JPH04145632A - Semiconductor sealing device - Google Patents

Abstract

PURPOSE:To accurately adjust a gap between a needle and a semiconductor chip by detecting a distance from the needle provided at the leading edge of a syringe which contains sealing material, to the semiconductor chip and stopping to ascend/descend a cylinder holder based on the fact that the distance is over the set value. CONSTITUTION:A syringe holder 9 which is ascended and descended by an ascending/descending device 10 is provided with a deformation sensor 11, and the contact of a needle 3, which is provided at the leading edge of a syringe 2 which contains sealing material 1, with a semiconductor chip 7 is detected. The output of the sensor 11 is compared with a previously set value, and when the output is over the set value, a drive stopping signal is supplied from a controller 12 and the device 10 is stopped. Thus, a gap between the needle and the semiconductor chip is accurately adjusted, and even when the tip of the needle is brought into contact with the semiconductor chip, the bending of the needle and semiconductor chip breakage are prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a semiconductor sealing device for sealing the inner lead joint portion of a semiconductor chip with a sealant.

(Prior Art) In general, this type of semiconductor sealing device, as shown in FIG. 3, includes a syringe 2 containing a sealing material 1 such as an epoxy resin,
The syringe 2 includes a thin tubular needle 3 attached to the tip thereof and a dispenser 5 connected to the syringe 2 via an air tube 4, and the dispenser 5 supplies pressurized air to the syringe 2. The sealing material 1 is dropped onto the surface of the semiconductor chip 7 on the chip table 6 from the tip of the needle 3.

By the way, in such a semiconductor sealing device, the needle 3
If the gap g between the semiconductor chip 7 and the semiconductor chip 7 changes, the amount of the sealing material 1 dropped onto the surface of the semiconductor chip 7 will change, which may cause sealing failure or the like. Therefore, in the past, the gap g between the needle 3 and the semiconductor chip 7 was adjusted by the following method.

That is, first, the syringe 2 is temporarily fixed to the syringe holder 9 using the fixing screw 8 . Next, the syringe holder 9 is moved downward by the lifting device 10, and the tip of the needle 3 is brought into contact with the semiconductor chip 7.

Then, the gap g between the needle 3 and the semiconductor chip 7 was adjusted by raising the syringe holder 9 by a predetermined distance from the point where the tip of the needle 3 contacted the semiconductor chip 7.

(Problem to be solved by the invention) However, according to the above-mentioned prior art, the needle 3
Since it was judged by human eyes whether the needle 3 and the semiconductor chip 7 came into contact with each other, it was difficult to accurately adjust the gap g between the needle 3 and the semiconductor chip 7. Also, if the needle 3 contacts the semiconductor chip 7 excessively, the needle 3
There was a problem that the semiconductor chip 7 could be bent or the semiconductor chip 7 could be damaged.

The present invention was made in view of the above-mentioned problems.
An object of the present invention is to provide a semiconductor sealing device that can accurately adjust the gap between a needle and a semiconductor chip, and that does not bend the needle or damage the semiconductor chip even when the tip of the needle comes into contact with the semiconductor chip. shall be.

[Configuration of the Invention (Means for Solving the Problems) In order to solve the above problems, the present invention includes a syringe containing a sealing material, a needle attached to the tip of the syringe, and a gas injected into the syringe. a dispenser that supplies and drips the sealing material from the tip of the needle onto the surface of the semiconductor chip; a syringe holder that holds the syringe; a lifting device that moves the syringe holder in the vertical direction; and a lifting device that is attached to the syringe holder. a detection device that detects the distance between the needle and the semiconductor chip; and a detection device that compares the output of this detection device with a predetermined set value, and when the output of the detection device exceeds the set value, the lifting device The controller is equipped with a controller that sends out a drive stop signal to the controller.

(Function) In the present invention, the detection device can detect that the needle has contacted the semiconductor chip. Therefore, the output of the detection device is input to the controller, and when the output of the detection device exceeds a predetermined set value, the drive of the lifting device is stopped by sending a drive stop signal from the controller to the lifting device. Therefore, the gap between the needle and the semiconductor chip can be adjusted accurately, and even if the needle comes into contact with the semiconductor chip, bending of the needle and damage to the semiconductor chip can be prevented.

(Example) An embodiment of the present invention will be described below with reference to FIG.

