JPH04136032A - Aromatic polyamide resin composition - Google Patents

Abstract

PURPOSE:To prepare the title compsn. having a remarkably high toughness and a high impact strength by compounding an arom. polymaide comprising specific component units with a polyarylate. CONSTITUTION:The title compsn. is prepd. by compounding 5-95 pts.wt. arom. polyamide with 95-5 pts.wt. polyarylate, the sum of the two polymers being 100 pts.wt. The plyamide comprises dicarboxylic acid component units consisting of 30-100 mol% terephthalic acid units and 0-70 mol% arom. dicarboxylic acid units other than terephthalic acid units and/or 0-70 mol% 4-20C aliph. dicarboxylic acid units and diamine component units consisting of aliph. diamine units and/or alicyclic diamine units.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to an aromatic polyamide resin composition, and more particularly to an aromatic polyamide resin composition that has excellent toughness and impact strength.

Technical Background of the Invention Hitherto, aliphatic polyamides such as nylon have been used in the field of synthetic fibers, and in recent years, aromatic polyamides have been used for their excellent abrasion resistance, toughness, chemical resistance, heat resistance,
It is known to have properties such as easy moldability, and is used as an engineering plastic for automobile and electrical engineering materials.

In addition, such engineering plastics are used in combination with different types of resin depending on their use, and various improvements have been added depending on the purpose.

However, as technology advances, such engineering plastics are now required to have even better properties such as toughness and impact strength.

Purpose of the Invention The present invention aims to solve the problems associated with the prior art as described above. The purpose is to provide a composition.

Summary of the invention The aromatic polyamide resin composition according to the present invention comprises [I]
Dicarboxylic acid component units (a) include 30 to 100 mol% of terephthalic acid component units, 0 to 70 mol% of aromatic dicarboxylic acid component units other than terephthalic acid component units, and/or aliphatic dicarboxylic acid components having 4 to 20 carbon atoms. Units 0-7
an aromatic polyamide consisting of repeating units consisting of diamine component units (b), aliphatic diamine component units and/or alicyclic cyamine component units; Aromatic polyamide [■] in an amount of 5 to 95 parts by weight,
Further, polyarylate [II] is contained in an amount of 5 to 95 parts by weight (provided that the total of [I] and [Loco] is 100 parts by weight).

Since the aromatic polyamide resin composition according to the present invention is composed of the above-mentioned components, it has extremely excellent toughness and excellent properties such as impact resistance.

DETAILED DESCRIPTION OF THE INVENTION The aromatic polyamide resin composition according to the present invention will be specifically described below.

The aromatic polyamide resin composition according to the present invention comprises the following aromatic polyamide [I] and polyarylate.
It consists of [■].

First, the aromatic polyamide [I] used in the present invention will be explained.

The aromatic polyamide used in the present invention contains a specific dicarboxylic acid component unit (a) and a specific diamine component unit (b).
) The specific dicarboxylic acid component unit (a) constituting the aromatic polyamide has a terephthalic acid component unit (a) as an essential component.
)including. The repeating unit of the polyamide containing the terephthalic acid component unit (a) can be represented by the following formula [I-al.

OO In the above formula [I-al, R1 represents an alkylene group, and usually represents an alkylene group having 4 to 25 carbon atoms.

The specific dicarboxylic acid component unit constituting the aromatic polyamide used in the present invention may contain other dicarboxylic acid component units in addition to the above-mentioned terephthalic acid component unit (a).

Such dicarboxylic acid component units other than terephthalic acid component include aromatic dicarboxylic acid component units other than terephthalic acid component and aliphatic dicarboxylic acid component units.

Examples of aromatic dicarboxylic acid component units other than terephthalic acid used in the present invention include isophthalic acid (IA), 2
- Component units derived from methyl terephthalic acid, naphthalene dicarboxylic acid, diphenyl dicarboxylic acid, etc. can be mentioned. When the polyamide of the present invention contains aromatic dicarboxylic acid component units other than terephthalic acid, such component units are preferably isophthalic acid or naphthalene carboxylic acid component units, and particularly preferably isophthalic acid component units.

Among such aromatic dicarboxylic acid component units other than terephthalic acid, a repeating unit having an isophthalic acid component unit that is particularly preferred in the present invention can be represented by the following formula [I-b].

However, in the above formula [I-b], R1 represents an alkylene group or an alicyclic group, and usually has 4 to 25 carbon atoms.
represents an alkylene group.

