JPH04154200A - Cooling structure of electronic device - Google Patents

Abstract

PURPOSE:To facilitate cooling and maintenance and eliminate the need for manday required for mounting and removing a cooling section or the like by fixing cooling bars with an electronic device module and installing a heat sink, into which said cooling bars can be inserted, on a multichip IC. CONSTITUTION:A plurality of cooling bars 5 are fixedly installed to an electronic device module 7 in advance in such a manner that it may be projected. With regards to an electronic circuit package 10, a multichip IC 11 or more, which comprise a plurality of electronic devices mounted on a board 2, are mounted on a printed wiring board 3 where a heat sink 4, which allows the bars to be inserted into it, is mounted on the top of the chip IC 11. The bars 5 are inserted into the cylinder-shaped sink 4 by guide-inserting the package 10 in the direction of A by means of a module 7's electronic circuit package guide groove 9 so that the bars 5 may penetrate the interior of the sink 4 where cooling is carried out. This construction makes it possible to carry out cooling and maintenance simply by the removal and insertion of the package 10 and eliminate the need for manday, say, mounting or dismounting cooling section.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an electronic device, and particularly to a cooling structure for a multichip IC mounted on a printed circuit wiring board.

[Conventional technology]

FIG. 5 shows an example of a conventional cooling structure for an electronic circuit package.

Conventional cooling structures for electronic devices, particularly liquid cooling structures, include multi-chip ICs 2 in which a plurality of electronic devices 21 such as LS I/I C are mounted on a substrate 20 made of ceramic or the like.
7 is mounted on a printed circuit wiring board 25, and the cooling unit 22 is brought into close contact with the multi-chip IC 27 in the electronic circuit package 28 to cool it. The cooling unit 22 includes a water pipe, and has a structure in which a refrigerant is taken in from an external water pipe 26 through a joint 23 and a hose 24.

When performing maintenance on the multi-chip IC 27 in this cooling structure, remove the cooling unit 22 with the joint 23 hose 24 connected to the external water pipe 26, take out the multi-chip IC 27 from the electronic circuit package 28, and perform maintenance. method is used.

[Problem to be solved by the invention]

In the conventional liquid cooling structure described above, since liquid is used as the refrigerant, the joint 23 and the hose 24 are essential, and it is impossible to remove them due to the risk of water leakage. Joint 23. Multi-chip IC with hose 24 connected to external water pipe 26
The only way to perform maintenance is to remove the electronic circuit package 27, which has the drawback of making it impossible to mount the electronic circuit package 28 adjacently. In other words, in an electronic device refined using a plurality of multi-chip ICs 27, it is only possible to provide a method of arranging the multi-chip ICs 27 in a two-dimensional manner, and it also requires a lot of man-hours such as installing and removing the cooling unit 22. there were.

[Means to solve the problem]

The cooling structure for an electronic device of the present invention is an electronic circuit package manufactured by mounting a multi-chip IC, which is formed by mounting a plurality of electronic devices such as LSI/IC on a ceramic substrate, on a printed circuit wiring board. In the liquid cooling structure, at least one cooling bar is provided with a wood tube, has a substantially rod shape, and is fixed in a protruding manner to the electronic device module in advance, and is attached to the multi-chip IC and connects the electronic circuit package to the electronic device module. The heat sink is provided with a heat sink that comes into intimate contact with the cooling bar when inserted.

Further, in the cooling structure for an electronic device according to the present invention, the heat sink has a cylindrical shape into which the cooling bar is inserted.

Furthermore, in the cooling structure for an electronic device of the present invention, either the heat sink or the cooling bar has a U-shaped groove in cross section, and the other is guided inside the groove.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a front view of the cooling structure of this embodiment, and Figs. 3 (a) and (b) are illustrations of inserting and removing the package of this embodiment. side view of time,
FIGS. 4(a) and 4(b) are front views showing another embodiment of the present invention.

The cooling bar 5 of this embodiment has a rectangular bar shape and is equipped with at least one water pipe 6 inside, and has a structure that takes in and discharges a refrigerant from the outside. Fixed. On the other hand, the electronic circuit package 10 is a multi-chip IC formed by mounting a plurality of electronic devices 1 such as LSI/IC on a substrate 2 made of ceramic or the like.
One or more I1 are mounted on the printed circuit wiring board 3,
A heat sink 4 having a shape into which a cooling bar 5 can be inserted is attached to the upper surface of this multi-chip ICII.

In this embodiment, the electronic circuit package 10
is guided and inserted in the direction of arrow A by the electronic circuit package guide 9 of the electronic device module 7, so that the cooling bar 5 penetrates the inside of the cylindrical heat sink 4,
Cooling. That is, this situation is shown in FIG.

FIG. 3(a) shows a case in which a cooling bar 5 installed in advance on an electronic device module 7 penetrates the inside of a heat sink 4 attached to a multi-chip IC 11 on an electronic circuit package 10 to cool the multi-chip IC 11. Also, Figure 3 (
b) shows a state in which the electronic circuit package 10 has been removed from the cooling bar 5.

As described above, according to this embodiment, the cooling bar 5 is protruded from and fixed to the electronic device module 7, and the multi-chip I
A heat sink 4 having a shape that allows the cooling bar 5 to be inserted is installed on the CI l, and when the electronic circuit package 10 is inserted, the cooling bar 5 passes through the inside of the heat sink 4, so that cooling and maintenance can be easily performed on the electronic circuit package. It is possible to install the cooling part by simply inserting and removing 10.

Man-hours such as removal can be made unnecessary.

In this embodiment, the cooling bar penetrates the inside of the cylindrical heat sink, but the structure is not limited to penetrating the inside of the heat sink 4. For example, as shown in FIGS. Either one of the cooling bars 4b and the cooling bars 5a, 5b may be formed into a groove having a U-shaped cross section, and the other may be guided inside the groove and brought into close contact with each other.

〔Effect of the invention〕

As explained above, in the electronic device cooling structure of the present invention, a cooling bar is fixed to an electronic device module, a heat sink into which this cooling bar can be inserted is attached on a multi-chip IC, and when an electronic circuit package is inserted. By creating a structure in which the cooling bar fits into the inside of the heat sink and makes close contact with it, cooling and maintenance can be performed by inserting and removing only the electronic circuit package, and there is no need for man-hours such as installing and removing the cooling part. be.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a front view of the cooling structure of this embodiment, and Figs. 3 (a) and (b) are illustrations of inserting and removing the package of this embodiment. side view of time,
FIGS. 4(a) and 4(b) are front views showing another embodiment of the present invention, and FIG. 5 is a perspective view of an example of a liquid cooling structure according to the prior art. 1.21...Electronic device, 2.20...Substrate, 3
．． 25...Printed circuit wiring board, 4...Heat sink,
5...Cooling bar, 6...Water tube, 7...Module, 11°27...Multi-chip IC19...Electronic circuit package guide groove, 10.28...Electronic circuit package, 22...・Cooling part, 23...Joint, 2
4...Hose, 26...External water pipe.

Claims (3)

[Claims] 1. In the liquid cooling structure of an electronic circuit package, which is constructed by mounting a multi-chip IC, which is formed by mounting multiple electronic devices such as LSI/IC on a ceramic substrate, on a printed circuit wiring board, the liquid cooling structure is equipped with a water tube. at least one cooling bar having a rod shape and protrudingly fixed to the electronic device module in advance; and at least one cooling bar attached to the multi-chip IC and coming into close contact with the cooling bar when the electronic circuit package is inserted into the electronic device module. A cooling structure for an electronic device, characterized by comprising a heat sink such as a heat sink. 2. 2. The cooling structure for an electronic device according to claim 1, wherein the heat sink has a cylindrical shape into which the cooling bar is inserted. 3. 2. The electronic device according to claim 1, wherein either the heat sink or the cooling bar has a groove shape with a U-shaped cross section, and the other has a shape such that it is guided inside the groove shape. Cooling structure.