JPH04132250A - Ic package for solderless mounting - Google Patents

Ic package for solderless mounting

Info

Publication number
JPH04132250A
JPH04132250A JP25334290A JP25334290A JPH04132250A JP H04132250 A JPH04132250 A JP H04132250A JP 25334290 A JP25334290 A JP 25334290A JP 25334290 A JP25334290 A JP 25334290A JP H04132250 A JPH04132250 A JP H04132250A
Authority
JP
Japan
Prior art keywords
hole
package
mounting board
lead
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25334290A
Other languages
Japanese (ja)
Inventor
Shingo Wada
和田　真悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP25334290A priority Critical patent/JPH04132250A/en
Publication of JPH04132250A publication Critical patent/JPH04132250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To upgrade the efficiency of replacing an IC such as ROM and to reduce product cost by making a mounting board for IC package have a structure that a lead and the corresponding through hole apply a pressure to each other when loading the board with the IC package. CONSTITUTION:Leads 2 are extended vertically from the bottom surface of an IC package so as not to be broken by a friction force when inserting leads 2 in to through holes of a mounting board 4. This lead 2 is made of elastic material, while a section for a through hole 3 on a mounting board 4 has a contact portion 2a slightly larger than the inner diameter of through hole 3 and in the center portion thereof is provided with a hole 2b. Therefore, when inserting the lead 2 in the through hole 3, the contact portion 2a is compressed and thrusted to the inner wall of through hole 3, thereby being able to secure electric and mechanical connection between them.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は無ハンダ実装用ＩＣパ・ソケージに関し、特に
ＲＯＭ等の実装基板上での交換作業を頻繁に行うＩＣの
パッケージングに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC package for solderless mounting, and more particularly to packaging of ICs in which ROM and other mounted substrates are frequently replaced.

〔従来の技術〕[Conventional technology]

従来、ＩＣは実装基板に直接実装する場合、第３図に示
す様に、実装基板４のスルーホール３との接続はハンダ
５で接続されるようにＩＣ）＜・７ケージ１１の側面か
らり−ド１２が引出されている。しかし、例えばＲＯＭ
の多くはファームウェアのデータ書込みとして使用され
ており、ファームウェアに要求される使用が変更となっ
たり、ファームウェアにバグがあった場合、データを修
正するためＲＯＭの交換作業が発生する。このとき、Ｒ
ＯＭを直接実装基板４にハンダ付けしていると交換作業
効率が悪く、はとんどの場合、第４図に示すように実装
基板４にはＩＣｙケ・ント１３をハンダ付けし、ＲＯＭ
はＩＣソケット１３に搭載しＲＯＭ交換作業効率を良く
していた。Conventionally, when an IC is directly mounted on a mounting board, as shown in FIG. - The card 12 is pulled out. However, for example, ROM
Most of the ROM is used to write firmware data, and if the usage required by the firmware changes or if there is a bug in the firmware, the ROM must be replaced to correct the data. At this time, R
If the OM is soldered directly to the mounting board 4, the replacement work efficiency will be poor, and in most cases, the ICy connector 13 is soldered to the mounting board 4 as shown in FIG.
was installed in IC socket 13 to improve the efficiency of ROM exchange work.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のＩＣパッケージは、ハンダ付け用となっ
ており、実装基板へ実装する場合、ＩＣの交換作業効率
を良くするなめ、そのほとんどが機能上必要のないＩＣ
ソケットを使用しなければならず、余分なコストアップ
の要因となっている。The conventional IC packages mentioned above are designed for soldering, and when mounted on a mounting board, most of the IC packages are soldered to improve the efficiency of IC replacement work.
A socket must be used, which increases costs.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の無ハンダ実装用ＩＣパッケージは、ＩＣパッケ
ージの底面より垂直に引出されたリードを有し、前記リ
ードの実装基板への取付部分が、実装基板のスルーホー
ルの内径より若干大きい外径を有する弾性部材からなり
、前記スルーホールへの挿入時に変形、圧縮され前記ス
ルーポールの内壁との電気的及び機械的接続を得る構成
である。The IC package for solderless mounting of the present invention has a lead drawn out perpendicularly from the bottom surface of the IC package, and the attachment part of the lead to the mounting board has an outer diameter slightly larger than the inner diameter of the through hole of the mounting board. The elastic member is deformed and compressed when inserted into the through hole to establish electrical and mechanical connection with the inner wall of the through pole.

