JPH04114494A - Miniature electronic equipment and manufacture thereof - Google Patents
Miniature electronic equipment and manufacture thereofInfo
- Publication number
- JPH04114494A JPH04114494A JP2234276A JP23427690A JPH04114494A JP H04114494 A JPH04114494 A JP H04114494A JP 2234276 A JP2234276 A JP 2234276A JP 23427690 A JP23427690 A JP 23427690A JP H04114494 A JPH04114494 A JP H04114494A
- Authority
- JP
- Japan
- Prior art keywords
- silicone rubber
- case
- filled
- gaps
- solidified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 42
- 239000004945 silicone rubber Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000005484 gravity Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000007711 solidification Methods 0.000 abstract description 5
- 230000008023 solidification Effects 0.000 abstract description 5
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 239000005060 rubber Substances 0.000 abstract description 2
- 238000004880 explosion Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Transceivers (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、防爆構造を有する小型電子機器及びその製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a small electronic device having an explosion-proof structure and a method for manufacturing the same.
［従来の技術］
近年各種小型電子機器は、増々高機能化が図られ、マイ
クロコンピュータの採用と共に電気回路の高密度化、回
路の高電圧化がなされている。斯かる電子機器では、電
気回路で発生する火花、熱により引火性カスを引火させ
る虞れがある。[Prior Art] In recent years, various small electronic devices have become increasingly sophisticated, and with the adoption of microcomputers, the density of electric circuits has been increased and the voltage of the circuits has been increased. In such electronic devices, sparks and heat generated in the electric circuit may ignite flammable scum.
特に小型電子機器が、携帯用無線機の様に、種々の環境
条件で使用されるもので、使用環境が引火性ガス雰囲気
、或は引火性ガス雰囲気となる可能性のある場所となる
ものについては、該機器の回路が発生する火花、熱によ
り、周囲の引火性ガスに引火しない様な防爆構造である
ことが要求される。In particular, small electronic devices such as portable radios are used in various environmental conditions and are used in flammable gas atmospheres or in places where there is a possibility of flammable gas atmospheres. The equipment is required to have an explosion-proof construction so that the sparks and heat generated by the equipment's circuits will not ignite surrounding flammable gases.
従来の防爆構造としては、ケースを完全な気密構造とし
、且ケースの内圧を若干高くしていた。In the conventional explosion-proof structure, the case is completely airtight, and the internal pressure of the case is slightly increased.
［発明が解決しようとする課題］
然し乍ら、ケースを完全な気密構造とする防爆槽遣は、
一般に大型で高級機器に採用される方法であり、携帯用
無線機等の櫟に小型、軽量化部も低コストが要求される
ものには不向きである。又、ケース内部の空間にエポキ
シ樹脂を充填することも考えられるが、エポキシ樹脂等
の合成樹脂は硬化時に縮小する性質があり、この為精密
な電子機器に用いた場合には配線を切断することが考え
られ、製品の信頼性を考慮すると用いることができない
。[Problem to be solved by the invention] However, the explosion-proof tank system with a completely airtight case structure,
This method is generally adopted for large, high-end equipment, and is not suitable for portable radios and other devices that require a smaller size, lighter weight, and lower cost. It is also possible to fill the space inside the case with epoxy resin, but synthetic resins such as epoxy resin have the property of shrinking when cured, so when used in precision electronic equipment, it is necessary to cut the wiring. Therefore, it cannot be used considering the reliability of the product.
本発明は、斯かる実情に鑑み、簡便で而も安価な防爆構
造とした小型電子機器及びその製造方法を提供しようと
するものである。In view of the above circumstances, the present invention aims to provide a small electronic device having a simple yet inexpensive explosion-proof structure and a method for manufacturing the same.
［課題を解決する為の手段］
本発明は、ケース内部の空隙に２液混合固化型シリコン
ゴムを充填したことを特徴とし、又シリコンゴムの充填
は、低粘度のシリコンゴムを自然落下によって行う。[Means for Solving the Problems] The present invention is characterized in that the void inside the case is filled with a two-component solidified silicone rubber, and the silicone rubber is filled by letting low-viscosity silicone rubber fall naturally. .
［作 用コ
ケース内部の空隙にシリコンゴムを充填することで、防
爆機能を具備する。又、低粘度の液状シリコンゴムを自
然落下により注入充填するので、シリコンゴムは狭小な
隙間に遥完全に充填される。[Operation] Explosion-proof function is provided by filling the void inside the co-case with silicone rubber. Furthermore, since the low-viscosity liquid silicone rubber is injected and filled by gravity, the silicone rubber can be completely filled into the narrow gap.
［実 施 例］ 以下、図面を参照しつつ本発明の一実施例を説明する。[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図〜第５図は、本発明を携帯用小型無線機に実施し
た場合を示している。1 to 5 show the case where the present invention is implemented in a small portable radio device.
