JPH0415251A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPH0415251A JPH0415251A JP12057290A JP12057290A JPH0415251A JP H0415251 A JPH0415251 A JP H0415251A JP 12057290 A JP12057290 A JP 12057290A JP 12057290 A JP12057290 A JP 12057290A JP H0415251 A JPH0415251 A JP H0415251A
- Authority
- JP
- Japan
- Prior art keywords
- group
- component
- polymer
- resin composition
- curable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 21
- -1 oxytetra-methylene Chemical group 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 9
- 238000009833 condensation Methods 0.000 claims abstract description 7
- 230000005494 condensation Effects 0.000 claims abstract description 7
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- 239000011521 glass Substances 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 10
- 238000002156 mixing Methods 0.000 abstract description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 abstract 6
- 239000000047 product Substances 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000003302 alkenyloxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- TYKCBTYOMAUNLH-MTOQALJVSA-J (z)-4-oxopent-2-en-2-olate;titanium(4+) Chemical compound [Ti+4].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O TYKCBTYOMAUNLH-MTOQALJVSA-J 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、硬化性樹脂を含何する硬化性樹脂組成物、さ
らに詳しくは、シーリング材用途に適した硬化性樹脂組
成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a curable resin composition containing a curable resin, and more particularly to a curable resin composition suitable for use as a sealant.
〔従来の技術及び発明が解決しようとする課題]従来、
室温硬化性シーリング材として、主鎖がポリプロピレン
グリコールからなり、末端にメトキシシリル基が結合し
た有機重合体(商品名MSSポリマー:淵化学工業■製
)を有効成分とする組成物が知られている。[Prior art and problems to be solved by the invention] Conventionally,
As a room temperature curable sealant, a composition containing as an active ingredient an organic polymer whose main chain is made of polypropylene glycol and has a methoxysilyl group bonded to the end (trade name: MSS Polymer, manufactured by Fuchi Kagaku Kogyo ■) is known. .
この組成物には、ガラス耐候接着性を高めるためにシラ
ンカップリング剤が配合されているが、それでもなお充
分なガラス耐候接着性は得られておらず、シーリング材
としての用途に限界があった。Although this composition contains a silane coupling agent to improve weather-resistant adhesion to glass, it still does not have sufficient weather-resistant adhesion to glass, and its use as a sealant is limited. .
本発明の目的は、耐候接着性、特にガラス耐候接着性に
優れた硬化性樹脂組成物を提供することにある。An object of the present invention is to provide a curable resin composition that has excellent weather-resistant adhesive properties, particularly excellent weather-resistant adhesive properties to glass.
[課題を解決するための手段及び作用コ本発明の硬化性
樹脂組成物は、
1、(A)水酸基または加水分解性基の結合したケイ素
原子を含むケイ素原子含有基(以下、「反応性ケイ素基
」という)を少なくとも1個有し、シロキサン結合を形
成することにより架橋しうるポリプロピレングリコール
系重合体100重量部、
(B)反応性ケイ素基を少なくとも1m有し、シロキサ
ン結合を形成することにより架橋しつるポリオキシテト
ラメチレン系重合体5〜120重量部、及び
(C)シラノール縮合触媒0.1〜20重量部を含有し
てなる。[Means and effects for solving the problems] The curable resin composition of the present invention has the following features: 1. (A) A silicon atom-containing group containing a silicon atom to which a hydroxyl group or a hydrolyzable group is bonded (hereinafter referred to as "reactive silicon (B) 100 parts by weight of a polypropylene glycol polymer having at least one reactive silicon group and capable of crosslinking by forming a siloxane bond; It contains 5 to 120 parts by weight of a crosslinked polyoxytetramethylene polymer and 0.1 to 20 parts by weight of (C) a silanol condensation catalyst.
(A)成分および(B)成分に存在する反応性ケイ素基
は特に限定されるものではないが、代表的なものを示す
と、例えば、下記一般式(1)で表わされる基が挙げら
れる。The reactive silicon groups present in component (A) and component (B) are not particularly limited, but typical examples include groups represented by the following general formula (1).
