JPH04155887A - Component mounting method - Google Patents

Component mounting method

Info

Publication number
JPH04155887A
JPH04155887A JP2279130A JP27913090A JPH04155887A JP H04155887 A JPH04155887 A JP H04155887A JP 2279130 A JP2279130 A JP 2279130A JP 27913090 A JP27913090 A JP 27913090A JP H04155887 A JPH04155887 A JP H04155887A
Authority
JP
Japan
Prior art keywords
solder
board
holes
jig
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2279130A
Other languages
Japanese (ja)
Inventor
Takeshi Sagawa
佐川　武司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2279130A priority Critical patent/JPH04155887A/en
Publication of JPH04155887A publication Critical patent/JPH04155887A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE:To enhance a component in lead bonding reliability when the component provided with leads is mounted on a board by a method wherein a jig which sucks up molten solder through a capillary phenomenon is provided on both the side where the components are mounted and the other side of the board. CONSTITUTION:A connector 2 is aligned so as to enable its leads 3 to be inserted into flux applied through-holes 1a bored in a board 1 at prescribed positions. On the other hand, a solid solder ring 6 is inserted so as to sandwich the board 1 with the connector 2, and a jig 5 which is formed of resin and provided with holes 5a at positions corresponding to the through-holes 1a is placed on the solder rings 6 enabling the leads 3 to be inserted into the holes 5a, where the inner walls of the holes 5a are rough. In this state, when a reflow process is carried out, solder comes into contact with the rough wall faces of the holes 5a and is sucked up toward the jig 5 to form solder fillets 4.

Description

【発明の詳細な説明】 〔概要〕 部品実装方法に係り、特に基板にリードを挿入した部品
を半田付けにて固着することで部品の実装を行う部品実
装方法に関し、 リードを有する部品を基板に実装する際のリード接合の
信頼性を向上することを目的とし、基板上に所定間隔を
もって穿孔された孔に部品から突出するリードを挿入し
、該挿入されたリードに対して、そのコネクタ挿入面と
反する面に半田リングを挿入し、該半田ＩＪソング上か
ら、該基板の孔と対応する位置に孔が穿孔された治具を
挿入し、該基板に該コネクタのリードを、また該リード
に該治具を挿入した状態でリフローすることで、該コネ
クタと反する面の半田フィレットを治具とリード間の毛
細化現象によって形成するよう構成する。[Detailed Description of the Invention] [Summary] This invention relates to a component mounting method, in particular a component mounting method in which a component with leads inserted into a board is fixed by soldering. In order to improve the reliability of lead joining during mounting, the leads protruding from the component are inserted into holes drilled at predetermined intervals on the board, and the connector insertion surface is Insert a solder ring on the opposite side, insert a jig with a hole drilled at a position corresponding to the hole in the board from above the solder IJ song, and attach the lead of the connector to the board and the lead to the lead. By performing reflow with the jig inserted, a solder fillet on the side opposite to the connector is formed by a capillary phenomenon between the jig and the leads.

〔産業上の利用分野〕[Industrial application field]

本発明は、部品実装方法に係り、特に基板にす−ドを挿
入した部品を半田付けにて固着することで部品の実装を
行う部品実装方法に関するものである。The present invention relates to a component mounting method, and more particularly to a component mounting method in which components are mounted by inserting a board into a board and fixing the component by soldering.

リードを有する部品の一例としてコネクタがあるが、こ
のコネクタを実装する際の実装形態としてベーパフェイ
ズソルダリング（略してｖｐｓ）と呼ばれるものがある
。An example of a component having leads is a connector, and a method of mounting this connector is called vapor phase soldering (VPS for short).

ＶＰＳを第４回を用いて簡単に説明すると、基板４０に
コネクタ４１のリード４２を挿入し、半田リング４３を
配置した状態で基板全体をベーパ槽に挿入することで、
基板４０にコネクタ４１を実装するものである。To briefly explain VPS using the 4th article, by inserting the lead 42 of the connector 41 into the board 40 and inserting the entire board into the vapor tank with the solder ring 43 placed,
A connector 41 is mounted on a board 40.

