JPH0413749A - Flame-retarding resin composition - Google Patents
Flame-retarding resin compositionInfo
- Publication number
- JPH0413749A JPH0413749A JP11650190A JP11650190A JPH0413749A JP H0413749 A JPH0413749 A JP H0413749A JP 11650190 A JP11650190 A JP 11650190A JP 11650190 A JP11650190 A JP 11650190A JP H0413749 A JPH0413749 A JP H0413749A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- compound
- rubber
- flame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 11
- 150000002366 halogen compounds Chemical class 0.000 claims abstract description 15
- 150000001463 antimony compounds Chemical class 0.000 claims abstract description 10
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 8
- 229920001225 polyester resin Polymers 0.000 claims abstract description 7
- 239000004645 polyester resin Substances 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 239000001257 hydrogen Substances 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 11
- 239000003063 flame retardant Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 15
- 229920001890 Novodur Polymers 0.000 abstract description 7
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 1
- 125000005843 halogen group Chemical group 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- -1 aromatic vinyl compound Chemical class 0.000 description 18
- 229920002554 vinyl polymer Polymers 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 6
- 229920000578 graft copolymer Polymers 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000007720 emulsion polymerization reaction Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 238000010557 suspension polymerization reaction Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- 238000012662 bulk polymerization Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- MCRWZBYTLVCCJJ-DKALBXGISA-N [(1s,3r)-3-[[(3s,4s)-3-methoxyoxan-4-yl]amino]-1-propan-2-ylcyclopentyl]-[(1s,4s)-5-[6-(trifluoromethyl)pyrimidin-4-yl]-2,5-diazabicyclo[2.2.1]heptan-2-yl]methanone Chemical compound C([C@]1(N(C[C@]2([H])C1)C(=O)[C@@]1(C[C@@H](CC1)N[C@@H]1[C@@H](COCC1)OC)C(C)C)[H])N2C1=CC(C(F)(F)F)=NC=N1 MCRWZBYTLVCCJJ-DKALBXGISA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、ゴム強化熱可塑性樹脂、飽和ポリエステル樹
、脂ならびに特定構造のハロゲン化合物からなる熱安定
性に優れた難燃性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a flame-retardant resin composition with excellent thermal stability, comprising a rubber-reinforced thermoplastic resin, a saturated polyester resin, a resin, and a halogen compound with a specific structure. .
(従来の技術)
ABS樹脂やABS樹脂に代表されるゴム強化スチレン
系樹脂と飽和ポリエステル樹脂とからなる樹脂組成物は
、耐薬品性改良ゴム強化スチレン系樹脂又は耐衝撃性改
良飽和ポリエステル樹脂として期待されている。しかし
ながら、かかる樹脂組成物は可燃性材料であるため、難
燃性、例えば米国アンダーライターズ ラボラトリーズ
(UL)規格94に基づく自己消火性(v−0、v−1
、V −2クラス) を必要トする電気・電子機器への
使用にあたっては制約を受けている。(Prior art) A resin composition consisting of ABS resin or a rubber-reinforced styrene resin represented by ABS resin and a saturated polyester resin is expected to be used as a rubber-reinforced styrenic resin with improved chemical resistance or a saturated polyester resin with improved impact resistance. has been done. However, since such resin compositions are flammable materials, they have flame retardant properties, such as self-extinguishing properties (v-0, v-1) based on U.S. Underwriters Laboratories (UL) Standard 94.
, V-2 class) are subject to restrictions when used in electrical and electronic equipment that requires
難燃化方法としては、すでにテトラブロモビヌフェノー
/L/A(TBA)、デカブロモジフェニルエーテ/v
(D B D E )、臭素化ポリカーボネートオリ
ゴマーなどのハロゲン化合物又はそれらとアンチモン化
合物との組み合わせが知られているが、これらの化合物
を配合することにより、難燃化を図ることができるもの
の、樹脂組成物の特長である耐熱性、耐衝撃性、加工性
が著しく低下するといった問題がある。As flame retardant methods, tetrabromobinupheno/L/A (TBA) and decabromodiphenyl ether/v have already been used.