[式中、RおよびR2は、いずれも炭素数1〜20のア
ルキル基、炭素数6〜20のアリール基、炭素数7〜2
0のアラルキル基または(R“) 3S s O−で示
されるトリオルガノシロキシ基を示し、R1またはR2
が2個以上存在するとき、それらは同一であってもよく
、異なっていてもよい。ここでR゛は炭素数1〜20の
1価の炭化水素基であり、3個のR“は同一であっても
よく、異なっていてもよい。Xは水酸基または加水分解
性基を示し、Xか2個以上存在するとき、それらは同一
であってもよく、異なっていてもよい。aは0.1.2
または3を、bは0.1または2をそれぞれ示す。また
、m個の
におけるbは異なっていてもよい。mは0または1〜1
9の整数を示す。但し、a十Σb≧1を満足するものと
する。コ
上記Xで示される加水分解性基は特に限定されず、従来
公知の加水分解性基であればよい。[In the formula, R and R2 are each an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aryl group having 7 to 2 carbon atoms.
0 aralkyl group or a triorganosiloxy group represented by (R") 3S s O-, R1 or R2
When two or more are present, they may be the same or different. Here, R' is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and the three R's may be the same or different. X represents a hydroxyl group or a hydrolyzable group, When two or more of X exist, they may be the same or different. a is 0.1.2
or 3, and b represents 0.1 or 2, respectively. Moreover, b in m pieces may be different. m is 0 or 1-1
Indicates an integer of 9. However, it is assumed that a+Σb≧1 is satisfied. The hydrolyzable group represented by X above is not particularly limited, and may be any conventionally known hydrolyzable group.
具体的には、例えば、水素原子、ハロゲン原子、アルコ
キシ基、アシルオキシ基、ケトキシメート基、アミノ基
、アミド基、酸アミド基、アミノオキシ基、メルカプト
基、アルケニルオキシ基等が挙げられる。これらの内で
は、水素原子、アルコキシ基、アシルオキシ基、ケトキ
シメート基、アミノ基、アミド基、アミノオキシ基、メ
ルカプト基およびアルケニルオキシ基か好ましいが、加
水分解性が穏やかで取扱いやすいという観点からアルコ
キシ基が特に好ましい。Specific examples include a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, and an alkenyloxy group. Among these, hydrogen atoms, alkoxy groups, acyloxy groups, ketoximate groups, amino groups, amido groups, aminooxy groups, mercapto groups, and alkenyloxy groups are preferred, but alkoxy groups are preferable from the viewpoint of mild hydrolysis and ease of handling. is particularly preferred.
この加水分解性基や水酸基は1個のケイ素原子に1〜3
個結合することができ、(a+Σb)は1〜5であるの
が好ましい。加水分解性基や水酸基が反応性ケイ素基中
に2個以上存在する場合には、それらは同一であっても
よく、異なっていてもよい。This hydrolyzable group or hydroxyl group has 1 to 3 per silicon atom.
It is preferable that (a+Σb) is 1 to 5. When two or more hydrolyzable groups or hydroxyl groups are present in the reactive silicon group, they may be the same or different.
反応性ケイ素基中に、ケイ素原子は1個あってもよく、
2個以上あってもよいが、シロキサン結合等によりケイ
素原子の連結された反応性ケイ素基の場合には、20個
程度あってもよい。There may be one silicon atom in the reactive silicon group,
There may be two or more, but in the case of a reactive silicon group in which silicon atoms are linked through a siloxane bond or the like, there may be about 20.
なお、下記一般式(2)で表わされる反応性ケイ素基が
、人手容易の点からは好ましい。Incidentally, a reactive silicon group represented by the following general formula (2) is preferable from the viewpoint of easy handling.