Further, in the present invention, the aliphatic dicarboxylic acid component unit used is usually derived from an aliphatic dicarboxylic acid having an alkylene group of 4 to 20, preferably 6 to 12, although the number of carbon atoms is not particularly limited. . Examples of aliphatic dicarboxylic acids used to derive such aliphatic dicarboxylic acid component units (C) include succinic acid, adipic acid (AA), azelaic acid, sebacic acid, decanedicarboxylic acid, undecanedicarboxylic acid, Mention may be made of dodecanedicarboxylic acid. When the polyamide contains aliphatic dicarboxylic acid component units, adipic acid component units are particularly preferred as such component units.

A repeating unit containing such an aliphatic dicarboxylic acid component unit (C) can be represented by the following formula [I-c].

... [I-c] In the above formula [I-c], n is usually 4 to 2
0, preferably an integer from 6 to 12.

R1 is the same as above.

In the present invention, when the dicarboxylic acid component unit (a) includes a terephthalic acid component unit and an aromatic dicarboxylic acid component unit other than the terephthalic acid component unit,
In 100 mol% of dicarboxylic acid component units, terephthalic acid component units are contained in an amount of 30 to 100 mol%, preferably 50 to 90 mol%, and aromatic dicarboxylic acid component units other than terephthalic acid component units are contained in an amount of 0 to 70 mol. % preferably 0
It is contained in an amount of ~30 mol%. Further, the aliphatic dicarboxylic acid component unit preferably has 4 to 0 to 70 mol% of any aliphatic dicarboxylic acid component unit, preferably 10 to 6 carbon atoms.
It is contained in an amount of 0 mol%.

If the dicarboxylic acid component unit (a) contains a terephthalic acid component unit, an aromatic dicarboxylic acid component unit other than the terephthalic acid component unit, and/or an aliphatic dicarboxylic acid component unit in the above amounts, this A molded article obtained from a composition containing an aromatic polyamide [I] consisting of a dicarboxylic acid component unit (a) such as the one described below and a diamine component unit (b) such as the one described below has heat resistance such as heat aging resistance and heat distortion temperature. It has particularly excellent mechanical properties such as tensile strength, bending strength, and abrasion resistance, and physical and chemical properties such as chemical resistance and water resistance.

Furthermore, in the present invention, the dicarboxylic acid component unit (a)
, a small amount, for example, about 10 mol % or less, of polyhydric carboxylic acid component units is contained together with the above-mentioned terephthalic acid component units and/or aromatic dicarboxylic acid component units other than terephthalic acid component units. You can.

Specific examples of such polyhydric carboxylic acid component units include tribasic acids and polybasic acids such as trimellitic acid and pyromellitic acid.

Together with the dicarboxylic acid component unit (a) as described above, the diamine component unit (b) constituting the aromatic polyamide [I] used in the present invention may consist only of aliphatic diamine component units, It may consist of an aliphatic diamine component unit and an alicyclic diamine component unit, or it may consist of only an alicyclic diamine component unit.

Such aliphatic diamine component units may be linear alkylene diamine component units or may be branched chain alkylene diamine component units. Among such aliphatic diamine component units, linear or branched chain alkylene cyamine component units having 4 to 25 carbon atoms are preferred, and straight chain alkylene cyamine component units having 6 to 18 carbon atoms are more preferred. A linear or branched alkylene diamine component unit is desirable.

Specifically, such aliphatic diamine component units include, for example, 1.4-diaminobutane, 1.6-cyamitohexane, 1.7-diaminohbutane, 1.8-diaminooctane, 1. 9-diaminononane, ■, lO-diaminodecane,
(2) Component units derived from linear alkylene diamines such as 11-diaminoundecane and 1.12-diaminododecane; and 1,4-diamino-1,1-dimethylbutane, 1.4-
Diamino-1-ethylbutane, 1,4-diamino-1,
2-dimethylbutane, 1.4-diamino-1,3-dimethylbutane, 1.4-diamino-1,4-dimethylbutane, 1.4-diamino-2,3-dimethylbutane, 1.
2-diamino-1-butylethane, 1,6-diamy2,5-dimethylhexane, 1,6-diamy2,4
-dimethylhexane, 1,6-diami2, 3.3-dimethylhexane, 1,6-diami2, 2.2-dimethylhexane, ■,6-diami2, 2.4-trimethylhexane, 1,6-diami2, 2.4 .4-trimethylhexane, 1.
7-diamino-2,5-dimethylhebutane, 1,7-diamino-2,2-dimethylhebutane, 1,8-diamino-1,3-dimethyloctane, 1,8-diamino-1,
4-dimethyloctane, ■, 8-diamino-2,4-dimethyloctane, 1,8-diamino-3,4-dimethyloctane, 1,8-diamino-4,5-dimethyloctane, 1,8-diamino- 2,2-dimethyloctane,
■, 8-diamino-3.3-dimethyloctane, 1.8
-Diamino-4,4-dimethyloctane, 1,6-diamino-2,4-diethylhexane, 1,9-diamino-
Examples include component units derived from branched chain alkylene diamines such as 5-methylnonane.

