JPH04120013U - T-die - Google Patents

T-die

Info

Publication number
JPH04120013U
JPH04120013U JP1991023038U JP2303891U JPH04120013U JP H04120013 U JPH04120013 U JP H04120013U JP 1991023038 U JP1991023038 U JP 1991023038U JP 2303891 U JP2303891 U JP 2303891U JP H04120013 U JPH04120013 U JP H04120013U
Authority
JP
Japan
Prior art keywords
temperature
die
temperature control
heater
lip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1991023038U
Other languages
Japanese (ja)
Inventor
弘信 榮嶋
Original Assignee
株式会社ムサシノキカイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ムサシノキカイ filed Critical 株式会社ムサシノキカイ
Priority to JP1991023038U priority Critical patent/JPH04120013U/en
Publication of JPH04120013U publication Critical patent/JPH04120013U/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/92Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92009Measured parameter
    • B29C2948/92209Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92323Location or phase of measurement
    • B29C2948/92361Extrusion unit
    • B29C2948/92409Die; Nozzle zone
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92504Controlled parameter
    • B29C2948/92609Dimensions
    • B29C2948/92647Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92504Controlled parameter
    • B29C2948/92704Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00Indexing scheme relating to extrusion moulding
    • B29C2948/92Measuring, controlling or regulating
    • B29C2948/92819Location or phase of control
    • B29C2948/92857Extrusion unit
    • B29C2948/92904Die; Nozzle zone

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

(57)【要約】 【目的】 Tダイの温度検出器の目視不可能な劣化、又
は取付け不良を検出出力と温度設定値との差から判定し
て正常な温度分布を維持し、フィルム等の厚さむらを防
止するものである。 【構成】 ダイ本体1を複数の温度管理領域に分割し
て、各温度管理領域にそれぞれ設けた本体ヒーター16
及びリップヒーター17を制御している温度調節器19
に設定温度を指示する温度設定器18の設定電圧と、各
温度管理領域の温度検出孔23に挿入されている温度検
出器22の検出出力(電圧)とを表示器21に表示さ
せ、両電圧の相違により、温度管理の不調を判断するよ
うに構成したものである。
(57) [Summary] [Purpose] Determine invisible deterioration or poor installation of the T-die temperature sensor from the difference between the detection output and the temperature setting, maintain normal temperature distribution, and This prevents thickness unevenness. [Configuration] The die body 1 is divided into a plurality of temperature control areas, and a body heater 16 is provided in each temperature control area.
and a temperature regulator 19 controlling the lip heater 17
The set voltage of the temperature setting device 18 that instructs the set temperature and the detection output (voltage) of the temperature detector 22 inserted into the temperature detection hole 23 of each temperature management area are displayed on the display 21, and both voltages are displayed on the display 21. This system is designed to determine whether temperature control is malfunctioning based on the difference in temperature.

Description

【考案の詳細な説明】[Detailed explanation of the idea]

【0001】0001

【産業上の利用分野】[Industrial application field]

本考案は溶融合成樹脂をシート状、あるいはフィルム状(以下フィルム等とい う)に押出すTダイに関する。 This invention uses molten synthetic resin in sheet or film form (hereinafter referred to as film). Regarding the T-die for extrusion.

【0002】0002

【従来の技術】[Conventional technology]

図3はフィルム等の成形装置の従来の一般的なTダイの断面図で、図4は図3 のA−A断面図である。このTダイは図示しない溶融樹脂圧送装置に連結したダ イ本体1内の供給管15の下端から一直線方向に延びるマニホールド2を有し、 更にこのマニホールド2からその全幅にわたって下方に延びる面状通路3を有す る。 Figure 3 is a cross-sectional view of a conventional general T-die for forming equipment for films, etc. It is an AA sectional view of. This T-die is connected to a molten resin pumping device (not shown). It has a manifold 2 extending in a straight line from the lower end of the supply pipe 15 in the main body 1, Furthermore, it has a planar passage 3 extending downward from the manifold 2 over its entire width. Ru.

【0003】 このダイ本体1の下面には一対のリップ4、5をボルト6及び差動ボルト7に より面状通路3の下端の両側にそれぞれ固定しており、このリップ4、5により リップランド部8を構成している。0003 A pair of lips 4 and 5 are connected to a bolt 6 and a differential bolt 7 on the bottom surface of the die body 1. These lips 4 and 5 are fixed to both sides of the lower end of the planar passage 3. It constitutes a lip land portion 8.

