JPH0411309A - Manufacture of magnetic head - Google Patents

Abstract

PURPOSE:To minimize the size of a core half and to reduce inductance of the magnetic head by forming at least one of coils to be wound on the core halves by a thin film formation technique. CONSTITUTION:A magnetic film 5 as one core half is formed on a lower conductive body pattern 4 of a substrate 1 with an insulating film interposed, while another magnetic film 5 for the other core half is formed apart from the first core half. Then belt-like upper conductive layers 72 are repeatedly provided on the magnetic film 5 and lower conductive layer 44 to form an upper conductive stripe pattern 7. Thus, a coil conductor with the coil helically wound around the core half is formed. Then this substrate is cut to separate the two core halves, the cut edge surfaces are polished, and these core halves are joined into one body with interposing a gas spacer. By this method, all of the lower conductive pattern 4, insulating film 31, magnetic films 5, 51 and upper conductive pattern 7 are formed by a thin film formation technique, which realizes a small-sized magnetic head with low inductance.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a magnetic head installed in a magnetic recording/reproducing device such as a VTR, and particularly to a magnetic head in which a coil constituting a magnetic circuit is formed by thin film forming technology. The present invention relates to a manufacturing method.

(Prior Art) In recording and reproducing devices that perform high-density magnetic recording, such as high-definition VTRs, magnetic heads are used whose magnetic path is formed by a metal magnetic thin film (Japanese Patent Laid-Open No.
-232508 [G11B5/127]). The magnetic head includes a pair of head halves (100) as shown in FIG.
(101) are butted together via a gap spacer (102) and integrated by bonding glass parts (107) and (108), and each head half is made up of a non-magnetic substrate (103).
), a magnetic thin film of metal such as Fe-Al-5i and 5i0
A core half body (104) having a predetermined track width is formed by alternately laminating non-magnetic films such as No. (10
6) is fixed.

A coil window (109) is opened in one head half (100), and both head halves (100) are passed through the coil window.
A coil conducting wire (110) such as uremet wire is wound around (101).

(Problem to be solved) However, in high-definition VTRs, etc., the inductance of the magnetic head needs to be lowered, so the head halves and coil windows tend to become smaller. ) It is necessary to wind a conducting wire (110) having a diameter of about 20 to 30 μm around 20 turns. Therefore, this winding work has to be done manually.
Not only did the number of assembly steps increase, but there were also limits to miniaturization of the magnetic head.

An object of the present invention is to provide a method for manufacturing a magnetic head in which a coil can be formed using a thin film forming technique, and thereby to reduce the size and inductance of the magnetic head.

(Means for Solving the Problems) In the method for manufacturing a magnetic head according to the present invention, in a first step, at least one of a pair of core halves that should constitute a magnetic path is placed on a non-magnetic substrate (1). extending in a direction perpendicular to the magnetic path of the core half to the area where the core half is to be installed;
A strip-shaped lower conductor layer (44) longer than the width of the core half in the orthogonal direction is repeatedly provided at intervals in the magnetic path direction to form a striped lower conductor pattern (4). .

In the next second step, one of the conductor layers (44) is placed on the lower conductor pattern (4) of the substrate (1) at a position where both ends of each conductor layer (44) are exposed through an insulating film (31). While forming a magnetic film (5) that will become the core half, the magnetic film (5)
A magnetic film (51) that becomes the other core half is located away from the
form.

In the third step, a pair of adjacent lower conductor patterns are applied to the upper surface of the magnetic film (5) formed on the lower conductor pattern (4) and the lower conductor layer (44) protruding from both sides of the magnetic film. A strip-shaped upper conductor layer (72) connecting opposite ends of the conductor layer to each other is repeatedly provided via an insulating film (6) to form a striped upper conductor pattern (7). , a coil conductor (4) spirally wound around the core half by the upper and lower conductor patterns (4) (7).
0).

Furthermore, in the fourth step, the substrate (1) that has gone through the above steps is cut to separate both core halves to produce a pair of block halves (83) and (84) each having a core half.

In the fifth step, the cut surfaces of both the block halves (83) and (84) are polished to form abutting surfaces (85) and (86) in which the end surfaces of the core halves, which serve as gap forming surfaces, are exposed. A gap spacer (9) is placed between the abutting surfaces (85) and (86).
), the two block halves (83) and (84) are joined and integrated.