Among such straight chain or branched chain alkylene diamine component units, straight chain alkylene diamine component units are preferable, and in particular, 1,6-cyamitsuhexane, 1,8-diaminooctane, Component units derived from one or more compounds of linear alkylene diamines such as (1), IO-diaminodecane, (2), and (2) 2-diaminododecane are preferred.

The alicyclic diamine component unit usually has 6 to 2 carbon atoms.
5 and is a component unit derived from a diamine containing at least one alicyclic hydrocarbon ring.

Specifically, such ring group diamine component units include, for example, 1.3-diaminocyclohexane, 1.4-diaminocyclohexane, 1.3-bis(aminomethyl)cyclohexane, and 1.4-diaminocyclohexane.
-Bis(aminomethyl)cyclohexane, isophoronediamine, piperazine, 2,5-dimethylpiperazine, bis(4-aminocyclohexyl)methane, bis(4-
aminocyclohexyl)propane, 4.4'-diamino-3,3'-dimethyldicyclohexylpropane, 4.4'-diamino-3,3-dimethyldicyclohexylmethane, 4.4-diamino-3,3'-dimethyl-5 , 5"-dimethyldicyclohexylmethane, 4,4-diamino-3,3-dimethyl-5,5-dimethyldicyclohexylpropane, α-α°-bis(4-aminocyclohexyl)-p-diisopropylbenzene, α-α° -bis(4-aminocyclohexyl)-m-diisopropylbenzene, α-α°-bis(4-aminocyclohexyl)-1,4
-cyclohexane, α-α°-bis(4-aminocyclohexyl)-1,3
- Component units derived from alicyclic diamines such as cyclohexane can be mentioned.

Among these alicyclic diamine component units, bis(aminomethyl)cyclohexyl methane, bis(4-aminocyclohexyl)methane, and 4,4-diamino-3,3'-dimethyldicyclohexylmethane are preferred, and particularly bis(aminomethyl)cyclohexylmethane is preferred. (4
Preferred are component units derived from alicyclic diamines such as -aminocyclohexyl)methane, 1,3-bis(aminocyclohexyl)methane, and t,a-bis(aminomethyl)cyclohexane.

The aromatic polyamide N used in the aromatic polyamide resin composition of the present invention has an intrinsic viscosity [η] measured in concentrated sulfuric acid at a temperature of 30°C, which is usually 0.5 dl/g to
3.0d,l! /g, preferably 0.5dll/lr~
2.8dII/g, more preferably 0.6-2.5d
Use one within the range of l/g.

Such aromatic polyamide [I] can be produced, for example, using a conventionally known method.

For example, Polymer Reviews, 10. C
on-densatlon Polymers by I
interraelal and 5solution M
methods (by P. W. Morgan) Inte
r-science Publishers (1%5)
), or Makro*o1. Chew,, 47
．． 93-113 (1%1), a diacid halide of an aromatic dicarboxylic acid from which the constituent units of the aromatic polyamide [I] described above can be derived and a diamine are prepared by a solution method. Aromatic polyamide [IF] can be obtained by polycondensation. Aromatic polyamide [I] can also be obtained by interfacial polymerization.

Alternatively, an aromatic dicarboxylic acid corresponding to the aromatic dicarboxylic acid component unit and a diamine or a polyamide salt thereof corresponding to the diamine component unit are melted in the presence or absence of a solvent such as water. Aromatic polyamide [I] can be obtained by polycondensation.

Furthermore, the aromatic polyamide [I] can also be obtained by producing an oligomer by using the above-mentioned solution method or the like, and then further polycondensing it by a solid phase polymerization method.

In addition, the diamine component unit forming the aromatic polyamide used in the present invention may include an aromatic diamine component unit in addition to the alkylene diamine component described above, and such aromatic diamine component units may include an aromatic diamine component unit. Specifically, as a component unit, for example, -1-xylylene diamine, p
- Component units derived from aromatic diamines such as xylylene diamine can be mentioned. These aromatic diamines can be used alone or in combination of two or more.

