JPH04154977A - Formation of colored resist pattern - Google Patents

Abstract

PURPOSE:To obtain a resist pattern adhered to the base, free from pinholes and having high visibility by preparing a coating bath for coating by electrodeposition with a photosensitive electrodeposition paint resin compsn. contg. a dye dissolved in an org. solvent. CONSTITUTION:A photosensitive electrodeposition paint resin compsn. contg. a polymer having 20-300 acid value obtd. by copolymerizing acrylic acid and/or methacrylic acid, a water-insoluble monomer having photopolymerizable unsatd. bonds in the molecule, a water-insoluble photopolymn. initiator and a dye dissolved in an org. solvent is prepd. and a basic org. compd. and water are added to the compsn. to obtain a water-soluble or water-dispersible coating bath for coating by electrodeposition. A substrate is immersed in the bath and a coating film is formed on the substrate by electro-deposition and imagewise irradiated with active rays of light to form a colored resist pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for forming a nine-colored resist pattern.

(Prior art) When manufacturing a printed circuit board, a layer of a photocurable resin composition is first formed on a substrate, and then actinic rays are irradiated in an image form, uncured portions are developed and removed, and a resist pattern is formed. is formed. In this step, a layer of the photocurable resin composition is formed.

Various methods have been adopted. For example, dip coat,
A method using a photocurable resin composition solution (coating liquid) such as roll coating or curtain coating, or a method of laminating a film (photosensitive film) of a photocurable resin composition is known. Among these methods, the method of laminating photosensitive films is currently adopted as the mainstream method because it can easily form a layer of a photocurable resin composition with a uniform thickness.

(Problems to be Solved by the Invention) Recently, as printed circuit boards have become denser and more precise, resist patterns of higher quality have become necessary. That is, it is desired that the resist pattern has no pinholes and is in close contact with the surface of the underlying substrate. It is known that the currently mainstream method of laminating photosensitive films has limitations in meeting such demands.

This method has poor ability to follow irregularities on the substrate surface caused by dents during substrate manufacturing, non-uniform polishing, pits of copper plating on the surface of the mesh 9 of the glass cloth in the inner layer of the substrate, etc. , it is difficult to obtain sufficient adhesion. This difficulty can be solved by laminating the films under reduced pressure (Tokuko Kokō 5).
9-3740), but this requires special and expensive equipment.

For these reasons, solution coating methods such as dip coating, roll coating, and curtain coating have been reconsidered in recent years.

However, these coating methods have problems such as difficulty in controlling the film thickness, insufficient uniformity of the film thickness, and occurrence of pinholes.

・Recently, a new method of forming a photoresist film by electrodeposition coating has been proposed (Japanese Unexamined Patent Publication No. 62-23
(See Publication No. 5496). This method improves the adhesion of the resist. ■Good ability to follow irregularities on the substrate surface. ■A photoresist film with uniform thickness can be formed in a short time.

■Since the coating liquid is an aqueous solution, it has the advantage of preventing contamination of the work environment and causing no problems in terms of disaster prevention. However, on the other hand, it is difficult to use an electrodeposition coating bath, and as a result, the resulting electrodeposition coating film ( Because the photoresist film (photoresist film) and the resist pattern obtained through the subsequent exposure and development processes are nearly colorless, it is difficult to distinguish between defective and normal parts of the photoresist film and resist pattern, which poses major problems in work management. have. Therefore, a method has been proposed in which a photoresist film or resist pattern is colored by providing a step of applying a solution containing a dye on the surface of the photoresist film or resist pattern after electrodeposition coating (Japanese Patent Application Laid-Open No. 1983-1979-1).
(See Publication No. 20694). However, this method is not a good idea as it increases the number of steps and also complicates process control. The paint bath itself is colored.

It is desirable that the electrodeposition coating film (photoresist film) itself is already colored after the electrodeposition coating. and.

It is desirable that the color is maintained without fading even during various processing steps until the subsequent resist pattern is obtained. Conventionally, electrodeposition coating baths are colored. That is, when common dyes and pigments are added to the electrodeposition coating bath, there are problems in that bumps occur in the coating film (photoresist film) after electrodeposition coating, and the sensitivity of the photoresist film decreases. Therefore, it has been an important issue to create a colored electrodeposition coating bath that does not cause these problems.

(Means for Solving the Problems) Therefore, as a result of intensive studies, the present inventors created an electrodeposition coating bath by adding an organic solvent-soluble dye to a highly sensitive photosensitive electrodeposition paint resin composition. Yoshishi.

Good colored electrodeposited film (photosensitive film) without bumps
can be obtained, and the photoresist film maintains high sensitivity,
It has been found that a good colored resist pattern can be formed by exposure and development.

That is, the present invention.

[al Polymer copolymerized with acrylic acid and/or methacrylic acid and having a phosphoric acid value of 20 to 300 (b) Water-insoluble monomer having two or more photopolymerizable unsaturated bonds in the molecule (c) Water-insoluble photoinitiator and (d) adding a basic organic compound and water to a photosensitive electrodeposition coating resin composition containing an organic solvent-soluble dye to form a water-soluble or water-dispersible electrodeposition coating bath; The conductive substrate is immersed as an anode and electrocoated by 9 electrifications to form an electrocoated film on the conductive substrate, and then actinic rays are irradiated onto the electrocoated film in an imagewise manner to photocure the exposed areas. 9. Then remove the unexposed areas by developing.
The present invention relates to a method for forming a colored resist pattern, which is characterized by forming a colored resist pattern.

The present invention will be explained in detail below.

The polymer component (a) is copolymerized with acrylic acid and/or methacrylic acid as an essential component and has an acid value of 20 to 30.
It is a copolymer of 0. Acrylic acid and methacrylic acid can be used alone or in combination, and the amount used is determined as appropriate so that the acid value of the polymer is in the range of 20 to 300. If the acid value of the polymer is less than 20, water dispersibility will be poor when a basic organic compound is added to the photosensitive electrodeposition coating resin composition and then water is added for water dispersion.

The composition settles. Furthermore, if the acid value of the polymer exceeds 300, the appearance of the electrodeposited film will be poor.

In addition to acrylic acid and methacrylic acid, the polymers of component (a) include ethyl acrylate, isopropyl acrylate, n-propyl acrylate, imbutyl acrylate, n-butyl acrylate, n-hexyl methacrylate, n-octyl methacrylate, n- - Decyl methacrylate.

Methyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, cyclohexyl methacrylate, tetrahydrofurfuryl methacrylate, glycidyl methacrylate.

2.2.2-trifluoroethyl methacrylate, diacetone acrylamide, acrylonitrile, styrene,
Copolymerization can be carried out by using one or more kinds of monomerizable monomers such as vinyltoluene in combination. The sound used is (a
) can be used in an amount of 91 parts by weight or less based on 100 parts by weight of the total amount of copolymerizable monomers forming the polymer.

The polymer component (a) was synthesized by mixing the above monomers with azobisisobutyronitrile in an organic solvent.

It can be obtained by general solution polymerization using a polymerization initiator such as azobisdimethylvaleronitrile or benzoyl peroxide. In this case, the organic solvent used is dioxane, considering that it will be used in electrodeposition paint.

It is preferable to mainly use hydrophilic organic solvents such as methoxyethanol, ethoxyethanol, and diethylene glycol. If toluene, xylene.

When mainly using hydrophobic organic solvents such as benzene,
After polymer synthesis, it is necessary to distill off the solvent and replace it with the hydrophilic solvent described above. The weight average molecular weight (in terms of standard polystyrene) of the polymer is preferably 5.000 to 150.000. 5. If it is less than OO0, the mechanical strength of the resist is weak. If it is more than 150,000, the electrodeposition coating properties tend to be poor and the appearance of the coating film tends to be poor.

The glass transition point of the polymer of component (a) is 75 to 120.
Preferably it is ℃. If the temperature is less than 75°C, the mechanical strength of the coating film tends to decrease, and if it exceeds 120°C, the electrodepositivity tends to decrease.

(a) From the viewpoint of the polymer structure of the component, the mechanical strength of the coating film, and the electrodepositivity, the copolymerized monomers constituting the polymer (D total amount 1
60 to 85 parts by weight of methyl methacrylate
Preferably, it is a copolymerized polymer in terms of parts by weight.

(The amount of polymer used as a component of al is (at and (b)
) is preferably 50 to 85 parts by weight, more preferably 60 to 75 parts by weight, based on 100 parts by weight of the total amount. If the amount used is less than 50 parts by weight, the water dispersion stability of the electrodeposition bath will be poor and the mechanical strength of the resist will be weak9.
In addition, if the amount exceeds 85 parts by weight, the proportion of the photopolymerizable monomer, which is the component (b), tends to decrease and the sensitivity to light tends to decrease.