(D B D E ), halogen compounds such as brominated polycarbonate oligomers, or combinations thereof with antimony compounds are known, but although flame retardation can be achieved by blending these compounds, the resin There is a problem that the heat resistance, impact resistance, and processability, which are the characteristics of the composition, are significantly reduced.
又、パーソナルコンピューターやファクシミリなど窓際
で使用される機器用材料においては耐光性も要求されて
いる。Light resistance is also required for materials for devices used near windows, such as personal computers and facsimile machines.
(問題点を解決するだめの手段)
本発明者は、かかる問題点に鑑み鋭意検討を行った結果
、特定構造のハロゲン化合物を用いることにより、樹脂
組成物の特長である優れた性
耐熱性、耐衝撃性及び加工性を犠履にすることなく、熱
安定性及び耐光性を著しく改善してなる難燃性組成物を
見出し、本発明に到達したものである。(Means for Solving the Problems) The inventors of the present invention have conducted intensive studies in view of the above problems, and have found that by using a halogen compound with a specific structure, the resin composition has excellent heat resistance and properties. The present invention was achieved by discovering a flame retardant composition that has significantly improved thermal stability and light resistance without sacrificing impact resistance or processability.
(B)10〜85重量%、次式(1)で表わされる高分
子量ハロゲン化合物(C)5〜35重量%およびアンチ
モン化合物(D)0〜10重量%からなる熱安定性に優
れた難燃性樹脂組成物を提供するものである。(B) 10 to 85% by weight, a high molecular weight halogen compound represented by the following formula (1) (C) 5 to 35% by weight, and an antimony compound (D) 0 to 10% by weight. Flame retardant with excellent thermal stability. The present invention provides a synthetic resin composition.
(式中nは平均重合度で4〜30の整数、RおよびR′
はそれぞれ独立に水素、メチル基、エポキシプロヒル基
、フェニル基、ハロゲン化フェニル基または
であり、かつ、臭素含有量が45重量%以上、エポキシ
当量が10000グラム1モル以上である。)
本発明の難燃性樹脂組成物について、以下に詳細に説明
する。(In the formula, n is the average degree of polymerization, an integer of 4 to 30, R and R'
are each independently hydrogen, a methyl group, an epoxyproyl group, a phenyl group, a halogenated phenyl group, or have a bromine content of 45% by weight or more and an epoxy equivalent of 10,000 grams or 1 mole or more. ) The flame-retardant resin composition of the present invention will be explained in detail below.
本発明におけるゴム強化スチレン系樹脂(A)とは、ゴ
ム状重合体の存在下に芳香族ビニル系化合物および必要
に応じて共重合可能な他のビニル系化合物を重合して得
られるグラフト共重合体または該グラフト共重合体と、
芳香族ビニル系化合物および必要に応じて共重合可能な
他のビニ)V系化合物を重合して得られる芳香族ビニル
系重合体との混合物である。The rubber-reinforced styrenic resin (A) in the present invention refers to a graft copolymer obtained by polymerizing an aromatic vinyl compound and, if necessary, another copolymerizable vinyl compound in the presence of a rubbery polymer. a combination or said graft copolymer;
It is a mixture of an aromatic vinyl compound and an aromatic vinyl polymer obtained by polymerizing an aromatic vinyl compound and, if necessary, another copolymerizable vinyl(V) compound.
