JPH0413101B2 - - Google Patents
Info
- Publication number
- JPH0413101B2 JPH0413101B2 JP63335561A JP33556188A JPH0413101B2 JP H0413101 B2 JPH0413101 B2 JP H0413101B2 JP 63335561 A JP63335561 A JP 63335561A JP 33556188 A JP33556188 A JP 33556188A JP H0413101 B2 JPH0413101 B2 JP H0413101B2
- Authority
- JP
- Japan
- Prior art keywords
- slits
- rotating
- blade
- substrate
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000945 filler Substances 0.000 claims description 20
- 230000000903 blocking effect Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000001743 silencing effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
[産業上の利用分野]
本発明はブレード用回転基板及び同基板を用い
た回転ブレードに関するものであつて、特に回転
中に発する騒音を抑制することを指向するもので
ある。
[従来技術]
回転ブレードの発する騒音を防止できる回転ブ
レードが特公昭50−10040号公報に開示されてい
る。この回転ブレードにおいては回転基板の周縁
におけるブレードの基部付近から略中心に向つて
適当の幅、例えば1.5mm、適当の長さ、例えば鋸
体外径の10%程度の長さの割溝を複数条等間隔で
形成し、前記の各割溝に回転基板より軟質の硬化
性合成樹脂を充填して割溝に固着させたものが示
されている。
この構成によれば、回転時、ブレードから生じ
る音波に前記硬化性合成樹脂充填層からの低い音
波が干渉して、全体として、音波の同調、共鳴を
妨げて単純な高音を複雑な低音に変化させ、高く
鋭い金属音が消去されると説明されている。
実際、回転基板の周辺部に形成されるブレード
は高速で回転して空気に乱流を生じて音を発し、
この乱流の発生により外力を受て振動し、あるい
は被切削材の負荷によつて外力を受て強制振動
し、この振動が回転基板の振動と共鳴して大きな
音を発生するものと考えられる。この点において
前記公報に記載されるものは、複数の割溝をブレ
ード部の基部付近から略中心に複数条件設け、こ
れをブレードより軟質の硬化性樹脂を充填して振
動伝播の緩衝帯となり、回転基板における振動の
伝播を部分的にとどめるようにしているものと理
解され、共鳴も減少するものと考えられる。
[解決しようとする問題点]
しかし、前記公報記載のものでは、中心よりの
放射状方向に振動の援衡帯があり、これによつ
て、ブレード部によつて生じる振動は、回転基板
上における円周方向において抑制されるが、ブレ
ード部で生じる振動は中心部で反射し、その結果
生じる振動は十分抑制できないものと考えられ
る。
[問題を解決するための手段]
本発明は上記観点より、大きな振動を生じる原
因となる回転基板周辺のブレード(鋸歯部)より
の振動を回転基板上の円周方向のみならず、回転
基板周辺よりその中心方向において抑制できるよ
うにするものであつて、その構成は、回転基板の
外縁に近い位置の第一の円周を基準に該基板の回
転中心に向つて開く第一の複数の半円形状スリツ
トを等間隔に形成し、前記第一のスリツトが位置
する内側の第二の円周と前記第一のスリツトの相
隣るスリツトの両端部と該基板の中心を結ぶ半径
とを基準に、前記相隣るスリツトの開く方向と対
向する方向に開き且つ該両スリツトの開き方向を
部分的に遮る複数の半円形状スリツトを形成し、
前記全スリツトに充填剤を充填して、回転基板と
の一体化をはかつたものである。
更に、本発明は前記基板外周において形成され
る多数ブレード間の溝に前記同様に充填剤を充填
して回転ブレードの一体化をはかるものである。
以下図面に示す実施例により本発明を説明す
る。
第1図は本発明のブレード用回転基板全体を示
す。
1は回転基板を示す。回転基板1は鋼板、又は
ステンレス鋼板を打ちぬいて円形に形成したもの
であり、2は回転基板1の中心に形成した軸孔、
3はブレードを示し、4,5は半円形状第一、第
二のスリツトを示す。
第2図イは、第1図B−Bで囲まれた部分にお
ける拡大図で、同ロは第1図A−Aにおける断面
拡大図である。図において6は充填した充填剤を
示す。
第1図に示すように、本例では、第一のスリツ
ト4は24個、第2のスリツトは12個で形成したも
のである。基板の厚みは、例えば4〜9.5mm、基
板の直径は、例えば30〜100インチ(75〜254cm)
程度である。
回転基板1の中心を0とし、回転基板1の外縁
に近い位置に、第一の円周7を設定し、これを基
準としてその外側全周にわたり、24個の半円形状
スリツト4を形成する。この時、相隣るスリツト
4の端部9と9′との間隔dは、形成される半円
形状スリツト4の内側半径r×2より小さい間隔
とする。
各半円形状スリツト4は、回転基板1の中心0
の方向に開いた形状をなし、また半円形状スリツ
ト4は半円より若干円弧が大きいか、小さいこと
