JPH04156000A - Semiconductor positioning device - Google Patents

Abstract

PURPOSE:To minimize the shock of fall in positioning of a semiconductor element by providing a transfer mechanism, which transfers the semiconductor element, capably in vertical motion at the central position of the recess, and equipping this transfer mechanism with a suction mechanism, which sucks the semiconductor element. CONSTITUTION:In a condition where a receiving shaft 23 is lifted, a semiconductor is made to stand by, and the receiving shaft 24 receives once the packaged semiconductor element 10 loaded by a pick and place mechanism 26, and next the shaft 24 sucks the element 10. Next, the receiving shaft 24 is lowered until the lead of the element 10 abuts on or comes close to the tapered part 16. Next, when the receiving shaft 24 is lowered after stopping the suction of the shaft 24, the element 10 goes down with the lead 11 sliding on the tapered part 16 for positioning, and when it has slid down so that the energy of the weight of the element 10 may be eliminated, it is automatically positioned.

Description

[Detailed description of the invention]

"Purpose of invention"

FIELD OF THE INVENTION The present invention relates to a positioning device for packaged semiconductor devices. BACKGROUND OF THE INVENTION In recent years, as electronic components, particularly semiconductor devices, have become more dense and highly integrated, there has been a significant trend toward increased number of terminals and narrower pitches in semiconductor devices. On the other hand, a measuring device for testing the electrical characteristics of a semiconductor element is also required to have high measurement precision and high precision handling. In particular, this high-precision handling is required to be able to handle semiconductor devices without causing external damage, such as mold chipping or lead bending. Conventionally, the positioning structure for horizontal conveyance handlers is
As shown in the figure, a positioning section 5 has a tapered surface 3 on the inner circumferential surface and a flat mounting surface 4 for holding the packaged semiconductor device 2 that has been sucked and loaded by the suction mechanism 1. At this position, suction is stopped and the semiconductor element 2 is dropped, and after the semiconductor element 2 is positioned on the mounting surface 4, the element 2 is again sucked by the suction mechanism 1 and transported to the next measurement section.

[Problem to be solved by the invention]

Since the lead pitch of the conventional packaged semiconductor device described above is about 1.0 to 0.81, the lead width is sufficient in this case, and it is difficult to drop the conventional semiconductor device into the positioning part 5. Even with the positioning method, the above element 2
It had the strength to prevent the lead from bending. However, as the recent trend toward higher integration has led to more pins and narrower pitches, the lead width of semiconductor devices has decreased to 0.
．． When the length is 2 to 0.15 m, the thickness is also about 0.1 square meters, and the lead is very likely to bend. For this reason, in the conventional drop-in method, the dead weight of the semiconductor element and the force of potential energy are applied to the leads, and there is a high possibility that the leads may be bent or otherwise damaged in appearance. Furthermore, this type of horizontal conveyance handler has the disadvantage that the processing speed is slower than that of the gravity drop type. There was also a problem with throughput. The present invention was developed in order to solve the above-mentioned conventional problems, and by minimizing the impact of dropping during positioning of semiconductor elements, it is possible to prevent appearance damage such as bending of the board. Moreover, the purpose is to improve the processing speed during positioning. "Structure of the Invention" [Means for Solving the Problems] In order to achieve the above object, the present invention provides a recess corresponding to the external shape of a packaged semiconductor element, and a side wall surface of the recess formed on the surface of the semiconductor element. a positioning tapered part provided so that the lead falls along; a delivery mechanism provided vertically movably in the center of the recessed part for delivering the semiconductor device; The device is configured to include a suction mechanism that suctions the semiconductor element.

[For use]

As described above, the present invention is provided with a vertically movable delivery mechanism for delivering a semiconductor element at the central position of the tapered part for positioning, and this delivery mechanism temporarily fixes the semiconductor element by suction at least when the semiconductor element is moved. Once the packaged semiconductor device is received, the semiconductor device's lead is gently dropped along the positioning taper part to eliminate the energy of its own weight, so the impact when the semiconductor device is dropped is reduced. can be minimized, and lead bending does not occur. With such a configuration, it is possible to perform positioning of a plurality of elements simultaneously and with high precision, and also to handle a plurality of elements at the same time, thereby making it possible to improve processing speed.

【Example】

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor element positioning apparatus according to the present invention will be described below with reference to the drawings. In this example, the flat-packaged semiconductor element 10 has lead arrays 11 arranged on its four sides, for example. Moreover, the exchange unit 13 provided in the main body 12 of the apparatus shown in FIG. The unit 13 is provided so that it can be attached and replaced with one touch via a latch mechanism 14 provided on the periphery of the unit 13. With this replaceable structure, not only can the semiconductor element 10, which is the object to be positioned, be used for positioning not only one type but also many types, and the switching operation can be simplified. The structure of this replacement unit 13 is as follows:
The unit 13 is provided with, for example, four concave tapered portions 16 for positioning. Each tapered portion 16 has four tapered blocks 17.
A rectangular positioning portion 1 that conforms to the outer shape of the semiconductor element 2.
8, and the taper block 17 has a tapered surface that is smooth and has at least an insulating property.In this example, aluminum is coated with Toughlam, and the taper angle is, for example, 60. ″～45
It has a Taber angle of @. Note that this Taber angle can be arbitrarily selected according to the device structure so that the lead tip row of the semiconductor device to be measured 10 falls along the tapered wall surface.
The number of positioning parts 18 is not limited to four, and any number can be provided as appropriate. Further, the opening 16a of the tapered portion 16 is larger than the outer size of the lead 11 of the element 10.
Moreover, the length of the position near the bottom of the tapered portion 16 is set to the length of the lead 11.
The lead 11 is configured to be locked and positioned at the position with the same outer size as the lead 11. Further, as shown in FIG. 4, this replacement unit 13 is formed with a positioning hole 20 that fits into a positioning pin 19 of the unit 13 provided in the main body 12 of the apparatus. Furthermore, a semiconductor element delivery mechanism 21 that moves up and down at the center of the bottom of the positioning section 18 is provided. This delivery mechanism 21 operates a shaft 24 via an actuator for vertical movement, in this example, an interlocking piece 23 provided on a pneumatic cylinder 22. The suction mechanism 25 directed toward the device is connected to a control mechanism for controlling suction stop, so that the element 10 can be suctioned by the shaft 24 or the suction can be stopped. In FIG. 5, 26 is a pick-and-place mechanism that sucks and loads semiconductor devices 10 from an untested tray, for example, to a positioning position, and 27 simultaneously sucks a plurality of positioned semiconductor devices 10 to a test site. It is a pick-and-place mechanism that transports
28 is a heater buried in the lower part of the replacement unit 13, and is provided to keep the element 10 warm without cooling it in the positioning device when the semiconductor element 10 is measured in a high-temperature environment test. It is. Further, in FIG. 6, numeral 32 is a device proper to which the positioning device of this example is applied, and this prober 32 includes a tray loader system 30 for loading or unloading a tray 33 in which elements 10 are arranged and accommodated, and A plurality of elements 10 taken out from 33 are mounted on an inspection table,
It consists of an inspection stage system 31 that transports the element 10 to the inspection section. A transfer mechanism 35 for transferring the element 10 is provided between the tray loader system 30 and the inspection stage system 31. Furthermore, the plurality of elements 10 positioned in the unit 13 are simultaneously suction-held and transferred onto the inspection table 36 of the inspection stage system 31 to be tested. Next, the operation of the above embodiment will be explained. In the operation sequence shown in FIG. 5, the semiconductor device 10 is placed on standby by the receiver with the shaft 24 raised as shown in FIG. The packaged semiconductor device 10 is first received by the receiving shaft 24, and then, as shown in FIG.
suction to. Next, as shown in Figure (D), the receiver connects the shaft 24 to the element 1.
The lead of 0 is brought into contact with the tapered portion 16 or is lowered to near contact.Next, the receiver stops the suction of the shaft 24, and then the receiver lowers the shaft 24, so that the element 10 reaches (E).
As shown in the figure, when the lead 11 of the semiconductor element 10 moves gently along the positioning tapered part 16 and slides down so that the energy of the weight of the element 10 is eliminated, the element 10 is automatically positioned. Such a positioning method can minimize the impact when the semiconductor element 10 is dropped, and there is little risk of lead bending or the like. After being positioned, the receiver raises the shaft 24 as shown in Figure (F), attracts suction at the position where it contacts the bottom surface of the element 10, and after raising it further, the receiver raises the shaft 24 at a predetermined position. At the same time, the pick-and-place mechanism 27 suctions and transports the element 10 to the test site. In addition, it is possible to simultaneously position multiple objects with an accuracy of ±0.1.
Since it is possible to carry out processing within the range of - and handle simultaneously, it is possible to improve the processing speed compared to the conventional method. "Effects of the Invention" As is clear from the above, the present invention has the following useful effects. That is, by minimizing the impact of dropping during positioning of the semiconductor element, external damage such as lead bending will not occur, and the processing speed during positioning can be improved.

[Brief explanation of the drawing]

1 to 5 show an embodiment of the positioning device for semiconductor elements according to the present invention. FIG. 1 is a plan view of a replaceable unit of the positioning device, and FIG.
An enlarged X-ray sectional view, FIG. 3 is a front sectional view showing the inside of the device, FIG. 4 is a side sectional view showing the inside of the device, and FIGS. 5 A to H
6 is an explanatory diagram showing a sequence of positioning operations, FIG. 6 is an explanatory plan view of a device prober, and FIG. 7 is an explanatory cross-sectional diagram illustrating a conventional positioning method. 10... Semiconductor element 13... Replacement unit 16... Positioning taper section 21... Delivery mechanism 22... Actuator 25... Suction mechanism Patent applicant Tokyo Electron Ltd. Patent applicant
Tokyo Electron Yamanashi Co., Ltd. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] (1) a recess corresponding to the external shape of the packaged semiconductor element; a side wall surface of the recess; a positioning tapered part provided so that the leads of the semiconductor element fall along;
A delivery mechanism is provided in the central position of the recess so as to be movable up and down and transfers the semiconductor element, and the delivery mechanism includes at least a suction mechanism that sucks the semiconductor element when the semiconductor element is moved. A positioning device for semiconductor elements.