この携帯用小型無線機のケース１は表パネル２、裏パネ
ル３の２分割構成であり、両パネル２．３にはそれぞれ
、電子部品が実装された配線基板４，５が取付けられて
いる。A case 1 of this portable small radio device has a two-part structure including a front panel 2 and a back panel 3, and wiring boards 4 and 5 on which electronic components are mounted are attached to both panels 2.3, respectively.
表パネル２側の配線基板４には、ブツシュスイッチユニ
ット６が取付けられ、該ブツシュスイッチユニット６の
各ブツシュ部７は前記表パネル２を貫通して突出してい
る。又、裏パネル３例の配線基板５にはシールドカバー
８が固着されている。A bushing switch unit 6 is attached to the wiring board 4 on the front panel 2 side, and each bushing portion 7 of the bushing switch unit 6 penetrates through the front panel 2 and projects. Further, a shield cover 8 is fixed to the wiring board 5 of the three back panels.
ケース１の上面には、アンテナ９、押釦スイッチ１０、
コネクタ１１が取付けられ、該コネクタ１１は接続ユニ
ット１２を介して表側配線基板４に接続されている。又
、ケース１の側面には、可変抵抗１３の音量調整用のス
ライドスイッチ１４が設けられる。On the top surface of the case 1, an antenna 9, a push button switch 10,
A connector 11 is attached, and the connector 11 is connected to the front side wiring board 4 via a connection unit 12. Further, a slide switch 14 for adjusting the volume of the variable resistor 13 is provided on the side surface of the case 1.
本実施例の小型無線機では、防爆対策としてケース１内
の空間、間隙に液状シリコンゴム１５１６、１７．１８
を充填し、その後固化させる。In the small radio device of this embodiment, liquid silicone rubber 1516, 17.
is filled and then solidified.
斯かる充填に用いられるシリコンゴム１５，１６゜１７
、１８は、固化時に体積変化のない２液混合固化型のも
のを使用し、且狭小な隙間にも充分浸透してゆく機、低
粘度（例えば２０ ｐｏｉｓｅ）のものが採用される。Silicone rubber used for such filling15,16゜17
, 18 uses a two-liquid mixing solidification type that does not change in volume during solidification, and has a low viscosity (for example, 20 poise) that can sufficiently penetrate into narrow gaps.
又、充填時に空気が、封込められにくい機、更に空気が
封込められた場合にも逃げ易い様、時間を掛けて充填し
、又充分な固化時間を与える。Also, during filling, it is difficult for air to be trapped, and even if air is trapped, it is easy to escape, so the filling takes time and sufficient solidification time is given.
ここで、充填の方法として好ましくは、ノズル等を用い
注入時に圧力を掛けることなく重力の自然落下によるも
のとする。自然落下による注入とすれば、注入された液
状シリコンゴムが浸透して行く速度と注入速度とのマツ
チングかとれ、完全に密な状態の充填か行える。Preferably, the filling method is to use a nozzle or the like and allow gravity to naturally fall without applying pressure during injection. If the injection is performed by gravity, the rate at which the injected liquid silicone rubber permeates and the injection rate are matched, and a completely dense filling can be achieved.
而して、シリコンゴムが固化した状態では、ケース１内
の空隙はシリコンゴムによって完全に充填され、外気と
電気回路の火花発生箇所、発熱部とが遮断され、外気が
引火性カス雰囲気であっても、電気回路に起因して引火
することはない。When the silicone rubber is solidified, the void inside the case 1 is completely filled with the silicone rubber, and the outside air is cut off from the spark generation point and the heat generating part of the electric circuit, and the outside air becomes a flammable gas atmosphere. However, the electrical circuit will not cause a fire.
尚、発熱部の熱はシリコンゴムにより拡散されるが、熱
拡散をより効果的に行う為、熱伝導性に優れた酸化アル
ミナの粉等をシリコンゴムに混合してもよい。Note that the heat from the heat generating portion is diffused by the silicone rubber, but in order to more effectively diffuse the heat, alumina oxide powder or the like having excellent thermal conductivity may be mixed with the silicone rubber.
前記した様に２液温合型のシリコンゴムは体積変化がな
いので、固化した状態で局部的な歪、該歪による残留応
力が発生することがなく、従って、微細な配線パターン
、リード線等を切断することがない、更に、シリコンゴ
ムは固化状態で高弾性であるので、例え歪を生じてもシ
リコンゴム自体の変形により吸収し、配線パターン、リ
ード線等の切断に到ることはない。As mentioned above, since the two-component heating type silicone rubber does not change in volume, it does not generate local distortion or residual stress due to the distortion in the solidified state, so it can be used for fine wiring patterns, lead wires, etc. Furthermore, since silicone rubber is highly elastic in its solidified state, even if distortion occurs, it will be absorbed by the deformation of the silicone rubber itself, and wiring patterns, lead wires, etc. will not be cut. .