もある。
この半円形状スリツト4はレーザー加工機によ
つて形成され、各スリツトの両端部は丸みをもた
せるように加工されており、そのスリツト幅は
0.4mm程度が適当である。
以上形成されたスリツトを第一の半円形状スリ
ツトと呼ぶことにする。
次に前記第一の円周7の内側に中心0を原点に
第二の円周8を設定し、この円周8と前記第一の
相隣る半円形状スリツト4の両端部9,9′と基
板の中心0を結ぶ半径を基準に、円周8の内側に
相隣るスリツト4の開き方向と対向する方向(開
き方向が外方向き)に開き、同時に両端部9,
9′を越えて両スリツト4,4の開き方向を部分
的に遮る半円形状スリツト5を一つおきに12個形
成する。
スリツト5の加工、スリツト幅についてはスリ
ツト4の加工と同様である。
上記において、第一の円周7と第二の円周8と
の径上の差lは回転基板1の切削負荷時の機械的
強度に関係するものである。
このようなスリツトの形状、配置により基板の
腰(高速回転研削中、ブレードを所定平面内に支
持するための基板の剛性)を弱めることなく、ス
リツト自体の延べ長さを大とすることができ、充
填剤の量も増大し、消音効果を向上させることが
できる。
また、半円形状スリツト4と5とは同径、また
は若干差違があつてもいずれでもよい。
すべての半円形状スリツト4と5とには合成樹
脂に耐熱性、耐圧性、耐振のシール剤の配合した
充填剤で充填する。ここに充填される合成樹脂と
してはリジツド状態からフレキシブル状態まで硬
度の調整可能のもので、切削水にも溶けにくい耐
水性を備え、高回転数による遠心力でぬけ出さな
い強力な金属接着性を有し、且つ充填しやすい低
粘度のものが最適であり、シール材としては例え
ば石綿、ガラス繊維を含むものが用いられ、本充
填剤は硬化後回転基板の硬度より低い硬度を有す
るものとする。
[試験例]
直径40,60,72,100インチ(約100〜254cm)、
厚み5.0〜7.0,6.5〜9.0mmの回転基板(通常基板)
と、同基板に幅0.2mmの第1の半円形状スリツト
24個、第2の半円形状スリツト12個を形成したも
の(スリツト加工基板)と、全スリツトに低粘度
可撓性調整可能エポキシ注型樹脂の主剤40以上、
硬化剤55以下、耐熱、耐圧、耐振のシール剤10〜
15(いずれも重量%)より重量を選択して配合し
た充填剤を注入充填して硬化させたもの(樹脂充
填基板)を作製し、その消音硬化試験を行つた。
表1はその結果を示す。
なお、測定距離は、低騒音室内で1m、測定器
具はリオン社製NA−09のAスケールによつた。
[Industrial Field of Application] The present invention relates to a rotary substrate for a blade and a rotary blade using the same, and is particularly directed to suppressing noise generated during rotation. [Prior Art] A rotary blade that can prevent the noise generated by the rotary blade is disclosed in Japanese Patent Publication No. 10040/1983. This rotary blade has a plurality of grooves with an appropriate width, e.g. 1.5 mm, and an appropriate length, e.g. about 10% of the outer diameter of the saw body, extending from near the base of the blade toward the center on the periphery of the rotating base plate. The grooves are formed at equal intervals, and each of the grooves is filled with a curable synthetic resin that is softer than the rotating substrate and fixed to the grooves. According to this configuration, when rotating, the low sound waves from the curable synthetic resin filling layer interfere with the sound waves generated from the blade, preventing the synchronization and resonance of the sound waves as a whole, changing a simple high-pitched sound into a complex low-pitched sound. It is explained that the high, sharp metallic sound is erased. In fact, the blades formed around the rotating board rotate at high speed, creating turbulence in the air and emitting sound.
