JPH0415534A - Pressure measuring instrument - Google Patents
Pressure measuring instrumentInfo
- Publication number
- JPH0415534A JPH0415534A JP12021590A JP12021590A JPH0415534A JP H0415534 A JPH0415534 A JP H0415534A JP 12021590 A JP12021590 A JP 12021590A JP 12021590 A JP12021590 A JP 12021590A JP H0415534 A JPH0415534 A JP H0415534A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- pressure
- sealed chamber
- enclosed chamber
- detection element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 23
- 239000012298 atmosphere Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 102220007331 rs111033633 Human genes 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はひずみ検出素子を用いた圧力測定装置に関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a pressure measuring device using strain sensing elements.
従来の技術
従来、この種の圧力測定装置は第4図に示すよ2 \
−
うな構成であった。図に示すように、密閉室18には減
圧装置14と圧力センサ16が設けられている。圧力セ
ンサ15はねじ部2oで密閉室のねじ部19に接続され
、密閉室18内の圧力を電気信号に変換する。この電気
[信号はコネクタ21゜22を介してマイコン16に伝
達され、数倣化されて、制御部17に伝達され、圧力表
示と圧力制御を行なっている。Prior Art Conventionally, this type of pressure measuring device is shown in Fig. 2.
− It had a similar structure. As shown in the figure, the sealed chamber 18 is provided with a pressure reducing device 14 and a pressure sensor 16. The pressure sensor 15 is connected to a threaded portion 19 of the sealed chamber through a threaded portion 2o, and converts the pressure within the sealed chamber 18 into an electrical signal. This electric signal is transmitted to the microcomputer 16 via the connectors 21 and 22, converted into a digital signal, and transmitted to the control section 17, where pressure display and pressure control are performed.
発明が解決しようとする課題
このような従来の構成では、圧力センサ16を気密性を
保ちながら密閉室18に固着しなければならない。例え
ば圧力センサ15と密閉室18の両方の接続部にねじ部
19.20を設け、気密性を保ちつつねじ部19.20
を締めつけて圧力センサ15を密閉室18に固定する。Problems to be Solved by the Invention In such a conventional configuration, the pressure sensor 16 must be fixed to the sealed chamber 18 while maintaining airtightness. For example, a threaded portion 19.20 is provided at the connection portion of both the pressure sensor 15 and the sealed chamber 18, and the threaded portion 19.20 is provided while maintaining airtightness.
The pressure sensor 15 is fixed in the sealed chamber 18 by tightening.
さらにコネクタ21.22を介してセンサ15とセンサ
回路とを′重置的に接続しなければならない。Furthermore, the sensor 15 and the sensor circuit must be connected in an overlapping manner via the connectors 21, 22.
また、このようにしてセンサ16の感圧部は密閉室18
内の雰囲気に直接接触するので、センサ15の感圧部が
汚染し、圧力l1111定精度を長期間維3 \
持することが困難であった。In addition, in this way, the pressure sensitive part of the sensor 16 is connected to the closed chamber 18.
Since the sensor 15 comes into direct contact with the internal atmosphere, the pressure sensitive part of the sensor 15 becomes contaminated, making it difficult to maintain constant pressure accuracy for a long period of time.
本発明はこのような課題を解決するもので、圧力センサ
を密閉室に連結するのに必要な部品を省略し、センサの
設置工数を削減するとともに、圧力センサの汚染を防止
して長期間にわたり圧力測定精度を維持できる圧力測定
装置を提供することを目的とするものである。The present invention solves these problems by omitting the parts necessary to connect the pressure sensor to a sealed chamber, reducing the number of man-hours required for installing the sensor, and preventing contamination of the pressure sensor so that it can be used for a long period of time. It is an object of the present invention to provide a pressure measuring device that can maintain pressure measurement accuracy.
課題を解決するための手段
この課題を解決するために本発明は、密閉室と、ひずみ
検出素子と、前記ひずみ検出素子の駆動と信号処理を行
う手段と、前記密閉室を加圧あるいは減圧する圧力制御
装置と、前記ひずみ検出素子や圧力制御装置を制御する
制御部とを備え、前記ひずみ検出素子を前記密閉室の外
壁面に固着し、前記圧力制御装置により前記密閉室を加
圧あるいは減圧したとき、[)IJ記密閉室内の圧力を
外壁のひずみとして前記ひずみ検出素子により検知し、
前記制御部にて圧力変化として計測するようにしたもの
である。Means for Solving the Problems In order to solve the problems, the present invention includes a sealed chamber, a strain detection element, means for driving and signal processing of the strain detection element, and pressurizing or depressurizing the sealed chamber. It includes a pressure control device and a control unit that controls the strain detection element and the pressure control device, the strain detection device is fixed to the outer wall surface of the sealed chamber, and the pressure control device pressurizes or depressurizes the sealed chamber. When [) IJ the pressure inside the sealed chamber is detected as a strain on the outer wall by the strain detection element,
The control unit measures the change in pressure.
