JPH04158510A - Semiconductor processing equipment - Google Patents
Semiconductor processing equipmentInfo
- Publication number
- JPH04158510A JPH04158510A JP28395390A JP28395390A JPH04158510A JP H04158510 A JPH04158510 A JP H04158510A JP 28395390 A JP28395390 A JP 28395390A JP 28395390 A JP28395390 A JP 28395390A JP H04158510 A JPH04158510 A JP H04158510A
- Authority
- JP
- Japan
- Prior art keywords
- chemical solution
- suckback
- sensor
- discharge nozzle
- chemical liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000000126 substance Substances 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 230000035515 penetration Effects 0.000 abstract 1
- 238000009987 spinning Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造装置に関し、特にフォトレジストの
塗布装置や百合露光後の現像装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to a photoresist coating device and a developing device after exposure.
従来、この種の半導体製造装置は、薬液吐出用ノズルか
ら一定量のフォトレジストや現像液等の薬液を、加圧気
体により押し出して半導体基板（ウェハー）上に滴下し
、スピンモータによりウェハーを回転させてウェハーへ
の薬液塗布を行なっている。薬液滴下後、ノズルに残留
する薬液が垂れるのを防止するために、減圧気体による
サックバックと称する吸い戻しを行なっている。このサ
ックバック機構は電磁弁が用いられ、−度設定すると一
定の機械的なタイミング動作を繰り返す機構になってお
り、塗布工程の途中での調整はできない構造になってい
る。Conventionally, this type of semiconductor manufacturing equipment uses pressurized gas to force out a certain amount of chemical liquid such as photoresist or developer from a chemical liquid discharge nozzle and drops it onto the semiconductor substrate (wafer), and then rotates the wafer using a spin motor. Then, the chemical solution is applied to the wafer. After the chemical liquid is dropped, in order to prevent the chemical liquid remaining in the nozzle from dripping, suction called suckback is performed using reduced pressure gas. This suckback mechanism uses a solenoid valve, and when set to - degree, repeats a certain mechanical timing operation, and has a structure that cannot be adjusted during the coating process.
上述した従来の半導体製造装置では、サックバック機構
は一定の機械的な動きを繰り返すだけであったため、薬
液の粘度や周方の変動があるとサックバック量が変動し
てしまい、その結果、薬液の滴下量が変動する。In the conventional semiconductor manufacturing equipment described above, the suckback mechanism only repeats a certain mechanical movement, so if there is a change in the viscosity or circumference of the chemical, the amount of suckback changes, and as a result, the amount of suckback changes The dripping amount fluctuates.
本発明の半導体製造装置は、薬液滴下用のノズルの先端
部に設置した薬液位置検出用センサーと、そのセンサー
の薬液位置検出信号によりサックバック機構を調整する
為のフィードバック系とを備えている。The semiconductor manufacturing apparatus of the present invention includes a sensor for detecting the position of a chemical liquid installed at the tip of a nozzle for dropping a chemical liquid, and a feedback system for adjusting the suckback mechanism based on a chemical liquid position detection signal from the sensor.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の概略構成図である。FIG. 1 is a schematic diagram of an embodiment of the present invention.
ウェハー１はスピンチャック６に真空吸着され、薬液吐
出用ノズル２からウェハー１上に薬液を滴下し、スピン
モータ７で回転しながら所望の薬液処理を行う。The wafer 1 is vacuum-adsorbed by a spin chuck 6, and a chemical liquid is dropped onto the wafer 1 from a chemical liquid discharge nozzle 2, and a desired chemical liquid treatment is performed while being rotated by a spin motor 7.
本実施例では、この薬液吐出用ノズル２の先端に薬液位
置検出センサーを設置している。そして、薬液吐出終了
時に、薬液吐出用ノズル２の先端におけるサックバック
された薬液位置を薬液位置検出センサー３で検出し、そ
のデータによりサックバックフィードバック系５が電磁
弁などのサックバック機構４を調整し、一定のサックバ
ックを行うことができる。この薬液位置検出センサー３
としては、容量センサー、透過形センサー、屈折率セン
サー等が考えられる。In this embodiment, a chemical liquid position detection sensor is installed at the tip of this chemical liquid discharge nozzle 2. Then, at the end of discharging the chemical liquid, the position of the sucked-back chemical liquid at the tip of the chemical liquid discharge nozzle 2 is detected by the chemical liquid position detection sensor 3, and based on the data, the suckback feedback system 5 adjusts the suckback mechanism 4 such as a solenoid valve. and can make constant sackbacks. This chemical liquid position detection sensor 3
Possible examples include capacitive sensors, transmission sensors, and refractive index sensors.