It is thought that the generation of this turbulent flow causes vibrations due to external force, or forced vibrations due to external force due to the load on the material to be cut, and this vibration resonates with the vibration of the rotating board and generates loud noise. . In this regard, what is described in the above-mentioned publication is to provide a plurality of grooves approximately in the center from the vicinity of the base of the blade portion, and fill these with a hardening resin that is softer than the blade to serve as a buffer zone for vibration propagation. It is understood that the propagation of vibrations in the rotating substrate is partially stopped, and it is thought that resonance is also reduced. [Problem to be solved] However, in the device described in the above publication, there is a vibration balancing band in the radial direction from the center, and due to this, the vibration generated by the blade part is caused by a circular vibration on the rotating substrate. Although it is suppressed in the circumferential direction, it is thought that the vibrations generated in the blade portion are reflected at the center, and the resulting vibrations cannot be suppressed sufficiently. [Means for solving the problem] From the above point of view, the present invention aims to reduce the vibrations from the blades (serrations) around the rotating substrate, which cause large vibrations, not only in the circumferential direction on the rotating substrate, but also in the circumferential direction of the rotating substrate. The configuration is such that a plurality of first halves open toward the center of rotation of the rotating substrate based on a first circumference located near the outer edge of the rotating substrate. Circular slits are formed at equal intervals, and a second circumference on the inside where the first slits are located and a radius connecting both ends of adjacent slits of the first slits and the center of the substrate are taken as a reference. forming a plurality of semicircular slits that open in a direction opposite to the opening direction of the adjacent slits and partially block the opening direction of both slits;
All the slits are filled with filler to integrate with the rotating substrate. Further, in the present invention, the grooves between the plurality of blades formed on the outer periphery of the substrate are filled with a filler in the same manner as described above to integrate the rotating blades. The present invention will be explained below with reference to embodiments shown in the drawings. FIG. 1 shows the entire rotating board for blades of the present invention. 1 indicates a rotating board. The rotating board 1 is formed into a circular shape by punching out a steel plate or a stainless steel plate, and 2 is a shaft hole formed in the center of the rotating board 1;
3 indicates a blade, and 4 and 5 indicate semicircular first and second slits. FIG. 2A is an enlarged view of the portion surrounded by BB in FIG. 1, and FIG. 2B is an enlarged sectional view taken along line AA in FIG. In the figure, 6 indicates the filled filler. As shown in FIG. 1, in this example, there are 24 first slits 4 and 12 second slits. The thickness of the board is, for example, 4 to 9.5 mm, and the diameter of the board is, for example, 30 to 100 inches (75 to 254 cm).
That's about it. With the center of the rotating substrate 1 as 0, a first circumference 7 is set near the outer edge of the rotating substrate 1, and 24 semicircular slits 4 are formed around the entire outer circumference with this as a reference. . At this time, the distance d between the end portions 9 and 9' of adjacent slits 4 is set to be smaller than the inner radius r×2 of the semicircular slit 4 to be formed. Each semicircular slit 4 is located at the center 0 of the rotating substrate 1.
