JPH04133060A - Method for inspecting adhered part or the like of pellicle for photomask - Google Patents
Method for inspecting adhered part or the like of pellicle for photomaskInfo
- Publication number
- JPH04133060A JPH04133060A JP2254626A JP25462690A JPH04133060A JP H04133060 A JPH04133060 A JP H04133060A JP 2254626 A JP2254626 A JP 2254626A JP 25462690 A JP25462690 A JP 25462690A JP H04133060 A JPH04133060 A JP H04133060A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- adhesive
- frame
- light
- excitation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 49
- 230000001070 adhesive effect Effects 0.000 claims abstract description 49
- 230000005284 excitation Effects 0.000 claims abstract description 22
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 239000012528 membrane Substances 0.000 claims description 14
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 10
- 238000007689 inspection Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 238000002189 fluorescence spectrum Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
C産業上の利用分野コ
本発明は、超LSI等の半導体集積回路の製造において
、フォトリソグラフィー工程で用いるフォトマスクに装
着するペリクルの検査方法に関し、特に、ペリクルのフ
レームへの接着部等の検査方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for inspecting a pellicle attached to a photomask used in a photolithography process in the manufacture of semiconductor integrated circuits such as VLSIs, and particularly relates to a method for inspecting a pellicle frame attached to a photomask used in a photolithography process. This relates to a method for inspecting adhesive parts, etc.
r従来の技術口
従来、半導体集積回路の製造において、フォトリソグラ
フィー工程で用いるフォトマスクのマスクパターン面に
ゴミが付着すると、このゴミが半導体基板表面に投影さ
れて焼き付けられ、製品の欠陥となってしまうため、フ
ォトマスクのゴミよけとしてペリクル膜(透明薄りをマ
スクパターン面からr/1間して取り付け、ゴミがこの
ペリクル膜に付着するようにして、マスクパターン面に
焦点を合わせて投影しても付着したゴミが結像しないで
ボケでしまうようにするペリクル付フォトマスクがすで
に提案されているが(特公昭54−28716号)、近
年の半導体集積回路の高集積化に伴ってますますこのペ
リクル付フォトマスクが利用されている。第3図にペリ
クル付フォトマスクの1例の斜視図(a)と断面図Q:
))を示す。図において、1はアルミニウム等の金属か
らなるペリクルフレーム、2はペリクル膜で、ペリクル
フレーム1の上面に均一に張り渡されて接着部3にて接
着されている。4はフォトマスク基板で、その表面にフ
ォトマスクパターン5が設けられ、ペリクル膜2がフォ
トマスクパターン5を覆うようにフレーム1がフォトマ
スク基板4の表面に接着剤6にて接着されている。Conventional technology: Traditionally, in the manufacture of semiconductor integrated circuits, when dust adheres to the mask pattern surface of a photomask used in the photolithography process, this dust is projected onto the surface of the semiconductor substrate and is burned, resulting in product defects. To protect the photomask from dust, a pellicle film (transparent thin film) is attached at a distance of r/1 from the mask pattern surface, so that the dust adheres to this pellicle film, and the projection is focused on the mask pattern surface. A photomask with a pellicle has already been proposed (Special Publication No. 54-28716), which prevents dust from forming an image even when the image is blurred, but with the recent increase in the degree of integration of semiconductor integrated circuits, This photomask with a pellicle is used. Figure 3 shows a perspective view (a) and a cross-sectional view of an example of a photomask with a pellicle.
)). In the figure, 1 is a pellicle frame made of metal such as aluminum, and 2 is a pellicle film, which is uniformly stretched over the upper surface of the pellicle frame 1 and bonded at an adhesive portion 3. Reference numeral 4 denotes a photomask substrate, on the surface of which a photomask pattern 5 is provided, and a frame 1 is bonded to the surface of the photomask substrate 4 with an adhesive 6 so that the pellicle film 2 covers the photomask pattern 5.
ご発明が解決しようとする課題〕
上記したように、ペリクル膜2は、本来フォトマスクパ
ターン5のゴミよけとして考案され、利用されているも
のであるが、ゴミを発生させる可能性のある部分もあり
、改良されてきた。しかし、現在でも、ペリクルフレー
ム1とペリクル膜2の接着部3の接着不良や接着不足を
根絶できず、これら不良部分からゴミが発生する可能性
がある。Problems to be Solved by the Invention] As mentioned above, the pellicle film 2 was originally devised and used as a dust shield for the photomask pattern 5, but the pellicle film 2 was originally designed and used to protect the photomask pattern 5 from dust. There is, and it has been improved. However, even now, it is not possible to eradicate poor adhesion or insufficient adhesion between the bonded portion 3 of the pellicle frame 1 and the pellicle membrane 2, and there is a possibility that dust may be generated from these defective portions.
また、ゴミをペリクルフレーム1の内面に吸着させてマ
スクパターン5面に付着させなし1ようにするために、
ペリクルフレーム1の内面に塗布されてしする粘着剤の
塗布不良や塗布ムラを根絶できず、この部分かちのゴミ
が発生する可能性がある。これらの点を第2図により説
明すると、図(alに示すように、ペリクルフレーム1
の上端に接着剤7によってペリクル膜2が接着されてい
る場合、例えば符号8で示す部分に接着剤7が不足して
フレーム1の上端の一部が露出していると、フレーム1
に付着していた微小なゴミが飛び出てマスクパターン5
上に付着してしまう可能性がある。また、第2図(b)
に示すように、ペリクルフレーム1の内面に粘着剤9を
塗布してゴミを吸着させ、マスクパターン面に付着させ
ないようにする場合があるが、その−邪に塗布不良や塗
布ムラ10があると、フレーム1に付着していた微小な
ゴミが飛び出てマスクパターン5上に付着してしまう可
能性がある。In addition, in order to prevent dust from adhering to the inner surface of the pellicle frame 1 and adhering to the mask pattern 5,
Poor or uneven application of the adhesive applied to the inner surface of the pellicle frame 1 cannot be eradicated, and there is a possibility that dust may be generated in this area. To explain these points with reference to Figure 2, as shown in Figure (al), the pellicle frame 1
When the pellicle membrane 2 is bonded to the upper end with an adhesive 7, for example, if the adhesive 7 is insufficient at the part indicated by reference numeral 8 and a part of the upper end of the frame 1 is exposed, the frame 1
The minute dust that was attached to the mask pattern 5 pops out.
It may stick to the top. Also, Figure 2(b)
As shown in Figure 2, adhesive 9 is sometimes applied to the inner surface of the pellicle frame 1 to attract dust and prevent it from adhering to the mask pattern surface. , there is a possibility that minute dust adhering to the frame 1 will fly out and adhere to the mask pattern 5.
したがって、これらの接着部又は粘着剤塗布部の不良品
を精度よく排除する検査法が必要であるが、現在は照明
光源の下において単に目視にて検査を行なっているたt
、検査精度が悪く、不良の見逃し率が高い。Therefore, there is a need for an inspection method that accurately eliminates defective products in these bonded parts or adhesive-applied parts, but currently inspections are simply performed visually under an illumination light source.
, Inspection accuracy is poor and failure rate is high.
本発明は上記のような従来技術の問題点に鑑みてなされ
たものであって、ペリクルフレームとペリクル膜の接着
部の接着不良、接着剤不足、及び、フレーム内壁面の粘
着剤の塗布不良や塗布ムラを簡単に精度よく検査するた
めのフォトマスク用ペリクルの接着部等の検査方法を提
供することである。The present invention has been made in view of the problems of the prior art as described above, and includes problems such as poor adhesion between the pellicle frame and the pellicle membrane, insufficient adhesive, and poor adhesive application on the inner wall surface of the frame. An object of the present invention is to provide a method for inspecting adhesive parts of a photomask pellicle, etc., for easily and accurately inspecting coating unevenness.
上記目的を達成する本発明のフォトマスク用ペリクルの
接着部等の検査方法は、フレーム付ペリクル膜に用いら
れている接着剤又は粘着剤に蛍光のための励起光を照射
し、その蛍光光の分布を選択的に観察することにより、
ペリクルフレームとペリクル膜の接着部の接着不良、接
着剤不足、フレーム内壁面の粘着剤の塗布不良、塗布ム
ラを検査することを特徴とする方法である。The method of inspecting adhesive parts of a photomask pellicle according to the present invention which achieves the above object is to irradiate excitation light for fluorescence to the adhesive or pressure-sensitive adhesive used in the framed pellicle film, and to emit the fluorescent light. By selectively observing the distribution,
This method is characterized by inspecting for poor adhesion between the pellicle frame and the pellicle membrane, insufficient adhesive, poor adhesive application on the inner wall surface of the frame, and uneven application.
この場合、励起波長、蛍光波長が共に可視域である場合
には、蛍光光の分布の選択的な観察は蛍光波長のみを透
過する吸収フィルターを介して行うことが必要である。In this case, if both the excitation wavelength and the fluorescence wavelength are in the visible range, it is necessary to selectively observe the distribution of the fluorescence light through an absorption filter that transmits only the fluorescence wavelength.
また、励起波長が紫外域の場合は、目を保護するために
吸収フィルタが必要となる。Furthermore, when the excitation wavelength is in the ultraviolet region, an absorption filter is required to protect the eyes.
本発明にふいては、励起光を照射し、その蛍光光の分布
を選択的に観察するのみの簡単な方法により、フォトマ
スク用ペリクルとペリクルフレームの接着部の接着不良
、接着剤不足、フレーム内壁面の粘着剤の塗布不良、塗
布ムラを簡単に精度よく検査することができる。The present invention uses a simple method of irradiating excitation light and selectively observing the distribution of the fluorescent light. It is possible to easily and accurately inspect adhesive coating defects and coating unevenness on the inner wall surface.
本発明の検査方法は、ぺυクルフレーム止ペリクル膜の
接着部の接着剤、及び、フレーム内壁面に塗布した粘着
剤は、通常、蛍光を出すことを利用するものである。The inspection method of the present invention utilizes the fact that the adhesive at the adhesive part of the pellicle frame-stopping pellicle film and the adhesive applied to the inner wall surface of the frame usually emit fluorescence.
蛍光とは、物質が紫外線や短波長の光を吸収し、吸収し
た光の波長より長い波長の光を再発光する現象であり、
前者の光の波長を励起スペクルトル、後者の光の波長を
蛍光スペクトルと呼ぶ。この励起スベクルトル、蛍光ス
ペクトルは物質に固有のものである。しかも、上記した
ように、ペリクルフレームとペリクル膜の接着部の接着
剤、フレーム内壁面に塗布した粘着剤に使用されてし)
る物質は、通常、蛍光性である。したがって、このよう
な接着剤、粘着剤に使用さている物質に対して、最も効
率よく蛍光を発光させる波長域の光のみを抽出して励起
光としてペリクルを照射し、発光された蛍光及び散乱さ
れた励起光の中から観察に必要な波長域の蛍光のみを抽
出して観察すれば、接着剤及び粘着剤が自ら発する蛍光
をとらえることができ、接着剤及び粘着剤の存在する部
分を選択的に検出することができる。投光器、蛍光灯等
の照明光源の下では一様にしか見えないものでも、この
ような蛍光によって感度よく、クツキリと浮かび上って
見える。Fluorescence is a phenomenon in which a substance absorbs ultraviolet light or short wavelength light and re-emits light with a longer wavelength than the absorbed light.
The wavelength of the former light is called the excitation spectrum, and the wavelength of the latter light is called the fluorescence spectrum. This excitation spectrum and fluorescence spectrum are unique to each substance. Moreover, as mentioned above, it is used as an adhesive for the bond between the pellicle frame and the pellicle membrane, and as an adhesive applied to the inner wall of the frame.
The substances used are usually fluorescent. Therefore, for materials used in such adhesives and adhesives, only the light in the wavelength range that most efficiently emits fluorescence is extracted and irradiated to the pellicle as excitation light, and the emitted fluorescence and the scattered light are extracted. By extracting and observing only the fluorescence in the wavelength range necessary for observation from the excitation light, it is possible to capture the fluorescence emitted by the adhesive and the adhesive itself, and selectively identify the adhesive and the area where the adhesive is present. can be detected. Even objects that can only be seen uniformly under illumination sources such as floodlights and fluorescent lights can be made to stand out with high sensitivity due to such fluorescence.