As the water-insoluble monomer having two or more photopolymerizable unsaturated bonds in the molecule, which is the component (b), for example, polyhydric alcohols other than polyethylene glycol condensed with one or more ethylene glycol, Saturated unsaturated fulvic/
A compound obtained by acid.

For example, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate,
Tetramethylolmethane tri(meth)acrylate, tetramethylolmethanetetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.
Compound 1 obtained by adding an α,β-unsaturated carboxylic acid to a glycidyl group-containing compound, such as trimethylolpropane triglycidyl ether triacrylate.

Bisphenol A diglycidyl ether di(meth)acrylate, etc., a polycarboxylic acid 9 such as phthalic anhydride, and a substance having a hydroxyl group and an ethylenically unsaturated group 9 such as β
- Esterified products such as hydroxyethyl (meth)acrylate are used, and furthermore, urethane diacrylate compounds having a urethane skeleton can also be used, in any case.

Any material may be used as long as it is water-insoluble and hardens by light irradiation. In that sense, hydrophilic monomers such as (poly)ethylene glycol diacrylate are outside the scope of the present invention. These can be used alone or in combination of two or more. (Amounts of components used in bl are (a) and (b)
) is preferably in the range of 15 to 50 parts by weight, preferably 25 to 40 parts by weight, based on 100 parts by weight of the total amount.

If the amount used is less than 15 parts by weight, the sensitivity to light will decrease,
Moreover, if it exceeds 50 parts by weight, the water dispersion stability of the electrodeposition bath will be poor.

Resist tends to become brittle.

Examples of water-insoluble photoinitiators or photoinitiator systems as component (c) include benzophenone, N,N'-tetramethyl-4,4'-diaminobenzophenone, and 4-methoxy-4'-dimethylaminobenzophenone. .

Aromatic ketones such as 2-ethylanthraquinone and phenanthrenequinone, benzoin methyl ether.

Benzoin ethers such as benzoin ethyl ether and benzoin phenyl ether, benzoin such as methylbenzoin and ethylbenzoin, 2-(.

-chlorophenyl) 4,5-cyphenylimitasol dimer, 2-(o-chlorophenyl) -4,5-di(m
-methoxyphenyl)imidazole dimer.

Examples include 2.4-cy(p-methoxyphenyl)-5-phenylimidazole dimer. These may be used alone or in combination of two or more. The amount of component (C) used is the total amount of (a) and (b) 10
The amount is preferably 0.1 to 10 parts by weight, more preferably 0.2 to 5.0 parts by weight. If the amount used is less than 0.1 part by weight, the sensitivity to light will decrease, and if it exceeds 10 parts by weight, light absorption on the surface of the composition will increase during exposure, and internal photocuring will tend to be insufficient. be.

All components of (bl and (cl) must be water-insoluble. If they are water-soluble, it will be difficult to perform electrodeposition coating in a state where they are uniformly mixed with other components.

The organic solvent-soluble dye, which is the component (d), refers to a dye that is insoluble in water but dissolves in an organic solvent, and is broadly classified into oil-soluble type and metal complex type, specifically azo type, anthraquinone type, and phthalocyanine type. There are systems etc. Further, examples of metals used in complex salts include cobalt, nickel, chromium, and copper. The usage amounts of these components (d) are as follows: [a), (
0.01 to 100 parts by weight of the total amount of bl and (c)
5.0 parts by weight, preferably in the range of 0.1 to 2.0 parts by weight. If the amount used is less than 0.01 parts by weight, the degree of coloring will be too weak and the effect will be low; if it exceeds 5.0 parts by weight, the sensitivity of the photosensitive film will tend to decrease, which is not preferred.

The photosensitive electrodeposition coating resin composition in the present invention includes:

Furthermore, thermal polymerization inhibitors, plasticizers, adhesion promoters, inorganic fillers, etc. may be added.

To prepare an electrodeposition coating bath containing the fa), (b), (cl and (d) components described above, first [a), (b)]
, (It is preferable to prepare a solution in which a photosensitive electrodeposition coating resin composition containing components c+ and (d) is uniformly dissolved in the above-mentioned hydrophilic organic solvent. In this case, component (a) The hydrophilic organic solvent used when synthesizing the polymer may be used as is, or after the synthesis solvent has been distilled off.