Thereafter, in a sixth step, the assembled body obtained through the fifth step is machined to produce a magnetic head chip.

(Function) In the above method for manufacturing a magnetic head, the lower conductor pattern (4) is formed in the first step, and the insulating film (4) is formed in the second step.
31) and the pair of magnetic films (5) (51), and the formation of the upper conductor pattern (7) in the third step are all performed by well-known thin film forming techniques.

Moreover, well-known glass bonding can be used to bond both block halves (83) and (84) in the fifth step.

(Effects of the Invention) According to the method for manufacturing a magnetic head according to the present invention, since the coil to be wound around at least one core half can be formed by thin film forming technology, it is possible to downsize the core half. The inductance of the magnetic head can be reduced.

(Examples) Examples are provided to explain the present invention, and should not be construed as limiting the invention described in the claims or reducing its scope.

FIG. 12 shows the structure of a magnetic head manufactured by a manufacturing method according to the present invention, which will be described later.
), a pair of core halves (8) (81) are placed abutting against each other via a magnetic gap (90), and a glass bonding layer ( A non-magnetic protection plate (13) is fixed via a (not shown).

A coil window (87) is provided in one of the core halves (8), and the C
A coil conductor (40) made of a thin film of U is spirally wound.

FIG. 13 shows a cross section of the magnetic head cut in a direction perpendicular to the longitudinal direction of the coil conductor (40).
The coil conductor (40) includes a lower conductor pattern (4) formed on a non-magnetic substrate (12) and an upper conductor pattern formed on the core half (8) via an insulating film (6). (7), an insulating film (31) is formed covering the lower conductor pattern (4), and an insulating film (6)
A sealing glass (14) for bonding is filled between the upper conductor pattern (7) and the protection plate (13).

The cross-sectional areas of the lower and upper conductor patterns (4) and (7) are each formed to be, for example, 50 μm 2 or more.

Hereinafter, a method for manufacturing the above magnetic head will be explained. In order to simplify the explanation, the steps to finally obtain one magnetic head will be illustrated and explained, but it is also possible to simultaneously manufacture a large number of magnetic heads through the same process. .

First, as shown in FIG. 1(a), on a nonmagnetic substrate (1),
As will be described later, magnetic thin films (2) and (20) are respectively formed in areas where a pair of core halves are to be installed at intervals by a thin film forming technique such as sputtering.

These magnetic thin films (2) (20) have long strip pattern parts (23) (2) in a direction perpendicular to the magnetic path of the core half.
4) are repeatedly formed at regular intervals in the direction of the magnetic path, and the front portions (21) (22) and the pattern portions (22) are formed on the head head side of these pattern portions (23) (24).
The back parts (25) and (26) are formed on the opposite side of the front part (21) of 23) and (24). Figure 1 (
As shown in b), grooves (27) are formed between the respective strip pattern parts (23) and (24).

On the wall surrounding the groove (27), there are
) An insulating film (3) made of 5i02 or the like is formed by vapor deposition or the like.

Next, as shown in FIGS. 3(a) and 3(b), lower conductor patterns (4) and (41) are formed by sputtering, etc., covering the insulating film (3), respectively, in the area where both core halves are to be installed. formed by One lower conductor pattern (4) covers the insulating film (3) and extends in the longitudinal direction of the insulating film, and further includes a plurality of band-shaped lower conductor layers (44) protruding to both sides of the insulating film; Back portion (25) of the magnetic thin film (2)
A terminal part (42) formed at the outer end of the lower conductor layer (44) along the other lower conductor layers (44)
) are respectively formed at the inner ends of the inverted-shaped connection parts (4
5).

The other lower conductor pattern (41) covers the insulating film (3) and extends in the longitudinal direction of the insulating film, and further includes a plurality of strip-shaped lower conductor layers (44) protruding to both sides of the insulating film. and a terminal portion (4) formed at the outer end of the lower conductive layer (44) along the back portion (26) of the magnetic thin film (20).
3), inverted-shaped connection portions (45) formed at the outer ends of the other plurality of lower conductor layers (44), and the front portion (22) of the magnetic thin film (20). A connecting portion (46) protruding from the inner end of the lower conductive layer (44) along
).

