JPH04148538A - Tab semiconductor device - Google Patents

Abstract

PURPOSE:To enhance productivity and yield by a method wherein one or two or more tie bars are installed at the outside of a tie bar so as to be separated by an outer lead hole in order to eliminate a danger that a substrate is contaminated and that a through hole is blocked up. CONSTITUTION:A second tie bar 8a is formed at the outside of a tie bar 8 so as to be separated by outer lead holes 4. When such a semiconductor device is mounted on a substrate and its outer circumference is coated with a molding material, the molding material 9 flows over the tie bar 8 when its amount is much. However, the molding material 9 is stopped by the second tie bar 8a and does not reach the substrate 11. Consequently, there is no danger that the substrate 11 is contaminated and that a through hole is blocked up. Since the two tie bars 8, 8a are installed at a lead 3, a stress exerted on the lead 3 is relaxed after it has been bonded to a conductive pattern 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a TAB type semiconductor device in which a semiconductor element is mounted on a flexible film.

[Prior Art] A TAB type semiconductor device, in which a semiconductor device is mounted on a flexible film such as a polyimide film, and leads provided on the film are connected to the electrodes, is suitable for mass production, can be miniaturized, and is a fine-grained semiconductor device. It is currently widely used because it has various features such as being able to be patterned.

FIG. 7 is a plan view showing an example of the manufacturing process of a TAB type semiconductor device, in which (1) is a long film, (2) is a film (
1) device holes provided at regular intervals in the length direction; (3) is a lead made of a highly conductive material such as copper foil provided on the film (1), the tip of which is connected to the device hole. (2) Inner lead protruding inward (3a)
is formed. (4) is an outer lead hole formed outside and parallel to the device hole (2) to expose the outer end of the lead (3), that is, the outer lead (3b); (5) is an outer lead hole formed in parallel with the device hole (2); ) is a sprocket hole for conveying. (6) is device hole (2)
It is a semiconductor element disposed inside the inner lead (3a), and its electrode is connected to the inner lead (3a).

The film (1) to which the semiconductor element (6) is connected in this way is cut 8 along the cutting line (7) using a press or the like.
As shown in the figure, these become individual semiconductor devices.

Note that (8) is a film left behind during cutting and is generally called a tie bar.

FIG. 9 is a schematic diagram showing the state in which the above-described semiconductor device is mounted on a substrate etc. (11) is the substrate, (12) is the substrate (
11) A conductive pattern formed thereon. The semiconductor device is placed on the substrate (11) with its active side facing down, and the outer leads (3b) are connected to the conductive patterns (12) by a bonding tool. In order to prevent moisture from entering, the outer periphery of the semiconductor element (6) and the substrate (11) are
A semi-liquid resin molding material (9) is applied between the two.

[Problems to be Solved by the Invention] The molding material (9) as described above is applied so as to fill the space between the semiconductor element (6) and the tie bar (8). If the amount is large, it often flows over the tie bars (8) and onto the substrate (11). Furthermore, during the drying process of the molding material (9), the molding material (9) fluidized by heat may flow out over the tie bars (8).

As a result, the substrate (11) gets dirty, making cleaning and removal extremely troublesome, which not only impedes productivity improvement, but also
Sometimes, the through holes provided in the substrate (11) may become blocked.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a TAB type semiconductor device in which there is no possibility that molding material applied to the outer periphery of a semiconductor element will flow out onto a substrate.

[Means for Solving the Problems] A TAB type semiconductor device according to the present invention has a tie bar for holding a large number of leads on the outside of at least two opposing sides of a device hole provided in a flexible film, and the device A TAB type semiconductor device in which the leads are respectively connected to the electrodes of a semiconductor element arranged in the hole, and one or more tie bars are provided outside the tie bar with an outer lead hole in between. be.

[Function] When a semiconductor device is mounted on a substrate, etc. and a molding material is applied between the outer periphery and the substrate, etc., if the amount of molding material is large or flows during drying, the molding material may cross over the tie bars. However, this flow is blocked by the second tie bar and will not stain the substrate or block the through holes.

[Example] FIG. 1 is a plan view schematically showing an embodiment of the present invention.

Note that the same parts as in the conventional example explained in FIG. 7 are denoted by the same reference numerals, and the explanation will be omitted. (4a) is a second outer lead hole provided outside the outer lead hole (4) at a predetermined distance from the outer lead hole (4) and in parallel therewith.