このような蛍光による検査のための装置の光学的配置は
第1図に示したようになる。すなわち、紫外線から可視
光線の光を出す光源りからの光を励起フィルターF、を
通して、フレーム付ペリクル膜Pに用いられている接着
剤又は粘着剤に固有な励起波長λ、のみを選択透過させ
る。この励起波長λ、、8によって被検査物であるフレ
ーム付ペリクル膜Pを照射すると、一部は励起のために
吸収され蛍光波長λ、8を発する。被検査物Pを直通し
たりそれにより散乱された励起波長λ□と接着剤又は粘
着剤による蛍光波長λ、花は混ざって出てくるが、吸収
フィルターF、(例えば、メガネに装着しておく。)に
よって蛍光波長λ0.のみを選択することにより、接着
剤又は粘着剤の存在する部分を選択的に見ることができ
、ペリクルフレームとペリクル膜の接着部の接着不良、
接着剤不足、フレーム内壁面の粘着剤の塗布不良や塗布
ムラを精度よく検査することができる。また、フレーム
付ペリクル膜Pに異なる複数種の接着剤、粘着剤が用い
られている場合には、各物質に固有の励起波長λ□、蛍
光波長λ、、に適合した複数の励起フィルターF、、吸
収フィルターF、を用意しておき、これらを切り換えな
がら検査するようにする。The optical arrangement of the apparatus for such fluorescence inspection is as shown in FIG. That is, light from a light source that emits light ranging from ultraviolet rays to visible light is passed through the excitation filter F, and only the excitation wavelength λ specific to the adhesive or pressure-sensitive adhesive used in the framed pellicle membrane P is selectively transmitted. When the frame-attached pellicle film P, which is an object to be inspected, is irradiated with this excitation wavelength λ, 8, a part of the pellicle film P with a frame is absorbed due to excitation and emits a fluorescence wavelength λ, 8. The excitation wavelength λ□ that passes directly through the object to be inspected or is scattered by it, and the fluorescence wavelength λ caused by the adhesive or adhesive are mixed together, but the absorption filter F, (for example, attached to glasses) ), the fluorescence wavelength λ0. By selecting only the pellicle frame and pellicle membrane, you can selectively see the adhesive or the area where the adhesive is present, and check for poor adhesion between the pellicle frame and the pellicle membrane.
It is possible to accurately inspect for insufficient adhesive, poor adhesive application, and uneven application on the inner wall of the frame. In addition, when multiple different types of adhesives and pressure-sensitive adhesives are used in the frame-attached pellicle membrane P, multiple excitation filters F adapted to the excitation wavelength λ□ and fluorescence wavelength λ, specific to each substance, are used. , absorption filter F are prepared, and inspection is performed while switching between these.
さらに、検査装置としては、被検査物のベグリルにゴミ
や異物が付着しないように、例えば清浄エアーの層流が
被検査物の上部より流れる等の装置配置をとることが望
ましい。Furthermore, it is desirable that the inspection device be arranged such that, for example, a laminar flow of clean air flows from above the object to prevent dust and foreign matter from adhering to the surface of the object to be inspected.
以上のような本発明のフォトマスク用ペリクルの接着部
等の検査方法においては、励起光を照射し、その蛍光光
の分布を選択的に観察するのみの簡単な方法により、フ
ォトマスク用ペリクルとペリクルフレームの接着部の接
着不良、接着剤不足、フレーム内壁面の粘着剤の塗布不
良、塗布ムラを簡単に精度よく検査することができる。In the above-described method for inspecting adhesive parts of a pellicle for a photomask of the present invention, a simple method of irradiating excitation light and selectively observing the distribution of the fluorescent light is used to inspect the pellicle for a photomask. It is possible to easily and accurately inspect for poor adhesion of the adhesive part of the pellicle frame, insufficient adhesive, poor adhesive application on the inner wall surface of the frame, and uneven application.