The polyamide used in the present invention has the above formula [■-a]
It may be a polyamide containing a repeating unit represented by [I-b co and the above formula [I-c], and
A polyamide whose main repeating unit is a repeating unit represented by the formula [I-a], a polyamide whose main repeating unit is a repeating unit represented by the formula [I-bl], and a polyamide whose main repeating unit is a repeating unit represented by the formula [I-bl]; It may also be a mixture of polyamides having repeating units represented by as main repeating units.

When the polyamide used in the present invention is a mixture, among these mixtures, a polyamide whose main repeating unit is a repeating unit represented by the above formula [I-a], and a polyamide whose main repeating unit is a repeating unit represented by the above formula [I-bl] and/or the above formula [I-bl and/or A composition comprising a polyamide having [I-c] as a main repeating unit is preferable. In this case, the content of the polyamide whose main repeating unit is the repeating unit represented by formula [I-a] is usually 30% by weight or more.

Furthermore, in this case, the polyamide containing the repeating unit represented by the formula [I-bl as the main repeating unit] is 0 to 70% by weight.
The blending ratio of polyamide whose main repeating units are repeating units represented by the above formula [I-c] is preferably 0 to 30% by weight, and is preferably 0 to 70% by weight, preferably 10 to 60% by weight.
Weight%.

The aromatic polyamide used in the present invention exhibits a much higher glass transition temperature (Tg) than conventionally used polyamides. That is, the glass transition temperature of the aromatic polyamide used in the present invention is usually 70 to 150.
°C, preferably 80-140 °C, typically 20-100 °C than conventional polyamides such as 6-row nylon.
The glass transition temperature also increases.

Next, polyarylate [II] constituting the aromatic polyamide resin composition of the present invention will be explained.

Polyarylate [II] Polyarylate [II] is composed of bisphenols and
Obtained by reaction with terephthalic acid, isophthalic acid, mixtures thereof or derivatives thereof.

Specifically, the above bisphenols include:
4.4゛-dihydroxy-diphenyl ether, bis(
4-hydroxy-2-methylphenyl) ether, bis(4-hydroxyphenyl) sulfide, bis(4-
hydroxyphenyl) sulfone, bis(4-hydroxyphenyl)ketone, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3-methylphenyl)methane, bis(4-hydroxyphenyl)ethane, 2
．． 2-bis(4-hydroxy-3-methylphenyl)propane, 1.1-bis(4-hydroxyphenyl)-n
-butane, bis(4-hydroxyphenyl)phenylmethane, bis(4-hydroxyphenyl)diphenylmethane, bis(4-hydroxyphenyl)-4°-methylphenylmethane, ■, 1-bis(4-hydroxyphenyl)cyclohexane, 1.1-bis(4-hydroxyphenyl)cyclohexylmethane, 2,2-bis(4-hydroxynaphthyl)propane, etc. are used.

The above bisphenols may be used alone or in combination, or bisphenols and a small amount of divalent compound such as 2,2°-dihydroxydiphenyl, 2,6-dihydroxynaphthalene, hydroquinone, resorcinol. , 2,6-cyhydroxytoluene, 3
．． It can also be used in combination with 6-hydroxytoluene or the like.

Bisphenols are generally 2,2-bis(4-
Preference is given to using hydroxyphenyl)propane or bisphenol A.

In the present invention, polyarylate [■] is obtained by reacting the above-mentioned bisphenols with terephthalic acid or isophthalic acid or their derivatives. dichlorite or diester of the acid.

Further, the phenyl group of terephthalic acid, isophthalic acid or the above-mentioned derivatives may be substituted with an alkyl group.

Such polyarylate [Il] can be produced by any conventionally known polymerization method, such as an interfacial polymerization method as shown in the following formula [U-a], a solution polymerization method, or a melt polymerization method. be able to.

(Polyarylate) ...... [U -al Such polyarylate [■] used in the present invention has a high heat distortion temperature, usually about 140 to 180°C.

Such a polyarylate usually has a logarithmic viscosity of about 0.4 to 0.8 when measured in phenol/tetrachloroethane (weight ratio 6:4) at 25°C.

In the present invention, the aromatic polyamide [I] is 5 to 9
The amount of polyarylate [■] is preferably 5 to 95 parts by weight, preferably 10 to 7 parts by weight.
0 parts by weight (however, the sum of τI] and [■] is 100 parts by weight)
Part by weight. ) is used in an amount such that When the weight ratio of both is in such a range, there is a tendency for especially excellent toughness and impact strength to be obtained.

Epoxy resin [I11] The epoxy resin [III], which is optionally included in the aromatic polyamide resin composition according to the present invention, is an ash compound.