The terminal portions (42) and (43) are connected to an external circuit,
The coil will be energized.

Next, as shown in FIGS. 4(a) and 4(b), 5i
An insulating film (31) such as 02 is formed by vapor deposition or the like. As a result, the surface of the insulating film (31) and the strip pattern portion (
23) The surface of (24) will be aligned on the same plane.

As shown in FIGS. 5(a) and 5(b), the magnetic thin film (2) (
20) and the insulating film (31), a pair of magnetic films (5) and (51) to serve as the main core are formed into predetermined shapes by sputtering or the like.

Furthermore, as shown in FIGS. 6(a) and (b), magnetic films (5) (51)
An insulating film (6) (61) of SiO++ or the like is formed on the entire surface by vapor deposition or the like.

After that, the upper surfaces of the insulating films (6) and (61) and the magnetic film (5
) (51) to the ends of the lower conductor layer (44) protruding from both sides and the upper surface of the connecting portion (45), as shown in FIGS. 7(a) and (b).
Upper conductor patterns (7) and (71) are respectively formed as shown in FIG. These upper conductor patterns (7) (74) are arranged on the lower conductor layer (44) on the insulating films (6) (61), respectively.
) is provided with a strip-shaped upper conductive layer (72) repeatedly formed at intervals.

Each conductor layer (72) of one upper conductor pattern (7)
The inner end protrudes from the magnetic film (5) and overlaps the connection part (45) of the lower conductor pattern (4),
At the outer end of each conductor layer (72), a lower conductor layer (
Inverted-shaped connection part (73) that overlaps the outer edge of 44)
is installed protrudingly. Further, a connecting portion (74) is formed at the inner end of the upper conductive layer (72) closest to the front portion.

As a result, a first coil conductor portion is formed that is spirally wound around the magnetic film (5).

Further, the outer end of each upper conductor layer (72) of the other upper conductor pattern (71) protrudes from the magnetic film (51) and connects with the connecting portion (45) of the lower conductor pattern (41). While overlapping, at the inner end of each conductor layer (72),
An inverted-shaped connection portion (73) is formed that overlaps the inner end of the lower conductor layer (44).

As a result, a second coil conductor part is formed surrounding the magnetic film (51) and spirally wound in the opposite direction to the first coil conductor part.

As shown in FIG. 8, a non-magnetic protective plate (11) is placed on the pair of core halves (8) (81) formed through the above steps via a low melting point bonded glass (not shown). After fixing and producing the integral block (82) shown in FIG. 9, the block (82) is cut along the chain line in the figure to form a pair of core halves (8) and (81), respectively. Create half a block.

The cut surfaces of the block halves are polished to form an abutting surface (8) where the end surfaces of the core halves (8) and (81) are exposed as shown in FIG.
5) Form (8B). Both butt surfaces (85) (8
In step 6), gap spacers (9) made of 5i02 or the like are formed on the end surfaces (gap forming surfaces) of both core halves (8) (81), respectively. Further, on the end surface of the substrate of one block half (83), a conductive film (
91), and a conductive film (92) is formed on the end surface of the substrate of the other block half (84) by vapor deposition or the like in connection with the connecting portion (46).

After that, the two block halves (83) (84) are joined to the butt surface (
85) Join and integrate at (86). As a result, the conductive film (91) of one block half (83) and the conductive film (92) of the other block half (84) are brought into close contact with each other.
The connecting portion (74) of the upper conductive pattern (7) formed on the right magnetic film (5) and the lower conductive pattern (41) formed on the left magnetic film (51) shown in FIG. 7(a). ) are connected to each other via the conductive films (91) and (92), forming the coil conductor (40) shown in FIG.
will be formed.

In addition, to join and fix both block halves (83) (84), for example, as shown in FIG.
3) has a vertical glass groove (80) on the abutting surface (85).
) is recessed, and the abutting surface (
86) has glass grooves (89) (89) recessed along the end faces of the substrate (1) and protection (11), and with both block halves (83) (84) butted against each other, Glass bonding can be employed in which the glass grooves (80), (89), and (89) are filled with low melting point glass (80) for welding, respectively.

Finally, in the bonded body obtained through the glass bonding process,
Machining such as cutting and curved surface polishing is performed to complete a magnetic head chip as shown in FIG.

According to the above method for manufacturing a magnetic head, both core halves (8)
Since the coil conductor (40) to be wound around the magnetic head (81) can be formed by thin film forming technology, the magnetic head can be made smaller, and thereby the inductance can be lowered. Further, since most of the magnetic head manufacturing process is performed using thin film forming technology, production efficiency is improved compared to the conventional method.

In addition, in the magnetic head shown in FIG. 12 obtained through the above steps, the coil conductor (40) is wound in balance around both core halves (8) and (81), so that the head efficiency is improved. But it's excellent.

The above description of the embodiments is for illustrating the present invention, and should not be construed to limit or reduce the scope of the invention described in the claims.

Further, it goes without saying that the configuration of each part of the present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the technical scope of the claims.

For example, in the magnetic head manufacturing method described above, the coil conductor (40) is wound around both of the pair of core halves (8) and (81), but a similar thin film is formed only on one of the core halves. It is also possible to form the coil conductor in the process.

[Brief explanation of the drawing]

FIGS. 1(a) to 11 show a series of process diagrams showing a method for manufacturing a magnetic head according to the present invention, and FIGS. 1(a) and 11(b) respectively show the formation of a magnetic thin film on a substrate. 2(a) and 2(b) are respectively perspective views and sectional views of the state in which the insulating film is formed on the substrate, and FIG. 8(a) and (b) are respectively the lower conductor. FIGS. 4(a) and 4(b) are a perspective view and a sectional view of a state in which a pattern has been formed, and FIGS. 6(a) and 6(b) are perspective views and sectional views showing a state in which an insulating film is formed on a magnetic film, and FIG. 7(a) is a perspective view and a sectional view showing a state in which a magnetic film is formed. (b) is a perspective view and a sectional view of the upper conductor layer formed on the insulating film, FIG. 8 is a perspective view of the step of fixing the protective plate, FIG. 9 is a perspective view of the block, and FIG. 10 is a perspective view of a pair of block halves, FIG. 11 is a perspective view showing a process of joining the pair of block halves, FIG. 12 is a perspective view of a magnetic head manufactured by the manufacturing method according to the present invention, and FIG. 13 is a perspective view of a pair of block halves. 1 is a sectional view showing essential parts of the magnetic head, and FIG. 14 is a perspective view of a conventional magnetic head. (1)...Substrate (11)...Protection plate (3) (31)...Insulating film (5) (51)
...Magnetic film (4) (41)...Lower conductor pattern (7) (71)...Upper conductor pattern 9th V! J (b) Cha 6 figure (b) Attack 11. @

Claims (1)

[Claims] [1] A pair of core halves made of a magnetic film are arranged on a non-magnetic substrate so as to butt against each other with a gap spacer interposed therebetween, and at least one core half is wound with a coil. In a method of manufacturing a magnetic head, a magnetic head is provided on a non-magnetic substrate (1), extending in a direction perpendicular to the magnetic path of the core half to a region where at least one of the core halves is to be installed; A strip-shaped lower conductor layer (44) longer than the width of the core half in the orthogonal direction is repeatedly provided at intervals in the magnetic path direction to form a striped lower conductor pattern (44).
) on the lower conductor pattern (4) of the substrate (1) at a position where both ends of each of the conductor layers (44) are exposed through an insulating film (31). Magnetic film (5) that becomes one core half
a second step of forming a magnetic film (51) which will become the other core half at a position apart from the magnetic film (5); Magnetic film (
5) and a band-shaped upper conductor layer (44) that connects the opposite ends of the pair of adjacent lower conductor layers to the upper surface of the lower conductor layer (44) protruding from both sides of the magnetic film.
72) is repeatedly provided via an insulating film (6) to form a striped upper conductor pattern (7), and the upper and lower conductor patterns (4) and (7) form a periphery of the core half. a third step of configuring a coil conductor (40) wound spirally; and a third step of configuring a coil conductor (40) that is spirally wound in Block half (83)
(84) and a fourth step of producing both block halves (
83) The cut surfaces of (84) are polished to form abutting surfaces (85) and (86) in which the end surfaces of the core halves that will become the gap forming surfaces are exposed.
), and both block halves (83) (84
); and a sixth step of fabricating a magnetic head chip by machining the bonded body obtained through the fifth step. .