また、上記構成において、前記リードの実装基板への取
付部分の中心に穴が明けられ、前記スルーホールへの挿
入時の変形が容易に行なわれる構成とすることができる
。Further, in the above structure, a hole is formed in the center of the attachment portion of the lead to the mounting board, so that the lead can be easily deformed when inserted into the through hole.

〔実施例〕 次に本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の底面の斜視図、第２図は実
装基板のスルーホールとＩＣパッケージのリードとの接
続の断面図である。FIG. 1 is a bottom perspective view of an embodiment of the present invention, and FIG. 2 is a sectional view of the connection between the through hole of the mounting board and the lead of the IC package.

リード２は実装基板４のスルーホール３に挿入する時の
摩擦力で折れたりしないように、ＩＣパッケージ１の底
面から垂直に引出されている。The leads 2 are drawn out perpendicularly from the bottom surface of the IC package 1 so as not to break due to frictional force when inserted into the through holes 3 of the mounting board 4.

このリード２は、弾性を有する部材でできており、実装
基板４のスルーホール３に対応する部分に、スルーホー
ル３の内径より若干大きい接触部２ａを有し、その中心
部に穴２ｂが明いている。This lead 2 is made of an elastic material, and has a contact portion 2a that is slightly larger than the inner diameter of the through hole 3 in a portion corresponding to the through hole 3 of the mounting board 4, and has a hole 2b clearly in the center thereof. I'm there.

このため、リード２をスルーホール３に挿入するとき、
接触部２ａが圧縮されてスルーホール３の内壁に圧接し
、確実な電気的及び機械的接続が得られる。Therefore, when inserting lead 2 into through hole 3,
The contact portion 2a is compressed and comes into pressure contact with the inner wall of the through hole 3, and a reliable electrical and mechanical connection is obtained.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、ＩＣパッケージを実装基
板に搭載するとき、スルーホール−との接続をハンダ付
けによらず、リードとスルーホールの圧力による構造に
することにより、ＩＣソケットを使用しなくても、ＲＯ
Ｍ等のＩＣ交換作業効率を良くでき、また、余分なＩＣ
ソケットを削減できるので、製品価格を低減できる効果
がある。As explained above, when mounting an IC package on a mounting board, the present invention uses an IC socket by making the connection with the through hole not by soldering but by using pressure between the leads and the through hole. Even without it, RO
It can improve the efficiency of IC replacement work such as
Since the number of sockets can be reduced, the product price can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の底面の斜視図、第２図は実
装基板のスルーホールとＩＣパッケージのリードとの接
続の断面図、第３図は従来のＩＣパッケージの実装基板
へのハンダ付けによる実装断面図、第４図は従来のＩＣ
パッケージのＩＣソケットを使用した実装の斜視図であ
る。 １．１１・・・ＩＣパッケージ、２．１２・・・リード
、３・・・スルーホール、４・・・実装基板、５・・・
ハンダ。Fig. 1 is a perspective view of the bottom of an embodiment of the present invention, Fig. 2 is a sectional view of the connection between the through hole of the mounting board and the lead of the IC package, and Fig. 3 is a diagram showing the connection between the through hole of the mounting board and the lead of the IC package. Figure 4 is a cross-sectional view of a conventional IC mounted by soldering.
FIG. 2 is a perspective view of a package mounted using an IC socket. 1.11... IC package, 2.12... Lead, 3... Through hole, 4... Mounting board, 5...
Solder.

Claims (2)

【特許請求の範囲】[Claims] １．ＩＣパッケージの底面より垂直に引出されたリード
を有し、前記リードの実装基板への取付部分が、実装基
板のスルーホールの内径より若干大きい外径を有する弾
性部材からなり、前記スルーホールへの挿入時に変形，
圧縮され前記スルーホールの内壁との電気的及び機械的
接続を得ることを特徴とする無ハンダ実装用ＩＣパッケ
ージ。1. It has a lead drawn out perpendicularly from the bottom surface of the IC package, and the attachment part of the lead to the mounting board is made of an elastic member having an outer diameter slightly larger than the inner diameter of the through hole of the mounting board, and Deformed when inserted,
An IC package for solderless mounting, characterized in that it is compressed to obtain electrical and mechanical connection with the inner wall of the through hole. ２．前記リードの実装基板への取付部分の中心に穴が明
けられ、前記スルーホールへの挿入時の変形が容易に行
なわれることを特徴とする請求項１記載の無ハンダ実装
用ＩＣパッケージ。2. 2. The IC package for solderless mounting according to claim 1, wherein a hole is formed in the center of a portion where the lead is attached to the mounting board, so that deformation is easily performed when inserted into the through hole.
JP25334290A 1990-09-21 1990-09-21 Ic package for solderless mounting Pending JPH04132250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25334290A JPH04132250A (en) 1990-09-21 1990-09-21 Ic package for solderless mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25334290A JPH04132250A (en) 1990-09-21 1990-09-21 Ic package for solderless mounting

Publications (1)

Publication Number Publication Date
JPH04132250A true JPH04132250A (en) 1992-05-06

Family

ID=17249995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25334290A Pending JPH04132250A (en) 1990-09-21 1990-09-21 Ic package for solderless mounting

Country Status (1)

Country Link
JP (1) JPH04132250A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619067A (en) * 1994-05-02 1997-04-08 Texas Instruments Incorporated Semiconductor device package side-by-side stacking and mounting system
WO2002097860A2 (en) * 2001-05-30 2002-12-05 Nokia Corporation Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
CN100372446C (en) * 2003-08-30 2008-02-27 华为技术有限公司 Back board for through hole plugging device and assembling method
JP2010103369A (en) * 2008-10-24 2010-05-06 Keihin Corp Electronic control device
CN105390841A (en) * 2014-09-09 2016-03-09 上海贝尔股份有限公司 Connection device in radio frequency module
JP2016119161A (en) * 2014-12-18 2016-06-30 第一精工株式会社 Circuit connection component
CN110521063A (en) * 2017-04-11 2019-11-29 罗伯特·博世有限公司 Contact device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619067A (en) * 1994-05-02 1997-04-08 Texas Instruments Incorporated Semiconductor device package side-by-side stacking and mounting system
US5663105A (en) * 1994-05-02 1997-09-02 Texas Instruments Incorporated Semiconductor device package side-by-side stacking and mounting system
WO2002097860A2 (en) * 2001-05-30 2002-12-05 Nokia Corporation Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
WO2002097860A3 (en) * 2001-05-30 2003-06-05 Nokia Corp Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
US6617522B2 (en) 2001-05-30 2003-09-09 Nokia Corporation Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
CN100372446C (en) * 2003-08-30 2008-02-27 华为技术有限公司 Back board for through hole plugging device and assembling method
JP2010103369A (en) * 2008-10-24 2010-05-06 Keihin Corp Electronic control device
CN105390841A (en) * 2014-09-09 2016-03-09 上海贝尔股份有限公司 Connection device in radio frequency module
JP2016119161A (en) * 2014-12-18 2016-06-30 第一精工株式会社 Circuit connection component
CN110521063A (en) * 2017-04-11 2019-11-29 罗伯特·博世有限公司 Contact device
US10873141B2 (en) 2017-04-11 2020-12-22 Robert Bosch Gmbh Electrical contact assembly
CN110521063B (en) * 2017-04-11 2021-09-07 罗伯特·博世有限公司 Electrical contact arrangement

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