JPH041504U - - Google Patents
Info
- Publication number
- JPH041504U JPH041504U JP1990040496U JP4049690U JPH041504U JP H041504 U JPH041504 U JP H041504U JP 1990040496 U JP1990040496 U JP 1990040496U JP 4049690 U JP4049690 U JP 4049690U JP H041504 U JPH041504 U JP H041504U
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- recess
- package
- optical
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 12
- 239000013307 optical fiber Substances 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
第１図Ａ及び第１図Ｂはこの考案が適用された
光送信器の一例の平面図及びその断面図、第２図
はこの考案が適用された光送信器の説明に用いる
断面図、第３図はこの考案が適用された光送信器
の他の実施例の断面図、第４図Ａ及び第４図Ｂは
この考案が適用された光受信器の一例の平面図及
びその断面図、第５図はこの考案が適用された光
受信器の説明に用いる断面図、第６図はこの考案
が適用された光受信器の他の実施例の断面図、第
７図は従来の光送信器の一例の断面図、第８図は
従来の光受信器の一例の断面図である。
図面における主要な符号の説明、１，１１……
パツケージ、２Ａ，２Ｂ，１２Ａ，１２Ｂ……リ
ードフレーム、３……発光ダイオード、５，１５
……凹部、６，１６……凸部、７，１７……光フ
アイバ、８，１８……凹部、１３……フオトダイ
オード。
1A and 1B are a plan view and a sectional view of an example of an optical transmitter to which this invention is applied, and FIG. 2 is a sectional view used to explain the optical transmitter to which this invention is applied. 3 is a sectional view of another embodiment of an optical transmitter to which this invention is applied, and FIGS. 4A and 4B are a plan view and a sectional view of an example of an optical receiver to which this invention is applied, Fig. 5 is a sectional view used to explain an optical receiver to which this invention is applied, Fig. 6 is a sectional view of another embodiment of an optical receiver to which this invention is applied, and Fig. 7 is a conventional optical transmitter. FIG. 8 is a sectional view of an example of a conventional optical receiver. Explanation of main symbols in the drawings, 1, 11...
Package, 2A, 2B, 12A, 12B... Lead frame, 3... Light emitting diode, 5, 15
...Concave portion, 6,16...Protrusion, 7,17...Optical fiber, 8,18...Concave portion, 13...Photodiode.
Claims (1)
た発光ダイオードと、上記発光ダイオードからの
光を伝送する光フアイバとからなり、上記発光ダ
イオードの中心位置を囲むように上記パツケージ
に凹部を形成し、上記凹部に囲まれた部分に対し
て光フアイバを装着するようにした光送信器と光
フアイバとの結合装置。 (2) 上記光フアイバの端面に、上記凹部に囲ま
れた部分と係合する凹部を形成するようにした請
求項１記載の光送信器と光フアイバとの結合装置
。 (3) パツケージと、上記パツケージに収納され
たフオトダイオードと、上記フオトダイオードか
らの光を伝送する光フアイバとからなり、上記フ
オトダイオードの中心位置を囲むように上記パツ
ケージに凹部を形成し、上記凹部に囲まれた部分
に対して光フアイバを装着するようにした光受信
器と光フアイバとの結合装置。 (4) 上記光フアイバの端面に、上記凹部に囲ま
れた部分と係合する凹部を形成するようにした請
求項３記載の光受信器と光フアイバとの結合装置
。[Claims for Utility Model Registration] (1) Consisting of a package, a light emitting diode housed in the package, and an optical fiber for transmitting light from the light emitting diode, the light emitting diode is arranged so as to surround the center position of the light emitting diode. A device for coupling an optical transmitter and an optical fiber, wherein a recess is formed in a package, and an optical fiber is attached to a portion surrounded by the recess. (2) The optical transmitter and optical fiber coupling device according to claim 1, wherein a recess is formed on the end face of the optical fiber to engage with a portion surrounded by the recess. (3) consisting of a package, a photodiode housed in the package, and an optical fiber for transmitting light from the photodiode; a recess is formed in the package to surround the center of the photodiode; A coupling device for an optical receiver and an optical fiber, in which the optical fiber is attached to a portion surrounded by a recess. (4) The optical receiver and optical fiber coupling device according to claim 3, wherein a recess is formed on the end face of the optical fiber to engage with a portion surrounded by the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990040496U JP2527665Y2 (en) | 1990-04-16 | 1990-04-16 | Coupling device between optical transmitter and optical fiber and coupling device between optical receiver and optical fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990040496U JP2527665Y2 (en) | 1990-04-16 | 1990-04-16 | Coupling device between optical transmitter and optical fiber and coupling device between optical receiver and optical fiber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH041504U true JPH041504U (en) | 1992-01-08 |
| JP2527665Y2 JP2527665Y2 (en) | 1997-03-05 |
Family
ID=31550334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990040496U Expired - Lifetime JP2527665Y2 (en) | 1990-04-16 | 1990-04-16 | Coupling device between optical transmitter and optical fiber and coupling device between optical receiver and optical fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527665Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54130825A (en) * | 1978-03-31 | 1979-10-11 | Canon Inc | Image scanner |
-
1990
- 1990-04-16 JP JP1990040496U patent/JP2527665Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54130825A (en) * | 1978-03-31 | 1979-10-11 | Canon Inc | Image scanner |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527665Y2 (en) | 1997-03-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |