JPH04134830U - Collective surface mount electronic components - Google Patents

Abstract

(57) [Summary] [Purpose] It is possible to easily assemble and integrate a large number of elements without any restriction on the number of elements, and to maintain the fixed state of the assembled elements even during mounting. It can be applied to devices without any design restrictions and improves workability. [Structure] Two or more electronic components 1A to 1C are integrally fixed with a heat-resistant adhesive tape 2. Electronic parts 1A~
The mutually contacting electrodes of 1C are joined by solder-plated electrode surfaces 3 applied to the surfaces of these electrodes. Additionally, the solder plated electrode surfaces 3 of the electronic components 1A to 1C are
Electrode plate 7 is fixed with solder and heat-resistant adhesive tape 8. In this case, the electrode plate 7 has a portion 7a separated from the solder plated electrode surface 3 of the electronic components 1A to 1C.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention is an integrated surface-mounted electronic device made by assembling and integrating two or more electronic components. Regarding parts.

0002

[Conventional technology]

Conventionally, collective surface mounting is made by assembling and integrating two or more electronic components (elements). 2. Description of the Related Art There are electronic components having structures as shown in FIGS. 5 and 6. this First, the collective surface mount electronic component shown in FIG. 5 consists of two elements 11A and 11B. stack them facing the same direction, and solder the adjacent electrodes to each other. By using the da-plated electrode surface 12, the two elements 11A and 11B are assembled and integrated. It has an aggregate element structure made up of In addition, the collective surface mount electrode shown in Figure 6 The child component is made by stacking two elements 11A and 11B facing the same direction and placing them next to each other. By fitting the contacting electrodes 13 into the same metal cap 14, the two elements It has an aggregate element structure in which 11A and 11B are assembled and integrated. This diagram In manufacturing the assembly element shown in 6, first, the electric current of the two elements 11A and 11B is Apply solder paste to the mating part of the pole 13 or metal cap 14, and After fitting the cap 14, heat to solder the metal cap 14 and the electrode 13. It is attached.

0003

[Problem that the idea aims to solve]

However, the conventional collective surface mount electronic components mentioned above have the following characteristics. There were some shortcomings.

0004 In other words, in the aggregate element structure shown in FIG. 5, there are two elements as shown in the figure. In this case, it is possible to easily prevent misalignment between elements during soldering, but When there are many elements, prevent misalignment between elements during soldering. This makes it difficult to fix all the elements together. Also, In this structure, when soldering and mounting on the board, the aggregate element will reach the melting point of the solder. When heated to a close level, the solder fixing the elements melts and the elements separate from each other. There is a risk that it will happen. Also, the high temperature caused during such soldering mounting The higher the number of elements, the higher the separation occurrence rate due to In construction, it is difficult to assemble and integrate a large number of elements.

[0005] In addition, in the assembly structure shown in Fig. 6, two elements are fitted together as shown in the figure. Although it is relatively easy to make a metal cap for Making a metal cap to fit the child is difficult. Also, such metal key Even if a metal cap is manufactured, it is difficult to fit a large number of elements into a metal cap. This process requires labor and time, and is extremely inefficient. In addition, metal of certain dimensions Caps can only be used for elements with corresponding dimensions, so It is necessary to manufacture the metal cap separately, and there are large dimensional constraints on the design. There are some drawbacks.

[0006] The present invention was proposed to solve the problems of the prior art as described above. Ru. In other words, the purpose of the present invention is to easily assemble a large number of elements without limiting the number of elements. ・It is possible to integrate and maintain the fixed state of the aggregate element even during mounting. Moreover, it can be applied to elements of any size without any design restrictions. Our goal is to provide superior aggregate surface mount electronic components that are easy to work with. Ru.

[0007]

[Means to solve the problem]

The assembled surface mount electronic component according to the present invention is a collection of two or more electronic components (elements). ・In integrated surface-mounted electronic components, two or more electronic components are Electrodes that are integrally fixed with heat-resistant adhesive tape and that touch each other on electronic components The space between the electrodes is connected by the solder plated electrode surface applied to the surface of these electrodes. It is characterized by

[0008] In addition, solder and heat-resistant adhesive tape are used on the solder-plated electrode surfaces of electronic components. The electrode plate is fixed and the electrode plate is separated from the solder plated electrode surface of the electronic component. It is desirable to have separate parts.