次に、第６図（Ａ）〜（Ｄ）に於いて、シリコンゴムの
充填方法について説明する。Next, a method of filling silicone rubber will be explained with reference to FIGS. 6(A) to 6(D).
（１）電子部品か実装された基板４，５について準備処
理を行う。(1) Preparation processing is performed on the boards 4 and 5 on which electronic components are mounted.
接点部かあれは、導電性を損わないベース１〜状物、例
えばシリコングリスを接点部に盛付け、又、シールドカ
バー８の内部等、液状シリコンゴムの浸透し難い部分に
、予め液状シリコンゴム１５を充填する（第６図（Ａ）
）。For the contact portions, apply a base 1-like material that does not impair conductivity, such as silicone grease, to the contact portions, and apply liquid silicone to areas where liquid silicone rubber is difficult to penetrate, such as the inside of the shield cover 8. Filling with rubber 15 (Fig. 6 (A)
).
（２）表パネル２にブツシュスイッチユニット６を取付
け、上記準備処理が完了し、シリコンゴムか固化した配
線基板４，５をそれぞれ、表パネル２、裏パネル３に固
着する。各パネル２３にアンテナ９、押釦スイッチ１０
、コネクタ１１、スライドスイッチ１４等の部品を取付
け、各部品の貫通部、可動部に充填する液状シリコンゴ
ムが侵入しない様、粘度の高いシリコンゴム（図示せず
）を必要箭所に塗布し固化させる。(2) The bushing switch unit 6 is attached to the front panel 2, and the above preparation process is completed, and the wiring boards 4 and 5 made of silicone rubber are fixed to the front panel 2 and the back panel 3, respectively. Antenna 9 and push button switch 10 on each panel 23
, connector 11, slide switch 14, etc., and apply high viscosity silicone rubber (not shown) to the necessary places and harden it to prevent the liquid silicone rubber filled into the penetrating parts and movable parts of each part from entering. let
（３）次に、表パネル２、裏パネル３と配線基板４．５
との間に液状シリコンゴム１６，１７を充填させる（第
６図（Ｂ）、第６図（Ｃ））。(3) Next, the front panel 2, back panel 3 and wiring board 4.5
Liquid silicone rubber 16, 17 is filled between the two (FIGS. 6(B) and 6(C)).
この時の液状シリコンゴム７６、Ｔ７の充填状態は、前
述した櫟に自由落下によるものとする。At this time, the filling state of the liquid silicone rubber 76 and T7 is such that it falls freely into the above-mentioned cage.
（４）表パネル２、裏パネル３に充填したシリコンゴム
１６，１７が固化したところで、表パネル２と裏パネル
３とを合体させる。(4) When the silicone rubbers 16 and 17 filled in the front panel 2 and the back panel 3 are solidified, the front panel 2 and the back panel 3 are combined.
裏パネル３の底面にはシリコンゴム注入用の孔１９が用
意されており、鎖孔１９よりケース１の内部にシリコン
ゴム１８を注入するぐ第６図（Ｄ＞）。A hole 19 for silicone rubber injection is provided on the bottom of the back panel 3, and the silicone rubber 18 is injected into the case 1 through the chain hole 19 as shown in FIG. 6 (D>).
完全にシリコンゴム１８を充填すると、前記孔１９を栓
等所要の手段で閉塞し、充分な時間を掛けて固化させる
。When the silicone rubber 18 is completely filled, the hole 19 is closed with a plug or other necessary means and allowed to solidify for a sufficient amount of time.
尚、完全に充填した後で固化時間を短縮したい場合は、
適宜加熱してもよい。In addition, if you want to shorten the solidification time after completely filling,
It may be heated as appropriate.
ス、２液温合型の液状シリコンゴムは２液の化合反応に
より固化するものであり、本実施例の様に深部に注入し
た場合でも、シリコンゴムが固化しにくいということは
ない。The two-component heating type liquid silicone rubber solidifies by a combination reaction of the two components, and even when injected deep as in this example, the silicone rubber does not have difficulty solidifying.
［発明の効果コ
以上述べた如く、本発明によれば、電子機器内部にシリ
コンゴムを充填したという簡単な構造で、防爆性能を満
足させ得、而も充填時に電子機器の電気回路、電気配線
、電子部品等を損傷させることがないという優れた効果
を発揮する。[Effects of the Invention] As described above, according to the present invention, explosion-proof performance can be satisfied with a simple structure in which the inside of an electronic device is filled with silicone rubber. , it exhibits an excellent effect of not damaging electronic components, etc.
