JPH04123744A - Formation of barrier rib - Google Patents

Abstract

PURPOSE:To increase the adhesion between a barrier rib and a substrate by depositing an anti-etching layer for preventing the loss and damage due to blasting, on an electrode, and at least on the substrate between the electrodes adjacent to the layer. CONSTITUTION:Striped cathodes 12 are provided in parallel on a back surface plate 10 made of glass. A Ni thick film paste is printed, and is baked. The cathode 12 is covered with an anti-etching layer 14, and a substrate surface 10 between adjacent cathodes is exposed. A thick film layer 16 for rib is deposited on a substrate surface 10a between the cathodes adjacent to the anti- etching layer 14. A resist pattern 20 is provided, and a polishing material 24 of alumina powder is blown to a groove-formed region 18 that is not covered with the resist pattern 20, and the thick film layer 16 for rib is etched off. The thick film layer 16 is baked and a barrier rib 26 of a gas discharge display panel is finished. According to this method of barrier rib formation, the barrier rib is hard to fall off from the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of forming barrier ribs of a gas discharge display panel.

(Prior Art) In recent years, there has been an increasing demand for higher pixel density in gas discharge display panels. In order to achieve high definition, it is necessary to form barrier ribs finely, for example, the height is 160 to 2.
To give a specific example, a panel with 640 x 480 pixels requires the formation of fine barrier ribs with a thickness of 00um and a width of 50-60L1m! 8 per mm
When creating a 12-inch pixel size with pixel density, the width of the barrier rib must be adjusted in order to make the aperture ratio of the display cell 50% or more! It needs to be 62.5 um or less.

In particular, in color display panels, it is necessary to form green, red, and blue display cells in one dot, so the resolution needs to be three times higher than that of monochrome display panels. There is a strong demand for smaller widths.

(Problem to be solved by the invention) However, in conventional barrier rib formation for gas discharge display panels, a thick film printing method suitable for mass production is used, and printing is repeated until thick film paste is laminated to a predetermined height. In order to form fine barrier ribs, it is necessary to pile up thick film paste with high accuracy in the fine rib formation area each time printing is performed. This is a technically very difficult task and is not suitable for forming fine barrier ribs. 1mm in thick film printing method
The limit is to form five barrier ribs.

Therefore, this applicant filed an application separate from this application,
We have proposed a barrier rib formation method using blast etching as a method more suitable for forming fine barrier ribs than the thick film printing method, and according to this method, the wall width is 50 to 80 mm.
It is possible to form barrier ribs with a height of 160 to 200 um.

A brief explanation of this barrier rib forming method is as follows.
An electrode, such as a cathode, is formed on a base such as a glass substrate, and the electrode is covered with an etching prevention layer to protect the electrode from damage caused by blasting. Next, a thick film layer for ribs is laminated on the etching prevention layer, and a resist pattern exposing the groove forming region is provided on the dried thick film layer for ribs. Then, an abrasive material such as alumina powder is sprayed onto the groove forming area, and the thick film layer for ribs in the groove forming area is etched away by blasting, and then the thick film layer for ribs is fired to form the remaining thick film layer for ribs. Complete the barrier ribs. The anti-etching layer and the resist pattern are decomposed or burned by the heating during firing, become gas, and are blown away.

However, when forming the barrier ribs, if the etching prevention layer is applied using a fixer, not only the electrode but also the base layer will be covered with the etching prevention layer. As a result, until the etching prevention layer is blown off by firing, it is interposed between the thick film layer for the ribs and the base and electrodes, so the thick film layer for the ribs (barrier ribs) and the base are Also, a strong adhesion force cannot be obtained around the electrode, making it easy to peel off partially from the base. As a result, there was a problem that the barrier ribs were chipped and the yield was reduced.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to provide a method for forming barrier ribs that can increase the adhesion between barrier ribs and a base.

(Means for Solving the Problems) In order to achieve this object, the barrier rib forming method of the present invention includes forming a plurality of electrodes in parallel on a base when forming barrier ribs for a gas discharge display panel. a step of forming an etching prevention layer so as to cover the electrodes and exposing the base between the electrodes that are in contact with each other; and a thick film layer for ribs on the etching prevention layer and on the base between the electrodes that are in contact with each other at least. a step of forming a resist pattern that exposes the groove forming region of the thick film layer for ribs, and a step of supplying an abrasive material to the groove forming region and etching away the thick film layer for ribs in the groove forming region by blasting. and firing the rib thick film layer.

(Function) According to such a barrier rib forming method, a diagonal etching prevention layer that prevents damage to the electrodes due to blasting is laminated on the electrodes and at least on the base between adjacent electrodes. Therefore, the thick film layer for ribs can be fired while maintaining good adhesion between the thick film layer for ribs before firing and at least the base between adjacent electrodes.

(Embodiment) Hereinafter, embodiment 1 of the present invention will be explained with reference to the drawings. It should be noted that the drawings are only schematic representations to the extent that the invention can be understood.