[0009] Furthermore, the soldering for forming the solder-plated electrode surface and fixing the electrode plate is The external shape of the electronic component (aggregate element) fixed with heat-resistant adhesive tape is Attach it to the mounting hole of the heat-resistant rubber mounting plate, which has a mounting hole smaller than the dimensions, and in this state. This can be done by dipping it into molten solder.

0010

[Effect]

The operation of the present invention having the above configuration is as follows. In other words, the element Because they are integrally fixed using heat-resistant adhesive tape, it is easy to use when using multiple elements. Even in the case of soldering, it is possible to prevent misalignment between elements during soldering. Also, In this way, since the elements are fixed together using heat-resistant adhesive tape, it is possible to When soldering and mounting, the aggregate element is heated to near the melting point of the solder. Even if the solder fixing the elements melts, the elements will not separate from each other. , the fixed state of the aggregate can be maintained. Furthermore, fixing with tape requires a large number of Even when using an element, it is as simple as wrapping tape around it. Because it is a commercial process, it has excellent workability. Moreover, when using a metal cap, Therefore, there are no restrictions on the size of the device, and it can be applied to devices of any size. There is also an advantage.

[0011] On the other hand, if an electrode plate is attached to the solder-plated electrode surface, heat resistance during mounting It also has the advantage of improving cycleability and solder erosion resistance. In addition, solder plated When soldering to form the electrode surface and fix the electrode plate, use heat-resistant adhesive tape. The aggregate element fixed by Attach it to the mounting hole of the thermal rubber mounting plate, and in this state, dip it in molten solder to carry out the operation. When applied, workability can be further improved.

0012

【Example】

Below, examples of collective surface mount electronic components according to the present invention are shown in FIGS. This will be explained in detail with reference to FIG. 4.

[0013] First, the collective surface mount electronic component shown in Fig. 1 consists of three laminated sheets as an electronic component. Using lamic capacitors 1A to 1C, these multilayer ceramic capacitors 1 Fix A to 1C with heat-resistant polyimide adhesive tape 2, and connect their external voltages. This is an embodiment in which a solder-plated electrode surface 3 is formed on the surface of the pole.

[0014] In manufacturing this aggregate type surface mount electronic component, as shown in Figure 1, Three laminated ceramic sheets measuring 10 x 8 x 2 mm with external electrodes provided on the opposite end faces. Capacitors 1A to 1C are heat-resistant with a width of 5 mm so that the external electrodes are in contact with each other. Fix with polyimide adhesive tape 2. Next, this heat-resistant polyimide adhesive tape 2 The assembly element 4 fixed by It is attached to the attachment hole 6 of the attachment plate 5. In this case, the dimensions of the mounting hole 6 are those of the aggregate element 4. The dimensions are set smaller than the external dimensions, and the assembly element is assembled using the elastic force of the mounting plate 5. 4 is held in the mounting hole 6. In this state, flux is applied to the aggregate element 4. Coat and dip in molten solder (Pb/Sn=50/50) at 220°C for 5 seconds. Then, as shown in FIG. 1, solder is applied to the surface of the external electrode of the multilayer ceramic capacitor 1. Form the plated electrode surface 3 and connect the external electrodes to complete the assembled surface mount electronic component. do.

[0015] In addition, FIG. 3 shows that an electrode plate 7 is further attached to the aggregate type surface mount electronic component in FIG. 1. This is an example. That is, on the solder plated electrode surface 3 of the aggregate element 4 in FIG. Electrode plate 7 is arranged and fixed with heat-resistant polyimide adhesive tape 8 having a width of 3 mm. . Then, in this state, flux was applied and molten solder (Pb/Sn) was applied at 220°C. =50/50) for 3 seconds to join the electrode plate 7 to the solder plated electrode surface 3. Then, an assembled surface-mounted electronic component with an electrode plate as shown in FIG. 3 is completed.

