JPH0415242U - - Google Patents
Info
- Publication number
- JPH0415242U JPH0415242U JP5507790U JP5507790U JPH0415242U JP H0415242 U JPH0415242 U JP H0415242U JP 5507790 U JP5507790 U JP 5507790U JP 5507790 U JP5507790 U JP 5507790U JP H0415242 U JPH0415242 U JP H0415242U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- insulating resin
- frame
- semiconductor chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507790U JPH0415242U (en:Method) | 1990-05-25 | 1990-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507790U JPH0415242U (en:Method) | 1990-05-25 | 1990-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415242U true JPH0415242U (en:Method) | 1992-02-06 |
Family
ID=31577709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5507790U Pending JPH0415242U (en:Method) | 1990-05-25 | 1990-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415242U (en:Method) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157241A (ja) * | 1984-01-26 | 1985-08-17 | Mitsubishi Electric Corp | 半導体装置 |
-
1990
- 1990-05-25 JP JP5507790U patent/JPH0415242U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60157241A (ja) * | 1984-01-26 | 1985-08-17 | Mitsubishi Electric Corp | 半導体装置 |