Figure 12 shows the film (1) as described above cut along the cutting line (7).A second tie bar (8a) is placed outside the tie bar (8) with the outer lead pole (4) in between. ) is formed.

When a semiconductor device as described above is mounted on a board and molding material is applied to its outer periphery, as shown in Figure 3, if there is a large amount of molding material (9), it may flow over the tie bars (8). However, this molding material (9) is blocked by the second tie bar (8a) and does not reach above the substrate (11), so there is no risk of contaminating the substrate (11) or blocking the through hole.

Also, the lead (3) has two tie bars (8), (
8a), the stress applied to the lead (3) after bonding with the conductive pattern (12) can be alleviated.

In addition, in the embodiment shown in FIG. 1, the outer lead hole (4
) are provided with second outer lead holes (4a
), but the second outer lead hole (4a) is provided only on the side where the lead (3) is provided, and the second outer lead hole (4a) is provided on the side where the lead (3) is not provided. The hole (4a) may be omitted.

FIG. 4 is a schematic plan view of another embodiment of the present invention. In the embodiment shown in FIG. 1, the second tie bar (8a) is provided on the outer periphery of the tie bar (8) at a predetermined distance, but in this embodiment, the lead (3 ) is provided with a second tie bar (8a) only on the side where it is provided,
The scales for preventing the molding material (9) from flowing onto the substrate (11) are the same as in the embodiment shown in FIG.

FIG. 5 is a schematic plan view of still another embodiment of the present invention. In this embodiment, the electrodes provided on the four sides of the semiconductor element (8) are connected to the leads (8) provided on the four sides of the device hole (2).
), in which a second outer lead is installed at a predetermined distance outside the outer lead hole (4) provided along the four sides of the device hole (2). A hole (4a) is provided and the film (1) is cut along this second outer lead hole (4a). With this configuration, a semiconductor device as shown in FIG. 6 can be obtained.

In the above description, a case is shown in which the second tie bar is provided on the outside of the tie bar, but two or more tie bars may be provided on the outside of the tie bar.

Further, although an example is shown in which a molding material is applied between the periphery of a semiconductor device mounted on a substrate etc. and the substrate, the present invention is not limited to this. The present invention can also be practiced when the inner leads are sealed by potting, or when the semiconductor element and the inner leads are packaged with synthetic resin or the like using a mold before being mounted on a substrate or the like.

[Effects of the Invention] As described in detail above, the present invention provides one or more tie bars on the outside of the tie bar of a TAB type semiconductor device with an outer lead hole in between, so that the outer periphery of the semiconductor element, the substrate, etc. Even if the molding material coated between the molding material and the semiconductor elements sealed by botting or molding flows over the tie bars, it is blocked by the outer tie bars and does not flow onto the substrate or the film. Therefore, there is no risk of clogging the squirrel holes that have contaminated the substrate or the like, and productivity and yield can be improved.

In addition, since the lead is held by multiple tie bars, it is possible to prevent the lead from bending or twisting.
The stress applied to the lead after connection to the electrode of the semiconductor element is alleviated, and the yield and reliability of the connection can be improved.

[Brief explanation of drawings]

FIG. 1 is a plan view schematically showing an embodiment of the present invention, FIG. 2(a) is a plan view showing a state cut along the cutting line of FIG. 1,
(b) is its A-A sectional view, Fig. 3 is an action explanatory diagram, and Fig. 4
The figure is a schematic plan view of another embodiment of the present invention, FIG. 5 is a schematic plan view of still another embodiment of the present invention, and FIG.
FIG. 7 is a perspective view showing a state cut along the cutting line in the figure; FIG. 7 is a plan view schematically showing an example of a conventional TAB type semiconductor device;
8(a) is a plan view taken along the cutting line in FIG. 7, FIG. 8(b) is a sectional view taken along line B-B, and FIG. 9 is a plan view showing the semiconductor device in FIG. 8 mounted on a board. FIG. (1): Film, (2): Device hole, (3):
Lead, (3b): Outer lead, (4): Outer lead hole, (4a): Second outer lead hole, (5): Sprocket hole, (8): Semiconductor element, (
7): cutting line, (8): tie bar (8a): second tie bar (9): molding material, (11): substrate etc., (12): conductive pattern.

Claims (1)

[Claims] A device hole provided in the flexible film has a tie bar for holding a large number of leads on the outside of at least two opposing sides, and each of the leads is connected to an electrode of a semiconductor element arranged in the device hole. A TAB type semiconductor device characterized in that one or more tie bars are provided on the outside of the tie bar with an outer lead hole in between.