JPH0411167Y2 - - Google Patents
Info
- Publication number
- JPH0411167Y2 JPH0411167Y2 JP1984150918U JP15091884U JPH0411167Y2 JP H0411167 Y2 JPH0411167 Y2 JP H0411167Y2 JP 1984150918 U JP1984150918 U JP 1984150918U JP 15091884 U JP15091884 U JP 15091884U JP H0411167 Y2 JPH0411167 Y2 JP H0411167Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact needle
- measured
- storage box
- electrical resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005259 measurement Methods 0.000 claims description 16
- 239000000523 sample Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/20—Investigating the presence of flaws
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は被検体金属の表面に接触針を当接し
て、その間の電気抵抗変化から亀裂深さ等を測定
する探傷装置非破壊検査装置等に用いられる電気
抵抗探傷法用測定プローブに関する。[Detailed description of the invention] [Industrial application field] This invention is a non-destructive testing device, etc. that measures crack depth etc. from the change in electrical resistance by contacting a contact needle with the surface of a metal to be inspected. This invention relates to a measurement probe for electrical resistance flaw detection used in
金属に亀裂が発生した場合、その亀裂深さを非
破壊的に測定する方法として、電気抵抗探傷法が
知られている。この原理は第２図に示す如く、被
測定体２１に４本の接触針２２を当て、そのうち
の特定の２本の接触針（外側の２本）に、一定電
流を流すと、他の一対の接触針（内側の２本）
に、亀裂２３の深さ（υ）に相当する電圧が指示
計２４で検出される。この測定電圧と健全部の測
定電圧比に対する亀裂深さの較正曲線より亀裂深
さが求まる。尚、２５は支持構体、２６はリード
線、２７はコネクタ、２８は接触針受け、２９は
針押圧ばねである。
When a crack occurs in metal, electrical resistance flaw detection is known as a method for non-destructively measuring the depth of the crack. As shown in Fig. 2, the principle of this is that four contact needles 22 are applied to the object to be measured 21, and when a constant current is applied to two specific contact needles (outer two), the other pair contact needles (inner two)
Then, a voltage corresponding to the depth (υ) of the crack 23 is detected by the indicator 24. The crack depth is determined from the calibration curve of the crack depth with respect to the measured voltage and the measured voltage ratio of the sound part. In addition, 25 is a support structure, 26 is a lead wire, 27 is a connector, 28 is a contact needle receiver, and 29 is a needle pressing spring.
上記測定に際して必ず実施しなければならない
のが、被測定体の測定面の前処理である。従来、
この為に、表面の黒皮や酸化膜をサンドペーパ
か、グラインダを別に用意して麿いている。とこ
ろが、測定場所が狭隘なところでは、すぐに間に
合わせることができない時があり、その準備、研
麿作業等に不都合を生じていた。
What must be carried out during the above measurement is pretreatment of the measurement surface of the object to be measured. Conventionally,
For this purpose, sandpaper or a separate grinder is used to remove the black crust and oxide film on the surface. However, in places where the measurement location is small, it may not be possible to complete the measurement in time, creating inconveniences in preparation and research work.
本考案は、被測定体の表面に接触針を当接し、
接触針間の電気抵抗変化を検出して被測定体の探
傷を行なう電気抵抗探傷法用測定プローブにおい
て、接触針格納箱と、この接触針格納箱の一端部
に突出して設けられる複数の接触針と、上記接触
針格納箱の他端部に回転可能に設けられ、上記被
測定体の表面を研磨するための研磨砥石と、この
研磨砥石を回転駆動する駆動手段とを備えたこと
を特徴とし、測定前に必ず実施される被測定面の
研磨作業時に、研磨器具を何等別途に用意するこ
となく、プローブ本体を構成する接触針格納箱に
付設した研磨砥石により研磨作業を実施できるよ
うにしたもので、これにより、研麿器具の用意怠
り等による作業の遅延等を未然に防止でき、研麿
作業を迅速かつ能率良く行なうことができる。
This invention brings a contact needle into contact with the surface of the object to be measured,
A measurement probe for electrical resistance flaw detection that detects changes in electrical resistance between contact needles to detect defects on a measured object includes a contact needle storage box and a plurality of contact needles protruding from one end of the contact needle storage box. and a polishing wheel rotatably provided at the other end of the contact needle storage box for polishing the surface of the object to be measured, and a drive means for rotationally driving the polishing wheel. When polishing the surface to be measured, which is always performed before measurement, it is now possible to perform the polishing work using the polishing wheel attached to the contact needle storage box that makes up the probe body, without having to prepare any separate polishing tools. As a result, it is possible to prevent delays in work due to failure to prepare the toning tools, etc., and the toning work can be carried out quickly and efficiently.
以下第１図を参照して本考案の一実施例を説明
する。第１図に本考案の測定プローブの構造を示
す。本考案に係るプローブは大別して、接触針格
納箱１６と研麿装置４から構成されている。接触
針格納箱１６内の４本の接触針７は、ばね６で押
さえられ、上蓋１５と接触針用ばね室８に格納さ
れている。この接触針７の先端はコネクタ１への
リード線３が半田付けされている。一方、研麿装
置４はギヤヘツド１３とDC（直流）モータ１４を
押えナツト５で格納されている。このギヤヘツド
１３の軸はカツプリング１２で研麿砥石９とカツ
プリングされている。研麿砥石９は締付ナツト２
で固定されている。DCモータ１４への電源はコ
ネクタ１についているスイツチ１７のオンにより
通電される。接触針格納箱１６と研麿装置４は、
ねじ込み式でカツプリングされている。以上、装
置のすべてのケースは絶縁材料が使用されてい
る。
An embodiment of the present invention will be described below with reference to FIG. FIG. 1 shows the structure of the measurement probe of the present invention. The probe according to the present invention is broadly divided into a contact needle storage box 16 and a toner device 4. The four contact needles 7 in the contact needle storage box 16 are held down by springs 6 and stored in the upper lid 15 and the contact needle spring chamber 8. A lead wire 3 to the connector 1 is soldered to the tip of the contact needle 7. On the other hand, a gear head 13 and a DC (direct current) motor 14 are housed in the touring device 4 with a holding nut 5. The shaft of this gear head 13 is coupled to the grindstone 9 by a coupling 12. Kenmaro whetstone 9 is tightening nut 2
is fixed. Power is supplied to the DC motor 14 by turning on the switch 17 attached to the connector 1. The contact needle storage box 16 and Kenmaro device 4 are
It is a screw-in type and has a coupling. As mentioned above, all cases of the device are made of insulating material.
ここで作用を説明すると、被測定面をカラーチ
エツクにより欠陥位置が確認出来れば、キヤツプ
１８を外し、研麿装置のスイツチ１７をオンに入
れ、研麿砥石９を駆動させ、欠陥部周辺を均等に
麿く。この時、研麿砥石９の種類は、その測定面
に合わせて取付チヤツク１０を緩め、適当なもの
を選び取付ける。測定面の黒皮が無くなり、地肌
が表われる程度に麿いたら、スイツチ１７をオフ
にし、キヤツプ１８を取りつけ、研麿作業を終了
する。この後、反対側に取りつけられた接触針７
を第１図のように測定面に当てると、リード線３
を通じて、亀裂深さに相当する電圧（μV）が指
示計に表われる。以上のようにして、従来通りの
亀裂測定を繰返し、指示計の指示が不安定の時は
この研麿作業を適時繰返す。 To explain the operation here, if the defect position can be confirmed by color checking the surface to be measured, remove the cap 18, turn on the switch 17 of the grinding device, drive the grinding wheel 9, and evenly grind the area around the defect. Fast forward to. At this time, the appropriate type of Kenmaro grindstone 9 is selected and installed by loosening the mounting chuck 10 according to the surface to be measured. When the surface to be measured has no black skin and the surface is smooth enough to show the surface, the switch 17 is turned off, the cap 18 is attached, and the grinding process is completed. After this, the contact needle 7 attached to the opposite side
When applied to the measurement surface as shown in Figure 1, the lead wire 3
Through this, a voltage (μV) corresponding to the crack depth appears on the indicator. As described above, crack measurement is repeated as usual, and if the indicator's indication is unstable, this grinding operation is repeated at appropriate times.
上述したようなプローブを用いることにより、
電気抵抗探傷法前処理時の研麿作業が測定プロー
ブと研麿砥石が一体となつている為、何時、何処
でも、随時行なえ、準備時間を必要としないこと
から、能率の良い測定作業が行なえる。 By using the probe as described above,
Because the measurement probe and grindstone are integrated, the grinding work during pretreatment for electrical resistance flaw detection can be done anytime, anywhere, and no preparation time is required, allowing for efficient measurement work. Ru.
