JPH0415898U - - Google Patents
Info
- Publication number
- JPH0415898U JPH0415898U JP5794490U JP5794490U JPH0415898U JP H0415898 U JPH0415898 U JP H0415898U JP 5794490 U JP5794490 U JP 5794490U JP 5794490 U JP5794490 U JP 5794490U JP H0415898 U JPH0415898 U JP H0415898U
- Authority
- JP
- Japan
- Prior art keywords
- parts
- template
- chip
- types
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004308 accommodation Effects 0.000 claims 1
Description
第１図は本考案の実施例による電子部品搭載装
置の部品分配器の断面図、第２図は前記部品分配
器とテンプレートの構造を示す斜視図、第３図は
前記部品分配器を備えた電子部品搭載装置の全体
構造を示す斜視図、第４図及び第５図は従来技術
による部品分配器を説明するための要部断面図、
第６図は、本考案の他の実施例による電子部品搭
載装置の部品分配器の断面図である。
２２……フレーム、４……バキユームケース、
５……吸気ダクト、６……テンプレート、６０…
…収納部、６１……収容凹部、６３……吸引孔、
１００……平面切削部。
FIG. 1 is a cross-sectional view of a component distributor of an electronic component mounting device according to an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of the component distributor and template, and FIG. 3 is a cross-sectional view of a component distributor equipped with the component distributor. A perspective view showing the overall structure of an electronic component mounting device; FIGS. 4 and 5 are sectional views of essential parts for explaining a component distributor according to the prior art;
FIG. 6 is a sectional view of a component distributor of an electronic component mounting device according to another embodiment of the present invention. 22...Frame, 4...Bakyum case,
5...Intake duct, 6...Template, 60...
...storage section, 61 ... storage recess, 63 ... suction hole,
100...Flat cutting part.
Claims (1)
種のチツプ状電子部品を収受する収容部が形成さ
れたテンプレートの上方から、搭載すべき前記複
数種のチツプ状電子部品を分配搬送する電子部品
搭載用部品分配器であつて、前記テンプレートの
収容凹部に対応する位置に、前記複数種のチツプ
状電子部品を搬送する通孔を各々開設したものに
おいて、前記テンプレートと対向する下面の高さ
が、収納部に収納される部品の大きさに応じて部
分的に異なることを特徴とする電子部品搭載用部
品分配器。 An electronic component mounting device that distributes and conveys the plurality of types of chip-shaped electronic components to be mounted from above a template in which a housing portion is formed to receive the plurality of types of chip-shaped electronic components according to the position to be mounted on the board. In the component distributor, in which through holes for conveying the plurality of types of chip-shaped electronic components are respectively opened at positions corresponding to the accommodation recesses of the template, the height of the lower surface facing the template is: A parts distributor for mounting electronic parts, characterized in that parts of the parts are different depending on the size of the parts stored in the storage part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057944U JPH0651036Y2 (en) | 1990-05-31 | 1990-05-31 | Component distributor for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057944U JPH0651036Y2 (en) | 1990-05-31 | 1990-05-31 | Component distributor for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415898U true JPH0415898U (en) | 1992-02-07 |
| JPH0651036Y2 JPH0651036Y2 (en) | 1994-12-21 |
Family
ID=31583116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990057944U Expired - Lifetime JPH0651036Y2 (en) | 1990-05-31 | 1990-05-31 | Component distributor for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651036Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278099A (en) * | 1988-04-28 | 1989-11-08 | Taiyo Yuden Co Ltd | Arrangement apparatus for chip-shaped circuit component |
-
1990
- 1990-05-31 JP JP1990057944U patent/JPH0651036Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01278099A (en) * | 1988-04-28 | 1989-11-08 | Taiyo Yuden Co Ltd | Arrangement apparatus for chip-shaped circuit component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0651036Y2 (en) | 1994-12-21 |