JPH0411176Y2 - - Google Patents

Description

[Detailed explanation of the invention] [Industrial application field] This invention is a tester that performs circuit checks by making point contact with printed wiring boards and various electronic components.
The present invention relates to pin probes used as measurement terminals and electrodes of checkers, sensors, etc., or contacts of slide switches.

[Conventional technology]

Conventional general pin probes used for such applications have a measuring pin slidably inserted into a cylindrical sleeve that is fixed to a measuring device, etc.
The pin is biased toward the measurement side or the anti-measurement side by a coil spring wound around the pin. In other words, in order to bias the pin toward the measurement side, a coil spring is placed inside the sleeve and interposed between the retaining ring fitted on the outside of the pin and the rear end of the sleeve, and is applied in the direction of pushing the pin out of the sleeve. By moving the sleeve in the measurement direction during measurement, the pin in contact with the measured point moves back into the sleeve, compressing the coil spring, and the restoring force of the coil spring applies an appropriate contact pressure to the pin. This is what you get. On the other hand, the pin that biases the pin toward the opposite measurement side uses a compression coil spring that is interposed between the base of the rear end of the pin and the rear end of the sleeve and is wound around the pin. Then, the stop ring fitted on the pin is brought into contact with the front end of the sleeve to hold the pin in the backward movement state, and during measurement, the pin is pushed out of the sleeve against the biasing force of the coil spring and brought into contact with the point to be measured. It's getting old.

[Problem that the invention attempts to solve]

By the way, as shown in FIGS. 6 and 7, the pin used in this pin probe has a core 1 made of a metal material with low conductivity from the viewpoint of cost or strength. The entire outer circumferential surface of the device is coated with a plating layer 2 made of a highly conductive metal. However, even in the pin probe described above in which the pin is biased by a coil spring in either the measurement side or the counter-measurement direction,
During measurement, the pin slides on the stationary sleeve 3 and the coil spring, so the plating layer 2 is worn out or peeled off depending on the frequency of sliding. Therefore, the current flowing from the tip of the pin that contacts the point to be measured flows through the core 1 having a large resistance value, thereby changing the current value and making it impossible to obtain an accurate measurement value. Furthermore, if the plating layer 2 is peeled off over part of the circumferential surface, a situation may occur in which current no longer flows and measurement cannot be performed.

This idea was developed in view of these problems, and it is possible to maintain a good conduction state regardless of the frequency of use and obtain accurate measurement results without increasing costs or decreasing strength. The purpose is to provide a pin probe.

[Means for solving problems]

In order to achieve the above object, the pin probe of this invention has a measuring pin whose tip is brought into contact with a point to be measured, which is slidably inserted into a stationary sleeve, and a coil spring wound around the measuring pin. In the pin probe which is biased by The gist of this is a configuration in which a current-carrying path is formed by filling or supplementing a metal material with a high rate.

[Effect]

Since the pin probe of this invention has the above-mentioned configuration, the current-carrying path formed on each sliding surface of the sleeve and coil spring in the pin is located in the defective part where physical phenomena such as abrasion and peeling do not occur. Because of this, the desired energization state can always be maintained regardless of the frequency of use, and accurate measurement results can be obtained.
In addition, since a metal material with high conductivity is locally filled or supplemented into the groove formed in a part of the pin, the conductivity is higher than that of the conventional plating layer formed on the entire circumference of the core. The overall amount of metal material used remains almost the same, so there is no increase in cost, and since it is done locally, there is no decrease in fastness.

〔Example〕

Hereinafter, embodiments of this invention will be described in detail based on the drawings.

Figures 1 to 3 show an embodiment of this invention, with Figure 1 being a longitudinal sectional view and Figure 2 being A-A in Figure 1.
The line sectional view and FIG. 3 are cutaway perspective views of the pin. In these figures, a measuring pin 6 is slidably inserted into a cylindrical sleeve 5 fixed to a mounting board 4 of a tester or the like. A coil spring 7 is wound between the base 6a of the pin 6 and the flange 5a at the rear end of the sleeve 5. At the same time, a retaining ring 8 fitted onto the pin 6 comes into contact with the front end of the sleeve 5 to hold the pin 6 in the backward movement state, and during measurement, the pin 6 is pressed in the direction of the arrow. It moves against the biasing force of the coil spring 7, the tip comes into contact with the point to be measured, and after the measurement, it returns due to the restoring force of the coil spring 7.

