JPH04123713A - Anisotropic conductive film - Google Patents
Anisotropic conductive filmInfo
- Publication number
- JPH04123713A JPH04123713A JP24272290A JP24272290A JPH04123713A JP H04123713 A JPH04123713 A JP H04123713A JP 24272290 A JP24272290 A JP 24272290A JP 24272290 A JP24272290 A JP 24272290A JP H04123713 A JPH04123713 A JP H04123713A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- amount
- butadiene copolymer
- acrylonitrile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002923 metal particle Substances 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 125000003277 amino group Chemical group 0.000 abstract 2
- 239000000805 composite resin Substances 0.000 abstract 2
- 125000002883 imidazolyl group Chemical group 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- 150000002825 nitriles Chemical class 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- NPUQCECELINJML-UHFFFAOYSA-N 2-ethylimidazole Chemical compound CCC1=NC=C[N]1 NPUQCECELINJML-UHFFFAOYSA-N 0.000 description 1
- -1 2-hebutadenimidazole Chemical compound 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WPYCRFCQABTEKC-UHFFFAOYSA-N Diglycidyl resorcinol ether Chemical compound C1OC1COC(C=1)=CC=CC=1OCC1CO1 WPYCRFCQABTEKC-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000012971 dimethylpiperazine Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、マイクロエレクトロニクス接合、例えば、Ｌ
ＣＤ、（液晶デイスプレー）とフレキシブルプリント回
路基板の端子部の電気的接合や、半導体ＩＣとＩＣ搭載
用回路基板の接合等に用いる異方導電フィルムに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to microelectronic junctions, e.g.
The present invention relates to an anisotropic conductive film used for electrically bonding the terminal portion of a CD (liquid crystal display) and a flexible printed circuit board, and bonding a semiconductor IC to a circuit board for mounting an IC.
最近の電子機器の小型化、薄型化に伴い、微細な回路同
志や、微小部品と微細な回路の接続等の必要性か飛躍的
に増大している。その接合方法のひとつとして異方導電
フィルムを用いる方法かある。異方導電フィルムは基本
的には熱可塑タイプと熱硬化タイプに分類され、それぞ
れの特性を活かした使用方法か提案されている（たとえ
ば、特開昭６０−８４７１８、特開昭６２−１８１３７
８、特開昭６２−２０７３８０、特開平１−１１３４８
０、特開平１−２４９８８０、特開平１−２６１４７８
各号公報）。特に熱硬化タイプは、熱可塑タイプのもの
に比べて接合の長期信頼性か高いことより、最近使用さ
れる事か多くなってきている。しかし、従来から使用さ
れている熱硬化タイプの異方導電フィルムは硬化速度が
遅かったり、接合時の作業性か不良であり、短時間の熱
圧着ては十分な接合信頼性は得られていないのが現状で
ある。With the recent miniaturization and thinning of electronic devices, the need for connections between fine circuits and between fine parts and fine circuits has increased dramatically. One of the bonding methods is to use an anisotropic conductive film. Anisotropic conductive films are basically classified into thermoplastic types and thermosetting types, and methods of use that take advantage of the characteristics of each have been proposed (for example, JP-A-60-84718, JP-A-62-18137).
8, JP-A No. 62-207380, JP-A No. 1-11348
0, JP 1-249880, JP 1-261478
(Each issue). In particular, thermosetting types have been increasingly used recently because of their higher long-term bonding reliability than thermoplastic types. However, conventionally used thermosetting anisotropic conductive films have slow curing speeds and poor workability during bonding, and sufficient bonding reliability cannot be achieved with short-term thermocompression bonding. is the current situation.
［発明か解決しようとする課題〕
熱硬化性樹脂をベースとした異方導電フィルムは硬化速
度の早い樹脂系を使用した場合、相対的に硬化速度の遅
い樹脂系を使用した場合に較へて同じ圧着条件では接合
信頼性はあがるか、フィルムの保存安定性か低下する傾
向かある。本発明はフィルムの保存安定性に優れ、短時
間の圧着ても高い接合信頼性を有する異方導電フィルム
を提供する事を目的としたものである。[Problem to be solved by the invention] When an anisotropic conductive film based on a thermosetting resin is used, a resin system with a fast curing speed is used, compared to a resin system with a relatively slow curing speed. Under the same pressure bonding conditions, the bonding reliability tends to increase, or the storage stability of the film tends to decrease. An object of the present invention is to provide an anisotropic conductive film that has excellent storage stability and high bonding reliability even when pressed for a short time.
