JPH04115173A - Method and apparatus for testing connection state of electronic part - Google Patents

Abstract

PURPOSE:To test the invisible connection part of an electronic part without destructing the electronic part by applying different voltages to the electronic part of a mounting substrate for a short time and measuring respective current values. CONSTITUTION:A voltage setting part 1 sets applied voltage and a voltage applying time and a voltage generating part 2 generates the voltage indicated by the voltage setting part 1. When the indicated voltage is applied, a current passes through a connection pattern from a measuring terminal 5 to flow to a measuring terminal 6 through a resistor. When the applied voltage is low, no current flows to an NPN transistor. The current flowing to the terminal 6 is measured by a current measuring part 4 and, when a predetermined current flows, the connection state of the output line of an OR gate can be confirmed. Next, when higher voltage is set in the same way to carry out measurement, a current flows in the same way but, since applied voltage is high, an NPN junction becomes a continuity state and a current is measured by the current measuring part 4 to make it possible to confirm the connection state of an input line. By this method, the invisible connection part of the electronic part can be tested without destructing the connection part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for testing the connection state of electronic components on a mounting board on which electronic components are mounted, and an apparatus for implementing this testing method.

[Conventional technology]

Conventionally, this type of test method puts the mounted board in operation state, applies a test pattern, compares the output pattern from the mounted board with the expected value pattern, and evaluates the connection status of electronic components mounted on the mounted board, such as soldering. Next, we test the open and shorted states of parts and board patterns. The connection status was also visually tested.

[Problem to be solved by the invention]

In the conventional test method described above, the detection power of the test pattern 7 is used to test the connection part using the detection power of the test pattern. There was a problem in that the deterioration made it difficult to test the connection parts. In addition, with the increase in the degree of integration of mounting boards and the emergence of surface mounting technology, the problem of not being able to visually test the connection status has arisen due to the structure in which it is impossible to visually see the connection parts. there were.

[Means to solve the problem]

The method for testing the connection state of electronic components according to the present invention includes a voltage setting section that can set the applied voltage and application time, a voltage generating section that generates the voltage specified by this voltage setting section, and switching the polarity of the applied voltage. It has a polarity switching section and a current measurement section that measures the current flowing through the test object, and destroys the shimiko parts by applying different voltages to the test object for a short time and measuring the respective current values. This is a book that allows you to take the exam without having to worry about it.

In addition, another test device of the present invention for testing the connection state of electronic components using the BAK is provided with a voltage application measuring section using the above test method, two stages with gloves that directly contact the measurement point of the test object, and the above-described an X-Y table for moving the test object;
The apparatus is equipped with a control section that controls these voltage application and measurement sections, two stages with gloves, and an XY table.

[Effect]

In the present invention, different voltages are applied to electronic components on a mounting board for a full time period, and the respective current values are measured.

〔Example〕

Embodiments of the present invention will be described in detail below based on the drawings.

FIG. 1 is a ninth block diagram illustrating an embodiment of the method for testing the connection state of electronic components according to the present invention.

In FIG. 1, 1 is a voltage setting section that can set the applied voltage and application time, 2 is a voltage generation section that generates the voltage specified by this voltage setting section 1, and 3 is a polarity switching section that switches the polarity of the applied voltage. , 4 is a current measuring section that measures the current flowing through the test object, and 5 and 6 are measurement terminals connected to the test object.

The device is configured to apply different voltages to the test object for a short period of time and measure the respective current values to perform the test without destroying the electronic components.

FIGS. 2 and 3 are circuit configuration diagrams showing an example of the configuration of a test object for explaining the present invention.

In FIGS. 2 and 3, the same reference numerals as in FIG. 1 indicate corresponding parts. In FIG. Connection pattern 9 has a resistor R1, and ECL
The OR gate T, 8 and the connection pattern 9 are represented by an equivalent circuit 14 shown in FIG. 15 is GND.

The equivalent circuit 14 shown in FIG.
NPN) transistor 12CTz), resistor 10 (R+), and OR gate 8 NPN) transistor 13 (T+), resistor l1 (R2), and other circuits.

Next, the operation of the embodiment shown in FIG. 1 will be explained with reference to FIGS. 2 and 3.