Such epoxy resins [I [I] include epoxy resins with or groups bonded to the molecular ends of chain-like or branched chain molecules, or epoxy resins with two or more groups bonded to the molecular chains other than the molecular ends. Examples include linear aliphatic epoxide type epoxy resins containing epoxy groups, and alicyclic epoxide type epoxy resins containing two or more epoxy groups in the molecular chain having an alicyclic structure. The following resins are used.

Glycidyl ether type; bisphenol A diglycidyl ether bisphenol A diβ-methylglycidyl ether bisphenol F diglycidyl ether tetratoproxyphenylmethane tetraglycidyl ether resorcinol diglycidyl ether halogenated bisphenol A diglycidyl ether novolac glycidyl ether polyethylene glycol diglycidyl ether, Polyalkylene glycol diglycidyl ether such as polypropylene glycol diglycidyl ether Hydrogenated bisphenol A glycidyl ether Diglycidyl ether of bisphenol A alkylene oxide adduct Epoxy urethane resin Glycerin triglycidyl ether Pentaerythritol diglycidyl ether Glycidyl ether ester type; P-oxy Benzoic acid glycidyl ether/ester Glycidyl ester type; Phthalic acid diglycidyl ester Tetrahydrophthalic acid diglycidyl ester Hexahydrophthalic acid diglycidyl ester Polyacrylic acid glycidyl ester Dimer acid diglycidyl ester Glycidyl amine type Nigericidylaniline Tetraglycidyl diaminodiphenylmethane Triglycidyl isocyanurate linear aliphatic epoxy resin; Epoxidized polybutadiene Epoxidized soybean oil cycloaliphatic epoxy resin: 3.4 epoxy-6 methylcyclohexyl methyl 3.4
Epoxy-6 methyl cyclohexane carboxylate 3.4 Epoxy cyclohexine methyl (3,4-epoxycyclohexane) carboxylate Bis (3,4-epoxy-6 methyl cyclohexyl methyl) adipate Vinyl cyclohexene dieboxide Dicyclopentadiene oxide Bis (2 , 3-Epoxycyclobentyl)ether limonene dioxide The above-mentioned epoxy resins, such as phenolic or alcoholic glycidyl ethers, glycidyl esters, and glycidyl amines, can be combined with corresponding polyhydric alcohols, polybasic acids, and polyamines, respectively. , and epichlorohydrin to remove hydrochloric acid.

Epoxidized olefins can be prepared by reacting a peracid, such as peracetic acid, with the double bonds of the olefin.

3.4 Epoxy-6 methyl cyclohexyl methyl 3.4
Epoxy-6 methyl cyclohexane carboxylate 3.4 Epoxy cyclohexine methyl (3,4-epoxycyclohexane) carboxylate bis (3,4-epoxy-6 methyl cyclohexyl methyl) adipate vinyl cyclohexene diepoxide dicyclopentadiene oxide bis (2, 3-Epoxycyclobentyl) ether limonene dioxide The above-mentioned epoxy resins, such as phenolic or alcohol-based glycidyl ethers, glycidyl esters, and glycidyl amines, can be combined with corresponding polyhydric alcohols, polybasic acids, and polyamines, respectively. It can be prepared by reacting with epichlorohydrin to remove hydrochloric acid.

Epoxidized olefins can be prepared by reacting a peracid, such as peracetic acid, with the double bonds of the olefin.

In the present invention, when preparing such an epoxy resin, the same bisphenol compounds as those used when preparing the polyarylate [II] can be used.

In the present invention, among the above epoxy resins,
It is preferable to use a glycidyl ether type epoxy resin, and among them, a phenolic epoxy resin is preferable, and it is particularly preferable to use an epoxy resin using bisphenol A as a main raw material.

The epoxy equivalent weight of such epoxy resin is usually 170
~3500.

In the aromatic polyamide resin composition according to the present invention,
When the above-mentioned epoxy resin TII [] is blended as necessary, the aromatic polyamide resin composition 10
0 parts by weight, the aromatic polyamide [I] is in an amount of 5 to 95 parts by weight, preferably 30 to 90 parts by weight, and the polyarylate [U] is in an amount of 5 to 95 parts by weight, preferably 10 to 70 parts by weight. The epoxy resin [I11] is used in an amount of 0.5 to 20 parts by weight, preferably 1 to 10 parts by weight (however, [I], [I[
The total of ] and [III] is 100 parts by weight. ) is preferably included. When the epoxy resin is contained in such an amount, the toughness (high elongation until breaking of the material and high tensile strength) of the resulting aromatic polyamide resin composition tends to be particularly improved.

This is thought to be due to improved compatibility between the aromatic polyamide and polyarylate.

