JPH0412675Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Technical field of the invention The invention relates to an electronic exposure apparatus that draws patterns for integrated circuits, etc., on wafers or masks at high speed. This invention relates to improvements in electron beam exposure equipment that are effective for precision lithography.

(b) Technology background Electron beam exposure technology has become well-established in high-density mask processes, and direct writing on wafers has also become a reality.
It is being introduced into the LSI manufacturing process. In recent years, variable area type (variable size shaped beam type) exposure technology, which divides the drawn figure into rectangular elements of arbitrary dimensions and draws the image, has dramatically improved exposure speed compared to the conventional vector scanning type exposure method using an electron beam spot. At the same time, fine patterns in the submicron region can be drawn with high precision.

Accordingly, it is necessary to control the holder on which the sample is placed so that it is always in the correct position relative to the irradiated electron beam.For example, it is necessary to control the holder so that the electron beam is irradiated vertically on an XY stage that is automatically controlled in the XY direction. Maintaining mounting accuracy is an important issue as a condition for precision pattern drawing.

(c) Prior art and problems FIG. 1 is a block diagram showing an electron beam exposure apparatus.

Substrate 2 such as a wafer or mask coated with resist
is placed on the holder 6, further fixed on the XY stage 5, and the pressure inside the apparatus is reduced to a constant pressure.

Pattern information to be drawn on the substrate 2 is input in advance to the pattern data memory 4 via the computer 3 and stored therein. During electron beam irradiation, the computer 3 is an XY stage 5 that controls the deflection of the electron beam and the movement of the substrate 2.
A signal is output so that a predetermined pattern is drawn on the resist film of the substrate 2, and at the same time, the electron beam is turned on and off.

FIG. 2 is a sectional view showing a holder mounted on a conventional XY stage. 3A and 3B are diagrams for explaining conventional holder positioning, in which figure A shows fixation in the X and Y axis directions, and figure B shows fixation in the Z axis direction.

In FIG. 2, a holder 6 on which the substrate 2 is placed is fixed on an XY stage 5 that is automatically controlled in the X-axis direction and the Y-axis direction.

It is fixed by a clamp plate 7 provided on the XY stage 5, and its positioning method is as shown in Figure 3A.
The holder 6 is pressed and positioned against the fixing part 8 by applying an external force to each of them. In the vertical direction, that is, in the Z-axis direction, an external force is applied from the top or bottom as shown in the diagram.
Add Fz and fix.

FIGS. 4A and 4B are cross-sectional views showing the positioning clamp structure in the Z-axis direction, where A is a cross-sectional view showing an upward pushing mechanism using a leaf spring, and FIG.

In figure A, the method is to abut against the fixed part above via a plate spring 9, or by pressing downward with the spring 10 as shown in figure B, to abut against the fixed part and lock it. However, under reduced pressure and vacuum conditions, the frictional resistance increases and the holding force becomes significantly weaker, so there is a risk that the holder 6 may be attached with a slight inclination.

(d) Purpose of the invention In view of the above-mentioned drawbacks, the present invention aims to improve an electron beam exposure apparatus by providing a holder fixing structure that improves the positioning accuracy of a holder on which a substrate is placed.

(e) Structure of the invention According to the invention, the above purpose is to provide an electron beam exposure apparatus for drawing a desired pattern on a sample by irradiating an electron beam, and a holder for placing the sample on the surface thereof, and a holder for placing the sample on the surface thereof. A holder provided on the back surface of the holder, the inner surface of which has a plurality of recesses having slopes toward the deepest part offset in a certain direction of the holder, and whose side surfaces contact the holder to restrict horizontal movement of the holder. a guide, a protrusion provided on the side surface of the holder guide to limit upward movement of the holder, and a plurality of operation rods supported by springs on an XY stage of the electron beam exposure apparatus, The holder is arranged such that the head of each of the operating rods is brought into contact with the deepest part of the concave part of the holder and the holder is moved in the direction of displacement of the deepest part of the concave part, so that the holder guide and its protruding part are connected to each other. This is achieved by an electron beam exposure holder fixing mechanism that is pressed into contact with a fixing part.

(f) Examples of the invention Examples of the invention will be described below in detail with reference to drawings.

Figures A, B, and C of FIG. 5 are cross-sectional views showing a fixing structure for fixing a holder to an XY stage, which is an embodiment of the present invention.

Figure A shows the restraining position, Figure B shows the operating position, and Figure C is a partially enlarged view.

In the figure, the movement of the holder 11 in the horizontal direction is restricted by a holder guide 15, and the movement in the vertical direction is restricted by a protrusion 14 provided on the holder guide 15.

In the figure, the back surface of the holder 11 is provided with recesses 11a at its four corners, and the head of the operating rod 13, which is pressed to a constant pressure by the spring 12, is located in the recesses 11a.
It is configured to come into contact with. The holder 11 is fixed to a corner formed by a holder guide 15 and a protruding part 14, that is, a fixing part 16 by the pressing force of the operating rod 13.

The operating rods 13 are located at the four corners of the bottom of the holder 11, are attached to air cylinders, and are interlocked by automatic control.

A concave portion 11a provided on the bottom surface of the holder 11 is shifted from its center position to form a curved concave surface, and the head of the operating rod 13 is formed so as to slide on one side of the concave portion 11a and push upward. The situation is shown in Figure C.

The operating rod 13 is pushed upward by an air cylinder, and its head slides along one side of the curved concave surface of the recess 11a of the holder 11, so that
The holder 11 is moved in a certain direction (direction P) and fixed to the fixing part 16 located in the certain direction. Moreover, the fixing mechanism is such that it is held at a constant pressure by a spring 12.

Therefore, compared to the conventional mechanism for positioning in the X and Y directions and further clamping in the Z direction, there is a great advantage that the operation is easier and the holding pressure is increased.

(g) Effects of the invention As explained in detail above, the holder fixing structure of the invention simplifies the operation and improves positional accuracy compared to the conventional method, making it possible to precisely draw fine patterns. It has an excellent effect.

[Brief explanation of the drawing]

Figure 1 is a configuration diagram showing an electron beam exposure device, Figure 2 is a sectional view showing a holder mounted on a conventional XY stage, and Figures A and B in Figure 3 are for explaining conventional holder positioning. Figure 4, Figures A and B in Figure 4 are cross-sectional views showing the positioning clamp structure in the Z-axis direction, Figures A, B and C in Figure 5 are examples of the holder of the present invention, which is fixed to the XY stage. Figure A is a static position, Figure B is an operating position, and Figure C is a partially enlarged view. In the figure, 11... holder, 11a... recess, 12...
Spring, 13... Operation stick, 14... Projection, 15...
...Holder guide, 16...Fixing part.

Claims (1)

[Scope of Claim for Utility Model Registration] An electron beam exposure device that irradiates an electron beam to draw a desired pattern on a sample, comprising: a holder on which the sample is placed on the front surface; and a holder provided on the back surface of the holder; A plurality of recesses having slopes toward the deepest part of the holder offset in a certain direction on the inner surface thereof, a holder guide whose side surfaces contact the holder to restrict horizontal movement of the holder, and the holder guide. a protrusion provided on the side surface of the holder to limit upward movement of the holder; and a plurality of operation rods supported by springs on an XY stage of the electron beam exposure apparatus, By abutting each head of the holder with the deepest part of the concave part of the holder and moving the holder in the direction of deviation of the deepest part of the concave part, the fixing part consisting of the holder guide and its protruding part is fixed. A holder fixing mechanism for electron beam exposure characterized by being pressure-welded.