The pin 7 has a notch removed linearly in the axial direction on both opposing sides of the core body 6b made of a metal material with low conductivity at each sliding portion between the sleeve 5 and the coil spring 7. A cut-out portion 6c is formed, and a high-conductivity metal material is filled in both cut-out portions 6c so as to have a circular cross section, thereby forming a current conducting path 9. The part where this current conducting path 9 is not formed is
As in the past, the entire outer peripheral surface of the core body 6b is covered with a plating layer 6d.
covered with.

Therefore, even if the surface of the energizing path 9 is slightly worn due to sliding with the sleeve 5 or the coil spring 7, unlike the conventional case in which the plating layer 6d is applied only to the surface of the core 6b, , is formed in the cutout part 6c, so that the core body 6b, which is substantially circular except for the cutout part 6c, does not wear down to the inside of the energizing path 9, and always maintains a good energized state.

In addition, since the energizing path 9 is simply made up of the missing portions 6c on the respective sliding surfaces of the pin sleeve 5 and the coil spring 7 so as to have a circular cross section, the energizing path 9 is formed using a highly conductive material. The amount of metal used is not large compared to a conventional plating layer that is formed on the entire surface of the core, and there is no increase in cost or decrease in fastness.

Alternatively, a configuration as shown in FIG. 4 or FIG. 5 may be used. That is, the pin 10 in FIG.
A cutout part 10b in the form of a V-shaped groove is formed on the opposing outer surface of 0a, and this is filled with a highly conductive metal material to form a current conducting path 11. The pin 12 in FIG. A substantially U-shaped groove cutout 12b on one side of the
is formed, and the cutout portion 12b is filled with a highly conductive metal material to form the current conducting path 13,
In either case, the same effects as in the above embodiment can be obtained.

It should be noted that this invention is not limited only to the above-mentioned embodiment, and it goes without saying that various embodiments can be considered based on the scope of the claims. 5
Although the current conducting paths 9, 11, 13 are formed only on the sliding surfaces of the pins 6, 10, 12, the current conducting paths 9, 13 are formed only on the sliding surfaces of the pins 6, 10, 12.
1 and 13 may be formed.

〔effect〕

As detailed above, according to the pin probe of this invention, a cutout is formed on each sliding surface of the pin sleeve and the coil spring, and the cutout is filled or compensated with a metal material with high conductivity. Since the current-carrying path is formed in a place where physical phenomena such as abrasion do not occur even during frequent use, a good current-carrying state can be maintained at all times. , accurate measurements can be made.
Moreover, since the amount of metal material with high conductivity used to form the current-carrying path does not increase compared to the conventional case, there is no increase in cost and no decrease in robustness.

[Brief explanation of drawings]

Figures 1 to 3 show an embodiment of the pin probe of this invention, with Figure 1 being a longitudinal sectional view, Figure 2 being a sectional view taken along line A--A in Figure 1, and Figure 3 showing a pin FIG. 4 and FIG. 5 are both sectional views of other embodiments of this invention, and FIGS. 6 and 7 are sectional views of a conventional pin probe and a partially cut away view of the pin, respectively. FIG. 5... Sleeve, 6, 10, 12... Measuring pin, 6c, 10b, 12b... Missing part, 9, 1
1, 13... energized path.

Claims (1)

[Claims for Utility Model Registration] 1. A measuring pin whose tip is brought into contact with a point to be measured is slidably inserted into a stationary sleeve, and the pin is biased by a coil spring wound around the measuring pin. In the pin probe, a cutout such as a groove is formed along the axial direction on at least each sliding surface of the pin with respect to the sleeve and the coil spring, and a metal material with high conductivity is filled in the cutout. A pin probe characterized in that a current-carrying path is formed by filling or supplementing. 2. The pin probe according to claim 1 of the utility model registration, in which the current conducting path is formed over the entire length of the pin. 3. Form a conductive path on each sliding surface of the pin between the sleeve and the coil spring, and cover the entire outer circumferential surface of the core made of a metal material with low conductivity, except for the portion where the conductive path is formed, with high conductivity. The pin probe according to claim 1, which has been registered as a utility model and has a structure in which a plating layer is formed of metal.