The semicircular slit 4 has an arc slightly larger or smaller than that of a semicircle. This semicircular slit 4 is formed by a laser processing machine, and both ends of each slit are processed to be rounded, and the slit width is
Approximately 0.4mm is appropriate. The slit formed above will be referred to as the first semicircular slit. Next, a second circumference 8 is set inside the first circumference 7 with the center 0 as the origin, and this circumference 8 and both ends 9, 9 of the first adjacent semicircular slits 4 are set. ′ and the center 0 of the substrate as a reference, the slits 4 are opened in a direction opposite to the opening direction of the adjacent slits 4 on the inside of the circumference 8 (the opening direction is outward), and at the same time both ends 9,
Twelve semicircular slits 5 are formed at every other interval beyond 9' to partially block the opening direction of both slits 4, 4. The processing of the slit 5 and the slit width are the same as the processing of the slit 4. In the above, the radial difference l between the first circumference 7 and the second circumference 8 is related to the mechanical strength of the rotary substrate 1 under cutting load. With this shape and arrangement of the slit, the total length of the slit itself can be increased without weakening the stiffness of the board (the rigidity of the board to support the blade within a predetermined plane during high-speed rotational grinding). , the amount of filler can also be increased and the sound deadening effect can be improved. Furthermore, the semicircular slits 4 and 5 may have the same diameter or may have a slight difference. All the semicircular slits 4 and 5 are filled with a filler made of synthetic resin mixed with a heat-resistant, pressure-resistant, and vibration-resistant sealant. The hardness of the synthetic resin filled here can be adjusted from a rigid state to a flexible state, and it has water resistance that does not dissolve in cutting water, and has strong metal adhesion that will not come off due to the centrifugal force caused by high rotational speeds. A material with a low viscosity that is easy to fill and is easy to fill is optimal.As a sealing material, a material containing, for example, asbestos or glass fiber is used, and this filler shall have a hardness lower than that of the rotating substrate after curing. . [Test example] Diameter 40, 60, 72, 100 inches (approximately 100 to 254 cm),
Rotating board (normal board) with thickness 5.0~7.0, 6.5~9.0mm
and a first semicircular slit with a width of 0.2 mm on the same board.
24 slits, 12 second semicircular slits (slit processed substrate), and all slits are filled with a base material of 40 or more low viscosity flexibility adjustable epoxy casting resin,
Hardening agent 55 or less, heat resistant, pressure resistant, vibration resistant sealant 10 ~
A resin-filled substrate (resin-filled substrate) was prepared by injecting and curing a filler with a weight selected from 15 (both weight %), and a sound-reducing curing test was conducted.
Table 1 shows the results. The measurement distance was 1 m in a low-noise room, and the measuring instrument was NA-09 A scale manufactured by Rion.
【表】
一方、前記表1のサイズ40インチ(約100cm)
のものに、前掲公報の4本の割溝を鋸歯部の基部
付近から中心に向けて、溝幅1.5mm、長さ4イン
チ(約10cm)のものを形成したものに前記と同配
合の合成樹脂充填剤を充填して、同条件で消音効
果試験したところ、その結果は94dBであつた。
次に前記スリツト加工基板を用いた本発明の回
転ブレードを第3図イ,ロにより説明する。
第3図イは第1図の基板においてその周辺のブ
レードに相当する部分を示したもので、7は基板
3の外縁に等間隔で形成されたU溝であつて、研
削粉を逃し、放熱部となる部分である。U溝7に
よつて形成された全台部8にダイヤモンド粉を金
属で一体焼結したチツプまたはその他タングステ
ンカーバイド焼結によるチツプ9がブレードとし
てろう付け、溶接によつて固定され、ブレードが
形成される。この点は従来のものと変るところは
ない。
次に本発明では、U溝7の中に前記説明の充填
剤と同様の配合の充填剤6が充填される。しかし
その配合は必ずしも同じでなくてもよい。この場
合、充填剤6の上面10は溝中にあるようにし
て、前後にあるチツプ9に対して深さに余裕のあ
る溝を残すものとする。
第3図ロは前記イの実施例にかえ、キー溝11
を備えるものを示す。充填剤6の充填については
イに示すものと変るところはない。
このようにして回転ブレードが形成される。
[試験例]
前記試験例における直径40インチ、厚み5.0mm
の回転基板に第一の半円形状スリツト24個、第2
の半円形状スリツト12個を形成し、各スリツトに
充填剤を充填した回転基板とこの回転基板の周辺
において、前記説明のように、全台部にチツプを
固定し、U溝に充填剤を充填した回転ブレードと
を試作し、これには研削負荷をかけることなく、
