JPH04131958U - light emitting diode display device - Google Patents
light emitting diode display deviceInfo
- Publication number
- JPH04131958U JPH04131958U JP1991038539U JP3853991U JPH04131958U JP H04131958 U JPH04131958 U JP H04131958U JP 1991038539 U JP1991038539 U JP 1991038539U JP 3853991 U JP3853991 U JP 3853991U JP H04131958 U JPH04131958 U JP H04131958U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- flexible substrate
- wire
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 238000005452 bending Methods 0.000 abstract description 12
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
(57)【要約】
【目的】 フレキシブル基板の湾曲中および湾曲後に金
属細線の断線を防止する。
【構成】 湾曲したフレキシブル基板と、その上に固着
された発光ダイオードを具備する。そしてそのフレキシ
ブル基板の湾曲方向と略直交する様に、その発光ダイオ
ードにワイヤボンドされた金属細線を具備する。
(57) [Summary] [Purpose] To prevent thin metal wires from breaking during and after bending a flexible substrate. [Structure] The device includes a curved flexible substrate and a light emitting diode fixed thereon. A thin metal wire is wire-bonded to the light emitting diode so as to be substantially perpendicular to the bending direction of the flexible substrate.
Description
【０００１】0001
本考案は湾曲したフレキシブル基板を用いた発光ダイオード表示装置に関する 。 This invention relates to a light emitting diode display device using a curved flexible substrate. .
【０００２】0002
従来、フレキシブル基板の上に発光ダイオードを固着した発光ダイオード表示 装置が例えば特開昭６２−２８５３０４号公報で示されている。これをその正面 図を示す図２（ａ）と図２（ａ）のＢＢ断面を示す図２（ｂ）に従って説明する 。１１は絶縁基板１２の上に導電パターンが形成されたフレキシブル基板であり 、側面から見ると略円弧状に湾曲され、１３がその湾曲方向である。１４はフレ キシブル基板１１上のペレット電極１５の上に導電性接着剤１６を介して固着さ れた発光ダイオードである。１７は発光ダイオード１４とフレキシブル基板１１ 上のボンディング電極１８との間をワイヤボンドされ、湾曲方向１３と略同一方 向に延びた金属細線である。 Conventional light-emitting diode display in which light-emitting diodes are fixed on a flexible substrate A device is disclosed, for example, in Japanese Patent Laid-Open No. 62-285304. this in front of it The explanation will be made according to FIG. 2(a) showing the diagram and FIG. 2(b) showing the BB cross section of FIG. 2(a). . 11 is a flexible substrate on which a conductive pattern is formed on an insulating substrate 12; , when viewed from the side, it is curved into a substantially circular arc shape, and 13 is the direction of the curve. 14 is Fre It is fixed onto the pellet electrode 15 on the flexible substrate 11 via a conductive adhesive 16. It is a light emitting diode. 17 is a light emitting diode 14 and a flexible substrate 11 Wire bonded between the upper bonding electrode 18 and the bending direction 13 It is a thin metal wire extending in the direction.
【０００３】0003
しかして上述の発光ダイオード表示装置に於て、ワイヤボンドするのは、ボン ディング機械の性質上、フレキシブル基板１１が平坦な状態で行なう。ワイヤボ ンドした後、フレキシブル基板１１を湾曲方向１３へ湾曲させる。そして金属細 線１７と湾曲方向が同一であるため、湾曲時に応力がかかるので断線が起こり易 い。また湾曲した時に断線していなくても、その後外力がフレキシブル基板１１ に与えられる事により、金属細線１７の断線が起こる。本考案は上述の欠点を鑑 みてなされたものであり、すなわちフレキシブル基板１１の湾曲中および湾曲後 に金属細線１７の断線が起こらない発光ダイオード表示装置を提供する。 However, in the above-mentioned light-emitting diode display device, wire bonding is performed by bonding. Due to the nature of the printing machine, the printing is performed with the flexible substrate 11 flat. wirebo After bending, the flexible substrate 11 is bent in the bending direction 13. and metal thin Since the bending direction is the same as that of wire 17, stress is applied when bending, so wire breakage is likely to occur. stomach. Furthermore, even if the wire is not broken when the flexible substrate 11 is bent, external force may be applied to the flexible substrate 11. As a result, the thin metal wire 17 breaks. This invention takes into consideration the above-mentioned drawbacks. That is, during and after bending the flexible substrate 11. To provide a light emitting diode display device in which disconnection of thin metal wires 17 does not occur.
【０００４】0004
本考案は上述の課題を解決するために、湾曲したフレキシブル基板とその上に 固着された発光ダイオードと、前記フレキシブル基板の湾曲方向と略直交して前 記発光ダイオードにワイヤボンドされた金属細線を設けるものである。 In order to solve the above-mentioned problems, this invention uses a curved flexible substrate and a The fixed light emitting diode and the flexible substrate are arranged in a direction substantially orthogonal to the curved direction of the flexible substrate. A thin metal wire wire-bonded to the light emitting diode is provided.