FIGS. 1(A) to 1()() are manufacturing process diagrams of an embodiment of the present invention, and FIGS. 1(A) to (C) are cross sections taken in a direction perpendicular to the extending direction of the cathode and the first Figures (D) to (H) represent cross sections taken along the direction in which the cathode extends.

*Step 1: First, prepare the back plate 10, for example, a glass substrate as a base, and as shown in FIG.
A plurality of stripe-shaped cathodes 12 are formed in parallel on the substrate.

In this example, N1 thick film paste (DuP) is used.

nt Co., Ltd. #9535) to form a plurality of striped cathode patterns, this pattern was dried for 1 hour at a drying temperature of 150°C, and the dried pattern was heated to a firing peak temperature of 580°C. Hold and bake for 10 minutes.

*Step 2: Next, as shown in FIG. 1 (8), an etching prevention layer 141Fr is applied to protect the cathode 12 from damage caused by blasting, and the substrate surface 10a between the cathodes that covers the cathode 12 and is in contact with at least wA is exposed. Form it like this.

The etching prevention layer 14 may have either a single-layer structure or a multi-layer structure, but in this embodiment, it has a two-layer structure consisting of a blast-resistant resin and a protective layer sequentially provided on the cathode 2.

The blast-resistant resin is made of an organic resin with low hardness and has the property of not being easily etched or etched by blasting. 0 made by Tokyo Ohka Co., Ltd. as a blast-resistant resin
Use 88-day sandblasting screen printing ink. Further, the protective layer is for preventing the solvent component contained in the printed thick film layer for ribs from penetrating into the blast-resistant resin and causing the blast-resistant resin to swell and peel off. As a protective layer, an anti-bleeding agent manufactured by Toko Ohka Co., Ltd. is used.

In this embodiment, the etching prevention layer 14 is formed by screen printing on the cathode 12 using the screen used for printing the cathode 12 or a screen having a printed pattern with a slightly wider pattern width than the cathode 12. do.

To explain in more detail, first, a blast-resistant resin is screen printed, and the film thickness of the dried resin on the printing edge is 30~30 mm.
A screen of about 70 mesh is used for printing so that the thickness is about 35 μm. After printing, the resin surface is leveled (smoothed) by allowing the resin to stand for 1 to 2 minutes, and then the resin is kept in an oven at 70° C. for 10 minutes to dry. After that, apply resin to film thickness x 0.5 mJ/cm2.
Cure under dim light. Next, the protective layer is screen printed on the blast-resistant resin, and the printed protective layer is leveled.
Dry and cure.

*Step 3: Next, a thick film layer for ribs is formed on the etching prevention layer 14 and at least on the substrate surface 10a between adjacent cathodes]
Layer 6.

In this example, glass thick film paste (DuPont $9741)! Solid printing is performed on the etching prevention layer 14 and the exposed substrate surface 10a over the entire barrier rib forming area, and printing is repeated to apply 160 ml of glass thick film paste.
Stack to a height of ~200um. If the layers are not stacked to the specified height, dry the printed thick film paste at a drying temperature of 1.
The next printing was performed after drying at 50°C for 10 minutes, and when the layers were stacked to a predetermined height, the printed thick film paste was dried at a drying temperature of 150°C for 1 hour.
As also shown in C), a thick film layer 16 for ribs made of thick film paste laminated to a predetermined height is obtained.

*Step 4: Next, groove forming area 18 of thick film layer 16 for ribs
A resist pattern 2o is formed that exposes.

In this example, as shown in FIG.
Apply a film of 15 to 20 um on top using a spin coater. The coating conditions for the resist 22 are as follows: The rotation speed of the spin coater is set to 500 r, p, m, 5 seconds from the start of rotation.
Hold for 60 seconds at 500r, p, m, then 1500r, p, m, then 500r.

Hold p, m, for 1 second, then press Or, for 5 seconds.
The condition is to drop down to p, m. After the resist 22 has been applied, the resist 22 is dried at a temperature of 70° C. for 15 minutes.

03BR-82B manufactured by Tokyo Ohka Co., Ltd. is used as the resist 22, but since this is a negative type, a mask is used that can expose the rough areas of the thick film layer 16 that are desired to remain as barrier ribs. In exposing the resist 22, a negative film of equal size is used and the mask is used in close contact with the resist 22, so an anti-tack agent manufactured by Tokyo Ohka Co., Ltd. is applied on the resist 22 in order to prevent the resist 22 from adhering to the mask. (not shown). The coating conditions were as follows: The rotation speed of the spin coater was set to 1000r, p, over 5 seconds from the start of rotation.
m, then 1000 r.

p, m, for 15 seconds, then 15oOj, p
, m, held at 1500r, p, m for 1 second after closing, then Or, p for 5 seconds.

The condition is that it drops to m. After this application, let it cool for 2 to 3 minutes at room temperature.

Next, the resist 22 is exposed, developed, fixed, and dried to obtain a resist pattern 20 exposing the groove forming regions 18, as shown in FIG. 1(E). In the exposure, the exposure amount was set to a film thickness of xo and 7 mJ/cm2, and after exposure, a 0.2% sodium carbonate aqueous solution was sprayed with a low-pressure spray and developed, followed by 5I! of pure water. and] A mixture of CC and 0.5% hydrochloric acid is sprayed and fixed. Note that the anti-tack agent is also patterned into the same shape as the resist pattern 20.