以上詳記したように、本考案によれば、測定プ
ローブ本体に研麿器具を付設し、電気抵抗探傷法
による測定前に必ず実施される被測定面の研麿作
業時に於いて、研麿器具を何ら別途に用意にする
ことなく、プローブ本体に付設された器具により
研麿作業を実施できるようにしたことにより、研
麿器具の用意怠り等による作業の遅延等を未然に
防止でき、研麿作業を迅速かつ能率良く行なうこ
とができる。
As described in detail above, according to the present invention, a grinding tool is attached to the measurement probe body, and during the grinding work of the surface to be measured, which is always performed before measurement using the electrical resistance flaw detection method, the grinding tool can be attached to the measuring probe body. By making it possible to carry out the Tomaro work using the equipment attached to the probe body without having to prepare any separate equipment, it is possible to prevent delays in work due to failure to prepare the Tomaro equipment, etc. Work can be done quickly and efficiently.
第１図ａは本考案の一実施例を示す要部を断面
にした構成説明図、同図ｂは上記実施例の外観及
び接続構成を示す図、第２図は従来のプローブ構
造を説明するためのプローブ本体を断面にした構
成説明図である。
１……コネクタ、２……締付ナツト、３……リ
ード線、４……研磨装置、５……押えナツト、６
……ばね、７……接触針、８……ばね室、９……
研麿砥石、１０……取付チヤツク、１２……カツ
プリング、１３……ギヤヘツド、１４……DCモ
ータ、１５……上蓋、１６……接触針格納箱、１
７……スイツチ、１８……キヤツプ。
Fig. 1a is an explanatory structural diagram showing an embodiment of the present invention with main parts in cross section, Fig. 1b is a diagram showing the external appearance and connection configuration of the above embodiment, and Fig. 2 explains the conventional probe structure. FIG. 2 is a configuration explanatory diagram showing a cross section of the probe body for use in the present invention. 1... Connector, 2... Tightening nut, 3... Lead wire, 4... Polishing device, 5... Holder nut, 6
...Spring, 7...Contact needle, 8...Spring chamber, 9...
Kenmaro grindstone, 10...Mounting chuck, 12...Coupling, 13...Gear head, 14...DC motor, 15...Top lid, 16...Contact needle storage box, 1
7...Switch, 18...Cap.
Claims (1)
電気抵抗変化を検出して被測定体の探傷を行なう
電気抵抗探傷法用測定プローブにおいて、接触針
格納箱と、この接触針格納箱の一端部に突出して
設けられる複数の接触針と、上記接触針格納箱の
他端部に回転可能に設けられ、上記被測定体の表
面を研磨するための研磨砥石と、この研磨砥石を
回転駆動する駆動手段とを具備したことを特徴と
する電気抵抗探傷法用測定プローブ。 In a measurement probe for electrical resistance flaw detection, which tests the object by contacting the contact needle with the surface of the object to be measured and detecting the change in electrical resistance between the contact needles, the contact needle storage box and this contact needle storage box are used. a plurality of contact needles protrudingly provided at one end; a polishing wheel rotatably provided at the other end of the contact needle storage box for polishing the surface of the object to be measured; and rotating the polishing wheel. A measurement probe for electrical resistance flaw detection, characterized by comprising a drive means for driving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150918U JPH0411167Y2 (en) | 1984-10-05 | 1984-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984150918U JPH0411167Y2 (en) | 1984-10-05 | 1984-10-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6167555U JPS6167555U (en) | 1986-05-09 |
| JPH0411167Y2 true JPH0411167Y2 (en) | 1992-03-19 |
Family
ID=30709049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984150918U Expired JPH0411167Y2 (en) | 1984-10-05 | 1984-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0411167Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662752A (en) * | 1979-10-24 | 1981-05-28 | Tokyo Seikou Kk | Automatic grinding device of die |
-
1984
- 1984-10-05 JP JP1984150918U patent/JPH0411167Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662752A (en) * | 1979-10-24 | 1981-05-28 | Tokyo Seikou Kk | Automatic grinding device of die |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6167555U (en) | 1986-05-09 |
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