【０００５】[0005]
本考案は上述の様に、フレキシブル基板の湾曲方向と略直交する様に、金属細 線を発光ダイオードにワイヤボンドすることにより、金属細線が湾曲方向に沿う 応力を受けないので、金属細線の断線を防止する事が出来る。 As mentioned above, the present invention is based on a method in which metal thin strips are By wire-bonding the wire to the light emitting diode, the thin metal wire follows the curved direction. Since it is not subjected to stress, it is possible to prevent the thin metal wire from breaking.
【０００６】[0006]
以下、本考案の一実施例を図面に基づいて説明する。図１（ａ）は発光ダイオ ード表示装置の正面図であり、図１（ａ）のＡＡ断面を図１（ｂ）に示す。これ らの図面において、１はポリエステル等の樹脂から成る絶縁基板２の上に銅箔か ら成る導電パターンが形成されたフレキシブル基板である。この導電パターンは 縦にストライプ状にそれぞれ間隔を置いて走査電極Ｙ1、Ｙ2、Ｙ3、Ｙ4、Ｙ5が 形成され、右横にストライプ状にそれぞれ間隔を置いて信号電極Ｘ1、Ｘ2、Ｘ3 、Ｘ4、Ｘ5、Ｘ6、Ｘ7が形成される。３は各走査電極の上に導電性接着剤４を介 して固着された発光ダイオードであり、例えばＧａＰから成り、波長７００ｎｍ の赤色を発光し、大きさは約３００μｍの略立方体である。５は金から成り、横 方向に各発光ダイオード３毎および各信号電極にワイヤボンドされた金属細線で ある。Hereinafter, one embodiment of the present invention will be described based on the drawings. FIG. 1(a) is a front view of a light emitting diode display device, and FIG. 1(b) is a cross-section taken along line AA in FIG. 1(a). In these drawings, reference numeral 1 denotes a flexible substrate in which a conductive pattern made of copper foil is formed on an insulating substrate 2 made of resin such as polyester. In this conductive pattern, scanning electrodes Y 1 , Y 2 , Y 3 , Y 4 , and Y 5 are formed vertically in stripes at intervals, and signal electrodes X 1 , Y 5 are formed in stripes on the right and at intervals, respectively. X 2 , X 3 , X 4 , X 5 , X 6 , and X 7 are formed. A light emitting diode 3 is fixed on each scanning electrode via a conductive adhesive 4, and is made of, for example, GaP, emits red light with a wavelength of 700 nm, and has a substantially cubic shape of about 300 μm in size. Reference numeral 5 denotes a thin metal wire made of gold and wire-bonded to each light emitting diode 3 and to each signal electrode in the lateral direction.
【０００７】 そしてフレキシブル基板１は側面から見ると略円弧状に湾曲されており、６が その湾曲方向である。７はポリフェニレンオキサイド等の樹脂から成り、フレキ シブル基板１の絶縁基板２に接着剤で固着、又はビス止めされた支持体である。 上述の様に金属細線５のワイヤボンドされる方向は湾曲方向６と略直交する様に 形成されている。以上により本実施例に係る発光ダイオード表示装置が完成され る。[0007] The flexible substrate 1 is curved in a substantially arc shape when viewed from the side, and the flexible substrate 1 is curved in a substantially arc shape. This is the direction of curvature. 7 is made of resin such as polyphenylene oxide, and is a flexible This support is fixed to the insulating substrate 2 of the flexible substrate 1 with an adhesive or screwed. As mentioned above, the direction in which the thin metal wire 5 is wire-bonded is approximately perpendicular to the bending direction 6. It is formed. Through the above steps, the light emitting diode display device according to this example is completed. Ru.
【０００８】 次に時分割駆動方式により、すなわち走査電極Ｙ1からＹ5までに順次電圧を印 加し、信号電極Ｘ1からＸ7までに順次データ信号電圧を印加する。この様にして 各発光ダイオード３を所定のタイミングで点灯させる。例えば縦１列を順次、赤 色に発光させると、表示面が湾曲しているので、あたかもドラムが上から下へ回 っているイメージを人間に与える。これはゲーム機などに用いられる。また本実 施例では電極をＸＹマトリックス状に配置したが、他の実施例としてペレット電 極とボンディング電極を個々に形成しても良い。Next, by a time division driving method, voltages are sequentially applied to scanning electrodes Y 1 to Y 5 , and data signal voltages are sequentially applied to signal electrodes X 1 to X 7 . In this way, each light emitting diode 3 is turned on at a predetermined timing. For example, when one vertical column is sequentially illuminated in red, the display surface is curved, giving the impression to humans that a drum is rotating from top to bottom. This is used for game consoles, etc. Further, in this embodiment, the electrodes are arranged in an XY matrix, but in other embodiments, the pellet electrodes and the bonding electrodes may be formed individually.