〔従来の技術〕[Conventional technology]

従来、第５図に示すように、基Ｆｉ５０上に後述説明す
るコネクタ５１のリード形成位置に対応して穿孔される
孔（スルーホール）に、当該リード５２を挿入し、コネ
クタ搭載面と反する面にリング状の半田を配置した状態
で熱を加えると、半田が溶融し基板５０とリード５２が
接合され、基板５０にコネクタ５１が実装される。Conventionally, as shown in FIG. 5, the leads 52 are inserted into holes (through holes) that are drilled on the base Fi 50 corresponding to the lead formation positions of the connector 51, which will be described later, and When heat is applied to a ring-shaped solder placed on the board, the solder melts, the board 50 and the leads 52 are joined, and the connector 51 is mounted on the board 50.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、第５図に示すように、コネクタは基板に
対して重力方向に位置された状態で熱を加えるため、溶
融した半田が重力に従って下方向（つまりコネクタ搭載
方向）流動するため、当該コネクタ搭載面と反する面の
部分の半田フィレットが正常に形成されず、リードの強
度に影響を与えてくる。However, as shown in Figure 5, since heat is applied to the connector while it is positioned in the direction of gravity with respect to the board, the molten solder flows downward (that is, in the connector mounting direction) according to gravity. The solder fillet on the opposite surface is not formed properly, which affects the strength of the lead.

また、下方向に流動する半田はその下がっていた分半田
の量が多くなることから、半田間でショートを起こす要
因ともなる。Further, since the amount of solder flowing downward increases by the amount of solder flowing downward, this may cause a short circuit between the solders.

尚、コネクタを基板に対して重力方向（下側）に位置さ
せるのは、リード側に半田リングを供給するためである
。Note that the reason why the connector is positioned in the direction of gravity (lower side) with respect to the board is to supply the solder ring to the lead side.

従って、本発明はり一ドを有する部品を基板に実装する
際のリード接合の信頼性を向上することを目的とするも
のである。Therefore, it is an object of the present invention to improve the reliability of lead bonding when mounting a component having a lead on a board.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的は、基ｖｉ１上に所定間隔をもって穿孔された
孔１ａに部品２から突出するり一ド３を挿入し、 該挿入されたり一ド３に対して、そのコネクタ挿入面と
反する面に半田リング６を挿入し、該半田リング６の上
から、該基板１の孔１ａと対応する位置に孔５ａが穿孔
された治具５を挿入し、 該基板１に該リード３を、また該リード３に該治具５を
挿入した状態でリフローすることで、該コネクタ２と反
する面の半田フィレット４を該治具５と該リード３間の
毛細化現象によって形成することを特徴とする部品実装
方法、にょって達成することができる。The above purpose is to insert the lead 3 protruding from the component 2 into the holes 1a drilled at predetermined intervals on the base vi1, and to solder the inserted lead 3 to the surface opposite to the connector insertion surface. A ring 6 is inserted, and a jig 5 with a hole 5a drilled at a position corresponding to the hole 1a of the board 1 is inserted from above the solder ring 6, and the lead 3 is attached to the board 1. 3, by performing reflow with the jig 5 inserted, a solder fillet 4 on the side opposite to the connector 2 is formed by a capillary phenomenon between the jig 5 and the leads 3. This can be achieved by a method.

〔作用〕[Effect]

即ち、本発明においては、部品が搭載される面と反する
面に溶融する半田を毛細化現象にて吸い上げる治具を設
けている。That is, in the present invention, a jig is provided on the surface opposite to the surface on which the component is mounted to suck up the melted solder by capillary phenomenon.

よって、溶融して重力方向に下がろうとする半田が基板
上の治具に接触することで、毛細化現象の要因となる、
半田分子間の凝縮力と、半田と治具との付着力の大小関
係によって、半田が治具を濡らす量が大きい（付着力が
大きい）時は半田が上昇するということに基づき、コネ
クタ搭載面と反する面の半田フィレットをも形成するこ
とが可能となる。Therefore, when the solder melts and tries to fall in the direction of gravity, it comes into contact with the jig on the board, causing capillary phenomenon.
The connector mounting surface is It is also possible to form a solder fillet on the opposite side.

〔実施例〕〔Example〕

以下、本発明の実施例について第１図乃至第３図を用い
て詳細に説明する。Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 3.