すなわち、アクリロニトリル−ブタジエン共重合体、エ
ポキシ樹脂、イミダゾール硬化剤、及び導電粒子を混ぜ
合わせた樹脂組成物に、アミン系の反応促進剤を添加し
て得られる異方導電フィルムである。That is, it is an anisotropic conductive film obtained by adding an amine-based reaction accelerator to a resin composition in which an acrylonitrile-butadiene copolymer, an epoxy resin, an imidazole curing agent, and conductive particles are mixed.
本発明において使用するアクリロニトリル−ブタジエン
共重合体は、結合アクリロニトリル量が３５％以上４５
％以下のものを用いる。The acrylonitrile-butadiene copolymer used in the present invention has a bound acrylonitrile content of 35% or more.
% or less.
エポキシ樹脂は、たとえばビスフェノールＡプリンジル
エーテル型エポキシ樹脂、ビスフェノールピグリンジル
エーテル型エポキシ樹脂、ヒスフェノールＳプリンジル
エーテル型エボキン樹脂、レゾルシノールグリシジルエ
ーテル型エポキシ樹脂、ヘキサヒドロビスフェノールＡ
プリンジルエーテル型エボキン樹脂、ダイマー酸ジグリ
シジルエーテル型エボキン樹脂、フェノールノホラノク
グリンジルエーテル型エポキシ樹脂、クレゾールノホラ
ック型エポキシ樹脂、ダイマー酸ジグリシジルエステル
型エボキン樹脂、グリシジルアミン型エポキシ樹脂、ゴ
ム変性エポキシ樹脂、ウレタン変性エポキシ樹脂等より
選ばれたエポキシ樹脂であり、１種又は２種類以上を組
合せて用いられる。Epoxy resins include, for example, bisphenol A purinzyl ether type epoxy resin, bisphenol piglindyl ether type epoxy resin, hisphenol S purindyl ether type Evoquin resin, resorcinol glycidyl ether type epoxy resin, hexahydrobisphenol A
Prinyl ether type Evoquin resin, dimer acid diglycidyl ether type Evoquin resin, phenol nophoranokgurindyl ether type epoxy resin, cresol nophorac type epoxy resin, dimer acid diglycidyl ester type Evoquin resin, glycidylamine type epoxy resin, rubber modification The epoxy resin is selected from epoxy resins, urethane-modified epoxy resins, etc., and can be used alone or in combination of two or more.
イミダゾール系硬化剤としては、たとえば、２−メチル
イミダゾール、２−エチルイミダゾール、２−エチル−
４−メチルイミダゾール、２−フェニルイミダゾール、
２−フェニル−４メチルイミダゾール、２−ウンデシル
イミダゾール、２−ヘブタデンルイミダゾール、１−ベ
ンジル−２−メチルイミダゾール、ｌ−シアノエチル２
−メチルイミダゾール、１−シアノエチル−２−ウンデ
シルイミダゾール、ｌ−シアノエチル−２−ウンデシル
イミダゾリウム・トリメリテート、２．４−ジアミノ−
６−〔２−メチルイミダゾール−（１）〕〕エチルー５
−ｈリアジン２．４−一ジアミノ−６−〔２−ウンデシ
ルイミダゾリル（１）〕〕エチルー８−トリアジンが用
いられ、２種類以上併用して用いても良い。Examples of imidazole curing agents include 2-methylimidazole, 2-ethylimidazole, 2-ethyl-
4-methylimidazole, 2-phenylimidazole,
2-phenyl-4methylimidazole, 2-undecylimidazole, 2-hebutadenimidazole, 1-benzyl-2-methylimidazole, l-cyanoethyl 2
-Methylimidazole, 1-cyanoethyl-2-undecylimidazole, l-cyanoethyl-2-undecylimidazolium trimellitate, 2,4-diamino-
6-[2-methylimidazole-(1)]]ethyl-5
-h riazine 2.4-monodiamino-6-[2-undecylimidazolyl (1)]]ethyl-8-triazine is used, and two or more types may be used in combination.
