JPH04121773U - Printed board - Google Patents

Abstract

(57) [Summary] [Purpose] Electrically connect the electric circuit on the board body and the check circuit on the waste board using the inner layer pattern, and form a V-groove on the boundary line between the board body and the waste board. electrical connection is possible. [Structure] The printed circuit board 1 is formed from two insulating layers 2 and 3. Further, the printed circuit board 1 is composed of a board main body 4 and a disposable board 5, and a V-groove 6 for division is formed on the boundary line between them. A through hole 8 is formed in the electric circuit 7 on the board body 4. A through hole 11 is also formed in the check circuit 10 on the disposable board 5. These through holes 8 and 11 are electrically connected by an inner layer pattern 13.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

The present invention relates to a printed circuit board on which electronic components are mounted.

0002

[Conventional technology]

Conventionally, in printed circuit boards, the electrical circuit of the board itself and the circuit for checking the discarded board Regarding the connection, the following ideas have been disclosed.

0003 For example, in the device described in Japanese Utility Model Application No. 1-97575, the board body and the disposable A dividing perforation is formed between the board and the holes that make up this perforation. A wiring pattern for connection was passed onto the board in the gap.

0004

[Problem that the idea aims to solve]

However, the prior art has the following drawbacks.

[0005] In other words, the gap between the holes where the route of the connection wiring pattern forms the perforation. The electric circuit of the board itself and the check circuit of the discarded board are As the number of wiring patterns to be connected increases, connection becomes difficult.

[0006] In addition, the gap between the holes that make up the perforations has been widened to increase the number of wiring patterns. Although it is possible to consider the method of Since the separation is done by hand without using a Separation work becomes difficult.

[0007] Therefore, the present invention was developed in view of the drawbacks of the conventional technology, and The number of wiring patterns for electrically connecting the circuit on the main body and the circuit on the disposable board is Even if the number increases, wiring can be done easily, and the board itself and the waste board can be separated. The purpose of the present invention is to provide a printed circuit board that does not cause any trouble when separating the circuit boards.

[0008]

[Means and actions for solving the problem]

This invention consists of a board body, a disposable board, and an electric circuit pattern provided on the board body side. the check pattern provided on the side of the waste board, and the board body and the waste board. The V-shaped groove that separates the electrical circuit pattern and the check pattern are connected. The device is equipped with a connection pattern formed inside the substrate.

[0009] FIG. 1 is a conceptual diagram of the present invention, and FIG. 2 is a sectional view taken along line A-A' in FIG.

0010 Reference numeral 1 designates a printed circuit board, and this printed circuit board 1 has a first insulating layer 2 integrally connected to the printed circuit board 1. and a second insulating layer 3. Also, print 1 is discarded with board body 4. A dividing V-groove 6 is formed on the boundary line between the substrate 5 and the substrate 5.

[0011] An electric circuit 7 is provided on the substrate body 4, and a through hole 8 is bored in the electric circuit 7. The through hole 8 is provided with a through hole conductor 9. Also , a check circuit 10 is provided on the disposable board 5, and a check circuit 10 is provided on the disposable board 5. A through hole 11 is drilled in the through hole 11, and a through hole conductor is installed in the through hole 11. 12 are provided.

0012 Then, the through hole conductor 9 and the through hole conductor 12 are electrically connected. A layer pattern 13 is interposed between the first insulating layer 2 and the second insulating layer 3.

[0013] The V-groove 6 of the printed circuit board 1 having the above configuration is generally used when processing a V-groove. It is formed by cutting or other means that are commonly used. At this time, the depth of the V groove 6 should be The depth is such that the substrate main body 4 and the waste substrate 5 can be easily separated by hand, and the inner layer pattern is The depth must be such that it does not damage the horn 13.

[0014] Note that the printed circuit board 1 has a two-layer structure including a first insulating layer 2 and a second insulating layer 3. However, the present invention is not limited to this, and the insulating layer can also have a three-layer structure. .

[0015] Further, after forming the interior pattern 13 on the substrate resin, a tree is formed on the inner layer pattern 13. It is also possible to form an integrated substrate with the inner layer pattern 13 provided therein by pouring oil into the substrate.

[0016]

[Example 1] 3 and 4 show this embodiment, FIG. 3 is a plan view, and FIG. 4 is a cross section taken along the line A-A' in FIG. It is a front view.

[0017] 21 is a printed circuit board, and this printed circuit board 21 is connected to a first insulator It is formed of a layer 22, a second insulating layer 23, and a third insulating layer 24. Also, The lint board 21 consists of a board main body 25 and a disposable board 26, and there is a separate board on the boundary line. A dividing V-groove 27 is formed.

[0018] An electric circuit 28 is provided on the board main body 25, and a through hole is provided in the electric circuit 28. 29 is bored, and a through hole conductor 30 is provided in the through hole 29. ing. Further, a check circuit 31 is provided on the disposable board 26, and a check circuit 31 is provided on the disposable board 26. A through hole 32 is bored in the circuit 31 for use. A through-hole conductor 33 is provided.

[0019] Then, the through-hole conductor 30 and the through-hole conductor 33 are electrically connected. An inner layer pattern 34 is interposed between the first insulating layer 22 and the second insulating layer 23. Ru.

[0020] The inner layer pattern 34 is formed to be thinner only in the portion that crosses the V-groove 27.

[0021] The electric circuit 28 on the board body 25 of the printed circuit board 21 having the above configuration The electrical connection with the check circuit 31 on the disposable board 26 is made through the through hole 2. Through-hole conductor 30 that constitutes 9 and through-hole that constitutes through hole 32 This is possible by connecting the conductor 33 with the inner layer pattern 34.