Another hydrophilic organic solvent may be added. Moreover, two or more types of hydrophilic organic solvents may be used. The amount of hydrophilic organic solvent used is (
The amount is preferably 300 parts by weight or less based on 100 parts by weight of the solid content containing components a), (b), (c) and (d).

Next, a basic organic compound is added to the above solution to neutralize the carboxyl groups contained in the polymer, which is component (a), thereby facilitating water solubilization or water dispersion.

The basic organic compound used here is not particularly limited, but examples thereof include triethylamine, monoethanolamine, jetanolamine, diisopropylamine, dimethylaminoethanol,9 and morpholine, which may be used alone or in combination of two or more. Can be used. The amount of these basic organic compounds used is 0.3 per equivalent of carboxyl group in the polymer that is component (a).
It is preferable to set it as 1.0 equivalent. If the amount is less than 0.3 equivalent, the water dispersion stability of the electrodeposition coating bath decreases.

If the amount exceeds 1.0 equivalent, the coating thickness after electrodeposition will become thinner,
Appearance tends to deteriorate.

Furthermore, it is better not to use basic inorganic compounds such as sodium hydroxide and potassium hydroxide because they tend to cause hydrolysis of the photosensitive electrodeposition coating resin composition. Next, water is added to dissolve or disperse the photosensitive electrodeposition coating resin composition in water to prepare an electrodeposition coating bath. The solid content of the electrodeposition coating bath is 5 to 2
It is preferable that the amount is 0% by weight and the pH is in the range of 6.0 to 9.0.

In order to adjust the pH to the above-mentioned preferred range, the above-mentioned basic organic compound may be added later to adjust the pH.

In addition, a nonionic surfactant is used to improve the water dispersibility and dispersion stability of the photosensitive electrodeposition coating resin composition.

A cationic surfactant, an anionic surfactant, etc. can also be added as appropriate.

In order to increase the coating amount during electrodeposition coating, a hydrophobic solvent such as toluene, xylene, 2-ethylhexyl alcohol, etc. can be added as appropriate.

In order to electrocoat a conductive substrate using the electrodeposition coating bath obtained in this way, the conductive substrate is immersed in the electrodeposition coating bath as an anode. ~100
DC current of mA/dm2.

In the case of the constant voltage method, a DC voltage of 50 to 400 V is applied for 10 seconds to 5 minutes, respectively.

The thickness of the resulting coating film is preferably 5 to 50 μm. At this time, it is desirable to control the temperature of the electrodeposition coating bath at 15 to 30°C.

After electrodeposition coating, the object to be coated is taken out of the electrodeposition coating bath, washed with water, drained, and then dried with hot air or the like. At this time, if the drying temperature is high, the coating film will be thermally cured, and a portion will remain undeveloped in the development process after exposure, so it is normal.

It is desirable to dry at 110°C or lower.

On the electrodeposited film thus obtained, in order to protect the film and prevent curing inhibition due to oxygen during the next exposure,
Approximately 1 coat of water-soluble polymer such as polyvinyl alcohol
It may be formed with a film thickness of about 10 μm.

Then, the coating film is irradiated with actinic light in an imagewise manner.

A photocured resist pattern can be obtained by photocuring the exposed areas of the coating film and removing the unexposed areas by development. As a light source of actinic rays, the wavelength is 300 to 450 nm.
For example, a mercury vapor arc, a carbon arc, a xenon arc, etc. are preferably used.

Developed with sodium hydroxide and sodium carbonate.

Spray alkaline water such as potassium hydroxide.

This can be done by immersing it in alkaline water.

(Example) The present invention will be explained below with reference to Examples.

Dioxane 11309 was added to a flask equipped with a stirrer, a reflux condenser, a dropping funnel with a thermometer, and a nitrogen gas introduction tube, and the mixture was heated to 90° C. while stirring and blowing nitrogen gas. When the temperature became constant at 90°C, methacrylic acid 1699. A mixture of 400 g of methyl methacrylate, 431 g of n-butyl acrylate, and 109 g of azobisin butyronitrile was added dropwise into the flask over 2.5 hours, and then kept at 90° C. with stirring for 3 hours. After 3 hours, a solution of 3 g of azobisisobutyronitrile dissolved in 100 g of dioxane was added dropwise into the flask over 10 minutes, and then kept at 90° C. for 4 hours with stirring.

The weight molecular weight of the polymer component (a) thus obtained was 54,000. The acid value was 111.

The solid content of the polymer solution was 45.4% by weight.

