JPS60165149U - Cutting wheel substrate - Google Patents

Cutting wheel substrate

Info

Publication number
JPS60165149U
JPS60165149U JP5181684U JP5181684U JPS60165149U JP S60165149 U JPS60165149 U JP S60165149U JP 5181684 U JP5181684 U JP 5181684U JP 5181684 U JP5181684 U JP 5181684U JP S60165149 U JPS60165149 U JP S60165149U
Authority
JP
Japan
Prior art keywords
cutting wheel
wheel substrate
substrate
outer periphery
cutting whetstone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5181684U
Other languages
Japanese (ja)
Inventor
和夫 伊藤
Original Assignee
池内精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 池内精機株式会社 filed Critical 池内精機株式会社
Priority to JP5181684U priority Critical patent/JPS60165149U/en
Publication of JPS60165149U publication Critical patent/JPS60165149U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案に係る切断砥石の一部を省略して示す平面説
明図である。 １・・・・・・砥石基板、２・・・・・・ダイヤモンド
カッター、３・・・・・・スリット。The figure is an explanatory plan view showing a cutting wheel according to the present invention with some parts omitted. 1... Grinding wheel substrate, 2... Diamond cutter, 3... Slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 鋼板製の切断砥石基板外周にカッターを周設してなる切
断砥石において、前記基板に複数個の弧状のスリットを
外周に向って放射状に配設したことを特徴とする切断砥
石基板。1. A cutting whetstone substrate made of a steel plate having a cutter disposed around the outer periphery of the cutting whetstone substrate, characterized in that a plurality of arc-shaped slits are arranged radially toward the outer periphery of the substrate.
JP5181684U 1984-04-09 1984-04-09 Cutting wheel substrate Pending JPS60165149U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5181684U JPS60165149U (en) 1984-04-09 1984-04-09 Cutting wheel substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5181684U JPS60165149U (en) 1984-04-09 1984-04-09 Cutting wheel substrate

Publications (1)

Publication Number Publication Date
JPS60165149U true JPS60165149U (en) 1985-11-01

Family

ID=30571206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5181684U Pending JPS60165149U (en) 1984-04-09 1984-04-09 Cutting wheel substrate

Country Status (1)

Country Link
JP (1) JPS60165149U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180564A (en) * 1988-12-28 1990-07-13 Osaka Diamond Ind Co Ltd Rotating substrate for blade and rotating blade

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU872281A1 (en) * 1980-02-29 1981-10-18 Одесский Инженерно-Строительный Институт Disc saw

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU872281A1 (en) * 1980-02-29 1981-10-18 Одесский Инженерно-Строительный Институт Disc saw

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180564A (en) * 1988-12-28 1990-07-13 Osaka Diamond Ind Co Ltd Rotating substrate for blade and rotating blade

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