[0022] In addition, the separation of the board main body 25 and the waste board 26 is performed by applying stress to the V-groove 27 by hand. This can be easily done by giving.

[0023] According to this embodiment, the electric circuit 28 on the board body 25 and the check on the disposable board 26 are In addition to increasing the number of wiring patterns that electrically connect the circuit 31 for After separating the substrate body 25 and the disposable substrate 26, the inner layer pad exposed from the substrate body 25 is removed. The width of the burr on the turn 34 can be kept small, and the width of the burr on the adjacent inner layer pattern 34 can be kept small. It reduces the risk of burrs coming into contact with each other and prevents short circuits.

[0024]

[Example 2] 5 to 7 show this embodiment, FIG. 5 is a plan view, and FIG. 6 is a sectional view taken along the line B-B' in FIG. , FIG. 7 is a sectional view taken along line C-C' in FIG.

[0025] The printed circuit board 41 of this embodiment is a substitute for the inner layer pattern 34 of the first embodiment. In contrast, the inner layer patterns 42a and 42b are provided with the second insulating layer 23 sandwiched therebetween. It differs in that it is constructed with The same numbers will be given to the parts, and the explanation thereof will be omitted.

[0026] The inner layer patterns 42a and 42b are located at positions sandwiching the second insulating layer 23 and are adjacent to each other. The inner layer patterns 42a and 42b are arranged in a staggered manner.

[0027] The electric circuit 28 on the board main body 25 in the printed circuit board 41 having the above configuration The electrical connection with the check circuit 31 on the disposable board 26 is made through the through hole 2. Through-hole conductor 30a that constitutes 9a and through-hole conductor 30a that constitutes through-hole 32a This is possible by connecting the hole conductor 33a with the inner layer pattern 42a.

[0028] Similarly, through-hole conductor 30b and through-hole constituting through-hole 29b The through-hole conductor 33b constituting the conductor 32b is connected by the inner layer pattern 42b. This becomes possible by doing so.

[0029] According to this embodiment, after separating the substrate body 25 and the disposable substrate 26, the substrate body 25 is Adjacent inner layer patterns 42a and 42b exposed from A gap equal to the thickness of the insulating layer 23 of the second layer can be secured, and these contact each other. It is possible to prevent short circuits caused by this.

[0030]

[Example 3] 8 and 9 show this embodiment, FIG. 8 is a plan view, and FIG. 9 is a cross section taken along the line A-A' in FIG. It is a front view.

[0031] The printed circuit board 51 of this embodiment has the same voltage as that of the third insulating layer 24 in the first embodiment. The difference is that a deep V-groove 27a is used instead of the groove 27, and the other structures are the same. The same components are given the same numbers and their explanations are omitted. .

[0032] The V grooves 27 and 27a formed on the printed circuit board 51 are formed on the first insulating layer 22. A deep V groove 27 similar to that of Example 1 and a deep V groove formed in the third insulating layer 24 It is composed of a groove 27a.

[0033] The V-groove 27 is machined to a depth that does not damage the inner layer pattern 34, and is a deep V-groove. 27a is a hindrance to the subsequent process in consideration of the thickness of the printed circuit board 51 and the depth of the V-groove 27. Machined to maximum depth without

[0034] The printed circuit board 51 having the above configuration is designed to prevent damage to the inner layer pattern 34 during processing. , it is necessary to form a V-groove 27 in the first insulating layer 22 similar to that in the first embodiment. On the other hand, since there is no possibility of damaging the inner layer pattern 34 to the third insulating layer 24, A deep V groove 27a is formed.

[0035] In addition, the electric circuit 28 on the board body 25 in the printed circuit board 51 and the disposable board 2 The electrical connection with the check circuit 31 on 6 constitutes a through hole 29. The through-hole conductor 30 and the through-hole conductor 33 forming the through-hole 32 are This is possible by connecting using the inner layer pattern 34.

[0036] According to this embodiment, the depth of the deep V-groove 27a is configured to be as deep as possible. This reduces the stress required when separating the substrate body 25 and the waste substrate 26. This allows for improved work efficiency.

[0037]

[Effect of the idea]

Internally connect the electrical circuit on the main board and the check circuit on the discarded board. By using a layer pattern, a V-groove is created on the boundary line between the board body and the waste board. It enables electrical connection even after forming, and provides a board with high-density mounting and easy production. can be provided.

[Brief explanation of drawings]

FIG. 1 is a conceptual diagram of the present invention.

FIG. 2 is a sectional view taken along line A-A' in FIG. 1;

FIG. 3 is a plan view showing Example 1.

FIG. 4 is a cross section taken along line A-A' in FIG. 3;

FIG. 5 is a plan view showing Example 2.

FIG. 6 is a sectional view taken along line B-B' in FIG. 5;

FIG. 7 is a sectional view taken along line C-C' in FIG. 5;

FIG. 8 is a plan view showing Example 3.

9 is a sectional view taken along line A-A' in FIG. 8;

[Explanation of symbols]

1 Printed circuit board 2 First insulation layer 3 Second insulation layer 4 Board body 5 Discarded board 6 V groove 7 Electric circuit 8 Through hole 10 Check circuit 11 Through hole 13 Inner layer pattern

Claims (1)

[Scope of utility model registration request] 1. A board main body, a waste board, an electric circuit pattern provided on the board main body side, a check pattern provided on the waste board side, and a V-shaped groove separating the board main body and the waste board. and a connection pattern internally layered within the board, which connects the electric circuit pattern and the check pattern.