ゴム強化スチレン系樹脂(A)を構成するゴム状重合体
としては、ポリブタジェン、ブタンエン−スチレン共重
合体、ブタジェン−アクリロニトリル共重合体等のジエ
ン系ゴム状重合体およびエチレン−プロピレン共重合体
、エチレンープロヒレンー非共役ジエン共重合体、アク
リル系ゴム状重合体、塩素化ポリエチレン等の非ジエン
系ゴム状重合体が例示され、1種又は2種以上使用する
ことができる。これらのゴム状重合体は乳化重合、溶液
重合、塊状重合、懸濁重合等により製造される。Examples of the rubbery polymer constituting the rubber-reinforced styrenic resin (A) include diene rubbery polymers such as polybutadiene, butane-styrene copolymer, butadiene-acrylonitrile copolymer, ethylene-propylene copolymer, and ethylene. -Prohylene-Non-diene rubbery polymers such as non-conjugated diene copolymers, acrylic rubbery polymers, and chlorinated polyethylenes are exemplified, and one or more of them can be used. These rubbery polymers are produced by emulsion polymerization, solution polymerization, bulk polymerization, suspension polymerization, and the like.
なお、乳化重合により製造する場合におけるゴム状重合
体の粒子径およびゲル含有率については特に制限はない
が、平均粒子径0.1〜1μmおよびゲル含有率0〜9
5%であることが好ましい。There are no particular restrictions on the particle size and gel content of the rubbery polymer when produced by emulsion polymerization, but the average particle size is 0.1 to 1 μm and the gel content is 0 to 9.
Preferably it is 5%.
芳香族ビニル系化合物としては、スチレン、α−メチル
スチレン、0−メチルスチレン、m−メチルスチレン、
p−メチルスチレン、tブチルスチレン、α−メチルビ
ニ/L/ ) /L’エン、シメチルヌチレン、クロル
スチレン、ジクロルスチレン、プロムヌチレン、シブロ
ムスチレン等が例示され、1種又は2種以上用いること
がテキル。特にスチレン、α−メチルスチレンが好まし
い。Examples of aromatic vinyl compounds include styrene, α-methylstyrene, 0-methylstyrene, m-methylstyrene,
Examples include p-methylstyrene, t-butylstyrene, α-methylviny/L/L'ene, dimethylnutylene, chlorstyrene, dichlorostyrene, promnutylene, sibromustyrene, etc., and one or more of them can be used in combination. . Particularly preferred are styrene and α-methylstyrene.
芳香族ビニ)v系化合物と共重合可能な他のビニ/l/
系化合物としては、アクリロニトリル、メタクリレート
リル等のシアン化ビニル系化合物、メチルアクリレート
、エチルアクリレート、ブチルアクリレート、2−エチ
ルヘキシルアクリレート
リレート、プロピルメタクリレート、2−エチルへキシ
ルメタクリレート等の不飽和カルボン酸アルキpエステ
ル、マレイミド、N−フェニルマレイミド、N−メチル
マレイミド、N−シクロヘキシルマレイミド等のマレイ
ミド系化合物が例示され各々1種又は2種以上用いるこ
とができる。特にアクリロニトリル、メチルメタクリレ
ートおよびN−フェニルマレイミドが好ましい。Aromatic vinyl) Other vinyl copolymerizable with v-based compounds /l/
Examples of such compounds include vinyl cyanide compounds such as acrylonitrile and methacrylate, unsaturated carboxylic acid alkyl p esters such as methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, propyl methacrylate, and 2-ethylhexyl methacrylate. , maleimide, N-phenylmaleimide, N-methylmaleimide, N-cyclohexylmaleimide and the like are exemplified, and one or more types of each can be used. Particularly preferred are acrylonitrile, methyl methacrylate and N-phenylmaleimide.
グラフト重合方法としては、公知の乳化重合、懸濁重合
、塊状重合、溶液重合またはこれらを組み合わせた方法
が用いられる。As the graft polymerization method, known methods such as emulsion polymerization, suspension polymerization, bulk polymerization, solution polymerization, or a combination thereof are used.