550r.p.mで回転させたところ、前記と同様な測定
方法で、ともに92dBであつた。
後者に負荷をかけ研削を行い、同様測定したと
ころ、100dBであつた。これは従来の同形状で回
転基板に何の消音工作を施していないものに比べ
ると10dB程度以上下つたことが認められた。
[発明の効果]
以上の結果より、本発明においては、合成樹
脂、シール剤を含む充填剤で、形成された半円形
状スリツトを埋め、これを基板と一体化させては
じめてその効果があり、又従来の中心に向けての
割溝に合成樹脂を充填したものに比較して、その
消音効果は十分あるものと認められる。
本発明の回転基板を用い、基板周辺の台部にチ
ツプを固定した回転ブレードは、従来品に比べ、
消音効果があるが、そのチツプ間の溝に充填剤を
充填すると更にその効果が向上し、この種回転ブ
レードを用いる作業環境を改善することができ
る。[Table] On the other hand, the size of Table 1 above is 40 inches (approx. 100 cm)
Synthesis of the same composition as above was made by forming the four grooves of the above-mentioned publication from near the base of the sawtooth part toward the center, with a groove width of 1.5 mm and a length of 4 inches (approximately 10 cm). When a resin filler was filled and a sound silencing effect test was conducted under the same conditions, the result was 94 dB. Next, the rotary blade of the present invention using the slit-processed substrate will be explained with reference to FIGS. 3A and 3B. Figure 3A shows the part corresponding to the blade around the board in Figure 1, and 7 is U grooves formed at equal intervals on the outer edge of the board 3 to allow grinding powder to escape and heat dissipation. This is the part that becomes the part. A chip 9 formed by integrally sintering diamond powder with metal or other sintered tungsten carbide is fixed to the entire base 8 formed by the U groove 7 as a blade by brazing and welding to form a blade. Ru. This point is no different from the conventional one. Next, in the present invention, the U-groove 7 is filled with a filler 6 having the same composition as the filler described above. However, the compositions do not necessarily have to be the same. In this case, the upper surface 10 of the filler 6 is placed in the groove, leaving a groove with sufficient depth for the chips 9 in front and behind. Figure 3B shows the keyway 11 in place of the embodiment in A above.
Indicates what is equipped with. The filling of the filler 6 is the same as shown in A. A rotating blade is thus formed. [Test Example] Diameter 40 inches and thickness 5.0 mm in the above test example
The first 24 semicircular slits, the second
12 semicircular slits are formed, each slit is filled with a filler on a rotating substrate, and around this rotating substrate, chips are fixed on the entire base as described above, and filler is filled in the U groove. We prototyped a filled rotating blade, and without applying any grinding load to it,
When rotated at 550 rpm, both measurements were 92 dB using the same measurement method as above. When the latter was subjected to grinding with a load applied and a similar measurement was made, it was 100 dB. This was found to be approximately 10 dB lower than a conventional model with the same shape but without any noise reduction measures applied to the rotating board. [Effects of the Invention] From the above results, the present invention is effective only when the formed semicircular slit is filled with a filler containing a synthetic resin and a sealant and is integrated with the substrate. Furthermore, it is recognized that the sound-dampening effect is sufficient compared to the conventional one in which the groove facing the center is filled with synthetic resin. Compared to conventional products, the rotating blade that uses the rotating substrate of the present invention and has chips fixed to the stand around the substrate has
Although it has a sound-deadening effect, filling the grooves between the chips with a filler further improves the effect and improves the working environment in which this type of rotary blade is used.
第1図は本発明の回転基板実施例を示す。第2
図イは第1図B−B部の拡大図であり、同ロはA
−A線断面の拡大図である。第3図イ,ロは本発
明の回転ブレード実施例をそれぞれ示す。
1……回転基板、2……軸孔、3……ブレー
ド、4,5……半円形スリツト、6……充填剤、
7……U溝、8……台部、9……チツプ、10…
…充填剤上面、11……キー溝。
FIG. 1 shows a rotating board embodiment of the invention. Second
Figure A is an enlarged view of section B-B in Figure 1, and Figure A is an enlarged view of section B-B in Figure 1.