ここで、アクリロニトリル−ブタジエン共重合体とエポ
キシ樹脂の割合は、エポキシ樹脂１００重量部に対して
アクリロニトリル−ブタジエン共重合体３０〜７０重量
部、好ましくは４０〜６０重量部とするのが良い。アク
リロニトリル−ブタジエン共重合体の量が３０重量部よ
り少ないとフィルムの可とう性が低下し、脆くなり割れ
てしまう。反対に、７０重量部より多いと、耐熱性が落
ちてしまう。Here, the ratio of the acrylonitrile-butadiene copolymer to the epoxy resin is preferably 30 to 70 parts by weight, preferably 40 to 60 parts by weight, per 100 parts by weight of the epoxy resin. If the amount of the acrylonitrile-butadiene copolymer is less than 30 parts by weight, the flexibility of the film will decrease and it will become brittle and crack. On the other hand, if the amount is more than 70 parts by weight, the heat resistance will deteriorate.
イミダゾール系硬化剤（よ、エポキシ樹脂ｌｏ。Imidazole curing agent (Yo, Epoxy resin lo.
重量部に対して、１０〜２０重量部の間で加える。It is added between 10 and 20 parts by weight.
１０重量部以下では、硬化速度が遅く、通常の熱圧着条
件では十分に硬化せず接合特性か不良となる。また、２
０部以上ではフィルムの保存性か低下し、通常４０度未
満の室温中でも２〜３日で使用不可能となる。If the amount is less than 10 parts by weight, the curing speed will be slow and the bonding properties will be poor because the curing will not be sufficient under normal thermocompression bonding conditions. Also, 2
If it is more than 0 parts, the storage stability of the film will deteriorate and it will become unusable within 2 to 3 days even at room temperature below 40 degrees Celsius.
導電粒子は、単一金属もしくは合金の金属粒子、あるい
は樹脂又は金属の粒子を核としそれにメツキを施したも
のをもちいることかできる。その配合量は、樹脂固形分
１００体積部に対して３〜ＩＯ体積部か適当である。３
体積部以下であると電極間に存在する粒子数か不足し安
定した導通抵抗か得られない。また、１０体積部以上で
あると隣接回路間の絶縁信頼性か劣る。The conductive particles may be metal particles of a single metal or an alloy, or particles having resin or metal particles as a core and plated thereon. The blending amount thereof is suitably 3 to IO parts by volume per 100 parts by volume of the resin solid content. 3
If it is less than part by volume, the number of particles existing between the electrodes will be insufficient, making it impossible to obtain stable conduction resistance. Further, if the amount is 10 parts by volume or more, insulation reliability between adjacent circuits will be poor.
これら組成物に対してアミン系の反応促進剤、特に第三
アミン、たとえばテトラメチルグアニジン、トリエタノ
ールアミン、ピペリジン、Ｎ。Amine-based reaction promoters, especially tertiary amines such as tetramethylguanidine, triethanolamine, piperidine, N, are used for these compositions.
Ｎｏ−ジメチルピペラジン、Ｉ、４−ジアザビシクロ（
２，２，２）オクタン（トリエチレンジアミン）、ピリ
ジン、ピコリン、１．８−ジアザ−ビシクロ（５，４，
０’）ウンデセン−７、ペンジルジメチルアミン、２−
（ジメチルアミノメチル）フェノール、２．４．６−ｈ
リス（ジメチルアミノメチル）フェノールノ等か適応可
能なものであり、エポキシ樹脂１当量あたり０２〜０゜
３アミン当量の割合で添加するのか適当である。No-dimethylpiperazine, I,4-diazabicyclo(
2,2,2) octane (triethylenediamine), pyridine, picoline, 1,8-diaza-bicyclo(5,4,
0') undecene-7, penzyldimethylamine, 2-
(dimethylaminomethyl)phenol, 2.4.6-h
Lis(dimethylaminomethyl)phenol or the like is applicable, and it is appropriate to add it at a ratio of 0.2 to 0.3 amine equivalents per equivalent of epoxy resin.