【０００９】[0009]
本考案はフレキシブル基板の湾曲方向と略直交する様に、金属細線を発光ダイ オードにワイヤボンドする。従ってワイヤボンドした後、フレキシブル基板を湾 曲させても、また湾曲後に外力がかかっても、応力は湾曲方向にかかり金属細線 にはかからない。故に金属細線の断線を防止する事が出来る。 In this invention, thin metal wires are attached to the light emitting diode in a direction that is approximately perpendicular to the bending direction of the flexible substrate. Wire bond to the ord. Therefore, after wire bonding, the flexible board is Even if the thin metal wire is bent or an external force is applied after bending, the stress will be applied in the bending direction. It doesn't apply. Therefore, it is possible to prevent the thin metal wire from breaking.
【図１】図１（ａ）は本考案実施例に係る発光ダイオー
ド表示装置の正面図であり、図１（ｂ）は図１（ａ）の
ＡＡ断面図である。FIG. 1(a) is a front view of a light emitting diode display device according to an embodiment of the present invention, and FIG. 1(b) is a sectional view taken along line AA in FIG. 1(a).
【図２】図２（ａ）は従来の発光ダイオード表示装置の
正面図であり、図２（ｂ）は図２（ａ）のＢＢ断面図で
ある。FIG. 2(a) is a front view of a conventional light emitting diode display device, and FIG. 2(b) is a sectional view taken along line BB in FIG. 2(a).
１ フレキシブル基板 ３ 発光ダイオード ５ 金属細線 ６ 湾曲方向 1 Flexible board 3 Light emitting diode 5 Fine metal wire 6 Curving direction
Claims (1)
固着された発光ダイオードと、前記フレキシブル基板の
湾曲方向と略直交して前記発光ダイオードにワイヤボン
ドされた金属細線を具備した事を特徴とする発光ダイオ
ード表示装置。1. A flexible substrate, comprising a curved flexible substrate, a light emitting diode fixed thereon, and a thin metal wire wire-bonded to the light emitting diode in a direction substantially orthogonal to the curved direction of the flexible substrate. Light emitting diode display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991038539U JP2581083Y2 (en) | 1991-05-28 | 1991-05-28 | Light emitting diode display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991038539U JP2581083Y2 (en) | 1991-05-28 | 1991-05-28 | Light emitting diode display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04131958U true JPH04131958U (en) | 1992-12-04 |
| JP2581083Y2 JP2581083Y2 (en) | 1998-09-17 |
Family
ID=31920021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991038539U Expired - Fee Related JP2581083Y2 (en) | 1991-05-28 | 1991-05-28 | Light emitting diode display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2581083Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332688A (en) * | 2006-07-10 | 2006-12-07 | Rabo Sufia Kk | Led chip laminate and led chip array |
| JP2012503866A (en) * | 2008-09-26 | 2012-02-09 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic module comprising a carrier substrate and a plurality of radiation-emitting semiconductor components, and a method for manufacturing the same |
| JP2015029120A (en) * | 2006-03-03 | 2015-02-12 | 株式会社半導体エネルギー研究所 | Light-emitting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179591U (en) * | 1985-04-25 | 1986-11-08 | ||
| JP3008384U (en) * | 1994-08-30 | 1995-03-14 | 一一 辻 | Auxiliary tool for pushing down the hot water supply push plate in the air pot |
-
1991
- 1991-05-28 JP JP1991038539U patent/JP2581083Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179591U (en) * | 1985-04-25 | 1986-11-08 | ||
| JP3008384U (en) * | 1994-08-30 | 1995-03-14 | 一一 辻 | Auxiliary tool for pushing down the hot water supply push plate in the air pot |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015029120A (en) * | 2006-03-03 | 2015-02-12 | 株式会社半導体エネルギー研究所 | Light-emitting device |
| JP2016026407A (en) * | 2006-03-03 | 2016-02-12 | 株式会社半導体エネルギー研究所 | Light-emitting device |
| JP2006332688A (en) * | 2006-07-10 | 2006-12-07 | Rabo Sufia Kk | Led chip laminate and led chip array |
| JP4657995B2 (en) * | 2006-07-10 | 2011-03-23 | ラボ・スフィア株式会社 | LED chip laminate and LED chip array |
| JP2012503866A (en) * | 2008-09-26 | 2012-02-09 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic module comprising a carrier substrate and a plurality of radiation-emitting semiconductor components, and a method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2581083Y2 (en) | 1998-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |