JPH0412540A - Device and method for assembling semiconductor - Google Patents

Abstract

PURPOSE:To make it possible to hold always a wire feed amount at a constant amount by a method wherein a wire clamping means is made to displace, a wire is brought into contact to an electricity-discharge generating means and whether the wire is fed out from the tip of a capillary or not is verified. CONSTITUTION:Whether a wire 10 is touched to an electric torch 12 or not is detected by current conduction and if a touch of the wire is verified, a clamp 9a is opened, a coil 11a of a linear motor of a clamping arm 9 is made to excite and the clamp 9a is made to descend by a constant amount and is made to stop. The clamp 9a is shut and at the same time, a tension clamp 13 is opened, the linear motor is excited, the clamp 9a is made to ascend by a prescribed amount and a detection is performed by current conduction. When a state of no touch is verified by this repetitive operation, a bonding arm 1 is made to gradually ascend so that the length of a gap between the clamp 9a and a capillary 7 becomes the length of a gap of a specified amount and the clamp 13 is shut. Thereby, a wire feed amount can be automatically decided.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to semiconductor integrated circuits (IC) and large-scale integrated circuits (L
The present invention relates to a semiconductor assembly device for assembling semiconductor components (SI).

[Background Art] Conventionally, an apparatus as shown in FIG. 5 has been known as this type of semiconductor assembly apparatus.

In FIG. 5, an ultrasonic transducer 50 is mounted on a frame 51 placed on an XY table movable in the X and Y directions.
It is swingably supported on the top via a pin 52. A capillary 63 is attached to the tip of a bonding arm 53 attached to one end of this ultrasonic transducer 50. Further, a lever 54 is provided at the other end of the ultrasonic vibrator 50, and a roller 55 is provided at the end of the lever 54. A bonding head is formed by these structures. The roller 55 is configured to receive a counterclockwise moment from a spring 57 so as to come into contact with a cam 56. When the cam 56 is rotated by a pulse motor or the like, the capillary 63 is raised and lowered by the shape of the cam 56. It is configured so that it can be done. wire 64
is wound on a reel 58. The clamp 60 grips and cuts the wire 64, and 59 is a ball 68.
This is a half clamp for pulling up and bringing it into contact with the lower end of the capillary 63. Further, 61 is a torch for forming balls, and is configured to be rotatable around a vertical axis.

A procedure for performing a bonding operation using the above device will be explained.

To explain the case of bonding the ball 68 formed at the tip of the wire 64 to the pad 65 of the pellet 66 using the capillary 63, first, move the frame 51 in the X and Y directions and position the capillary 63 above the torch 61. Let capillary 6
A wire 64 is extended a predetermined length from the tip of the wire 64, and a ball is formed at the tip of the wire 64 using a torch 61.

Next, as shown in FIG. 6(a), the capillary 63 is moved and positioned directly above the pad 65. next,
As shown in FIG. 6(b), the capillary 63 is lowered to bring the ball 68 into contact with the pad 65 and crush the ball 68. At the same time as this crushing, ultrasonic vibration or superheating is applied. Thereafter, the capillary 63 is moved upward and horizontally to be positioned above the lead 67 to be bonded, and the capillary 63 is lowered as shown by the two-dot chain line to crush a portion of the wire 64 with its lower end.
A flat part is formed and fixed to the lead 67 using ultrasonic waves or superheating, the wire 64 is pulled and cut from the end of the flat part, and then the capillary 63 is raised to complete one bonding. Thereafter, a ball 68 is formed at the tip of the wire 64 using the torch 61, and the state shown in FIG. 6(a) is returned to perform the next bonding.

By the way, when performing a wire feeding operation in which the wire 64 is sent downward from the tip of the capillary 63 using the above-mentioned device, when the wire 64 is raised after the 2' nd bonding connection on the lead 67 side shown in FIG. 6(b). The amount of wire feed is determined by closing the clamp 60, grasping the wire 64, and pulling out and cutting a predetermined amount of wire at the bonding timing. That is, the clamp is closed while the capillary 63 is rising, so that a predetermined length of the wire 64 extends from the tip of the capillary 63.

[Problem to be solved by the invention]

However, with the mechanism configuration for determining the wire feed amount as in conventional semiconductor assembly equipment, that is, the method of determining the wire feed amount based on the bonding timing at the rise of a certain 2°nd, there is a possibility that the wire feed amount may be long or short. The disadvantage is that it comes out. If the amount of wire feed is long or short, the ball 68 may not be formed to the desired size when the torch 61 is used to form the ball 68, or the ball 68 may not be formed and then the half clamp 59 is used to wire the wire. There is a drawback that when the capillary 64 is pulled up, it is unwound from the tip of the capillary 63 and the wire breaks.

If a wire breakage occurs during the bonding work as described above, the operator stops the device, cuts the wire into the capillary 63, performs temporary bonding at a different bonding point, and forms a ball. . This provisional bonding is performed to form a ball by temporary bonding at the timing when the main bonding is performed when a wire breaks or a ball is not formed during the first bonding as described above. This temporary bonding is performed between the lead 67 and the pad 6, which will be formally bonded.
Since it is not possible to use the lead 67 as shown in FIG. 7, this is done at the end of the lead 67 where short-circuiting, conduction, etc. will not occur.

However, the above-mentioned wire and wire work requires skill on the part of the operator, and also requires temporary bonding to adjust the timing and wire removal, which takes time and reduces work efficiency. .

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a semiconductor assembly apparatus and a method thereof that can always keep the amount of wire feed constant.

[Means for Solving the Problems] The present invention provides a bonding arm provided with a capillary at its tip, a swinging arm that swings the bonding arm up and down, and a swinging arm provided on the swinging arm. a wire clamping means displaceable between the wire clamping means, a driving means for displacing the wire clamping means, and an electric wire movable below the capillary provided on the bonding arm.
A semiconductor assembly device comprising a discharge generating means, wherein the clamped wire is brought into contact with the electric discharge generating means by displacing the wire clamping means to determine whether the wire is drawn out from the tip of the capillary. It is configured so that it can be confirmed.

The present invention also provides a bonding arm having a capillary at its tip, a swinging arm that swings the bonding arm up and down, and a wire disposed on the swinging arm and displaceable between the swinging arm and the swinging arm. A semiconductor assembly apparatus comprising a clamping means, a driving means for displacing the wire clamping means, and an electric discharge generating means movable below a capillary provided on the bonding arm,
If the wire is drawn out longer than the tip of the capillary, after displacing the wire clamping means until the wire end no longer comes into contact with the electric discharge generating means,
The bonding arm is swung so that a predetermined gap length is created between the electric discharge generating means and the wire end, and conversely, when the wire drawn out from the tip of the capillary is short, the wire clamp After displacing the means until the wire end comes into contact with the electric discharge generating means, the bonding arm is configured to swing so that a predetermined gap length is created between the electric discharge generating means and the wire end. This is what I did.

Further, in the present invention, when the electric discharge generating means movable below the capillary and the end of the wire fed out from the capillary do not have a predetermined gap length, the wire clamping means for clamping the wire is displaced to generate the electric discharge. - The control means determines whether the wire comes into contact with or separates from the discharge generating means, and swings the bonding arm so that a predetermined gap length is achieved.

[Example] Next, an example of the present invention will be described in detail using the drawings.

FIG. 1 is a diagram showing the configuration of a semiconductor assembly apparatus according to the present invention.

In FIG. 1, a bonding arm 1 and a swinging arm 2 capable of generating ultrasonic vibrations are rotatably supported on a shaft 3 supported by a frame of a bonding head movable in the X and Y directions. An electromagnetic adsorption piece 4b is disposed on the bonding arm 1, facing the solenoid 4a disposed on the swing arm 2. When this solenoid 4a is energized from a power supply (not shown), an attractive force acts between it and the electromagnetic attraction piece 4b, and the bonding arm 1 and the swinging arm 2 are fixed. The bonding arm 1 is attracted to the solenoid 4a side by the attraction force of the solenoid 4a, but an adjustable stopper 6 made of a screw or the like is provided on the swinging arm 2 to prevent it from being attracted beyond a predetermined distance. Further, a coil 5b is arranged on the bonding arm 1 facing the magnet 5a provided on the swing arm 2, and the attraction force between the magnet 5a and the coil 5b is created at the tip of the bonding arm 1 during bonding. This is generated in order to force the tip of the capillary 7 that has been rotated downward about the shaft 3 as a fulcrum. A clamp arm 9 is supported at the tip of the swing arm 2 via a shaft 8 so as to be rotatable in the vertical direction in FIG. A clamp 9a is provided for gripping and cutting. This clamp 9a
A linear motor 11 for vertically rotating the clamp arm 9 about the shaft 8 is disposed between the shaft 8 and the shaft 8 . This linear motor 11 is composed of a coil lla provided on the upper support part of the clamp arm 9 and a magnet llb provided on the upper support part of the swing arm 2. It is configured so that it can be controlled. The clamp arm 9 is controlled between the coil 11a and the magnet llb so as to be able to swing upward.

Further, below the capillary 7, an electric torch 12 (i.e.,
! The gas torch 12 (including a discharge electrode) is disposed and is configured to be rotated to the lower surface of the capillary 7 as the ribboning arm 1 moves. This electric torch 12 is configured such that a predetermined voltage is applied to form a ball at the tip of the wire 10, and it is also possible to detect whether or not the wire 10 is touched. Furthermore, the configuration is such that it is possible to detect the voltage between the electric torch 12 and the wire 10, and use a control circuit (not shown) to determine whether or not the wire is broken based on a change in this voltage. Also, clamp 9
Above a, a wire 10 is fixedly supported by a frame (not shown), and a predetermined tension is applied to the wire 10 so that the wire 10 is always held in a straight state up to the tip of the capillary 7 of the bonding arm 1. A tension clamp 13 that can be opened and closed by an opening and closing mechanism is provided, and this wire 10 is further wound by a reel (not shown) via a guide 14.

Next, a mechanism for vertically moving the swing arm 2 will be explained.

The arm-side cam follower 15 is rotatably supported by the shaft 15a of the swing arm 2, and the arm-side cam follower 15 and the swing base 16a of the swing frame 16 are mutually rotatable independently of the swing arm 2. is supported by A bearing guide 16b is fixed to this swing base 16a, and a preload arm 16d on which a cam follower 17 is supported is rotatably provided to the preload arm bin 16c. A preload spring 16e having a tensile force is hooked between the swing base 16a and the tip thereof. Further, the peripheral edge of the cam 18 is pressed against the arm-side cam follower 15 and the cam follower 17, and each contact point between the arm-side cam follower 15 and the cam follower 17 and the cam 18 is configured to sandwich the center of rotation of the cam 18. In addition, the bearing guide 16
b is a radial bearing 20 provided on the camshaft 19;
is provided so as to be in contact with the outer surface of the Drive motor 21
The driving force is transmitted to the cam 18 via the camshaft 19, and the amount of change due to the rotation of this cam 18 is proportional to the amount of change in the rotation angle, and the amount of rotation of this cam 18 is It is configured to be controlled by a control means (not shown). By controlling this cam 18, the amount of vertical movement of the bonding arm 1 can be controlled. The swinging arm 2 makes a reciprocating rotational movement about the shaft 3 based on the movement of the cam 18, and causes the bonding arm 1 fixed to the swinging arm 2 to make a reciprocating rotational movement using the solenoid 4a and the electromagnetic attraction piece 4b. .

Next, the operation of the device having the above configuration will be explained.

First, as shown in FIG. 2(b), when the electric torch 12 located below the capillary 7 and the wire 10 are sent out a predetermined distance from the tip of the capillary 7, there is a gap between the wire end and the electric torch 12. A gap of a specified amount is required. This is because if there is no gap of this specified amount, problems may occur, such as a ball of a predetermined size not being formed at the tip of the wire, or no ball being formed at all.

[I] Correction when the feed amount of the wire 10 fed to the lower end of the capillary 7 is long as shown in FIG. 2(a) will be explained using FIG. 3.

In FIG. 3, the tension clamp 13 and the clamp 9a are both closed, and the tip of the wire is touching the electric torch 12. A predetermined voltage is applied to the electric torch 12 to detect whether or not the wire 10 is touching, and when the wire 10 is confirmed to be touched, the clamp 9 is closed.
A is opened (Fig. 3 -), the coil lla of the linear motor of the clamp arm 9 is excited, and the clamp arm 9 is lowered by a certain amount and then stopped (Fig. 3 -). Then, at the same time as the clamp 9a is closed, the tension clamp 13 is opened (Fig. 3 ■), and the linear motor of the clamp arm 9 is energized → the clamp 9a is raised by a predetermined amount (Fig. 3 ■), and energization is detected. At this time, since the tension clamp 13 is open, no slack occurs in the wire 10. When a no-touch condition is confirmed by this repeated operation, the bonding arm 1 is gradually raised to a specified gap distance, and the tension clamp 13 is closed as shown in FIG. 3 (3).

By this correction, the wire 10 is fed out from the tip of the capillary 7 with a gap of a specified amount, and a good ball is formed.

[11] Next, correction when the wire 10 fed out to the lower end of the capillary 7 is short as shown in FIG. 2(C) will be explained using FIG. 4.

If the wire 10 being sent out from the tip of the capillary 7 is short as shown in Fig. 4 (■), the clamp 9a is opened and the coil lla of the linear motor is energized as shown in Fig. 4 (■). Turn 9 to clamp it (Fig. 4 ■■). Then, the clamp arm 9 is rotated by a linear motor until the tip of the wire 10 is detected to be energized by the electric torch 12, and the wire 10 is let out and rotated until the end of the wire touches the electric torch 12. When the wire end touches the electric torch 12, the bonding arm 1 is gradually raised so that a gap of a predetermined amount is created.