以上説明したように本発明は、薬液のサックバック量を
所定量に調整できるので、薬液の粘度や周方の変動があ
っても一定のサックバックを行なえるという効果がある
。As explained above, the present invention has the effect that the amount of suck back of the chemical solution can be adjusted to a predetermined amount, so that even if there are variations in the viscosity or circumference of the drug solution, constant suck back can be performed.
第１図は本発明の一実施例の概略構成図である。
１・・・ウェハー、２・・・薬液吐出用ノズル、３・・
・薬液位置検出センサー、４・・・サックバック機構、
５・・・サックバックフィードバック系、６・・スピン
チャック、７・・・スピンモータ。FIG. 1 is a schematic diagram of an embodiment of the present invention. 1... Wafer, 2... Chemical liquid discharge nozzle, 3...
・Chemical liquid position detection sensor, 4...Suckback mechanism,
5...Suckback feedback system, 6...Spin chuck, 7...Spin motor.
Claims (1)
、薬液吐出用ノズルの先端部に取り付けられ薬液滴下終
了後のサックバック量を監視するセンサーと、このセン
サーからの信号によりサックバック機構を制御するフィ
ードバック系とを備えること特徴とする半導体製造装置
。In semiconductor manufacturing equipment that applies chemical liquid to semiconductor substrates, there is a sensor attached to the tip of the chemical liquid discharge nozzle that monitors the amount of suckback after the chemical liquid is dropped, and a feedback system that controls the suckback mechanism based on the signal from this sensor. A semiconductor manufacturing device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28395390A JPH04158510A (en) | 1990-10-22 | 1990-10-22 | Semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28395390A JPH04158510A (en) | 1990-10-22 | 1990-10-22 | Semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04158510A true JPH04158510A (en) | 1992-06-01 |
Family
ID=17672365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28395390A Pending JPH04158510A (en) | 1990-10-22 | 1990-10-22 | Semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04158510A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223402A (en) * | 1999-02-02 | 2000-08-11 | Tokyo Electron Ltd | Coating film forming method and coating equipment thereof |
| WO2001097983A1 (en) * | 2000-06-19 | 2001-12-27 | Mykrolis Corporation | Process and system for determining acceptability of a fluid dispense |
| US6617079B1 (en) | 2000-06-19 | 2003-09-09 | Mykrolis Corporation | Process and system for determining acceptibility of a fluid dispense |
| KR20030096854A (en) * | 2002-06-18 | 2003-12-31 | 삼성전자주식회사 | Injector for spray process gas |
| KR100476862B1 (en) * | 1997-06-23 | 2005-07-12 | 삼성전자주식회사 | Apparauts for checking injection state of wafer coating equipment |
| JP2013062330A (en) * | 2011-09-13 | 2013-04-04 | Tokyo Electron Ltd | Liquid processing device, liquid processing method, and memory medium |
| JP2016182540A (en) * | 2015-03-25 | 2016-10-20 | 旭有機材株式会社 | Liquid discharge device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6421924A (en) * | 1987-07-17 | 1989-01-25 | Oki Electric Ind Co Ltd | Resist dropping apparatus |
-
1990
- 1990-10-22 JP JP28395390A patent/JPH04158510A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6421924A (en) * | 1987-07-17 | 1989-01-25 | Oki Electric Ind Co Ltd | Resist dropping apparatus |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100476862B1 (en) * | 1997-06-23 | 2005-07-12 | 삼성전자주식회사 | Apparauts for checking injection state of wafer coating equipment |
| JP2000223402A (en) * | 1999-02-02 | 2000-08-11 | Tokyo Electron Ltd | Coating film forming method and coating equipment thereof |
| WO2001097983A1 (en) * | 2000-06-19 | 2001-12-27 | Mykrolis Corporation | Process and system for determining acceptability of a fluid dispense |
| US6617079B1 (en) | 2000-06-19 | 2003-09-09 | Mykrolis Corporation | Process and system for determining acceptibility of a fluid dispense |
| KR20030096854A (en) * | 2002-06-18 | 2003-12-31 | 삼성전자주식회사 | Injector for spray process gas |
| JP2013062330A (en) * | 2011-09-13 | 2013-04-04 | Tokyo Electron Ltd | Liquid processing device, liquid processing method, and memory medium |
| JP2016182540A (en) * | 2015-03-25 | 2016-10-20 | 旭有機材株式会社 | Liquid discharge device |
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