R3−a
・・・・・・ (2)
iX a
(式中、RX、aは前記と同じ。)
また、上記−数式(1)におけるR1およびR2の具体
例としては、例えば、メチル基、エチル基などのアルキ
ル基、シクロヘキシル基などのシクロアルキル基、フェ
ニル基などのアリール基、ベンジル基などのアラルキル
基、R。R3-a ...... (2) iX a (In the formula, RX and a are the same as above.) Also, specific examples of R1 and R2 in the above formula (1) include, for example, a methyl group, an alkyl group such as an ethyl group, a cycloalkyl group such as a cyclohexyl group, an aryl group such as a phenyl group, an aralkyl group such as a benzyl group;
がメチル基やフェニル基などである
(R’ ) 3S i O−で示されるトリオルガノシ
ロキシ基等が挙げられる。これらの中ではメチル基が特
に好ましい。Examples include a triorganosiloxy group represented by (R') 3S i O-, where is a methyl group, a phenyl group, or the like. Among these, methyl group is particularly preferred.
反応性ケイ素基は(A)成分および(B)成分の各重合
体1分子中に少なくとも1個、好ましくは1.1〜5個
存在するのがよい。重合体1分子中に含まれる反応性ケ
イ素基の数が1個未満になると、硬化性が不充分になり
、良好なゴム弾性挙動を発現しにくくなる。At least one reactive silicon group, preferably 1.1 to 5 reactive silicon groups, should be present in each molecule of the component (A) and (B). When the number of reactive silicon groups contained in one polymer molecule is less than one, the curability becomes insufficient and it becomes difficult to exhibit good rubber elastic behavior.
1、(A)成分および(B)成分に存在する反応性ケイ
素基は同一種であってもよく、異種であってもよい。1. The reactive silicon groups present in component (A) and component (B) may be of the same type or may be of different types.
また、反応性ケイ素基は重合体分子鎖の末端に存在して
もよく、内部に存在してもよく、或は両方に存在しても
よい。特に、反応性ケイ素基か分子鎖の末端に存在する
場合には、最終的に形成される硬化物に含まれる重合体
成分の有効網目鎖量が多くなるため、高強度で高伸び(
低弾性率)を示すゴム状硬化物が得られやすくなるなど
の利点があり、好ましい。Further, the reactive silicon group may be present at the end of the polymer molecular chain, may be present inside the polymer chain, or may be present at both ends. In particular, when a reactive silicon group is present at the end of a molecular chain, the effective network chain amount of the polymer component contained in the finally formed cured product increases, resulting in high strength and high elongation (
It is preferable because it has the advantage that it becomes easier to obtain a rubber-like cured product exhibiting a low elastic modulus.
反応性ケイ素基の導入は公知の方法で行なえばよい。す
なわち、例えば、末端または主鎖中に水酸基等の官能基
を有する重合体に、この官能基に対して反応性を示す活
性基及び不飽和基を有する有機化合物を反応させ、次い
で、得られた反応生成物に加水分解性基を有するヒドロ
シランを作用させてヒドロシリル化すればよい。The reactive silicon group may be introduced by a known method. That is, for example, a polymer having a functional group such as a hydroxyl group at the end or in the main chain is reacted with an organic compound having an active group and an unsaturated group that is reactive with this functional group, and then the obtained polymer is The reaction product may be hydrosilylated by acting with a hydrosilane having a hydrolyzable group.
本発明において(A)成分として用いられるポリプロピ
レングリコール系重合体は、数平均分子量が1,000
〜50.000であるのが好ましい。数平均分子量が1
.000未満であると、本発明の組成物を硬化物にした
場合に充分な伸びが得られず、また充分な強度が発言さ
れる前に破断が起こってしまう。そこで、充分な機械強
度を得るためには、数平均分子量は1゜000以上であ
るのが好ましい。しかし、あまり分子量が大きすぎると
硬化が不充分となり、充分な機械強度が得られない。The polypropylene glycol polymer used as component (A) in the present invention has a number average molecular weight of 1,000.