[II[] Next, if the ball is not formed and the wire is broken, move the XY table to bonding arm 1.
The electric torch 12 is moved so that it is located on the lower surface of the capillary 7. Then, the clamp arm 9 shown in FIG.
The wire 10 is passed through the hole formed in the capillary 7 while the clamp arm 9 is gradually lowered by energizing the linear motor. At this time, bonding arm 1
Since the tool is configured to be able to generate ultrasonic vibrations at its tip, ultrasonic waves are applied to the end of the tool (capillary 7) to make it easier to pass the wire through. Then, whether or not the wire 10 has passed is detected by detecting current flow using the electric torch 12 located on the lower surface of the capillary 7 and performing touch detection. Once this touch is confirmed, the [II
].

[JV] Furthermore, when adjusting the feed amount, it can be done by opening and closing the clamp 9a and moving the bonding arm 1 up and down.

In this embodiment, as described above, the clamp arm 9 is rotated by a linear motor, moved a certain distance, and then stopped to detect the energization. A configuration may also be adopted in which detection is performed while sampling.

Further, instead of the linear motor, a cam mechanism may be provided between the clamp arm 9 and the bonding arm 1, and the rotation of the clamp arm 9 may be controlled by the amount of rotation of this cam mechanism.

Other changes may be made as appropriate within the spirit of the present invention.

L Effects of the Invention] As described above, according to the present invention, there is an effect that the wire feed amount can be automatically determined so as to provide a predetermined gap length between the wire and the electric torch. According to the present invention, the amount of wire feed is not determined by the bonding timing at a certain 2°nd rise during the bonding operation, so there is an advantage that there is no variation in the amount of wire feed. Therefore, balls of a predetermined size can always be formed. Further, according to the present invention, there is no need to perform temporary bonding even if a wire breaks during the bonding operation, thereby improving the efficiency of the bonding operation.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a semiconductor assembly apparatus according to the present invention, and FIGS. 3 and 4 are explanatory diagrams explaining the wire length adjustment process according to the present invention, FIG. 5 is a diagram showing a conventional semiconductor assembly apparatus, and FIG.
Figures (a) and (b) are diagrams explaining the bonding process,
FIG. 7 is a diagram illustrating conventional temporary bonding. 1... Bonding arm, 2... Swinging arm, 3
...Shaft, 4a...Solenoid, 4b...1 as magnetic adsorption piece, 5a...Magnet, 5b...Coil, 6.
... Stopper, 7... Capillary, 8... Shaft, 9...
...Clamp arm, 9a...Clamp, 10...
Wire, 11... Linear motor, 12... Electric torch, 13... Tension clamp, 14... Guide, 16... Swing frame, 17... Cam follower,
18...cam. Patent applicant: Kaiyo Denki Co., Ltd. agent, patent attorney Masaharu Hakiri Figure 4: Difficult case ω Okemasa, ■ ■ ■ ■ ■ ;; = ko Figure 3 ℃) Case 4 correction■ ■ ■ ■ ■ ■ ■ Figure 6 (a) 6 (b)

Claims (5)

[Claims] (1) A bonding arm provided with a capillary at the tip, a swinging arm that swings the bonding arm up and down, and a wire clamping means provided on the swinging arm and movable between the swinging arm. a semiconductor assembly device comprising: a driving means for displacing the wire clamping means; and an electric discharge generating means movable below a capillary provided on the bonding arm, the semiconductor assembly device displacing the wire clamping means. A semiconductor assembly apparatus characterized in that the clamped wire is brought into contact with the electric discharge generating means to confirm whether or not the wire is drawn out from the tip of the capillary. (2) A bonding arm provided with a capillary at the tip, a swinging arm that swings the bonding arm up and down, and a wire clamping means provided on the swinging arm and movable between the swinging arm. A semiconductor assembly device comprising: a driving means for displacing the wire clamping means; and an electric discharge generating means movable below a capillary provided on the bonding arm, the wire being disposed from the tip of the capillary. After displacing the wire clamping means until the wire end no longer comes into contact with the electric discharge generating means if the wire has been unwound for a long time,
The bonding arm is swung so that a predetermined gap length is created between the electric discharge generating means and the wire end, and conversely, when the wire drawn out from the tip of the capillary is short, the wire clamp After the means is displaced until the wire end comes into contact with the electric discharge generating means, the bonding arm is swung so that a predetermined gap length is created between the electric discharge generating means and the wire end. A semiconductor assembly device characterized by: (3) The semiconductor assembly apparatus according to claim 1 or 2, wherein the drive means for displacing the wire clamp means is constituted by a linear motor. (4) The semiconductor assembly apparatus according to claim 1 or 2, wherein the drive means for displacing the wire clamp means is constituted by a cam mechanism. (5) If the electric discharge generating means movable below the capillary and the end of the wire fed out from the capillary do not have a predetermined gap length, the wire clamping means for clamping the wire is displaced and the electric discharge is generated. A method for assembling a semiconductor, characterized in that the bonding arm is swung so that a predetermined gap length is obtained by determining whether the wire comes into contact with or separating from the generating means by means of a control means.