第１図は、本発明の実施例を示す図であり、第２図は、
本発明の治具の斜視図であり、第３図は、半田の溶融状
態を示す図であり、同図（ａ）は、その初期時、 同図（ｂ）は、リフロー時、 同図（Ｃ）は、固着時を示す。FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing an embodiment of the present invention.
FIG. 3 is a perspective view of the jig of the present invention, and FIG. 3 is a diagram showing the molten state of solder, in which FIG. C) shows the time of fixation.

第１図乃至第３図において、１ば基板、ｌａば孔（以下
、スルーホールと略す）スルーホール）。In FIGS. 1 to 3, 1 indicates a substrate, and 1 indicates a hole (hereinafter abbreviated as "through hole").

２はコネクタ、３はリード、４は半田フィレット５ば治
具、５ａば孔、６ば半田リング、７ば溶融半田をそれぞ
れ示す。2 is a connector, 3 is a lead, 4 is a solder fillet, 5 is a jig, 5 is a hole, 6 is a solder ring, and 7 is molten solder.

尚、第１図乃至第３図において同一符号を付したものは
同一対象物をそれぞれ示す。Note that in FIGS. 1 to 3, the same reference numerals indicate the same objects.

第１図に示すように、フラックスがその表面に塗布され
た基板１上の所定位置に穿孔されたスルーホール１ａに
、そのリード３が挿入されるようにコネクタ２を位置合
わせし、挿入する（第３図（ａ）参照）。As shown in FIG. 1, the connector 2 is aligned and inserted so that the leads 3 are inserted into the through holes 1a drilled at predetermined positions on the board 1 whose surface is coated with flux ( (See Figure 3(a)).

一方、このコネクタ２が挿入された反対側の面には基板
１を挟み込むよう面形の半田リング６を挿入し、更にそ
の半田リング６の上に第２図に示すように同じく基板１
に穿孔されたスルーホール１ａと対応する位置に孔５ａ
を有する樹脂から構成され、且つその孔５ａの壁面が粗
い治具５をリード３に挿入する（同じく第３図（ａ）参
照）。On the other hand, a planar solder ring 6 is inserted into the opposite side to which the connector 2 is inserted so as to sandwich the board 1, and the same board 1 is placed on top of the solder ring 6 as shown in FIG.
A hole 5a is formed at a position corresponding to the through hole 1a drilled in
A jig 5 made of a resin having a rough hole 5a and having a rough wall is inserted into the lead 3 (see also FIG. 3(a)).

上記治具５に穿孔された孔５ａはリード３の径よりも片
側０．２〜０．３閣大きい径にて構成されている。The hole 5a drilled in the jig 5 has a diameter 0.2 to 0.3 degrees larger on one side than the diameter of the lead 3.

この状態をもって、リフロー（ｖｐＳ）すると、溶融す
る半田７は元の状態、すなわちリングの形状を保とうと
する（第３図（ｂ）参照）。その後基板１に穿孔された
スルーホール１ａを通って下がっていこうとするが、溶
融した時に表面の粗い孔５ａの壁面に半田が接触するこ
とで半田の付着力が半田分子間の凝縮力に優り、リード
３と治具５の隙間から上がっていこうとする（毛細化現
象）。When reflowing (vpS) is performed in this state, the melted solder 7 tries to maintain its original state, that is, the ring shape (see FIG. 3(b)). After that, the solder tries to go down through the through hole 1a drilled in the substrate 1, but when it melts, the solder comes into contact with the wall of the hole 5a, which has a rough surface, and the adhesion force of the solder exceeds the condensation force between the solder molecules. , tries to rise through the gap between the lead 3 and the jig 5 (capillary phenomenon).

従って、半田が上に上がっていきその状態で冷却すると
第１図および第３図（ｃ）に示すように、半田が基板１
と反する方向に吸い上げられ、半田フィレット４が図中
のように形成される。Therefore, if the solder rises to the top and is cooled in that state, the solder will rise to the top of the board as shown in Figures 1 and 3 (c).
The solder fillet 4 is formed as shown in the figure.

