JPH04130435U - Semiconductor substrate dryer - Google Patents

Abstract

(57) [Summary] [Purpose] To completely remove moisture from the surface of a semiconductor substrate having an ultra-fine pattern. [Structure] A rotor 12 is rotated within a chamber 11 of a dryer main body 10, and moisture adhering to the surface of a semiconductor substrate held within the rotor 12 is removed by centrifugal force. In order to increase the water removal ability, a heating drying means 20 is installed in the dryer main body 10.
and vacuum drying means 30. Heating drying means 20
The air is heated by an infrared plate heater 21 and then supplied into the chamber 11. After the dryer main body 10 and the heating drying means 20 are stopped, the vacuum drying means 30 starts operating the vacuum pump 3.
1, the inside of the chamber 11 is evacuated to remove moisture at the molecular level.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to a semiconductor substrate dryer called a spin dryer that uses centrifugal force. Ru.

0002

[Conventional technology]

A device called a spin dryer is used to dry semiconductor substrates after cleaning. There is a dryer. This dryer uses semiconductors in the rotor that rotates at high speed inside the chamber. A device that removes moisture from the surface of the semiconductor substrate by placing the substrate on it and using the centrifugal force generated by the rotation of the rotor. It has become the mainstream dryer today.

0003

[Problem that the idea aims to solve]

However, even if this dryer is used, the semiconductor substrate may have ultra-fine patterns. When using a product, it is unavoidable that very slight water marks remain on the surface, resulting in poor quality. This may lead to a decrease in yield.

0004 The purpose of this invention is to develop a semiconductor substrate that can completely dry even semiconductor substrates with ultra-fine patterns. An object of the present invention is to provide a body substrate dryer.

[0005]

[Means to solve the problem]

The semiconductor substrate dryer of the present invention loads semiconductor substrates into a rotor in a chamber, a dryer body that removes moisture from the surface of the semiconductor substrate using centrifugal force caused by the rotation of the rotor; The chamber is in contact with the semiconductor substrate loaded on the rotor in the chamber. - heating drying means for circulating heated dry clean gas inside the chamber; and vacuum drying means for evacuating.

[0006]

[Effect]

Semiconductors loaded into the rotor by rotating the rotor in the chamber The surface of the substrate is drained by centrifugal force. In this drainer, inside the chamber When dry heated cleaning gas is passed through, ultra-fine particles that could not be removed due to centrifugal force are removed. Moisture in the pattern area also evaporates. Furthermore, if the inside of the chamber is evacuated, the Even a small amount of residual moisture that could not be evaporated by heat drying is completely removed relatively quickly. write Even semiconductor substrates with ultra-fine patterns can be sufficiently dried in a short time. Ru.

[0007] By the way, if you only use a combination of draining and heat drying, the drying time will be longer and the processing time will be longer. It also reduces the efficiency. In addition, complete drying can be achieved by simply combining draining and vacuum drying. It takes a long time to process the process, and the processing efficiency decreases significantly.

[0008]

【Example】

Embodiments of the present invention will be described below based on the drawings. Figure 1 shows the half in which the present invention was implemented. FIG. 2 is a longitudinal side view showing the structure of an example of a conductive substrate dryer.

[0009] The semiconductor substrate dryer includes a dryer main body 10 and a heating drying means 20 attached thereto. and vacuum drying means 30.

0010 The dryer main body 10 has a cylindrical chamber 11. Chamber 11 is It has an intake hole 11a in the center of the well, and a rotor 12 is housed inside. Rotor 12 is rotated by a drive device 13 provided in the lower part of the dryer main body 10. Low A carrier 14 for accommodating a semiconductor substrate is held in an annular shape along the inner peripheral surface within the carrier 12. be done.

[0011] The heating drying means 20 is an infrared ray printer disposed inside the intake hole 11a of the chamber 11. It has a rate heater 21. The infrared plate heater 21 includes a valve 22 and a filter. The dry clean air introduced into the chamber 11 through the filter 25 is heated to, for example, 100°C. Heat to above temperature. The heated dry clean air passes through the inside of the rotor 12 and enters the exhaust pipe 2. 3 to the outside of the chamber 11. The exhaust pipe 23 is located on the side of the chamber 11. and is equipped with a valve 24.

0012 The vacuum drying means 30 has a vacuum pump 31 that evacuates the inside of the chamber 11. Ru. The vacuum pump 31 is pulled out from the bottom of the chamber 11 to the outside of the dryer main body 10. The exhaust pipe 32 is interposed together with a valve 33. truth inside chamber 11 The degree of reaching the sky is usually 20 Torr or less. As the vacuum pump 31, A dry pump, cryopump, or turbomolecular pump is preferable.

[0013] When drying, first the carrier 14 containing the semiconductor substrate is placed on the rotor 12. set. Then, the valve 33 is closed, the valves 22 and 24 are opened, and the infrared radiation Turn on the plate heater 21 and introduce air into the chamber 11 from the intake hole 11a. The rotor 12 is rotated while feeding.

[0014] As the rotor 12 rotates, moisture adhering to the surface of the semiconductor substrate is removed by centrifugal force. It will be done. In addition, the dry clean air passing through the intake hole 11a is heated to the infrared plate heater 21. is heated and supplied into the chamber 11. This heated air is supplied to the rotor 12 While passing through the carrier 14, it comes into contact with the surface of the semiconductor substrate within the carrier 14. This results in The water in the ultra-fine slits evaporates.

[0015] When the water removal combined with heating and drying is completed, the rotation of the rotor 12 is stopped and the Then, valves 22 and 24 are closed and valve 33 is opened to operate the vacuum pump 31. make it move. This allows moisture that was not evaporated by heated air to evaporate and be removed even at low temperatures. be removed. Thus, even if the semiconductor substrate has an ultrafine pattern, the surface It dries completely in a relatively short time.

FIG. 2 shows another embodiment of the invention. In this embodiment, the infrared plate heater 21 of the heating and drying means 20 is separately placed outside the dryer main body 10. The infrared plate heater 21 is designed to heat N ₂ gas from which moisture and dust have been removed, and the heated N ₂ gas is blown into the center of the rotor 12 from above through the gas pipe 26 . Also by using such heating drying means 20 in combination, the surface of a semiconductor substrate having an ultra-fine pattern can be completely dried.

[0017]

[Effect of the idea]

As is clear from the above explanation, the semiconductor substrate dryer of the present invention uses centrifugal force. In addition to moisture removal, drying with heated gas followed by vacuum drying is recommended. Even if a semiconductor substrate has an ultra-fine pattern, moisture on its surface can be removed in a relatively short period of time. It can be completely removed in between, and high-quality semiconductor substrates can be manufactured with high yield.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional side view of a semiconductor substrate dryer according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional side view showing another embodiment of the present invention.

[Explanation of symbols]

10 Dryer body 11 Chamber 12 Rotor 20 Heat drying means 21 Infrared plate heater 30 Vacuum drying means 31 Vacuum pump

Claims (1)

[Scope of utility model registration request] 1. A dryer main body that loads a semiconductor substrate on a rotor in a chamber and removes moisture on the surface of the semiconductor substrate by centrifugal force as the rotor rotates; 1. A semiconductor substrate dryer comprising: a heating drying means for circulating a heated dry clean gas into a chamber so as to be in contact with each other; and a vacuum drying means for evacuating the inside of the chamber.