グラフト共重合体と混合して用いられる芳香族ビニル系
重合体を構成する芳香族ビニル系化合物および共重合可
能な他のビニル系化合物としては、各々グラフト共重合
体に用いられるものと同一の群から任意の1種又は2種
以上を選択して用いることができる。また、該重合体の
重合方法としては、公知の乳化重合、懸濁重合、溶液重
合、塊状1合またはこれらを組み合わせた方法が用いら
れる。The aromatic vinyl compounds constituting the aromatic vinyl polymer used in combination with the graft copolymer and other copolymerizable vinyl compounds are from the same group as those used in the graft copolymer. Any one type or two or more types can be selected and used from the following. Further, as a polymerization method for the polymer, known methods such as emulsion polymerization, suspension polymerization, solution polymerization, bulk polymerization, or a combination thereof are used.
ゴム強化ヌチレン系樹脂(A)におけるゴム状重合体と
化合物との構成比には制限はないが、好ましくはゴム状
重合体5〜80重量%、化合物95〜20重量%である
。またかかる化合物における芳香族ビニル系化合物と他
のビニル系化合物との構成比にも特に制限はないが、芳
香族ビニル系化合物lO〜100重量%、特に30〜7
0重量%、他のビニ/’ 系化合物90〜0重量%、特
に70〜30重量%が好ましい。Although there is no restriction on the composition ratio of the rubbery polymer and the compound in the rubber-reinforced nutylene resin (A), it is preferably 5 to 80% by weight of the rubbery polymer and 95 to 20% by weight of the compound. There is also no particular restriction on the composition ratio of the aromatic vinyl compound and other vinyl compounds in such a compound, but the aromatic vinyl compound lO to 100% by weight, especially 30 to 7% by weight.
0% by weight, and 90 to 0% by weight, particularly 70 to 30% by weight of other vinyl/' compounds.
又、本発明の無燃性樹脂組成物を構成する飽和ボリエヌ
テ)V樹脂(B)とは、次の一般式で示される樹脂であ
る。Further, the saturated V resin (B) constituting the nonflammable resin composition of the present invention is a resin represented by the following general formula.
(但しn及びmは整数、又Arは芳香族基)一般にはテ
レフタル酸、イソフタル酸、オルトフタル酸、1.5(
又は2.5又は2.6)−ナフタレンジカルボン酸等の
芳香族ジカルボン酸トエチレングリコール、プロピレン
グリコール、ブチレングリコール、ヘキシレングリコー
ル、1.4−シクロヘキサン6’ノール等のジオールと
の重縮合反応、または、上述の芳香族ジカルボン酸のエ
ステルとジオールとでエステル交換反応を行った後に加
熱してなる重縮合反応によシ得られる。(However, n and m are integers, and Ar is an aromatic group) Generally, terephthalic acid, isophthalic acid, orthophthalic acid, 1.5 (
or 2.5 or 2.6) - Polycondensation reaction of aromatic dicarboxylic acids such as naphthalene dicarboxylic acid with diols such as ethylene glycol, propylene glycol, butylene glycol, hexylene glycol, 1,4-cyclohexane 6'nol, Alternatively, it can be obtained by a polycondensation reaction performed by carrying out a transesterification reaction between the above-mentioned ester of aromatic dicarboxylic acid and a diol, followed by heating.
具体的にハポリエチレンテレフタレート、ポリプロピレ
ンテレフタレート、ポリブチレンテレフタレート、ポリ
エチレンナフタレート、ポリエチレンイソフタレート−
テレフタレート、ポリブチレンテレフタレート−イソフ
タレートなどが挙げられ、1種又は2種以上用いること
ができる。特にポリブチレンテレフタレートが好ましい
。又、分子量にも特に制限はないが粘度平均分子量20
,000〜40,000のものが好ましい。Specifically, polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene isophthalate.
Examples include terephthalate, polybutylene terephthalate-isophthalate, and one type or two or more types can be used. Particularly preferred is polybutylene terephthalate. In addition, there is no particular restriction on the molecular weight, but the viscosity average molecular weight is 20
,000 to 40,000 is preferred.
本発明で用いられる高分子量ハロゲン化合物(C)とは
、次式で表わされる化合物である。The high molecular weight halogen compound (C) used in the present invention is a compound represented by the following formula.
