JPH04113491U - Assembly structure of electronic equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To reduce the size and thickness of resin casings that house electronic components. [Structure] By replacing a part of the resin casing with a thin metal plate 9 and bringing it into direct contact with the heating element 7 mounted on the internal circuit board 3, it is possible to replace the conventional shield 6, heat sink 8, etc. The number of parts can be reduced, and since it is a metal plate, even if it is made thin, there will be no decrease in rigidity.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to an assembly structure of an electronic device, particularly a housing.

0002

[Conventional technology]

FIG. 3 is a cross-sectional view showing a conventional resin housing structure. In the figure, 1 is a case, 2 is a cover, 3 is a circuit board attached to case 1, and 4 is a cover for installing circuit board 3. 5 is the circuit component mounted on the circuit board 3, 6 is the shield cover, and 7 is the emitting screw. The heating element 8 is a heat sink for dissipating the heat of the heating element 7.

0003 Next, the effect will be explained. The circuit components 5 mounted on the circuit board 3 cause electromagnetic interference. It is covered with a metal shield cover 6 to prevent this. Also, from the heating element 7 The generated heat is transmitted to the heat sink plate 8 and dissipated, thereby preventing the heating element 7 from overheating. these The components are housed in a resin case 1 and cover 2.

0004

[Problem that the idea aims to solve]

Since the conventional electronic equipment is configured as described above, the height a of the circuit component 5 The height b of the shield cover 6 is determined, and the height b of the shield cover 6 and the cover The height d from the thickness c of the cover 2 to the outer surface of the cover 2 is determined. Therefore, the thickness of the resin casing There was a problem in that the height was limited to the height e shown in FIG. Also, case 1 and case Bar 2 is a resin molded product, so it needs to have an appropriate wall thickness. However, there are problems in that it becomes difficult to mold and the rigidity decreases, especially when it comes to molding. had the fatal problem that if there was a difference in wall thickness, molding would become impossible.

[0005] This idea was made to solve the above problems, and it has been widely used. It is an object of the present invention to obtain a casing structure that has a vertically thin wall portion and does not have a decrease in rigidity.

[0006]

[Means to solve the problem] The assembly structure of the electronic device according to this invention consists of a part of the casing made of a thin metal plate; This is brought into contact with a heating element mounted on a circuit board.

[0007] Further, an oval drawn portion is provided on the thin metal plate.

[0008]

[Effect]

In this idea, a part of the casing is made of thin metal plate, so that parts can be Along with the reduction, a wide range of thin-walled areas can be obtained, and the overall thickness of the casing can be made thinner. Sometimes, it prevents a decrease in rigidity.

[0009]

【Example】

An embodiment of this invention will be described below with reference to the drawings. In Figure 1, 1, 3, 4, 5, and 7 are the same as those in the conventional example. 2 is a ring shape having an opening 2a 9 is a cover of this cover 2 so as to close the opening 2a of this cover 2. It is a thin metal plate that is insert molded.

0010 Next, the operation of the above embodiment will be explained. Circuit components 5 mounted on circuit board 3 was conventionally covered by a shield cover, but in this invention, this is incorporated into cover 2. Since the insert-molded thin metal plate 9 is used instead, the number of parts can be reduced. Also, conventional The part that was made up of the resin cover 2 is now made up of a thin metal plate 9 that is thinner than the resin. Therefore, the thickness e of the housing can be reduced. Furthermore, due to the thinner wall thickness, Decrease in rigidity is prevented by using a metal plate. Furthermore, conventionally, heat sinks generate The heat was radiated by the heat plate 7, but since this is also replaced by the thin metal plate 9, the heat radiator is not needed. This makes it possible to reduce the number of parts. In other words, it is possible to reduce the thickness of the resin casing and prevent a decrease in rigidity. This simultaneously reduces the number of parts.

[0011] Figure 2 shows an example of a thin metal plate with a bent portion formed by drawing. Ru. The effect of this embodiment is that the drawing part 9a is made into an oval shape, so that the resin and The strain caused by the thermal stress of the metal plate is absorbed by the drawn portion 9a regardless of the direction. metal The effect of drawing on a plate is to compensate for the difference in linear expansion coefficient between resin and metal. The coefficient of linear expansion of resin and metal is This increases the degree of freedom in material selection without being constrained by differences in

0012

[Effect of the idea]

As described above, according to this invention, a part of the resin casing is made of a thin metal plate, and this By making the metal plate contact the heating element mounted inside, the number of parts can be reduced. In addition, it is thinner than before, and there is no risk of a decrease in rigidity.

[0013] In addition, by forming bent parts on thin metal plates by drawing, etc., we can accommodate differences in materials. This has the effect of escaping the expansion strain that occurs.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of this invention.

FIG. 2 is a plan view a of a thin metal plate according to another embodiment of the invention, and its AA cross section b and B-B cross section c.

FIG. 3 is a sectional view showing an assembled structure of a conventional electronic device.

[Explanation of symbols]

1 case 2 Cover 3 Circuit board 5 Circuit parts 7 Heating element 9 Thin metal plate 9a Bending section

Claims (2)

[Scope of utility model registration request] [Claim 1] A case made of resin, a circuit board attached to the case, a circuit component and a heating element mounted on the circuit board, and a case mounted so as to come into contact with the heating element and cover the opening of the case. Assembly structure of electronic equipment with thin metal plates. 2. The electronic device assembly structure according to claim 1, wherein the thin metal plate has an oval bent portion.