It is preferable that it is 50,000. Number average molecular weight is 1
.. If it is less than 000, sufficient elongation will not be obtained when the composition of the present invention is made into a cured product, and breakage will occur before sufficient strength is exhibited. Therefore, in order to obtain sufficient mechanical strength, the number average molecular weight is preferably 1°000 or more. However, if the molecular weight is too large, curing will be insufficient and sufficient mechanical strength will not be obtained.
本発明において(B)成分として用いられるポリオキシ
テトラメチレン系重合体は、数平均分子量が500〜2
0,000であるのが好ましい。数平均分子量が500
未満であると、本発明の組成物を硬化物にした場合に充
分な伸びが得られず、また充分な強度が発現される前に
破断が起こってしまう。そこで、充分な機械強度を得る
ためには、数平均分子量は500以上であるのが好まし
い。しかし、あまり分子量が大きすぎると硬化が不充分
となり、充分な機械強度が得られない。特に、(B)成
分は(A)成分にガラス耐候接着性を付与するだけでな
く、硬化物の機械的強度の調整に使用できる。すなわち
、分子量の比較的小さな(B)成分を使用すると、弾性
率か大きくなり伸びが小さくなる。また、分子量の大き
な(B)成分を使用すると、強度が大きくなり、伸びが
大きくなる。The polyoxytetramethylene polymer used as component (B) in the present invention has a number average molecular weight of 500 to 2.
Preferably it is 0,000. Number average molecular weight is 500
If it is less than that, sufficient elongation will not be obtained when the composition of the present invention is made into a cured product, and breakage will occur before sufficient strength is developed. Therefore, in order to obtain sufficient mechanical strength, the number average molecular weight is preferably 500 or more. However, if the molecular weight is too large, curing will be insufficient and sufficient mechanical strength will not be obtained. In particular, component (B) not only imparts weather-resistant adhesion to glass to component (A), but can also be used to adjust the mechanical strength of the cured product. That is, when component (B) having a relatively small molecular weight is used, the elastic modulus increases and elongation decreases. Furthermore, when component (B) having a large molecular weight is used, the strength and elongation become large.
上記の(A)成分100重量部に対して(B)成分を5
〜120重量部添加することにより、ガラス耐候接着性
が飛躍的に向上する。これは、(B)成分のポリオキシ
テトラメチレン系重合体か耐候性および耐水性に優れて
いるため、(A)成分に対してもこれらの特性を付与す
ることとなり、その結果ガラス耐候性に優れた組成物と
なるからである。(B)成分が5重量部未満だと、この
ような効果が有効に発現しない。一方、(B)成分が1
20重量部を超えると、硬化させた際に弾力性が劣り、
シーリング材として有効に働かない。従って、本発明の
配合割合からなる組成物は、ガラスが使用されている個
所において優れたシーリング材として使用できる。好ま
しい配合割合は、(A)成分100重量部に対して(B
)成分10〜100重量部である。Add 5 parts of component (B) to 100 parts by weight of component (A) above.
By adding ~120 parts by weight, the weathering adhesion to glass is dramatically improved. This is because the polyoxytetramethylene polymer of component (B) has excellent weather resistance and water resistance, so these characteristics are imparted to component (A) as well, resulting in improved glass weather resistance. This is because it results in an excellent composition. If the amount of component (B) is less than 5 parts by weight, such effects will not be effectively exhibited. On the other hand, component (B) is 1
If it exceeds 20 parts by weight, the elasticity will be poor when cured,
Does not work effectively as a sealant. Therefore, the composition having the blending ratio of the present invention can be used as an excellent sealing material in places where glass is used. The preferred blending ratio is (B) to 100 parts by weight of component (A).
) component is 10 to 100 parts by weight.