平均重合度″n″は4〜30であシ、4未満では最終組
成物の耐衝撃性、耐熱性ならびに熱安定性が劣り、又3
0を超すと加工性が劣る。The average degree of polymerization "n" should be 4 to 30; if it is less than 4, the impact resistance, heat resistance and thermal stability of the final composition will be poor;
If it exceeds 0, workability will be poor.
耐衝撃性、耐熱性、熱安定性および加工性のバランス面
よシ平均重合度6〜25、特に10〜25が好ましい。In terms of balance among impact resistance, heat resistance, thermal stability and processability, the average degree of polymerization is preferably 6 to 25, particularly 10 to 25.
R及びR′は水素、メチル基、エポキシプロピル基、フ
ェニル基、ハロゲン化フェニル基マたは
R及びR′のいずれもがハロゲン化フェニル基、特にト
リブロモフェニルであることが最終組成物の熱安定性お
よび難燃性の面より好ましい。R and R' are hydrogen, a methyl group, an epoxypropyl group, a phenyl group, a halogenated phenyl group, or both R and R' are halogenated phenyl groups, especially tribromophenyl. It is more preferable in terms of stability and flame retardancy.
臭素含有量は45重量%以上でろシ、それ未満では最終
組成物の難燃性に劣る。特に好ましくは50重量%以上
である。If the bromine content is 45% by weight or more, the flame retardancy of the final composition is poor. Particularly preferably, it is 50% by weight or more.
さらに、エポキシ当量は10000グラム/七p以上で
あり、それ未満では最終組成物の熱安定性に劣る。特に
20000グラム/七p以上100000未満が好まし
い。Further, the epoxy equivalent weight is 10,000 grams/7p or more, and if it is less than that, the final composition will have poor thermal stability. Particularly preferred is 20,000 g/7 or more and less than 100,000.
なお、高分子量ハロゲン化合物(C)の軟化屯には特に
制限はないが、最終組成物の耐衝撃性および耐熱性の面
よ、biso〜210℃のものが特に好ましい。The softening temperature of the high molecular weight halogen compound (C) is not particularly limited, but from the viewpoint of impact resistance and heat resistance of the final composition, a softening temperature of biso to 210° C. is particularly preferred.
高分子量ハロゲン化合物(C)の製造としては次のよう
な方法が挙げられる。The following methods can be used for producing the high molecular weight halogen compound (C).
!X化ビヌフェノー/l/A型エポキシ樹脂と臭素化フ
ェノ−/L/(特に好ましくはトリブロモフェノール)
とを水酸化リチウム等の塩基性触媒の存在下、加熱反応
させる。この反応により該エポキシ樹脂の末端エポキシ
基の多くが臭素化フェノールとなり、一部エポキシ基と
して残存した高分子量ハロゲン化合物となる。! X-vinuphenol/l/A-type epoxy resin and brominated phenol/l/(particularly preferably tribromophenol)
and are subjected to a heating reaction in the presence of a basic catalyst such as lithium hydroxide. As a result of this reaction, most of the terminal epoxy groups of the epoxy resin become brominated phenols, and some of them become high molecular weight halogen compounds remaining as epoxy groups.
本発明において用いることのできるアンチモン化合物(
D)としては、三酸化アンチモン、五酸化アンチモン等
が挙げられ、一種又は二種以上用いることができる。Antimony compounds that can be used in the present invention (
Examples of D) include antimony trioxide, antimony pentoxide, etc., and one or more types can be used.
アンチモン化合物(D)を上述の高分子量ハロゲン化合
物(C)と併用することができ、アンチモン化合物−公
知の難燃剤(TBA、DBDE又は臭素化ポリカーボネ
ートオリゴマー)併用系に比ベプレートアウトが少なく
、耐光性も良好である。The antimony compound (D) can be used in combination with the above-mentioned high molecular weight halogen compound (C), and has less plateout and light resistance compared to the antimony compound-known flame retardant (TBA, DBDE or brominated polycarbonate oligomer) combination system. The quality is also good.
本発明の難燃性樹脂組成物は、上述のゴム強化スチレン
系樹脂(A)80〜10重量%、飽和ポリエステル樹脂
(B)10〜85重量%、高分子量ハロゲン化合物(C
)5〜35重量%およびアンチモン化合物(D)0〜1
0重量%からなる。この範囲外では目的とする性能を有
する組成物を得ることができない。耐衝撃性、耐熱性、
加工性、熱安定性、難燃性、耐光性等の面よシ(A)7
5〜12重量%、(B)20〜80重量%、(C)8〜
25重量%、(D)0〜5重量%が好ましい。The flame-retardant resin composition of the present invention contains 80 to 10% by weight of the above-mentioned rubber-reinforced styrene resin (A), 10 to 85% by weight of the saturated polyester resin (B), and a high molecular weight halogen compound (C
) 5 to 35% by weight and antimony compound (D) 0 to 1
It consists of 0% by weight. Outside this range, a composition having the desired performance cannot be obtained. impact resistance, heat resistance,
Surface characteristics such as processability, thermal stability, flame retardance, and light resistance (A) 7
5-12% by weight, (B) 20-80% by weight, (C) 8-80% by weight
25% by weight and (D) 0 to 5% by weight are preferred.
上述の各成分の混合順序ならびに混合方法に何ら制限は
なく一括混合をはじめ特定成分を予備混合した後に残る
成分を混合することができる。又、バンバリーミキサ−
ローtv、n圧機等の公知の方法を採用することができ
る。There are no restrictions on the mixing order or mixing method of each of the above-mentioned components, and it is possible to mix all at once or to mix the remaining components after premixing specific components. Also, Banbury mixer
Known methods such as low TV, n-pressure machine, etc. can be employed.
なお、混合時に、必要に応じて帯電防止剤、滑剤、染顔
料、可塑剤、離型剤、充填剤等を配合することができる
。In addition, at the time of mixing, antistatic agents, lubricants, dyes and pigments, plasticizers, mold release agents, fillers, etc. can be added as necessary.
次に実施例および比較例により本発明を具体的に説明す
る。部数および%は重量基準で示す。Next, the present invention will be specifically explained using Examples and Comparative Examples. Parts and percentages are given on a weight basis.
参考例−1(ABS樹脂−1)
ポリブタジェン50部、スチレン75部およびアクリロ
ニトリル15部を公知の乳化グラフト重合してなるグラ
フト重合体とスチレン75部およびアクリロニトリル2
5部を公知の懸濁重合してなる共重合体とからなるゴム
分20%のゴム強化スチレン系樹脂(ABS樹脂−1)
を得た。Reference Example-1 (ABS Resin-1) Graft polymer obtained by known emulsion graft polymerization of 50 parts of polybutadiene, 75 parts of styrene, and 15 parts of acrylonitrile, and 75 parts of styrene and 2 parts of acrylonitrile.
Rubber-reinforced styrenic resin (ABS resin-1) with a rubber content of 20%, consisting of 5 parts of a copolymer obtained by suspension polymerization of known
I got it.
参考例−2(ABS樹脂−2)
ABS樹脂−1に用いられたグラフト重合体とα−メチ
ルスチレン75部およびアクリロニトリル25部を公知
の乳化重合してなる共重合体とからなるゴム分15%の
ゴム強化スチレン系樹脂(ABS樹脂−2)を得た。Reference Example-2 (ABS Resin-2) Rubber content 15% consisting of the graft polymer used in ABS Resin-1 and a copolymer obtained by known emulsion polymerization of 75 parts of α-methylstyrene and 25 parts of acrylonitrile. A rubber-reinforced styrene resin (ABS resin-2) was obtained.
参考例−3(PBT) 下記−数式で示される粘度平均分子量 80.000のポリブチレンテレフタレート。Reference example-3 (PBT) Below - viscosity average molecular weight expressed by the formula 80.000 polybutylene terephthalate.