Styrenic copolymer [■] The styrenic copolymer [IV] optionally contained in the aromatic polyamide composition according to the present invention is a copolymer of a styrenic monomer and an unsaturated acid or a derivative thereof. Alternatively, in addition to these copolymerizable components, other copolymerizable unsaturated monomer components may be contained as necessary. Specifically, the unsaturated monomer component which may be optionally copolymerized includes ethylene, propylene, 1- Butene, 4-methyl-1-pentene, 1-
hexene, 1-octene, 1-decene, 1-dodecene,
α- having 2 to 20 carbon atoms such as 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, etc.
Examples include olefins.

Examples of styrene monomers include styrene, 0-chlorostyrene, vinyltoluene, diallyl phthalate, triallyl cyanurate, methyl methacrylate, diallylbenzenephosphonate, and the like. Among these, styrene is preferably used.

Examples of unsaturated acids or their derivatives include acrylic acid, methacrylic acid, maleic acid, fumaric acid, tetrahydrophthalic acid, itaconic acid, citraconic acid, crotonic acid, nadic acid Examples include 5-ene-2,3-dicarboxylic acid, acid anhydrides thereof, and derivatives thereof, such as acid halides, amides, imides, esters, etc. Specifically, maleyl chloride, malenylimide, maleic anhydride, citracon anhydride, etc. acids, monomethyl maleate, dimethyl maleate, etc. Among these, unsaturated dicarboxylic acids or their acid anhydrides are preferred, particularly maleic acid,
Nadic acid (2) or acid anhydrides thereof are preferred.

Among styrenic copolymers made of these raw materials, styrene-maleic anhydride copolymers are preferred.

When using the above styrene copolymer [IV],
To obtain sliding parts etc. that have excellent properties such as elongation at break while maintaining mechanical properties such as tensile strength, bending strength, flexural modulus, and impact strength originally possessed by the aromatic polyamide [I]. A suitable aromatic polyamide resin composition is obtained.

To produce the above styrenic polymer [IV] by copolymerizing a monomer selected from unsaturated carboxylic acids or derivatives thereof with the above styrene, various conventionally known methods can be employed. .

For example, there are methods such as solution polymerization, emulsion polymerization, suspension polymerization, and bulk polymerization. In any case, for efficient copolymerization, it is preferable to carry out the reaction in the presence of a radical initiator. The proportion of the radical initiator used is usually in the range of 0.001 to 1 part by weight per 100 parts by weight of the styrene copolymer. Examples of the radical initiator include organic peroxides, organic bersesters, and other azo compounds. Among these radical initiators, dicumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3,2,5-dimethyl-2,5-di(tert-butylperoxide),
-butylperoxy)hexane, 1,4-bis(ter)
Dialkyl peroxides such as t-butylperoxyisopropyl)benzene are preferred.

In the aromatic polyamide resin composition according to the present invention,
When the above styrene polymer [IV] is blended as necessary, aromatic polyamide resin composition 1
00 parts by weight, aromatic polyamide [I] is in an amount of 5 to 95 parts by weight, preferably 30 to 90 parts by weight, and polyarylate [I1] is in an amount of 5 to 95 parts by weight, preferably 10 to 70 parts by weight.
The amount of styrenic polymer [IV] is 0.5 to 2 parts by weight.
0 parts by weight, preferably 1 to 10 parts by weight (provided that [I]
The total of [I1] and [IV] is 100 parts by weight.

) is preferably included. Styrenic polymer [
IV] in such an amount tends to particularly improve the toughness of the resulting aromatic polyamide resin composition. This is thought to be due to improved compatibility between the aromatic polyamide and the polyalate.

Preparation of aromatic polyamide-based resin composition Such an aromatic polyamide-based resin composition is made of the above-mentioned polyamide [I], polyarylate [■], and, if necessary, the above-mentioned other compounds. Resin, epoxy resin [II[] or styrene copolymer [I
V], and then, while maintaining these components in a molten state, additives such as fillers are further blended and kneaded.

Note that when producing such an aromatic polyamide resin composition, the order of mixing each component is arbitrary; for example, a resin composition is prepared by mixing polyamide [I] and bolyaryl) [I] in advance, Next, if necessary, epoxy resin [III] styrenic copolymer]
Alternatively, various additives as described below may be added and mixed, or all these components may be mixed at the same time.

For premixing, a mortar, a Henschel mixer ball mill, a ribbon blender, etc. can be used. A melt mixer such as a Barry mixer can be used to melt and mix all the components.