本発明における(C)成分であるシラノール縮合触媒(
硬化触I)としては、従来公知のものを広く使用するこ
とができる。その具体例としては、テトラブチルチタネ
ニト、テトラプロピルチタネートなどのチタン酸エステ
ル類;ジブチルスズジラウレート、ジブチルスズマレエ
ート、ジブチルスズジアセテート、オクチル酸スズ、ナ
フテン酸スズなどのスズカルボン酸塩類;ジブチルスズ
オ牛サイドとフタル酸エステルとの反応物;ジブチルス
ズジアセチルアセトナート;アルミニウムトリスアセチ
ルアセトナート、アルミニウムトリスエチルアセトアセ
テート、ジイソプロポキシアルミニウムエチルアセトア
セテートなどの有機アルミニウム化合物類;ジルコニウ
ムテトラアセチルアセトナート、チタンテトラアセチル
アセトナートなどのキレート化合物類;オクチル酸鉛ニ
ブチルアミン、オクチルアミン、ジブチルアミン、モノ
エタノールアミン、ジェタノールアミン、トリエタノー
ルアミン、ジエチレントリアミン、トリエチレンテトラ
ミン、オレイルアミン、シクロヘキシルアミン、ベンジ
ルアミン、ジエチルアミノプロビルアミン、キシリレン
ジアミン、トリエチレンジアミン、グアニジン、ジフェ
ニルグアニジン、2.4.6−)リス(ジメチルアミノ
メチル)フェノール、モルホリン、N−メチルモルホリ
ン、2−エチル−4−メチルイミダゾール、1.8−ジ
アザビシクロ(5,4,0)ウンデセン−7(DBU)
などのアミン系化合物、あるいはこれらアミン系化合物
のカルボン酸などとの塩;過剰のポリアミンと多塩基酸
とから得られる低分子量ポリアミド樹脂;過剰のポリア
ミンとエポキシ化合物との反応生成物;γ−アミノプロ
ピルトリメトキシシラン、N−(β−アミノエチル)ア
ミノプロピルメチルジメトキシシランなどのアミノ基を
有するシランカップリング剤;などのシラノール縮合触
媒、さらには他の酸性触媒、塩基性触媒などの公知のシ
ラノール縮合触媒等が挙げられる。これらの触媒は単独
で使用してもよく、2種以上併用してもよい。The silanol condensation catalyst (C) component in the present invention (
As the curing agent I), a wide variety of conventionally known materials can be used. Specific examples include titanate esters such as tetrabutyl titanenite and tetrapropyl titanate; tin carboxylates such as dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, tin octylate, and tin naphthenate; Reactants with phthalate esters; dibutyltin diacetylacetonate; organoaluminum compounds such as aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate; zirconium tetraacetylacetonate, titanium tetraacetylacetonate Chelate compounds such as lead octylate-nibutylamine, octylamine, dibutylamine, monoethanolamine, jetanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, diethylaminopropylamine, xylene Diamine, triethylenediamine, guanidine, diphenylguanidine, 2.4.6-)lis(dimethylaminomethyl)phenol, morpholine, N-methylmorpholine, 2-ethyl-4-methylimidazole, 1.8-diazabicyclo(5, 4,0) Undecene-7 (DBU)
amine compounds such as, or salts of these amine compounds with carboxylic acids; low molecular weight polyamide resins obtained from excess polyamines and polybasic acids; reaction products between excess polyamines and epoxy compounds; γ-amino Silanol condensation catalysts such as propyltrimethoxysilane, N-(β-aminoethyl)aminopropylmethyldimethoxysilane and other amino group-containing silane coupling agents; and other known silanol catalysts such as acidic and basic catalysts. Examples include condensation catalysts. These catalysts may be used alone or in combination of two or more.
本発明の樹脂組成物における(C)成分の配合量は、(
A)成分100重量部に対して0.1〜20重量部であ
り、好ましくは1〜10重量部である。(A)成分に対
して(C)成分の配合量が少なすぎると、硬化速度が遅
くなり、また硬化反応が充分に進行しにくくなるので、
好ましくない。一方、(A)成分に対して(C)成分の
配合量が多すぎると、硬化時に局部的な発熱や発泡が生
じ、良好な硬化物が得られにくくなるので、好ましくな
い。The blending amount of component (C) in the resin composition of the present invention is (
The amount is 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, per 100 parts by weight of component A). If the amount of component (C) blended is too small relative to component (A), the curing speed will be slow and the curing reaction will be difficult to proceed sufficiently.