参考例−4〜12
臭素化ビスフェノ−lv A型エポキシ樹脂とトリブロ
モフェノールとを水酸化リチウムの存在下、200℃で
反応させた。かかる合成条件を変更することにより、平
均重合度、臭素含有量又はエポキシ当量の相異する高分
子量ハロゲン化合物8種(C−1〜4、X−1〜4)を
得た。Reference Examples 4 to 12 Brominated bisphenolv A-type epoxy resin and tribromophenol were reacted at 200°C in the presence of lithium hydroxide. By changing the synthesis conditions, eight types of high molecular weight halogen compounds (C-1 to 4, X-1 to 4) having different average polymerization degrees, bromine contents, or epoxy equivalents were obtained.
参考例−13
アンチモン化合物として市販の三酸化アンチモン(5b
20a )を用いた。Reference Example-13 Antimony trioxide (5b) commercially available as an antimony compound
20a) was used.
実施例および比較例
上述の参考例で得られたゴム強化スチレン系樹脂(AB
S樹脂)、飽和ポリエステル樹脂、高分子量ハロゲン化
合物(又は公知の難燃剤)およびアンチモン化合物を表
−1〜3に示される配合比率にて混練し、各種組成物を
得た。Examples and Comparative Examples Rubber-reinforced styrenic resin (AB
S resin), a saturated polyester resin, a high molecular weight halogen compound (or a known flame retardant), and an antimony compound were kneaded at the blending ratios shown in Tables 1 to 3 to obtain various compositions.
得られた組成物の特性を表−1〜3に示す。The properties of the obtained compositions are shown in Tables 1 to 3.
(発明の効果)
本発明は、従来公知の難燃性樹脂組成物に比べ、熱安定
性はもとより耐熱性、耐衝撃性、加工性ならびに耐光性
に優れた組成物を提供するものである。(Effects of the Invention) The present invention provides a composition that is superior in thermal stability, heat resistance, impact resistance, processability, and light resistance as compared to conventionally known flame-retardant resin compositions.
Claims (1)
和ポリエステル樹脂(B)10〜85重量%、次式(
I )で表わされる高分子量ハロゲン化合物(C)5〜3
5重量%およびアンチモン化合物(D)0〜10重量%
からなる熱安定性に優れた難燃性樹脂組成物。 ▲数式、化学式、表等があります▼・・・・・・( I
) (式中nは平均重合度で4〜30の整数、RおよびR′
はそれぞれ独立に水素、メチル基、エポキシプロピル基
、フェニル基、ハロゲン化フェニル基または ▲数式、化学式、表等があります▼(但しmは0〜3の
整数) であり、かつ、臭素含有量が45重量%以上、エポキシ
当量が10000グラム/モル以上である。)[Claims] Rubber-reinforced styrene resin (A) 80 to 10% by weight, saturated polyester resin (B) 10 to 85% by weight, the following formula (
High molecular weight halogen compound (C) 5 to 3 represented by I)
5% by weight and antimony compound (D) 0-10% by weight
A flame-retardant resin composition with excellent thermal stability. ▲There are mathematical formulas, chemical formulas, tables, etc.▼・・・・・・( I
) (wherein n is an integer of 4 to 30, R and R' are the average degree of polymerization
are independently hydrogen, methyl group, epoxypropyl group, phenyl group, halogenated phenyl group, or ▲a mathematical formula, chemical formula, table, etc.▼ (where m is an integer from 0 to 3), and the bromine content is 45% by weight or more, and the epoxy equivalent is 10,000 g/mol or more. )
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11650190A JPH0413749A (en) | 1990-05-02 | 1990-05-02 | Flame-retarding resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11650190A JPH0413749A (en) | 1990-05-02 | 1990-05-02 | Flame-retarding resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0413749A true JPH0413749A (en) | 1992-01-17 |
Family
ID=14688696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11650190A Pending JPH0413749A (en) | 1990-05-02 | 1990-05-02 | Flame-retarding resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0413749A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03280172A (en) * | 1990-03-29 | 1991-12-11 | Takaoka Electric Mfg Co Ltd | Picture processing area setting method |