作 用
この構成に」:す、ひずみ検出素子を密閉室の壁面の外
側に固着することにより密閉室内の圧力を測定するとと
ができるので、従来のように、圧力センサと密閉室に特
種な接続加工を行う必要がない。その結果、接続部品が
不要に々るとともに、接続加工の工程も削減できる。Function: With this configuration, the pressure inside the sealed chamber can be measured by fixing the strain sensing element to the outside of the wall of the sealed chamber. There is no need for processing. As a result, the number of connecting parts becomes unnecessary, and the process of connection processing can also be reduced.
また、密閉室の壁面の外側にひずみ検出素子を固着する
ので、圧力測定時に密閉室内の雰囲気に接触しない。そ
の結果、密閉室内に存在するガスや油煙によりひずみ検
出素子が汚染されることがなく、圧力測定精度が長期間
にわたり保持されることとなる。Furthermore, since the strain detection element is fixed to the outside of the wall of the sealed chamber, it does not come into contact with the atmosphere inside the sealed chamber when measuring pressure. As a result, the strain detection elements are not contaminated by gas or oil smoke existing in the sealed chamber, and pressure measurement accuracy is maintained over a long period of time.
実施例
以下、本発明の一実施例の圧力測定装置を図面を用いて
説明する。EXAMPLE Hereinafter, a pressure measuring device according to an example of the present invention will be explained with reference to the drawings.
第1図は圧力測定装置のブロック図を示す。図に示すよ
うに密閉室6に、圧力制御装置1が接続される。密閉室
6の外壁面6の外側にひずみ検出センサ2が固着され、
その(言号はセンサ回路3に接続され、センサ回路3で
処理されたセンサ信号51、 。FIG. 1 shows a block diagram of a pressure measuring device. As shown in the figure, a pressure control device 1 is connected to the sealed chamber 6. A strain detection sensor 2 is fixed to the outside of the outer wall surface 6 of the sealed chamber 6,
The sensor signal 51 is connected to the sensor circuit 3 and processed by the sensor circuit 3.
はマイクロコンピュータ(以下マイコンと呼ぶ)4のA
/Dポートに接続される。またマイコン4は商用電源9
に低圧トランス8と定電圧発生回路7を介して接続され
る。is a microcomputer (hereinafter referred to as microcomputer) 4 A
/Connected to D port. Also, the microcomputer 4 is connected to the commercial power supply 9.
is connected to via a low voltage transformer 8 and a constant voltage generating circuit 7.
第2図にひずみ挾出素子の概略構成を示す。基板10に
は通常電気絶縁物で作成された薄板が用いられる。基板
1oの表面には金属線抵抗線11が設けられ、金属抵抗
線11にはリード線12が接続されている。基板10を
密閉室5の外壁6への固着方法は第1表に示すように、
基板10の材質に適合する接着剤を選択して用い、接着
ずればよい。FIG. 2 shows a schematic configuration of the strain extrusion element. The substrate 10 is usually a thin plate made of an electrical insulator. A metal wire resistance wire 11 is provided on the surface of the substrate 1o, and a lead wire 12 is connected to the metal resistance wire 11. The method of fixing the substrate 10 to the outer wall 6 of the sealed chamber 5 is as shown in Table 1.
An adhesive suitable for the material of the substrate 10 may be selected and used, and the adhesive may be bonded.