*Step 5: Next, thick film layer 16 for ribs in groove forming area 18
is removed by etching by blasting using an abrasive material for blasting.

In this example, a blasting machine (fine powder type 5C-3 manufactured by Fuji Seisakusho) was used, and an abrasive material of alumina powder 241 was used.
The Fr resist pattern 20 is sprayed onto the uncovered groove forming area 18, and the rib thick film layer 16 in the groove forming area 18 is etched away, as shown in FIG. 1(F). Since the rib thick film layer 16 is in a dry state, it can be easily etched.

After the etching of the thick film layer 16 for ribs is completed, as shown in FIG.
As also shown in F) to (G), the abrasive material 24 adhering to the rib thick film layer 16, the exposed substrate surface 10a, etc. is removed.

*Step 6: Next, the rib thick film layer 16 is fired.

In this example, the rib thick film layer 16 is fired at a temperature of 530'.
C for 10 minutes and fired to complete the barrier ribs 26 of the gas discharge display panel, as shown in FIG. 1(H).

The resist pattern 2o, the etching prevention layer 14, and the tack prevention agent (not shown) are decomposed or burned by the heating during baking, become gas, and are blown away.

When the etching prevention layer 14 is applied using a spinner, not only the cathode 12 but also the substrate surface 10a is covered with the etching prevention layer 14.
If the etching prevention layer 14 does not fly away before the etching process 6 is sintered, the rib thick film layer 16 (barrier rib 26
), the substrate surface 10a, and the cathode 12 in the dark, it is difficult to obtain a strong adhesion force, but in this embodiment, as shown in FIG.
As shown in ~(C), etching prevention layer 141E:
Since the substrate surface 10a between the cathodes in contact with at least III is exposed, the rib thick film layer 16 can be laminated in contact with at least the substrate surface 10a between the cathodes, and as a result, the firing It is possible to strengthen the adhesion between the subsequent thick film layer 16 for ribs and at least the substrate surface 10a between the cathodes, thereby reducing chipping of the barrier ribs 26, and therefore improving the yield of barrier ribs.

In addition to the above-mentioned blast-resistant resin, for example, an ultraviolet curing ink for sandblasting manufactured by Tokyo Ohka Co., Ltd., ○SB Japan-Russia V, may be used. When this ultraviolet curing ink is used, after printing with this ink. After printing this ink and omitting the drying step, it is possible to cure the ink by irradiating it with ultraviolet rays.

The present invention is not limited to the embodiments described above, and therefore the shape, size, arrangement position, configuration, etc. of each component,
The forming material, forming method, numerical conditions, and other conditions can be changed as desired.

For example, the barrier ribs may be formed on the side of the substrate on which the anode of the gas discharge display panel is formed. Furthermore, the present invention can be applied to the formation of barrier ribs in gas discharge display panels of various configurations, and therefore the configuration of the base can be changed to any suitable configuration depending on the configuration of the gas discharge display panel to which it is applied. Further, the etching prevention layer may cover the entire electrode or a portion of the electrode.

(Effects of the Invention) As is clear from the above description, according to the barrier rib forming method of the present invention, an etching prevention layer is laminated on the electrodes and on the base between the electrodes that are in at least llI contact with each other.

Therefore, the thick film layer for ribs can be fired while maintaining good adhesion between the thick film layer for ribs before firing and at least the base between adjacent electrodes. As a result, good adhesion is obtained between the thick film layer for ribs (barrier ribs) of fired porridge and the substrate between the electrodes that are in contact with GIl, making it difficult for the barrier ribs to fall off from the substrate, thus increasing the yield of barrier ribs. be able to.

[Brief explanation of drawings]

FIGS. 1A to 1H are manufacturing process diagrams for explaining an embodiment of the present invention. 10--Base, e.g., back plate 12--Electrode, e.g., cathode 14--Etching prevention layer 16--Thick film layer for ribs, 18--Groove forming region 20-
...Resist Bakushi 24...Abrasive material. Patent applicant: Oki Electric Industry Co., Ltd. / 10a-Substrate surface 0a Manufacturing process diagram No. 1 for explaining the embodiment 18: J forming area Manufacturing process diagram No. 1 for explaining the embodiment

Claims (1)

[Claims] (1) When forming barrier ribs for a gas discharge display panel, there are two steps: forming a plurality of electrodes in parallel on a base, and etching to cover the electrodes and expose at least the base between adjacent electrodes. a step of forming a prevention layer; a step of laminating a thick film layer for ribs on the etching prevention layer and on a base between at least adjacent electrodes; and a resist pattern exposing a groove forming region of the thick film layer for ribs. a step of supplying an abrasive to the groove forming region and etching away the thick film layer for ribs in the groove forming region by blasting; and a step of firing the thick film layer for ribs. A method for forming barrier ribs.