The aromatic polyamide resin composition according to the present invention as described above can be applied to various engineering plastics such as sliding parts for motor vehicles, engine parts, etc. by a normal melt molding method, such as a compression molding method, an injection molding method, or an extrusion molding method. Molded into parts, electrical components, precision equipment parts, electronic parts, etc.

As described above, the aromatic polyamide resin composition according to the present invention comprises aromatic polyamide [I] and polyarylate [■
However, in addition to these essential components, other resins such as those mentioned above, such as epoxy resin [III] or styrene copolymer [IV
], and also contains inorganic or organic fillers, antioxidants,
UV absorbers, photoprotectants, heat stabilizers, phenite stabilizers, peroxide decomposers, basic auxiliaries, nucleating agents, plasticizers, lubricants, antistatic agents, flame retardants, pigments, dyes It may contain one or more types of additives such as. Further, the aromatic polyamide resin composition according to the present invention includes thermoplastic resins such as polyethylene, polypropylene, and polyethylene terephthalate;
Reinforcing agents such as glass fiber, carbon fiber, boron fiber, silicon carbide fiber, asbestos fiber, metal fiber, clay
A suitable amount of fillers such as silica, mica, graphite, glass beads, alumina, calcium carbonate, magnesium mercury, and hydrotalcite may be included.

Effects of the Invention The aromatic polyamide resin composition according to the present invention is composed of the above-mentioned aromatic polyamide and polyarylate, and therefore has outstanding toughness and excellent properties such as impact resistance. .

EXAMPLES The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.

Preparation of sample [Synthesis of polyamide (PA-1)] Terephthalic acid 201g (55 mol%), adipic acid 1
44.7 g (45 mol%), 255.6 g (100 mol%) of hexamethylene diamine, and 1 g of sodium hypophosphite 0.45 g and 148 g of ion-exchanged water as a catalyst.
Place in an autoclave and heat at 250°C for 35k after replacing with nitrogen.
The reaction was allowed to proceed for 1 hour at g/c.

The low-order condensate thus obtained had an intrinsic viscosity [η] of 0.15 dl/g at 30°C in concentrated sulfuric acid.

This low-order condensate was further melt-polymerized using a twin-screw extruder to obtain a polymer. The obtained polymer is
The intrinsic viscosity [η] measured in concentrated sulfuric acid at 30°C is 1.0
2 dN/g, and the melting point was 312°C.

[Synthesis of polyamide (PA-2)] Terephthalic acid 255.8+r (70 mol%), isophthalic acid 109.8 g (30 mol%), hexamethylene diamine 255.6 g (100 mol%) and sodium hypophosphite 0 The intrinsic viscosity [η] was measured in concentrated sulfuric acid at 30°C in the same manner as PA-1 using 148 g of ion-exchanged water and 1.00 dN/g, and the melting point was 3.
A polyamide at 24°C was obtained.

[Polyarylate (PAR)] Polyarylate (Unitika Co., Ltd. U Polymer U-1) obtained by polycondensing a mixed acid consisting of 50 mol% terephthalic acid and 50 mol% isophthalic acid with bisphenol A.
00).

[Epoxy resin (A) Bisphenol A type epoxy resin with a coepoxy equivalent of 3000 (Epomisoku R-309 manufactured by Mitsui Ishiura Chemical Industries, Ltd.) [Styrene-maleic anhydride copolymer (B)] (Dylark manufactured by Sekisui Kaseihin Kogyo Co., Ltd.) #232) Example 1 [Manufacture of aromatic polyamide resin composition] 89% by weight of the polyamide (PA2) obtained as described above, 10% by weight of polyarylate, and a bisphenol A type epoxy resin with an epoxy equivalent of 3000 ( An aromatic polyamide resin composition was prepared by kneading 1 wt.

The manufactured aromatic polyamide resin composition was injection molded at 330°C to prepare a test piece.

Using the obtained test piece, tensile strength, elongation at break, bending strength, bending modulus, and isot impact strength (with notch) were determined.

The results are shown in Table 1.

[Test Method] The impact resistance test was conducted using a test piece according to STM-D-256.

Tensile strength (kg/cd) and tensile elongation (elongation at break) (%) were in accordance with ASTM-D-638.

Bending strength (kg/cd) and bending modulus are AS
Based on TM-D-790.

Example 2 In Example 1, when manufacturing the aromatic polyamide resin composition and product, the amount of polyamide (PA-2) used was 6
7% by weight, and the amount of polyarylate is 30% by weight,
A test piece was prepared using the same manufacturing method as in Example 1, except that the amount of epoxy resin (A) was reduced to 3% by weight, and the same test as in Example 1 was conducted.

The results are shown in Table 1.