6 ・\−7
ひずみ検出素子2の動作、すなわち、「物理現象」−「
機械的ひずみ」−「電気信号」への変換器としての動作
を第3図に示す。第2図の金属抵抗線11の抵抗値をR
1とすると、R1=ρIV、/aである。ここで、2は
金属抵抗線の長さ、aは断面層、ρは比抵抗である。い
ま金属抵抗線が外力により軸線方向に引張られると、金
属抵抗線は長さが7℃だけ伸び、断面積がΔa、比抵抗
がΔρだけ便化すると、抵抗の変化率は
ΔR/R−Δfl / R−A a / a十Δρ/ρ
・・・・・・・・・・・・<1)で、ひずみεは
ε=Δp、/2 ・・・・・・・・・・・・
・・・・・・(巧また、金属抵抗線の全体積を■とする
と、■二aX氾 ・・・・・・・・・・・・・
・・・・・(3)また、金属抵抗線の伸縮により、体積
は、ΔV/V=Δa/a+Δp、7x−Δa/a+ε
−=−・−・(4)また、体積変化率と比抵抗の変化率
が同じであると仮定すると、
Δρ/ρ=ΔV/V=Δa/a十ε ・・・・・・・
・・・・・・・・・・・(に)0)、(匂、(6)式よ
り、
ΔR/R= 26
しかし、実際のひずみ検出素子では、(輸式の仮定が成
り立たたないことがあるために(6)式のようになる。6 ・\−7 Operation of strain detection element 2, that is, “physical phenomenon” − “
The operation as a converter from "mechanical strain" to "electrical signal" is shown in FIG. The resistance value of the metal resistance wire 11 in Fig. 2 is R
1, R1=ρIV,/a. Here, 2 is the length of the metal resistance wire, a is the cross-sectional layer, and ρ is the specific resistance. Now, when the metal resistance wire is pulled in the axial direction by an external force, the length of the metal resistance wire increases by 7℃, the cross-sectional area decreases by Δa, and the specific resistance decreases by Δρ, then the rate of change in resistance is ΔR/R−Δfl / R-A a / a+Δρ/ρ
・・・・・・・・・・・・<1), and the strain ε is ε=Δp,/2 ・・・・・・・・・・・・
・・・・・・(Takumi) Also, if the total volume of the metal resistance wire is ■, then ■2aX flood ・・・・・・・・・・・・・・・
...(3) Also, due to the expansion and contraction of the metal resistance wire, the volume is ΔV/V=Δa/a+Δp, 7x−Δa/a+ε
-=-・-・(4) Also, assuming that the rate of change in volume and the rate of change in specific resistance are the same, Δρ/ρ=ΔV/V=Δa/a×ε...
・・・・・・・・・・・・(Ni) 0), (Ni) From equation (6), ΔR/R= 26 However, in actual strain detection elements, (the assumption of transfer equation does not hold) Because of this, equation (6) is obtained.
ΔR/R= Kε ・・・・・・・・・・
・・・・(6)(6)式でKはその金属抵抗線に依存す
る定数となる。ΔR/R= Kε ・・・・・・・・・・・・
(6) In equation (6), K is a constant that depends on the metal resistance wire.
このO・ずみ検出素子(抵抗R1)を第3図に示す回路
に接続する。以下に信号検出の方式について述べる。第
4図において、ブリッジ回路の印加電圧をEどすると、
出力電圧e。は
eo−〔(R4十R11)R3−R2R4〕/(R1+
R4/+−R2)(R3+R4)である。This O-strain detection element (resistance R1) is connected to the circuit shown in FIG. The signal detection method will be described below. In Fig. 4, when the applied voltage of the bridge circuit is set to E,
Output voltage e. is eo-[(R40R11)R3-R2R4]/(R1+
R4/+-R2) (R3+R4).
ひずみ検出素子2を密閉室5の外壁6に接着した状態で
R1′を調節して
R1+R11=R2=R3−R4二R
とすると、
eo −0
である。If R1' is adjusted with the strain detection element 2 adhered to the outer wall 6 of the sealed chamber 5 to obtain R1+R11=R2=R3-R42R, then eo -0 is obtained.
いま、R1なるひずみ検出素子がひずみを受けて、
R4+ΔR4
なる変化を起こしたとすると、
eo:EΔR/(4R+2ΔR) EΔR/(4B
、)ただし、R(ΔRである。Now, if the strain detection element R1 receives strain and causes a change of R4+ΔR4, then eo:EΔR/(4R+2ΔR) EΔR/(4B
, ) However, R(ΔR.
