apparatus for tape carrier for tab |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04162733A true JPH04162733A (en) | 1992-06-08 |
Family
ID=17752141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29012690A Pending JPH04162733A (en) | 1990-10-26 | 1990-10-26 | Manufacturing apparatus for tape carrier for tab |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04162733A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347298A (en) * | 2004-05-31 | 2005-12-15 | Satsuma Tsushin Kogyo Kk | Method for forming film on flexible printed board and its system |
-
1990
- 1990-10-26 JP JP29012690A patent/JPH04162733A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347298A (en) * | 2004-05-31 | 2005-12-15 | Satsuma Tsushin Kogyo Kk | Method for forming film on flexible printed board and its system |
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