Undesirable. On the other hand, if the blending amount of component (C) is too large relative to component (A), local heat generation and foaming will occur during curing, making it difficult to obtain a good cured product, which is not preferable.
本発明の組成物には、更に、必要に応じて、接着性改良
剤、物性調整剤、保存安定性改良剤、可塑剤、充填剤、
老化防止剤、紫外線吸収剤、金属不活性化剤、オゾン劣
化防止剤、光安定剤、アミン系ラジカル連鎖禁止剤、リ
ン系過酸化物分解剤、滑剤、顔料、発泡剤などの各種添
加剤を適宜添加することが可能である。The composition of the present invention further includes, if necessary, an adhesion improver, a physical property adjuster, a storage stability improver, a plasticizer, a filler,
Various additives such as anti-aging agents, ultraviolet absorbers, metal deactivators, anti-ozonants, light stabilizers, amine-based radical chain inhibitors, phosphorus-based peroxide decomposers, lubricants, pigments, foaming agents, etc. It can be added as appropriate.
本発明の硬化性樹脂組成物を硬化させて得られる硬化物
は、耐候接着性、特にガラス耐候接着性に優れるととも
に、弾性体として優れた機械特性を有するものである。The cured product obtained by curing the curable resin composition of the present invention has excellent weather-resistant adhesion, particularly weather-resistant adhesion to glass, and has excellent mechanical properties as an elastic body.
[実施例コ
本発明をより一層明らかにするために、以下に実施例を
掲げる。[Examples] In order to further clarify the present invention, Examples are given below.
実施例1〜4、比較例1〜3
1、(A)成分および(B)成分としては、以下の重合
体を用いた。Examples 1 to 4, Comparative Examples 1 to 3 1. The following polymers were used as component (A) and component (B).
(A)成分二次式で表わされる数平均分子量8゜000
のポリプロピレングリコ−
ル系重合体(P−1と略す)
(B)成分二次式で表わされる数平均分子量2゜000
のポリオキシテトラメチル
ン系重合体(T−1と略す)
(B)成分二上記T−1と同じ式で表わされる数平均分
子量4,000のポリオ
キシテトラメチレン系重合体(T
−2と略す)
以上のP−1、T−1、T−2の各重合体および他の添
加剤を表−1に示すように配合して硬化性樹脂組成物を
得た。この組成物とガラス板を用いて、J l5−A5
757に準じて引張り試験用の試験体を作成し、室温で
4日問および50℃で4日間の養生条件により硬化させ
た。(A) Number average molecular weight expressed by component quadratic formula: 8°000
Polypropylene glycol-based polymer (abbreviated as P-1) (B) component has a number average molecular weight of 2°000 expressed by the quadratic formula
Polyoxytetramethylene polymer (abbreviated as T-1) (B) Component 2 A polyoxytetramethylene polymer (abbreviated as T-2) with a number average molecular weight of 4,000 expressed by the same formula as T-1 above. (Omitted) The above polymers P-1, T-1, T-2 and other additives were blended as shown in Table 1 to obtain a curable resin composition. Using this composition and a glass plate, J l5-A5
A specimen for a tensile test was prepared in accordance with 757, and cured at room temperature for 4 days and at 50° C. for 4 days.
この試験体を、サンシャイン ウエーザー メーター(
ブラックパネル温度63℃、散水18mfn/2hr)
に取り付け、所定時間後の引張り特性(ガラス耐候接着
性)を測定した。結果を表−2に示す。This test specimen was measured using a Sunshine Weather Meter (
Black panel temperature 63℃, watering 18mfn/2hr)
, and the tensile properties (glass weather resistance adhesion) were measured after a predetermined period of time. The results are shown in Table-2.
表−1
aCOa
:充填材
TjO:顔料
スズ系化合物二ジブチルスズノアセチルアセトナート表
−2より明らかなように、
本発明の組成物
は優れたガラス耐候接着性を示した。Table 1 aCOa: Filler TjO: Pigment tin-based compound didibutyltin acetylacetonate As is clear from Table 2, the composition of the present invention exhibited excellent weathering adhesion to glass.