ここで(6)式ΔR=4εRより
e○=EKε/4
たとえばに:2. ε:lX10 、E=1Vとする
と、e o :I X 2 X 10 /4=O−5
+TI Vとなり、この値をオペアンプ13で増幅して
、マイコン4のA/Dポートに入力すれば、密閉室5の
圧力が計測できる。Here, from equation (6) ΔR=4εR, e○=EKε/4 For example: 2. If ε:lX10 and E=1V, e o :IX2X10/4=O-5
+TI V. If this value is amplified by the operational amplifier 13 and inputted to the A/D port of the microcomputer 4, the pressure in the sealed chamber 5 can be measured.
発明の効果
以上の実施例の説明からも明らかなように、本発明によ
れば、
(1) 密閉室の外壁にひずみ検出素子を固着して圧
力を測定することにより、従来用いられていたような、
圧力センサを気密に固定するねじ部やコネクタなどの部
品が不要となる。また組立工数力E 1M11 mgさ
れるので、コストダウンが図れる。Effects of the Invention As is clear from the description of the embodiments above, according to the present invention, (1) By fixing a strain detection element to the outer wall of a sealed chamber and measuring pressure, it is possible to solve the problem as conventionally used. What?
Parts such as screws and connectors that secure the pressure sensor airtight are no longer required. Furthermore, since the assembly man-hour effort is reduced to E 1M11 mg, costs can be reduced.
(2)密閉室の外壁の外側にひずみ検出素子を固着する
ことにより、密閉室内の雰囲気から隔離され、センサが
汚染することがなく、ひずみ検出素子の耐久性が向上す
るという効果が得られる。(2) By fixing the strain detection element to the outside of the outer wall of the sealed chamber, it is isolated from the atmosphere inside the sealed chamber, the sensor is not contaminated, and the durability of the strain detection element is improved.
第1図は本発明の一実施例の圧力測定装置のブロック図
、第2図は同ひずみ検出素子の斜視図、ツク図である。
1・・・・・・圧力制御装置、2・・・・・・ひずみ検
出素子、5・・・・・・密閉室、6・・・・・・外壁、
10・・・・・・基板、11・・・・・・金属抵抗線、
12・・・・・・リード線。
代理人の氏名 ブ↑理士 粟 野 重 孝 ほか1名第
図
10−K 板
11− 金 胤 λ抗 緯
t2− リード緯
第
図FIG. 1 is a block diagram of a pressure measuring device according to an embodiment of the present invention, and FIG. 2 is a perspective view and a block diagram of the same strain detecting element. 1... Pressure control device, 2... Strain detection element, 5... Sealed chamber, 6... Outer wall,
10...Substrate, 11...Metal resistance wire,
12...Lead wire. Name of agent: BU↑Physical engineer Shigetaka Awano and one other person Figure 10-K Plate 11- Kin Tan λ latitude t2- Lead latitude map
Claims (1)
駆動と信号処理を行う手段と、前記密閉室内の圧力を変
化させる圧力制御装置と、前記ひずみ検出素子や圧力制
御装置を制御する制御部とを備え、前記ひずみ検出素子
を前記密閉室の外壁面に固着し、前記圧力制御装置によ
り前記密閉室を加圧あるいは減圧したとき、前記密閉室
内の圧力を外壁のひずみとして前記ひずみ検出素子によ
り検知し、前記制御部にて圧力変化として計測する圧力
測定装置。A sealed chamber, a strain detection element, means for driving and signal processing of the strain detection element, a pressure control device for changing the pressure in the sealed chamber, and a control section for controlling the strain detection element and the pressure control device. The strain detection element is fixed to the outer wall surface of the sealed chamber, and when the pressure control device pressurizes or depressurizes the sealed chamber, the strain detection element detects the pressure inside the sealed chamber as a strain on the outer wall. and a pressure measuring device that measures pressure changes in the control section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12021590A JPH0415534A (en) | 1990-05-10 | 1990-05-10 | Pressure measuring instrument |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12021590A JPH0415534A (en) | 1990-05-10 | 1990-05-10 | Pressure measuring instrument |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0415534A true JPH0415534A (en) | 1992-01-20 |
Family
ID=14780745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12021590A Pending JPH0415534A (en) | 1990-05-10 | 1990-05-10 | Pressure measuring instrument |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0415534A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1333319A2 (en) | 2002-01-30 | 2003-08-06 | Fuji Photo Film Co., Ltd. | Silver halide photographic light-sensitive material |
-
1990
- 1990-05-10 JP JP12021590A patent/JPH0415534A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1333319A2 (en) | 2002-01-30 | 2003-08-06 | Fuji Photo Film Co., Ltd. | Silver halide photographic light-sensitive material |
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