０２当量以下の場合、反応促進効果が低下し、熱圧着後
も硬化か不十分て高い接合信頼性は得られない。また、
０．３当量以上の場合はエポキシ樹脂の硬化を促進して
しまい、フィルムの保存安定性か著しく悪くなり、本発
明の目的を達することかできない。If the amount is less than 0.02 equivalent, the reaction accelerating effect decreases, and even after thermocompression bonding, curing is insufficient and high bonding reliability cannot be obtained. Also,
If the amount is more than 0.3 equivalent, the curing of the epoxy resin will be accelerated, and the storage stability of the film will be significantly deteriorated, making it impossible to achieve the object of the present invention.
以丁、実施例により、本発明を、具体的に説明する。 The present invention will now be specifically explained with reference to Examples.
（実施例Ｉ〜２）（比較例１〜４）
アクリロニトリル−ブタジエン共重合体としては、結合
アクリロニトリル量が４８％のＮ２１５ＳＬ、４１％の
Ｎ２２Ｏ８、および２０％のＮ２５０Ｓ（いずれも日本
合成ゴム社製）の各２０％メチルエチルケトン溶液を、
また、エポキシ樹脂としては、ビスフェノールＡクリソ
ジルエーテル型のエピコート１００１ （油化シェル社
製）の７０％メチルエチルケトン溶液を、硬化剤として
は２エチル４メチルイミダゾール（２Ｅ４ＭＺ）（四国
化成社製）をそれぞれ用意した。また、導電粒子として
は４００メツンユバスのアトマイズ半田粉（日本アトマ
イズ工業社製）を使用した。(Examples I to 2) (Comparative Examples 1 to 4) As the acrylonitrile-butadiene copolymer, N215SL with a bonded acrylonitrile content of 48%, N22O8 with 41%, and N250S with 20% (all manufactured by Japan Synthetic Rubber Co., Ltd. ) of each 20% methyl ethyl ketone solution,
In addition, as the epoxy resin, a 70% methyl ethyl ketone solution of bisphenol A chrysodyle ether type Epicote 1001 (manufactured by Yuka Shell Co., Ltd.) was used, and as a curing agent, 2 ethyl 4 methyl imidazole (2E4MZ) (manufactured by Shikoku Kasei Co., Ltd.) was used. Prepared. In addition, as the conductive particles, 400 mtsunyuba atomized solder powder (manufactured by Nihon Atomize Kogyo Co., Ltd.) was used.
上記の樹脂と硬化剤を配合した樹脂溶液に、シランカン
ブリング剤処理した導電粒子を分散させ１時間攪拌した
。次に、製膜する前に、反応促進剤としてトリエタノー
ルアミン（和光純薬社製）を添加し５分間攪拌した後、
直ちに離型フィルム上に流延し、乾燥させて製膜した。Conductive particles treated with a silane cambling agent were dispersed in a resin solution containing the above resin and curing agent, and the mixture was stirred for 1 hour. Next, before forming a film, triethanolamine (manufactured by Wako Pure Chemical Industries, Ltd.) was added as a reaction accelerator, and after stirring for 5 minutes,
It was immediately cast onto a release film and dried to form a film.
尚、各試料は第１表の割合で用いた。Incidentally, each sample was used in the proportions shown in Table 1.