Example 3 In Example 1, when manufacturing the aromatic polyamide resin composition, the amount of polyamide (PA-2) used was 67% by weight, the amount of polyarylate was 30% by weight, and the amount of epoxy resin (A Test specimens were prepared in the same manner as in Example 1, except that the styrene-maleic anhydride copolymer (B) was used in an amount of 3% by weight in place of ), and the same tests as in Example 1 were conducted.

The results are shown in Table 1.

Example 4 In Example 1, when manufacturing the aromatic polyamide resin composition, the amount of polyamide (PA-2) used was 70% by weight, the amount of polyarylate was 30% by weight,
A test piece was prepared using the same manufacturing method as in Example 1, except that the epoxy resin (A) was not used, and the same test as in Example 1 was conducted.

The results are shown in Table 1.

Example 5 In Example 1, when manufacturing the aromatic polyamide resin composition, the amount of polyamide (PA-2) used was 34% by weight, the amount of polyarylate used was 60% by weight,
A test piece was prepared using the same manufacturing method as in Example 1, except that the epoxy resin (A) was used in an amount of 6% by weight, and the same test as in Example 1 was conducted.

The results are shown in Table 1.

Example 6 In Example 1, when manufacturing the aromatic polyamide resin composition, polyamide (PA-1) was replaced with polyamide (PA-2) by 67% by weight, and the amount of polyarylate used was 30% by weight. %, and the epoxy resin (A) is 3% by weight.
A test piece was made using the same manufacturing method as in Example 1, except that the amount of the sample was used, and the same test as in Example 1 was conducted.

The results are shown in Table 1.

Comparative Example 1 In Example 1, when manufacturing the aromatic polyamide resin composition, only polyamide (PA-1) was used in an amount of 100% by weight instead of polyamide (PA-2). A test piece was prepared using the same manufacturing method as in Example 1, and the same test as in Example 1 was conducted.

The results are shown in Table 1.

Comparative Example 2 A test piece was prepared in the same manner as in Example 1, except that 100% by weight of polyamide (PA-2) was used in producing the aromatic polyamide resin composition. The same test as in Example 1 was conducted.

The results are shown in Table 1.

Claims (3)

[Claims] (1) [I] Dicarboxylic acid component units (a) are 30 to 100 mol% of terephthalic acid component units and 0 to 70 mol% of aromatic dicarboxylic acid component units other than terephthalic acid component units
and/or 0 to 70 mol% of aliphatic dicarboxylic acid component units having 4 to 20 carbon atoms, and the diamine component unit (b) is composed of repeating units consisting of aliphatic diamine component units and/or alicyclic diamine component units. consisting of an aromatic polyamide and [II] polyarylate, and the aromatic polyamide [I] is in an amount of 5 to 95 parts by weight, and the polyarylate [II] is in an amount of 5 to 95 parts by weight (however, [
An aromatic polyamide resin composition characterized in that the aromatic polyamide resin composition contains 100 parts by weight of the total of 1] and [II]. (2) [I] dicarboxylic acid component unit (a) is 30 to 100 mol% of terephthalic acid component unit and 0 to 70 mol% of aromatic dicarboxylic acid component unit other than terephthalic acid component unit
and/or 0 to 70 aliphatic dicarboxylic acid component units having 4 to 20 carbon atoms
mol%, and diamine component unit (b) is composed of repeating units consisting of aliphatic diamine component units and/or alicyclic diamine component units, [II] polyarylate and [III] epoxy resin and the aromatic polyamide [I] is in an amount of 5 to 95 parts by weight, and the polyarylate [II] is in an amount of 5 to 95 parts by weight,
Epoxy resin [III] is 0.5 to 20 parts by weight (however, [I
], [II] and [III] in an amount of 100 parts by weight. (3) [I] dicarboxylic acid component unit (a) is 30 to 100 mol% of terephthalic acid component unit and 0 to 70 mol% of aromatic dicarboxylic acid component unit other than terephthalic acid component unit
and/or 0 to 70 aliphatic dicarboxylic acid component units having 4 to 20 carbon atoms
mol%, and diamine component unit (b) is composed of repeating units consisting of aliphatic diamine component units and/or alicyclic diamine component units, [II] polyarylate, and [IV] styrenic. consisting of a copolymer, and the aromatic polyamide [I] is in an amount of 5 to 95 parts by weight, and the polyarylate [II] is in an amount of 5 to 95 parts by weight,
The styrenic copolymer [IV] is contained in an amount of 0.5 to 20 parts by weight (however, the total of [I], [II] and [IV] is 100 parts by weight). Aromatic polyamide resin composition.