[0016] Furthermore, the aggregate element according to the present invention (FIG. 1) as described above and the subordinate device as described above, 100 samples each were prepared for both the aggregate element of the conventional structure (Fig. 5). Prepared and soldered using solder (Pb/Sn=40/60) at 200℃ for 30 seconds. When I soldered it to a board using a reflow oven, I got the following results. In other words, the aggregate element with the conventional structure can be applied to 66 out of 100 samples. This caused misalignment between the elements. In contrast, the aggregate element of the present invention is No misalignment between elements occurred in any of the 100 samples. Also, Under reflow conditions of 230°C, the conventionally structured aggregate element However, the aggregate element of the present invention does not cause any positional deviation. It was. This result demonstrates the superiority of the fixing feature of the present invention using heat-resistant adhesive tape. The purpose of this study is to demonstrate the effectiveness of this technology.

[0017] On the other hand, fixing the electrode plate to the aggregate element by soldering is also simple. If you only do this, there is a risk of misalignment between the assembly element and the electrode plate. , as in the previous example, when soldering, fix with heat-resistant adhesive tape. By doing so, such positional deviation can be prevented.

[0018] Note that the present invention is not limited to the above-mentioned embodiments, and for example, heat-resistant adhesive The tape winding method is limited to winding parallel to the electrode surface, as shown in Figure 1. It is also possible to wind the electrode across the electrode surface. Also, the electrode The shape and mounting condition of the plate can also be selected as appropriate; for example, the electrode as shown in Figure 4 It is also possible to attach a plate 7. And, as for the installation state of the electrode plate, As shown in FIGS. 3 and 4, at least one end 7a of the electrode plate 7 is It only needs to be away from the pole surface 3. On the other hand, the type of element used in this invention is It is also possible to configure not only capacitors but also aggregates such as varistors. and multiple different components such as capacitors and varistors or other components. It is also possible to construct an aggregate whose elements are parts. In addition, the present invention has three It is equally effective when configuring an aggregate using not only individual elements but also four or more elements. conversely, when constructing an assembly using only two elements. Similarly, excellent effects and effects can be obtained, and there is no restriction on the number of elements. Sara Furthermore, the material of the heat-resistant adhesive tape can also be selected as appropriate.

[0019]

[Effect of the idea]

As mentioned above, in this invention, fixing is done using heat-resistant adhesive tape. By simply improving the configuration, it is possible to easily assemble and integrate a large number of elements without limiting the number of elements. It is possible to maintain the fixed state of the aggregate element even during mounting, Furthermore, it can be applied to elements of any size without any design constraints, making it easy to work with. It is possible to provide an excellent aggregated surface-mounted electronic component with good properties.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of a collective surface-mounted electronic component according to the present invention.

FIG. 2 is a perspective view showing a mounting plate used to form a solder-plated electrode surface of the collective surface-mounted electronic component in FIG. 1;

FIG. 3 is a perspective view showing an embodiment of the collective surface-mounted electronic component with electrode plates according to the present invention.

FIG. 4 is a perspective view showing a different embodiment from FIG. 3 of the collective surface mount electronic component with electrode plate according to the present invention.

FIG. 5 is a perspective view showing an example of a conventional collective surface-mounted electronic component.

FIG. 6 is a perspective view showing an example of a conventional collective surface-mounted electronic component, which is different from FIG. 5;

[Explanation of symbols]

1A~1C multilayer ceramic capacitor element 2,8 Heat-resistant polyimide adhesive tape 3 Solder plated electrode surface 4 Aggregate element 5 Mounting plate 6 Mounting hole 7 Electrode plate

Claims (2)

[Scope of utility model registration request] Claim 1. An assembled surface mount electronic component formed by assembling and integrating two or more electronic components, wherein the two or more electronic components are integrally fixed with a heat-resistant adhesive tape, and A collective surface-mounted electronic component characterized in that the mutually contacting electrodes of the component are joined by solder-plated electrode surfaces applied to the surfaces of these electrodes. [Claim 2] An electrode plate is fixed to the solder-plated electrode surface of the electronic component with solder and heat-resistant adhesive tape, and
2. The assembled surface-mounted electronic component according to claim 1, wherein the electrode plate has a portion separated from the solder-plated electrode surface of the electronic component.