【0004】 更に、Tダイは押出されるフィルム等20の厚さにむらが生じないようにマニ ホールド2の方向に複数の温度管理領域を分割し、それぞれの温度管理領域毎に ダイ本体1には上端部の両側に本体ヒーター16、16を設け、リップ4、5に はリップヒーター17、17を設けてある。0004 Furthermore, the T-die has a manifold to prevent uneven thickness of the extruded film 20. Divide multiple temperature control areas in the direction of Hold 2, and set each temperature control area separately. Die body 1 is provided with body heaters 16, 16 on both sides of the upper end, and lips 4, 5 are provided with body heaters 16, 16 on both sides of the upper end. is provided with lip heaters 17, 17.

【0005】 なお、10はダイ本体1の下方に設けたクーリングロール、11は同じくシリ コンゴムロールである。[0005] In addition, 10 is a cooling roll provided below the die body 1, and 11 is also a series. It is a congo roll.

【0006】 このようなTダイは図4に示すように、面状通路3の両端部には形成すべきフ ィルム等20の幅を調節するため、一対のフォーミングプレート12を左右動可 能に設け、このフォーミングプレート12の外側面には操作ロッド13を連結し て、この操作ロッド13をダイ本体1の外に延長させ、この突出端を操作するこ とによってフォーミングプレート12を左右動させ、溶融樹脂の通る面状通路3 の幅を調節している。[0006] As shown in FIG. 4, such a T-die has holes to be formed at both ends of the planar passage 3. In order to adjust the width of the film etc. 20, the pair of forming plates 12 can be moved left and right. An operating rod 13 is connected to the outer surface of the forming plate 12. Then, this operating rod 13 is extended outside the die body 1, and this protruding end can be operated. The forming plate 12 is moved left and right by Adjusting the width.

【0007】 又、リップランド部8のシール用ロッド14はフォーミングプレート12と同 様に一端はダイ本体1の外に延長されており、フォーミングプレート12と共に 左右動してリップランド部8の幅を調節するものである。[0007] Also, the sealing rod 14 of the lip land portion 8 is the same as the forming plate 12. Similarly, one end is extended outside the die body 1, and together with the forming plate 12, The width of the lip land portion 8 is adjusted by moving left and right.

【0008】 この装置において、溶融樹脂は中央部の供給管15から供給され、図4の矢印 のようにマニホールド2で面状通路3の全幅に拡幅され、フォーミングプレート 12及びシール用ロッド14で両端が規制されてフィルム等20に成形される。[0008] In this device, the molten resin is supplied from the central supply pipe 15, and the arrow shown in FIG. As shown in the figure, the width of the planar passage 3 is widened by the manifold 2, and the forming plate is Both ends are regulated by 12 and a sealing rod 14 and formed into a film or the like 20.

【0009】 この場合、Tダイの部分的な冷却のために温度むらが発生してフィルム等20 の厚さむらを発生させないために図2の温度管理機構の構成図に示すように、ダ イ本体1では本体ヒーター16により、リップランド部8ではリップヒーター1 7により所定の温度分布になるように温度設定器18で温度分布を設定し、温度 調節器19により各本体ヒーター16及びリップヒーター17の温度を調節して いる。[0009] In this case, temperature unevenness occurs due to partial cooling of the T-die, and the film, etc. In order to prevent unevenness in the thickness of the The body heater 16 is used in the main body 1, and the lip heater 1 is used in the lip land portion 8. 7, set the temperature distribution with the temperature setting device 18 so that the predetermined temperature distribution is achieved, and set the temperature. The temperature of each main body heater 16 and lip heater 17 is adjusted by the regulator 19. There is.

【0010】 この調節は一般には温度検出器22として熱電対が使用されており、この熱電 対が各温度管理領域毎にダイ本体1に穿孔された温度検出孔23の奥(底)まで 挿入されて、各時点の温度を検出電圧に変換して温度調節器19に入力し、この 温度調節器19は温度設定器18で設定されている各温度管理領域の設定温度と 比較して、誤差が零となるように本体ヒーター16及びリップヒーター17を調 節している。0010 Generally, a thermocouple is used as the temperature sensor 22 for this adjustment. The pair reaches the back (bottom) of the temperature detection hole 23 drilled in the die body 1 for each temperature control area. is inserted, converts the temperature at each point into a detection voltage and inputs it to the temperature controller 19, and this The temperature controller 19 adjusts the set temperature of each temperature control area set by the temperature setting device 18. By comparison, adjust the main body heater 16 and lip heater 17 so that the error is zero. It is knotted.