第1図は本発明のフォトマスク用ペリクルの接着部等の
検査方法を実施するた約の装置の光学的配置図、第2図
はフレーム付ペリクル膜からゴミが発生する理由を説明
するための図、第3図はべりタル付フォトマスクの1例
の斜視図(a、)と断面図ら)である。
1・・・ペリクルフレーム、2・・・ペリクル膜、3・
・・接着部、4・・・フナトマスク基板、5・・・フォ
トマスクパターン、6・・・接着剤、7・・・接着剤、
8・・・接着不良部、9・・・粘着剤、10・・・塗布
不良部、L・・・光源、F、・・・励起フィルター、P
・・・フレーム付ペリクル膜、F、・・・吸収フィルタ
ー
出
願
人 大日本印刷株式会社
代理人 弁理士 韮 澤 弘(外7名)↓
討
Lイ二==コ
一−一σFig. 1 is an optical layout diagram of a device for carrying out the method of inspecting bonded parts of a photomask pellicle according to the present invention, and Fig. 2 is a diagram illustrating the reason why dust is generated from a pellicle membrane with a frame. FIG. 3 is a perspective view (a) and a cross-sectional view (a) of an example of a photomask with a beam. 1... Pellicle frame, 2... Pellicle membrane, 3.
... Adhesive part, 4... Funatomask substrate, 5... Photomask pattern, 6... Adhesive, 7... Adhesive,
8... Defective adhesion part, 9... Adhesive, 10... Defective coating part, L... Light source, F... Excitation filter, P
... Pellicle membrane with frame, F, ... Absorption filter Applicant Dai Nippon Printing Co., Ltd. Agent Patent attorney Hiroshi Nirasawa (7 others) ↓
Claims (2)
は粘着剤に蛍光のための励起光を照射し、その蛍光光の
分布を選択的に観察することにより、ペリクルフレーム
とペリクル膜の接着部の接着不良、接着剤不足、フレー
ム内壁面の粘着剤の塗布不良、塗布ムラを検査すること
を特徴とするフォトマスク用ペリクルの接着部等の検査
方法。(1) By irradiating the adhesive or pressure-sensitive adhesive used in the frame-attached pellicle membrane with excitation light for fluorescence and selectively observing the distribution of the fluorescent light, the bond between the pellicle frame and the pellicle membrane can be measured. A method for inspecting bonded parts of pellicles for photomasks, etc., characterized by inspecting for poor adhesion, insufficient adhesive, poor adhesive application on the inner wall surface of the frame, and uneven application.
過する吸収フィルターを介して行うことを特徴とする請
求項1記載のフォトマスク用ペリクルの接着部等の検査
方法。(2) The method for inspecting a bonded portion of a photomask pellicle according to claim 1, wherein the selective observation of the distribution of fluorescent light is performed through an absorption filter that transmits only fluorescent wavelengths.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2254626A JPH04133060A (en) | 1990-09-25 | 1990-09-25 | Method for inspecting adhered part or the like of pellicle for photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2254626A JPH04133060A (en) | 1990-09-25 | 1990-09-25 | Method for inspecting adhered part or the like of pellicle for photomask |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04133060A true JPH04133060A (en) | 1992-05-07 |
Family
ID=17267642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2254626A Pending JPH04133060A (en) | 1990-09-25 | 1990-09-25 | Method for inspecting adhered part or the like of pellicle for photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04133060A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1530091A1 (en) * | 2003-11-07 | 2005-05-11 | ASML Netherlands B.V. | Radiation detector |
JP2016122090A (en) * | 2014-12-25 | 2016-07-07 | 信越化学工業株式会社 | Adhesive for pellicle, pellicle using the same, and evaluation method of pellicle |
-
1990
- 1990-09-25 JP JP2254626A patent/JPH04133060A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1530091A1 (en) * | 2003-11-07 | 2005-05-11 | ASML Netherlands B.V. | Radiation detector |
JP2016122090A (en) * | 2014-12-25 | 2016-07-07 | 信越化学工業株式会社 | Adhesive for pellicle, pellicle using the same, and evaluation method of pellicle |
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