First, connect the measurement terminal 5 to the input part of the OR gate 8, connect the measurement terminal 6 to the GND 15, specify the stain pressure of 0.3V and the application time of 1 second from the voltage setting part 1, and set the voltage of 1 second from the voltage generation part 2. Generates a voltage of 0.3 cm per second. The polarity switching section 3 sets the measurement terminal 5 to a + (plus) potential and the measurement terminal 6 to a - (minus) potential.

When a voltage is applied, the current flows from the measurement terminal 5 through the connection pattern 9 and through the resistance 10 (T1) to the measurement terminal 6.
flows to Here, since the applied voltage is as low as 0°3V, N
PN) Current I'i does not flow toward transistor 13 (T+). The current flowing through the measurement terminal 6 is measured by the current measurement unit 4, and if a current of 0.3/(H, +Rz)A is flowing, it is possible to check the connection state of the output wire/of OR game) 7. .

Next, apply voltage 2. When measuring by setting OV and application time for 1 second, the current is similarly 2/ (Rt + R1)
A flows to OR gate 1, but because the applied voltage is high, NP
The PN junction of the N transistor 13 (T+) becomes conductive. Then, due to the conduction of this NPN transistor 13 (T+), the NPN transistor 1 in the OR gate 8
3 (T1), and further through the resistor 11 (R2), the current 2/R, A flows in the current measuring section 4 (2/(R
If the current of t+R, )+2/Rz) A can be measured, the connection state of the input line of the OR gate 8 can be confirmed.

FIG. 4 is a block diagram showing an embodiment of a test device for testing the connection state of electronic components according to the present invention.

In this FIG. 4, 16 is a test object, 17 is a voltage application measurement unit using the test method shown in FIG. X-Y table 20 for moving the test object 16
For example, it is a control section that controls the voltage application and measurement section 11, the two stages 18 with probes, and the XY table 19. One terminal of the voltage application and measurement section 17 is connected to the GND section 21 of the test object 16.

Next, the operation of the embodiment shown in FIG. 4 will be explained.

First, according to the instructions from the control section 20, the X-Y table 19
is moved to the measurement location within the test object 16.

Next, the two stages 18 with gloves are moved and the probe is connected to the measurement location. The control unit 20 applies a voltage to the voltage application and measurement unit 1T according to the above-described test method and measures the current,
Perform pass/fail judgment. When the measurement is completed, the control section 20 separates the probe of the two-stage gloved stage 18 from the measurement point, moves the XY table 19, and repeats the above operation in order to test the next measurement point.

〔Effect of the invention〕

As explained above, the present invention applies different voltages to electronic components on a mounting board for a short time and measures the respective current values, thereby connecting the electronic components that are invisible to the naked eye without destroying the electronic components. There are effects that can be tested.

[Brief explanation of the drawing]

FIG. 1 is a block diagram for explaining an embodiment of the method for testing the connection state of electronic components according to the present invention, and FIGS. 2 and 3 are circuit diagrams showing an example of the configuration of a test object used for explaining the present invention. FIG. 4 is a block diagram showing an embodiment of a test device for testing the connection state of electronic components according to the present invention. 1... Voltage setting section, 2... Voltage generating section, 3...
...Polarity switching section, 4...Current measurement section, 5.6...
・Measurement terminal, 16... Test object, 17... Voltage application measurement section, 18... Z stage with probe, 1
9. Cloudy 011X-Y table, 20...control unit. Figure 1

Claims (2)

[Claims] (1) A voltage setting section that can set the applied voltage and application time,
The voltage generating section generates the voltage specified by the voltage setting section, the polarity switching section switches the polarity of the applied voltage, and the current measuring section measures the current flowing through the test object. A method for testing the connection state of an electronic component, characterized in that the test is performed without destroying the electronic component by applying different voltages for a short period of time and measuring the respective current values. (2) A voltage application and measurement section using the test method according to claim 1, and a Z with a probe that directly contacts the measurement location of the test object.
A connection state of an electronic component characterized by comprising a stage, an X-Y table for moving the object under test, and a control section for controlling the voltage application and measurement section, the Z stage with a probe, and the X-Y table. test equipment.