【0011】[0011]

【考案が解決しようとする課題】[Problem that the idea aims to solve]

上述の温度管理は温度検出器22は特性が劣化していないこと、及び所定の温 度検出孔23の奥まで完全に挿入されていることが絶対に必要である。 The above-mentioned temperature management is performed to ensure that the characteristics of the temperature detector 22 are not deteriorated and that the temperature is maintained at a predetermined temperature. It is absolutely necessary that the sensor be completely inserted into the depth detection hole 23.

【0012】 しかし、温度検出器22に使用している熱電対は特性が経時変化して劣化する ことが普通であり、又温度検出孔23の奥まで挿入されているか否かは目視では 不可能である。0012 However, the characteristics of the thermocouple used in the temperature detector 22 change over time and deteriorate. This is normal, and it is not possible to visually check whether it is inserted all the way into the temperature detection hole 23. It's impossible.

【0013】 本考案は上述の問題を解決して、目視不可能な温度検出器22の状態を目視可 能な状態に変換して監視し、フィルム等20の厚さむらを防止可能なTダイを提 供することを課題とする。[0013] The present invention solves the above-mentioned problems and makes it possible to visually check the status of the temperature sensor 22, which is invisible to the naked eye. We offer a T-die that can be converted into a functional state and monitored to prevent thickness unevenness in films, etc. The challenge is to provide

【0014】[0014]

【課題を解決するための手段】[Means to solve the problem]

上述の課題を解決するために、合成樹脂成形装置で、溶融樹脂圧送装置から圧 送された溶融樹脂を受け入れるためにダイ本体1の中央部に設けられた供給管1 5の先端側で一直線方向に延びるマニホールド2と、このマニホールド2の下側 の全幅に連設している面状通路3と、この面状通路3の下端に設けられたリップ ランド部8よりなるTダイにおいて、前記ダイ本体1の温度管理が前記マニホー ルド2の方向の複数の温度管理領域に分割され、それぞれの温度管理領域に本体 ヒーター16、温度検出器22、温度設定器18、及び温度調節器19とが設け られており、前記温度設定器18の設定値と前記温度検出器22の検出値とを前 記各温度管理領域ごとに表示する表示器21を設けたものである。 In order to solve the above-mentioned problems, in synthetic resin molding equipment, pressure is removed from molten resin pumping equipment. A supply pipe 1 provided in the center of the die body 1 to receive the sent molten resin. A manifold 2 extending in a straight line on the tip side of 5 and the lower side of this manifold 2 A planar passage 3 connected to the entire width of the planar passage 3, and a lip provided at the lower end of this planar passage 3. In a T die consisting of a land portion 8, the temperature of the die body 1 is controlled by the manifold. The main unit is divided into multiple temperature control areas in the direction of LED 2. A heater 16, a temperature detector 22, a temperature setting device 18, and a temperature controller 19 are provided. The set value of the temperature setting device 18 and the detected value of the temperature detector 22 are A display 21 is provided to display information for each temperature management area.

【0015】 なお、前記温度設定器18、温度調節器19及び表示器21は1組とし、各温 度管理領域の本体ヒーター16及びリップヒーター17を一定時間毎に順次切替 え接続して温度管理を行うように構成したものもある。[0015] Note that the temperature setting device 18, temperature controller 19, and display device 21 are one set, and each temperature The main body heater 16 and lip heater 17 in the temperature control area are switched sequentially at regular intervals. Some devices are configured to be connected to a remote control to control temperature.

【0016】[0016]

【実施例】【Example】

図1は本考案のTダイの温度管理機構の構成図である。この構成は図2の従来 の構成のほかに、温度検出器22の検出電圧(温度調節器19の検出器側入力) と温度設定器18の設定電圧(温度調節器19の設定側入力)とを表示する表示 器21を設けたものである。 FIG. 1 is a configuration diagram of the T-die temperature control mechanism of the present invention. This configuration is the conventional configuration shown in Figure 2. In addition to the configuration, the detection voltage of the temperature detector 22 (detector side input of the temperature controller 19) and the setting voltage of the temperature setting device 18 (the setting side input of the temperature controller 19). A container 21 is provided.

【0017】 上述の温度検出は例えば熱電対によると、使用する熱電対の規格により温度と 出力電圧との間に一定の相関関係がある。この相関関係に基づき所定の温度にな るように温度設定器18から設定電圧として温度調節器19に入力しておく。[0017] For example, the above-mentioned temperature detection is performed using a thermocouple. Depending on the standard of the thermocouple used, the temperature and There is a certain correlation with the output voltage. Based on this correlation, a given temperature is reached. The voltage is input from the temperature setting device 18 to the temperature controller 19 as a set voltage so that the voltage is set.

【0018】 一方、温度検出器22からは、その検出電圧が温度調節器19に入力されてい るので、これら設定電圧と検出電圧とが一致している場合には各温度管理領域が それぞれ所定温度に管理されていることになる。[0018] On the other hand, the detected voltage from the temperature detector 22 is input to the temperature controller 19. Therefore, if these set voltages and detection voltages match, each temperature control area is Each temperature is controlled to a predetermined temperature.

【0019】 これらの設定電圧と検出電圧を表示器21で表示しておくことにより、両電圧 が一致している場合は温度管理が順調に行われているものであるが、不一致の場 合(殆どは検出電圧が低くなる)は温度管理が不調であり、検出電圧が低い場合 には温度調節器19は温度を上げる方向に動作する。この結果、Tダイの温度は 設定温度より高くなってしまう。[0019] By displaying these set voltage and detection voltage on the display 21, both voltages can be If they match, temperature control is being performed smoothly; however, if they do not match, If the detection voltage is low (in most cases the detection voltage is low), the temperature control is poor, and the detection voltage is low. In this case, the temperature regulator 19 operates to raise the temperature. As a result, the temperature of the T-die is The temperature becomes higher than the set temperature.

【0020】 このような場合、上述のようにTダイの全幅が複数の温度管理領域に別れてい るので、この温度管理領域のうちの一個所又は数個所に上記の温度管理の不調個 所が発生すると、全体の温度分布が乱れ、結果として押出されるフィルム等20 の厚さむらとなってしまう。[0020] In such a case, the entire width of the T-die is divided into multiple temperature control areas as described above. Therefore, if one or several of these temperature control areas have the above temperature control problems, If this happens, the overall temperature distribution will be disturbed, resulting in the extruded film etc.20 This results in uneven thickness.

【0021】 この原因としての上述のような目視不可能な熱電対の劣化、温度検出孔23へ の挿入不完全の状態を発見出来、交換又は挿入し直し等の処置が可能となる。[0021] The cause of this is the invisible deterioration of the thermocouple as described above, and the temperature detection hole 23. It is possible to detect incomplete insertion and take measures such as replacement or re-insertion.

【0022】 なお、温度設定器18、温度調節器19及び表示器21は1組とし、各温度管 理領域の本体ヒーター16及びリップヒーター17を一定時間毎に順次切替え接 続して温度管理を行うように構成しても良いことは勿論である。[0022] Note that the temperature setting device 18, temperature controller 19, and display device 21 are one set, and each temperature tube The main body heater 16 and lip heater 17 in the control area are switched and connected sequentially at regular intervals. Of course, it is also possible to configure the system so that temperature management is performed subsequently.

【0023】[0023]

【考案の効果】[Effect of the idea]

上述のように、目視不可能な温度検出器としての熱電対の劣化や熱電対の挿入 不完全による温度調節の不調が防止出来、この結果、温度むらによるフィルム等 の厚さむらを防止することが可能である。 As mentioned above, deterioration of thermocouples and insertion of thermocouples as invisible temperature detectors Malfunctions in temperature control due to imperfections can be prevented, and as a result, film etc. due to temperature unevenness can be prevented. It is possible to prevent thickness unevenness.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本考案のTダイの温度管理機構の構成図であ
る。
FIG. 1 is a configuration diagram of a T-die temperature control mechanism of the present invention.

【図2】従来のTダイの温度管理機構の構成図である。FIG. 2 is a configuration diagram of a conventional T-die temperature control mechanism.

【図3】フィルム等の成形装置の従来の一般的なTダイ
の断面図である。
FIG. 3 is a cross-sectional view of a conventional general T-die for forming equipment for films and the like.

【図4】図3のA−A断面図である。FIG. 4 is a sectional view taken along line AA in FIG. 3;

【符号の説明】[Explanation of symbols]

1 ダイ本体 2 マニホールド 3 面状通路 4 リップ 5 リップ 8 リップランド部 15 供給管 16 本体ヒーター 17 リップヒーター 18 温度設定器 19 温度調節器 21 表示器 22 温度検出器 23 温度検出孔 1 Die body 2 Manifold 3 Planar passage 4 Lip 5 Lip 8 Ripland section 15 Supply pipe 16 Body heater 17 Lip heater 18 Temperature setting device 19 Temperature controller 21 Display 22 Temperature detector 23 Temperature detection hole

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 合成樹脂成形装置で、溶融樹脂圧送装置
から圧送された溶融樹脂を受け入れるためにダイ本体の
中央部に設けられた供給管の先端側で一直線方向に延び
るマニホールドと、このマニホールドの下側の全幅に連
設している面状通路と、この面状通路の下端に設けられ
たリップランド部よりなるTダイにおいて、前記ダイ本
体の温度管理が前記マニホールドの方向の複数の温度管
理領域に分割され、それぞれの温度管理領域に本体ヒー
ター、温度検出器、温度設定器、及び温度調節器とが設
けられており、前記温度設定器の設定値と前記温度検出
器の検出値とを前記各温度管理領域ごとに表示する表示
器を設けたことを特徴とするTダイ。
Claim 1: A synthetic resin molding device comprising: a manifold extending in a straight line at the tip side of a supply pipe provided in the center of a die body to receive molten resin pumped from a molten resin pumping device; In a T-die consisting of a planar passage continuous to the entire width of the lower side and a lip land section provided at the lower end of the planar passage, the temperature control of the die body is performed by a plurality of temperature controls in the direction of the manifold. Each temperature control area is provided with a main body heater, a temperature detector, a temperature setter, and a temperature controller, and the set value of the temperature setter and the detected value of the temperature detector are A T-die characterized in that a display device is provided to display each of the temperature control areas.
【請求項2】 前記温度設定器、温度調節器及び表示器
は1組とし、各温度管理領域の本体ヒーター及びリップ
ヒーターに一定時間毎に順次切替え接続して温度管理を
行うように構成したことを特徴とする請求項1記載のT
ダイ。
2. The temperature setting device, the temperature controller, and the display device are configured as one set, and the temperature control is performed by sequentially switching and connecting the main body heater and lip heater of each temperature control area at fixed time intervals. T according to claim 1, characterized in that
Thailand.
JP1991023038U 1991-04-09 1991-04-09 T-die Pending JPH04120013U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991023038U JPH04120013U (en) 1991-04-09 1991-04-09 T-die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991023038U JPH04120013U (en) 1991-04-09 1991-04-09 T-die

Publications (1)

Publication Number Publication Date
JPH04120013U true JPH04120013U (en) 1992-10-27

Family

ID=31908383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991023038U Pending JPH04120013U (en) 1991-04-09 1991-04-09 T-die

Country Status (1)

Country Link
JP (1) JPH04120013U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3087216B2 (en) * 1996-11-20 2000-09-11 宏 五十嵐 Sound insulation materials for building construction

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3087216B2 (en) * 1996-11-20 2000-09-11 宏 五十嵐 Sound insulation materials for building construction

Similar Documents

Publication Publication Date Title
EP2753999B1 (en) Method for operating and/or monitoring an hvac system
US3341388A (en) Method and apparatus for the uniform extruding of thermoplastic film
JP2002096370A (en) Mouthpiece, sheet, and apparatus and method for manufacturing the sheet
WO2000037895A1 (en) Method and sensor for measuring a mass flow
EP1936288A2 (en) Method and system for detecting the hydraulic balance of a heating system
US5261481A (en) Method of determining setback for HVAC system
CH705804A1 (en) Method for regulating the room temperature in a room or a group of several rooms and a device for carrying out the method.
DE112014007068T5 (en) Air conditioning control system, connection device and air conditioning control method
CN109059224A (en) Control method, device and the apparatus of air conditioning of the apparatus of air conditioning
JPH04120013U (en) T-die
DE102012005950A1 (en) Method for controlling a fan
DE102014102275B4 (en) Method for regulating a heating and / or air conditioning system and heating and / or air conditioning system for this purpose
JP5998697B2 (en) Extrusion die, extrusion system using the same, and extrusion method
CN108800470A (en) Control method, device and the apparatus of air conditioning of the apparatus of air conditioning
EP1074795B1 (en) Method for hydraulic calibrating a heating installation
DE112015002876B4 (en) LED drive current adjustment for irradiance step response output and system for driving one or more light emitting devices
EP2636959A1 (en) Heater control
US6607379B2 (en) Temperature control method in hot pressing
DE102017218139A1 (en) Method for operating a heating system
WO1998057244A3 (en) Method and apparatus for power output control and correction
DE3110233C2 (en) Electronic temperature control for heating systems
JPS63167684A (en) Control circuit for piezoelectric actuator
JPH07329147A (en) Cap gap adjusting method and cap
DE10393047T5 (en) Expected temperature control for a heat transfer coating
DE102008021560B4 (en) Manufacturing apparatus and method for treating a mat-shaped material layer