Next, add EO to this polymer solution 6509 as component (b).
150 g of modified bisphenol A dimethacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., trade name NK Ester BPE-200) and 25 g of hexanediol dimethacrylate (manufactured by Shin Nakamura Chemical Co., Ltd., trade name NK Ester HD), (cl.
Components include benzophenone aog and N,N'-tetraethyl-4,4'-diaonobenzophenone lu, (d
) As a component, 0.159% of the product name B-Blue 7 (manufactured by Odugaya Chemical Co., Ltd.) was added and dissolved.

After adding and dissolving 31.8 g of dimethylaminoethanol as a basic organic compound to the solution.

While stirring the solution, 4.200 ml of ion-exchanged water was gradually added dropwise to obtain an electrodeposition coating bath. The solid content of this electrodeposition coating bath was 10.0% by weight, and the pH was 7.8 at 25°C.

A glass epoxy steel clad laminate (MCL-E-61 manufactured by Hitachi Chemical Co., Ltd.) was used as an anode in the above electrodeposition coating bath and a stainless steel plate (SU8304) (shape 200
[[IInX 1 mm] was immersed as a cathode at 25°C.
A DC voltage of 150 V was applied for 3 minutes at a temperature of 150 V to form an electrodeposition coating film on the surface of the copper clad laminate.

Thereafter, the film was washed with water, drained, and dried at 80° C. for 15 minutes (film thickness after drying: 9 μm). The electrodeposited film (photoresist film) at this time had no bumps and had good blue gloss.

This material was imagewise exposed to a light intensity of 80 mJ/cm2 using a 3kW ultra-high pressure mercury lamp through a negative mask.

As a result of development with a 1% aqueous sodium carbonate solution, a step tablet (optical density of 0.05 was set as the first stage) was obtained.

Using a negative mask in which the optical density increases by 0.15 for each step), a high photosensitivity of 8 steps was obtained, and an attractive resist pattern with a high resolution of 50 μm could be formed. Since this product is colored blue, inspection of the resist pattern is much easier than in the past.

Example 2 Ethyl cellosolve 1.1309 was added to a flask equipped with the same apparatus as in Example 1, stirred, and heated to 90° C. while blowing nitrogen gas. When the temperature became constant at 90°C, methacrylic acid 2309, methyl methacrylate 4609. A mixture of 310 g of ethyl acrylate and 10 g of azobisisobutyronitrile was dropped into the flask over 2 hours, and then kept at 90° C. with stirring for 3 hours. 3 hours later azobisinvaleronitrile 5
A mixture of 100 g of ethyl cellosolve and 100 g of ethyl cellosolve was added dropwise into the flask over 10 minutes, and then kept at 90° C. for 4 hours with stirring.

The weight average molecular weight of the polymer component (a) thus obtained was 41,000. The acid value was 158.

The solid content of the polymer solution was 45.3% by weight.

Next, as component (b) to 557 g of this polymer solution,
Epoxy acrylate (Osaka Organic Chemical Industry type).

Product name Visco-) 540) 1509 and urethane acrylate (manufactured by Shin-Nakamura Chemical Industries, product name U-108-A) 6
0g, 33g of benzophenone and N as component (c),
N'-tetraethyl-4,4'-diaminobenzophenone 0-8 g* (d) As the component, the product name Vali
fast Blue 2606 (Orient Chemistry Exhibition)
0.209 was added and dissolved.

Morpholine 39 is added to this □ solution as a basic organic compound.
After adding 9 and 100 g of n-butanol to dissolve, add 4.100 g of ion-exchanged water while stirring the solution.
9 was gradually added dropwise to obtain an electrodeposition coating bath. The solid content of this electrodeposition coating bath was 10.5% by weight, and the pH was 7.48 at 25°C.

A stainless steel plate (sUsao4) (shape 200 nm +
1mm) as a cathode, and 150°C at a temperature of 25°C.
A DC voltage of V was applied for 3 minutes to form an electrodeposition coating film on the surface of the steel clad laminate. After this, wash with water and drain at 80℃.
The film was dried for 15 minutes (film thickness after drying: 12 μm). No bumps were observed in the electrodeposited film (photoresist film) at this time, and the film had good blue gloss.

A 3 kW ultra-high pressure mercury lamp was applied to this through a negative mask.
After imagewise exposure to a light intensity of 0 mJ/cm''.

As a result of development with a 1% sodium carbonate aqueous solution, a high photosensitivity of 9 step tablets was obtained, and a good resist pattern with a high resolution of 50 μm could be formed. Since this product is colored blue, inspection of the resist pattern is much easier than in the past.

Example 3 900 g of ethyl cellosolve was added to a flask equipped with the same equipment as in Example 1, stirred, and heated to 90° C. while blowing nitrogen gas. When the temperature became constant at 90℃, add 64g of acrylic acid.

516 g of methyl methacrylate, 420 g of n-propyl acrylate and 2,59 g of azobisisobutyronitrile
The mixed solution was added dropwise into the flask over 2 hours, and then kept at 90° C. with stirring for 3 hours. After 3 hours, a solution of azobisisobutyronitrile x, og dissolved in 100 g of ethyl cellosolve was added dropwise into the flask over 10 minutes, and then kept at 90° C. for 4 hours with stirring.

The weight average molecular weight of the thus obtained polymer, component fa), was 62,000. The acid value I/'i was 49.5. The solid content of the polymer solution was 50.3% by weight.

Next, this polymer solution 7509 is added as component (b) of pentaerythritol tetraacrylate (manufactured by Sartomer Company, trade name SR, -295) 1009 and trisacryloxyethyl isocyanurate (Hitachi Chemical Co., Ltd.).
(trade name: FA-731A) 25 g, [c) component: 30 g of benzophenone and 1 g of N,N'-tetraethyl-4,4'-diaminobenzophenone, [dl component: product name: Sumiplast BlueS (manufactured by Sumitomo Chemical) 0. 089 was added and dissolved.

After adding triethylamine 169 as a basic organic compound to this solution and dissolving it, ion exchange water 4.4009 was gradually added dropwise while stirring the solution to obtain an electrodeposition coating bath. The solid content of this electrodeposition coating bath was 10.2% by weight, and the pH was 8.6 at 25°C.

A glass epoxy copper-clad laminate (MCL-E-61, manufactured by Hitachi Chemical Co., Ltd.) was used as an anode in the above electrodeposition coating bath, and a stainless steel plate (SUS304) (shape 200 m 1 ll x 75 m
m×1 mm) was immersed as a cathode, and a DC voltage of 150 μm was applied for 3 minutes at a temperature of 25° C. to form a fixed coating film on the surface of the copper-clad laminate.

Thereafter, the film was washed with water, drained, and dried at 80° C. for 15 minutes (film thickness after drying: 15 μm). Electrodeposition coating film (photoresist film) at this time
No bumps were observed, and the film had a good blue gloss.

A 3kW ultra-high pressure mercury lamp was applied to this item through a negative mask.
After imagewise exposure to a light intensity of 00 mJ/cm''.

As a result of developing with a 1% IJum aqueous solution, a high photosensitivity of 10 step tablets was obtained.

Furthermore, a good resist pattern with a high resolution of 50 μm could be formed. Since this product is colored blue, inspection of the resist pattern is much easier than in the past.

(Effects of the Invention) By using the method for forming a colored resist pattern of the present invention, a resist pattern with high visibility can be obtained.

The resist pattern forming method of the present invention is useful for forming a photoresist for etching or plating using the resist as a relief or using a copper-clad laminate as a substrate.

Claims (3)

[Claims] 1. (a) A polymer copolymerized with acrylic acid and/or methacrylic acid with an acid value of 20 to 300, (b) A water-insoluble monomer having two or more photopolymerizable unsaturated bonds in the molecule, (c) Water-insoluble Adding a basic organic compound and water to a photosensitive electrodeposition coating resin composition containing a photoinitiator and (d) an organic solvent-soluble dye to form a water-soluble or water-dispersible electrodeposition coating bath; A conductive substrate is immersed in water as an anode, and electrocoated by applying electricity to form an electrocoated film on the conductive substrate. After that, actinic light is irradiated onto the electrocoated film in an imagewise manner, and the exposed area is exposed to light. After curing, unexposed areas are removed by development.
A method for forming a colored resist pattern, the method comprising forming a colored resist pattern. 2. The glass transition point of the polymer of component (a) is 75 to 12
The method for forming a colored resist pattern according to claim 1, wherein the temperature is 0°C. 3. The colored resist pattern according to claim 1 or 2, wherein the polymer component (a) is a polymer copolymerized with 60 to 85 parts by weight of methyl methacrylate based on 100 parts by weight of the total amount of copolymerized monomers constituting the polymer. Formation method.