- It is an enlarged view of the A line cross section. FIGS. 3A and 3B show embodiments of the rotating blade of the present invention, respectively. 1... Rotating substrate, 2... Shaft hole, 3... Blade, 4, 5... Semicircular slit, 6... Filler,
7...U groove, 8...base, 9...chip, 10...
...Top surface of filler, 11...Keyway.
Claims (1)
準に該基板の回転中心に向つて開く第一の複数の
半円形状スリツトを等間隔に形成し、前記第一の
スリツトが位置する内側の第二の円周と前記第一
のスリツトの相隣るスリツトの両端部と該基板の
中心を結ぶ半径とを基準に、前記相隣る第一のス
リツトの開く方向と対向する方向に開き、且つ前
記相隣るスリツトの開き方向を部分的に遮る復数
の第二の半円形状スリツトを形成し、前記全スリ
ツトに充填剤を充填して、回転基板との一体化を
はかつたことを特徴とする回転ブレード用回転基
板。 2 請求項1の回転ブレード用回転基板の外縁に
多数の溝を形成し、前記溝によつて形成される台
部にブレードを固定し、前記溝に充填剤を充填し
たことを特徴とする回転ブレード。[Scope of Claims] 1. A first plurality of semicircular slits opening toward the center of rotation of the rotating substrate are formed at equal intervals based on a first circumference located near the outer edge of the rotating substrate, and The opening of the adjacent first slits is based on the inner second circumference where one slit is located and the radius connecting both ends of the adjacent slits of the first slit and the center of the substrate. forming a plurality of second semicircular slits that open in a direction opposite to the opening direction and partially blocking the opening direction of the adjacent slits, and filling all the slits with a filler to form a rotating substrate. A rotating board for a rotating blade, characterized by integrating the following. 2. A rotating blade characterized in that a large number of grooves are formed on the outer edge of the rotary substrate for a rotary blade according to claim 1, the blade is fixed to a platform formed by the grooves, and the grooves are filled with a filler. blade.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33556188A JPH02180564A (en) | 1988-12-28 | 1988-12-28 | Rotating substrate for blade and rotating blade |
US07/457,954 US5012792A (en) | 1988-12-27 | 1989-12-27 | Rotary blade and a rotary substrate for use in the rotary blade |
DE68916930T DE68916930T2 (en) | 1988-12-27 | 1989-12-27 | Carrier for a saw blade. |
ES89313586T ES2056234T3 (en) | 1988-12-27 | 1989-12-27 | ROTATING SUBSTRATE FOR A ROTATING BLADE. |
EP89313586A EP0376676B1 (en) | 1988-12-27 | 1989-12-27 | Rotary substrate for a rotary blade |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33556188A JPH02180564A (en) | 1988-12-28 | 1988-12-28 | Rotating substrate for blade and rotating blade |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02180564A JPH02180564A (en) | 1990-07-13 |
JPH0413101B2 true JPH0413101B2 (en) | 1992-03-06 |
Family
ID=18289956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33556188A Granted JPH02180564A (en) | 1988-12-27 | 1988-12-28 | Rotating substrate for blade and rotating blade |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02180564A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0741538B2 (en) * | 1990-12-25 | 1995-05-10 | 大阪ダイヤモンド工業株式会社 | Deadening drum |
US7017465B2 (en) * | 2002-07-29 | 2006-03-28 | L.S. Starrett Company | Cutting tool with grooved cutting edge |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010040A (en) * | 1973-05-23 | 1975-02-01 | ||
JPS63256308A (en) * | 1987-04-11 | 1988-10-24 | Tenryu Seikiyo Kk | Noise preventing device in circular saw base disc |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60165149U (en) * | 1984-04-09 | 1985-11-01 | 池内精機株式会社 | Cutting wheel substrate |
JPH0427605Y2 (en) * | 1987-06-18 | 1992-07-02 |
-
1988
- 1988-12-28 JP JP33556188A patent/JPH02180564A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010040A (en) * | 1973-05-23 | 1975-02-01 | ||
JPS63256308A (en) * | 1987-04-11 | 1988-10-24 | Tenryu Seikiyo Kk | Noise preventing device in circular saw base disc |
Also Published As
Publication number | Publication date |
---|---|
JPH02180564A (en) | 1990-07-13 |
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