Claims (1)
を含むケイ素原子含有基を少なくとも1個有し、シロキ
サン結合を形成することにより架橋しうるポリプロピレ
ングリコール系重合体100重量部、 (B)水酸基または加水分解性基の結合したケイ素原子
を含むケイ素原子含有基を少なくとも1個有し、シロキ
サン結合を形成することにより架橋しうるポリオキシテ
トラメチレン系重合体5〜120重量部、及び (C)シラノール縮合触媒0.1〜20重量部を含有し
てなる硬化性樹脂組成物。 2、(A)成分の数平均分子量が1,000〜50,0
00であることを特徴とする請求項1記載の樹脂組成物
。 3、(B)成分の数平均分子量が500〜20,000
であることを特徴とする請求項1又は2に記載の樹脂組
成物。[Scope of Claims] 1. (A) A polypropylene glycol polymer having at least one silicon atom-containing group containing a silicon atom to which a hydroxyl group or a hydrolyzable group is bonded, and which can be crosslinked by forming a siloxane bond. 100 parts by weight, (B) Polyoxytetramethylene-based polymers 5 to 5, which have at least one silicon atom-containing group containing a silicon atom to which a hydroxyl group or a hydrolyzable group is bonded, and which can be crosslinked by forming a siloxane bond. 120 parts by weight, and (C) 0.1 to 20 parts by weight of a silanol condensation catalyst. 2. The number average molecular weight of component (A) is 1,000 to 50,0
The resin composition according to claim 1, wherein the resin composition has a molecular weight of 0.00. 3. The number average molecular weight of component (B) is 500 to 20,000
The resin composition according to claim 1 or 2, characterized in that:
Priority Applications (1)
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---|---|---|---|
JP2120572A JP2984763B2 (en) | 1990-05-09 | 1990-05-09 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2120572A JP2984763B2 (en) | 1990-05-09 | 1990-05-09 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0415251A true JPH0415251A (en) | 1992-01-20 |
JP2984763B2 JP2984763B2 (en) | 1999-11-29 |
Family
ID=14789616
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2120572A Expired - Fee Related JP2984763B2 (en) | 1990-05-09 | 1990-05-09 | Curable resin composition |
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Country | Link |
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JP (1) | JP2984763B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060194930A1 (en) * | 2003-10-29 | 2006-08-31 | Thomas Bachon | Polymers with improved strength comprising mixed oxyalkyl units |
JP2007246577A (en) * | 2006-03-14 | 2007-09-27 | Konishi Co Ltd | Hardening catalyst for hardenable silicone-based resin and hardenable silicone-based resin composition |
JP2018507314A (en) * | 2014-12-22 | 2018-03-15 | ダウ グローバル テクノロジーズ エルエルシー | Moisture curable polymer systems based on mixtures of polysilylated polyethers |
-
1990
- 1990-05-09 JP JP2120572A patent/JP2984763B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060194930A1 (en) * | 2003-10-29 | 2006-08-31 | Thomas Bachon | Polymers with improved strength comprising mixed oxyalkyl units |
JP2007510020A (en) * | 2003-10-29 | 2007-04-19 | ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン | Mixed oxyalkylene unit-containing polymer with improved strength |
US8772421B2 (en) | 2003-10-29 | 2014-07-08 | Henkel Ag & Co. Kgaa | Polymers with improved strength comprising mixed oxyalkyl units |
JP2007246577A (en) * | 2006-03-14 | 2007-09-27 | Konishi Co Ltd | Hardening catalyst for hardenable silicone-based resin and hardenable silicone-based resin composition |
JP2018507314A (en) * | 2014-12-22 | 2018-03-15 | ダウ グローバル テクノロジーズ エルエルシー | Moisture curable polymer systems based on mixtures of polysilylated polyethers |
Also Published As
Publication number | Publication date |
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