二のようにして得られた異方導電フィルムを用いて、４
０℃の雰囲気中に保存し一定時間ごとに取り出して、フ
レキシブルプリント回路基板とｒＴｏ（インジウム・ス
ズ酸化膜）透明導電膜をパターン加工したガラスの回路
基板とを圧着し、両回路基板の接続端子間の接続抵抗値
の変化を測定した。また、同じ試験片を用いて温度サイ
クル試験として一３０℃雰囲気中に３０分り８０°Ｃ雰
囲気中に３０分放置を■サイクルとして処理し、定サイ
クルごとに上記と同し試験片を用い、接続端子間の抵抗
値の変化を測定し、接続安定性の評価を行なった。ここ
で、圧着するフレキンプルプリント回路基板とＩＴＯガ
ラス基板の回路は２００μｔｎピツチ、熱圧着条件は１
６０°Ｃ１３０ｋｇ／ｃｍ、１５ｓｅｃで行った。Using the anisotropic conductive film obtained in 2.
The flexible printed circuit board was stored in an atmosphere at 0°C and taken out at regular intervals, and the flexible printed circuit board was crimped to a glass circuit board patterned with rTo (indium tin oxide) transparent conductive film, and the connection terminals of both circuit boards were connected. The change in connection resistance between the two was measured. In addition, using the same test piece, a temperature cycle test was performed in which 30 minutes were placed in a -30°C atmosphere and 30 minutes left in an 80°C atmosphere. Connection stability was evaluated by measuring changes in resistance between terminals. Here, the circuits of the flexible printed circuit board and the ITO glass substrate to be crimped have a pitch of 200μtn, and the thermocompression bonding conditions are 1.
It was carried out at 60°C, 130 kg/cm, and 15 seconds.
保存試験の結果は第ｔｍに示した通りてあった。The results of the storage test were as shown in Section tm.
実施例１、実施例２は、結合ニトリル量４１％のアクリ
ロニトリル−ブタジエン共重合体を用いた系であるが、
抵抗値の変化はほとんどみられなかった。また、結合ニ
トリル量４４，５％相当のアクリロニトリル−ブタジエ
ン共重合体を用いた実施例３、結合ニトリル量３６．８
％相当のアクリロニトリル−ブタジエン共重合体を用い
た実施例４も抵抗値の変化はなかった。反応促進剤を入
れなかった系（比較例１）、（比較例２）、（比較例３
）、結合ニトリル量４８％のアクリロニトリル−ブタジ
エン共重合体を用い反応促進剤をエポキシ樹脂に対して
０，３アミン当量入れた系（比較例４）も初期抵抗値の
変化はみられなかった。Examples 1 and 2 are systems using an acrylonitrile-butadiene copolymer with a bonded nitrile content of 41%,
Almost no change in resistance value was observed. In addition, Example 3 using an acrylonitrile-butadiene copolymer with a bonded nitrile content of 44.5%, a bonded nitrile content of 36.8%.
% of the acrylonitrile-butadiene copolymer was used, and there was no change in resistance value. Systems in which no reaction accelerator was added (Comparative Example 1), (Comparative Example 2), (Comparative Example 3)
), a system in which an acrylonitrile-butadiene copolymer with a bonded nitrile content of 48% was used and a reaction accelerator was added in an amount of 0.3 amine equivalent to the epoxy resin (Comparative Example 4) also showed no change in the initial resistance value.
結合ニトリル量３４，７％相当のアクリロニトリル−ブ
タジエン共重合体を用いた実施例５は、若干抵抗値の上
昇かみられた。In Example 5, which used an acrylonitrile-butadiene copolymer with a bonded nitrile content of 34.7%, a slight increase in resistance was observed.
それに対し、結合ニトリル量３０．５％相当のアクリロ
ニトリル−ブタジエン共重合体を用いた比較例５、結合
ニトリル量２０％のアクリロニトリル−ブタジエン共重
合体を用いた比較例５、比較例６ては、反応促進剤か適
量であっても、保存試験７日後で初期抵抗値に上昇か見
られ、比較例７、比較例８、比較例９は、反応促進剤を
エポキシ樹脂に対して０．６アミン当量入れた系では、
保存試験７日後で初期抵抗値が２倍以上になり使用に耐
えぬものであった。On the other hand, Comparative Example 5 using an acrylonitrile-butadiene copolymer with a bound nitrile content of 30.5%, Comparative Example 5 and Comparative Example 6 using an acrylonitrile-butadiene copolymer with a bound nitrile content of 20%, Even if the reaction accelerator was used in an appropriate amount, an increase in the initial resistance value was observed after 7 days of the storage test. In a system containing an equivalent amount,
Seven days after the storage test, the initial resistance value more than doubled, making it unusable.