JP2006515035A (en) * | 2003-01-13 | 2006-05-18 | ブローミン コンパウンズ リミテッド | Flame retardants for engineering thermoplastics |
CN104672756A (en) * | 2015-02-11 | 2015-06-03 | 深圳市兴盛迪新材料有限公司 | ABS composite flame resistant material and preparation method thereof |
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JPS59217738A (en) * | 1983-05-24 | 1984-12-07 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant synthetic resin composition |
JPS61130366A (en) * | 1984-11-30 | 1986-06-18 | Dainippon Ink & Chem Inc | Impact-resistant resin composition having good thermal stability |
JPS62223257A (en) * | 1986-03-25 | 1987-10-01 | Kanebo Ltd | Flame-retardant thermoplastic polyester composition |
JPH01240571A (en) * | 1988-03-18 | 1989-09-26 | Hitachi Chem Co Ltd | Flame-retardant resin composition |
JPH028234A (en) * | 1988-06-27 | 1990-01-11 | Daicel Chem Ind Ltd | Styrene resin composition having excellent flame retardance |
JPH0320351A (en) * | 1989-06-16 | 1991-01-29 | Japan Synthetic Rubber Co Ltd | Flame-retarding polyester composition |
JPH0331349A (en) * | 1989-06-28 | 1991-02-12 | Daicel Chem Ind Ltd | Styrene resin composition having high flame retardancy |
JPH03153747A (en) * | 1989-11-13 | 1991-07-01 | Sankyo Yuki Gosei Kk | Method for stabilizing flame-retardant resin composition |
-
1990
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS59217738A (en) * | 1983-05-24 | 1984-12-07 | Kanegafuchi Chem Ind Co Ltd | Flame-retardant synthetic resin composition |
JPS61130366A (en) * | 1984-11-30 | 1986-06-18 | Dainippon Ink & Chem Inc | Impact-resistant resin composition having good thermal stability |
JPS62223257A (en) * | 1986-03-25 | 1987-10-01 | Kanebo Ltd | Flame-retardant thermoplastic polyester composition |
JPH01240571A (en) * | 1988-03-18 | 1989-09-26 | Hitachi Chem Co Ltd | Flame-retardant resin composition |
JPH028234A (en) * | 1988-06-27 | 1990-01-11 | Daicel Chem Ind Ltd | Styrene resin composition having excellent flame retardance |
JPH0320351A (en) * | 1989-06-16 | 1991-01-29 | Japan Synthetic Rubber Co Ltd | Flame-retarding polyester composition |
JPH0331349A (en) * | 1989-06-28 | 1991-02-12 | Daicel Chem Ind Ltd | Styrene resin composition having high flame retardancy |
JPH03153747A (en) * | 1989-11-13 | 1991-07-01 | Sankyo Yuki Gosei Kk | Method for stabilizing flame-retardant resin composition |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03280172A (en) * | 1990-03-29 | 1991-12-11 | Takaoka Electric Mfg Co Ltd | Picture processing area setting method |
JP2006515035A (en) * | 2003-01-13 | 2006-05-18 | ブローミン コンパウンズ リミテッド | Flame retardants for engineering thermoplastics |
KR101023371B1 (en) * | 2003-01-13 | 2011-03-18 | 브로민 콤파운드 리미티드 | Flame-Retardant for Engineering Thermoplastic Applications |
US8067497B2 (en) | 2003-01-13 | 2011-11-29 | Bromine Compounds Ltd. | Flame-retardant for engineering thermoplastic applications |
CN104672756A (en) * | 2015-02-11 | 2015-06-03 | 深圳市兴盛迪新材料有限公司 | ABS composite flame resistant material and preparation method thereof |
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