In FIG. 1, 1 is a sealing material, 2 is a syringe, 3 is a needle, 4 is an air tube, 5 is a dispenser, 6 is a chip table, 7 is a semiconductor chip, 8 is a fixing screw, 9 is a syringe holder, and 10 is a The lifting devices are the same as those shown in FIG. Further, 11 is a strain sensor attached to the syringe holder 9, and the output of this strain sensor 11 is input to the controller 12.

The controller 12 drives and controls the lifting device 10 based on the signal from the strain sensor 11, and the output of the strain sensor 11 input to the controller 12 is compared with a preset value. . When the output of the strain sensor 11 exceeds the above set value, the controller 12
A drive stop signal is sent to the elevating device 10 from the elevating device 10.

In the semiconductor sealing device configured as described above, the strain sensor 11 is attached to the syringe holder 9 that holds the syringe 2, so that the tip of the needle 3
The strain sensor 11 can detect the contact. Therefore, the output of the strain sensor 11 is transferred to the controller 12.
The output of the strain sensor 11 is compared with a predetermined set value, and when the output of the strain sensor 11 exceeds the set value, the controller 12 sends a drive stop signal to the lifting device 10. Since the drive of the needle 10 can be stopped, the gap between the needle 3 and the semiconductor chip 7 can be adjusted accurately, and even if the needle 3 contacts the semiconductor chip 7, bending of the needle 3 and damage to the semiconductor chip 7 can be prevented. can do.

Note that the present invention is not limited to the above embodiments,
Various modifications can be made without departing from the spirit of the invention. For example, as shown in FIG. 2, a piezoelectric element 13 may be used in place of the strain sensor 11, and whether or not the tip of the needle 3 has contacted the semiconductor chip 7 may be detected from a change in the output voltage of the piezoelectric element 13. . In addition, 1 in Figure 2
Reference numeral 4 denotes a holding member that is vertically movably held in the syringe holder 9, and the syringe 2 is held in the syringe holder 9 via the holding member 14.

The piezoelectric element 13 is attached to the upper surface of a holding member 14, and when the tip of the needle 3 comes into contact with a semiconductor chip (not shown), the holding member 14 moves upward against the spring force of a compression spring 15. , the upper surface of the piezoelectric element 13 is pressed against the syringe holder 9. As a result, the output voltage of the piezoelectric element 13 changes, and it is possible to detect that the tip of the needle 3 has contacted the semiconductor chip 7.

[Effects of the Invention] As explained above, the present invention includes a syringe containing a sealing material, a needle attached to the tip of the syringe, and a gas being supplied to the syringe to release a semiconductor chip from the tip of the needle. a dispenser that drips the sealing material onto a surface; a syringe holder that holds the syringe; and a lifting device that moves the syringe holder in the vertical direction;
A detection device is attached to the syringe holder and detects the distance between the needle and the semiconductor chip, and the output of this detection device is compared with a predetermined setting value, and the output of the detection device exceeds the setting value. and a controller that sends a drive stop signal to the elevating device based on the above. Therefore, the drive of the lifting device can be stopped based on the signal from the detection device, so the gap between the needle and the semiconductor chip can be adjusted accurately, and even if the tip of the needle comes into contact with the semiconductor chip, the needle will not move. It is possible to provide a semiconductor sealing device that does not bend or damage the semiconductor chip.

[Brief explanation of the drawing]

FIG. 1 is a schematic configuration diagram of a semiconductor encapsulation device showing an embodiment of the present invention, FIG. 2 is a diagram showing a modification of the same embodiment, and FIG. 3 is a schematic configuration diagram of a conventional semiconductor encapsulation device. be. DESCRIPTION OF SYMBOLS 1... Sealing material, 2... Syringe, 3... Needle, 4... Air tube, 5... Dispenser, 6... Chip table, 7... Semiconductor chip, 8... - Fixing screw, 9... Syringe holder, 10... Elevating device, 1... Strain sensor, 2... Controller, 3... Piezoelectric element.

Claims (1)

[Claims] A syringe containing a sealing material, a needle attached to the tip of the syringe, a dispenser that supplies gas to the syringe and drips the sealing material onto the surface of a semiconductor chip from the tip of the needle, and the syringe. a syringe holder that holds the syringe holder, a lifting device that moves the syringe holder in the vertical direction, a detection device that is attached to the syringe holder and detects the distance between the needle and the semiconductor chip, and a predetermined output of the detection device. 1. A semiconductor encapsulation apparatus, comprising: a controller that sends a drive stop signal to the elevating device when the output of the detecting device exceeds the preset value.