温度サイクル試験処理後の抵抗値の変化率は、第２図に
示した通りて、実施例Ｉ、実施例２、実施例３、実施例
４、の５００サイクル処理後の抵抗の変化率は、非常に
小さいのに対し、実施例５はやや上昇する。一方、比較
例は、との場合も、抵抗の変化率は著しく大きい。As shown in FIG. 2, the rate of change in resistance after temperature cycle test treatment is as follows: While it is very small, Example 5 shows a slight increase. On the other hand, in the comparative example, the rate of change in resistance was significantly large.
すなわち、結合ニトリル量３５％〜４５％のアクリロニ
トリル−ブタジエン共重合体を用いた系て、反応促進剤
をエポキシ■当量に対し０．２〜０．３添加することで
、保存性に優れた高信頼性の異方導電フィルムか得られ
た。That is, in a system using an acrylonitrile-butadiene copolymer with a bound nitrile content of 35% to 45%, by adding a reaction accelerator of 0.2 to 0.3 to the equivalent of epoxy, a high-quality product with excellent preservability can be obtained. A reliable anisotropic conductive film was obtained.
本発明による異方導電フィルムは、保存安定性が４０℃
以下の通常の室温雰囲気中で９０日以上ときわめて優れ
ており、また、短時間で確実に圧着できる高信頼性の異
方導電フィルムである。The anisotropic conductive film according to the present invention has a storage stability of 40°C.
It is an extremely reliable anisotropic conductive film that lasts for 90 days or more in the following normal room temperature atmosphere, and can be reliably crimped in a short period of time.
第１図は４
０℃における保存安定性の図である。
第２図は温度サイクルによる導通抵抗値の変化率を示す
図である。FIG. 1 is a diagram of storage stability at 40°C. FIG. 2 is a diagram showing the rate of change in conduction resistance value due to temperature cycles.
Claims (1)
下のアクリロニトリル−ブタジエン共重合体、エポキシ
樹脂、イミダゾール系硬化剤、及び導電粒子とからなる
樹脂組成物溶液に、アミン系の反応促進剤をエポキシ１
当量あたり０．２〜０．３アミン当量の割合で添加し、
離型フィルム上に流延、溶剤を揮散させて得られること
を特徴とする異方導電フィルム。(1) Add an amine-based reaction accelerator to a resin composition solution consisting of an acrylonitrile-butadiene copolymer with a bonded acrylonitrile content of 35% or more and 45% or less, an epoxy resin, an imidazole-based curing agent, and conductive particles. 1
added at a ratio of 0.2 to 0.3 amine equivalents per equivalent,
An anisotropic conductive film characterized by being obtained by casting on a release film and volatilizing a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24272290A JP2994012B2 (en) | 1990-09-14 | 1990-09-14 | Anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24272290A JP2994012B2 (en) | 1990-09-14 | 1990-09-14 | Anisotropic conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04123713A true JPH04123713A (en) | 1992-04-23 |
| JP2994012B2 JP2994012B2 (en) | 1999-12-27 |
Family
ID=17093276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24272290A Expired - Fee Related JP2994012B2 (en) | 1990-09-14 | 1990-09-14 | Anisotropic conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2994012B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04262890A (en) * | 1990-09-27 | 1992-09-18 | Motorola Inc | Flux agent and adhesive containing metal particle |
| KR100891414B1 (en) * | 2007-11-20 | 2009-04-02 | 제일모직주식회사 | Anisotropic conductive film composition for high storage stability |
-
1990
- 1990-09-14 JP JP24272290A patent/JP2994012B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04262890A (en) * | 1990-09-27 | 1992-09-18 | Motorola Inc | Flux agent and adhesive containing metal particle |
| KR100891414B1 (en) * | 2007-11-20 | 2009-04-02 | 제일모직주식회사 | Anisotropic conductive film composition for high storage stability |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2994012B2 (en) | 1999-12-27 |
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