このような構成とすることで半田フィレット４ばコネク
タ側に特に下がることなく、コネクタ挿入面と反する面
にも半田フィレットが形成されることになり、接合の信
鱈性が向上する。With this configuration, the solder fillet 4 does not particularly fall toward the connector side, and the solder fillet is also formed on the surface opposite to the connector insertion surface, thereby improving the reliability of the joint.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明においてば、リードを基板の
孔に接合する場合に重力による半田を下りを防止するこ
とができ、その半田の下りに基づくショート等が発生す
ることが無くなるため、信頼性の高い半田付けを行うこ
とができ、部品の組立精度に依存する必要もなくなる。As explained above, according to the present invention, it is possible to prevent the solder from falling down due to gravity when connecting the leads to the holes in the substrate, and since short circuits etc. due to the solder falling down do not occur, the reliability is improved. It is possible to perform soldering with a high degree of accuracy, and there is no need to rely on the precision of assembling parts.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明の実施例を示す図であり、第２図は、
治具斜視図であり、 第３図は、半田の溶融状態を示す図であり、第４図は、
本発明の利用分野を示す図であり、第５図は、従来例と
課題を示す回である。 図において、 １・・・・基板。 １ａ・・・孔（スルーホール）。 ２・・・・コネクタ。 ３　・　・　・　・リード。 ４・・・・半田フィレット。 ５・・・・治具。 ５ａ・・・孔。 をそれぞれ示す。 参奔θ目の実絶４列［がＴ口 第１図 第２図 シ台　具　傘キ　千屯　圀 ス ！１１時 （Ｃ） 半田のシ容高１に町、１示Ｔ口 第３図 、不、？８Ｒノｔ’ｌ用分＊ｓ小’７＠第４図 イｌ仔１１と書平即８芋ＶＩ２］ 第５図FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing an embodiment of the present invention.
FIG. 3 is a perspective view of the jig, FIG. 3 is a diagram showing a molten state of solder, and FIG.
FIG. 5 is a diagram showing the field of application of the present invention, and FIG. 5 is a diagram showing a conventional example and problems. In the figure: 1...Substrate. 1a...hole (through hole). 2...Connector. 3 ・ ・ ・ ・Lead. 4...Solder fillet. 5...Jig. 5a... hole. are shown respectively. The 4th line of the 4th row of the 3rd entry [T-guchi 1st fig. 11:00 (C) Handa's High School 1, Town, 1, T Exit, Figure 3, No, ? Figure 5

Claims (1)

【特許請求の範囲】 　基板（１）上に所定間隔をもって穿孔された孔（１ａ
）に部品（２）から突出するリード（３）を挿入し、 該挿入されたリード（３）に対して、そのコネクタ挿入
面と反する面に半田リング（６）を挿入し、 該半田リング（６）の上から、該基板（１）の孔（１ａ
）と対応する位置に孔（５ａ）が穿孔された治具（５）
を挿入し、 該基板（１）に該リード（３）を、また該リード（３）
に該治具（５）を挿入した状態でリフローすることで、
該コネクタ（２）と反する面の半田フィレット（４）を
該治具（５）と該サード（３）間の毛細化現象によって
形成することを特徴とする部品実装方法。[Claims] Holes (1a) drilled at predetermined intervals on the substrate (1).
), insert the lead (3) protruding from the component (2) into the inserted lead (3), insert the solder ring (6) on the surface opposite to the connector insertion surface, and then insert the solder ring (6) into the inserted lead (3). 6) from above, the hole (1a) of the substrate (1)
) A jig (5) with a hole (5a) drilled at a position corresponding to
Insert the lead (3) into the board (1) and the lead (3)
By reflowing with the jig (5) inserted into the
A component mounting method characterized in that a solder fillet (4) on a surface opposite to the connector (2) is formed by a capillary phenomenon between the jig (5) and the third (3).
JP2279130A 1990-10-19 1990-10-19 Component mounting method Pending JPH04155887A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2279130A JPH04155887A (en) 1990-10-19 1990-10-19 Component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2279130A JPH04155887A (en) 1990-10-19 1990-10-19 Component mounting method

Publications (1)

Publication Number Publication Date
JPH04155887A true JPH04155887A (en) 1992-05-28

Family

ID=17606854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2279130A Pending JPH04155887A (en) 1990-10-19 1990-10-19 Component mounting method

Country Status (1)

Country Link
JP (1) JPH04155887A (en)

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