第１図は本発明の一実施例に係る携帯用小型無線機の正
面図、第２図は同前左側面図、第３図は同前平面図、第
４図は同前底面図、第５図は側断面図、第６図（Ａ）〜
（Ｄ）はシリコンゴム充填手順を示す図である。
１はケース、２は表パネル、３は裏パネル、１５１６↑
７，１８はシリコンゴムを示す。FIG. 1 is a front view of a small portable radio according to an embodiment of the present invention, FIG. 2 is a left side view of the same, FIG. 3 is a plan view of the front, and FIG. 4 is a bottom view of the same. Figure 5 is a side sectional view, Figure 6 (A) -
(D) is a diagram showing a silicone rubber filling procedure. 1 is the case, 2 is the front panel, 3 is the back panel, 1516↑
7 and 18 indicate silicone rubber.
Claims (1)
充填したことを特徴とする小型電子機器。 ２）ケース内部の空間に低粘度の２液混合固化型シリコ
ンゴムを自然落下により注入充填することを特徴とする
小型電子機器の製造方法。 ３）ケースが表パネル、裏パネルから成り、表パネル、
裏パネルを合体させる前、表パネル、裏パネルそれぞれ
の空隙にシリコンゴムを充填させて固化させ、次に表パ
ネル、裏パネルを合体させた後、残る空隙にシリコンゴ
ムを充填させる請求項第２項記載の小型電子機器の製造
方法。[Claims] 1) A small electronic device characterized in that a gap inside a case is filled with a two-component solidified silicone rubber. 2) A method for manufacturing a small electronic device, characterized in that a low viscosity two-component solidified silicone rubber is injected and filled into the space inside the case by gravity. 3) The case consists of a front panel and a back panel.
Claim 2: Before the back panels are combined, silicone rubber is filled into the gaps between the front panel and the back panel and allowed to solidify, and then after the front and back panels are combined, the remaining gaps are filled with silicone rubber. A method for manufacturing a small electronic device as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2234276A JPH0728144B2 (en) | 1990-09-04 | 1990-09-04 | Manufacturing method for small electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2234276A JPH0728144B2 (en) | 1990-09-04 | 1990-09-04 | Manufacturing method for small electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04114494A true JPH04114494A (en) | 1992-04-15 |
| JPH0728144B2 JPH0728144B2 (en) | 1995-03-29 |
Family
ID=16968435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2234276A Expired - Fee Related JPH0728144B2 (en) | 1990-09-04 | 1990-09-04 | Manufacturing method for small electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728144B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005101931A1 (en) * | 2004-04-15 | 2005-10-27 | Mitsubishi Denki Kabushiki Kaisha | Surface mounted component mounting structure |
| JP2010154708A (en) * | 2008-12-26 | 2010-07-08 | Kenwood Corp | Filling structure of filler of explosion-proof wireless unit |
| JP2011040840A (en) * | 2009-08-07 | 2011-02-24 | Kenwood Corp | Explosion-proof radio equipment, and method of filling the explosion-proof radio equipment with filler |
| JP2012004814A (en) * | 2010-06-16 | 2012-01-05 | Nec Casio Mobile Communications Ltd | Electronic apparatus, and manufacturing method of the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58111397A (en) * | 1981-12-24 | 1983-07-02 | 日本電気株式会社 | Electronic circuit board sealing structure |
| JPS60237397A (en) * | 1984-05-11 | 1985-11-26 | ニチアス株式会社 | Gamma-ray shielding material, combustion resistance thereof is improved |
| JPS6412043A (en) * | 1987-07-06 | 1989-01-17 | Hitachi Ltd | Storing case for electronic circuit |
-
1990
- 1990-09-04 JP JP2234276A patent/JPH0728144B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58111397A (en) * | 1981-12-24 | 1983-07-02 | 日本電気株式会社 | Electronic circuit board sealing structure |
| JPS60237397A (en) * | 1984-05-11 | 1985-11-26 | ニチアス株式会社 | Gamma-ray shielding material, combustion resistance thereof is improved |
| JPS6412043A (en) * | 1987-07-06 | 1989-01-17 | Hitachi Ltd | Storing case for electronic circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005101931A1 (en) * | 2004-04-15 | 2005-10-27 | Mitsubishi Denki Kabushiki Kaisha | Surface mounted component mounting structure |
| JP2010154708A (en) * | 2008-12-26 | 2010-07-08 | Kenwood Corp | Filling structure of filler of explosion-proof wireless unit |
| JP2011040840A (en) * | 2009-08-07 | 2011-02-24 | Kenwood Corp | Explosion-proof radio equipment, and method of filling the explosion-proof radio equipment with filler |
| JP2012004814A (en) * | 2010-06-16 | 2012-01-05 | Nec Casio Mobile Communications Ltd | Electronic apparatus, and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0728144B2 (en) | 1995-03-29 |
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