JPH04109658A - Electronic component package - Google Patents
Electronic component packageInfo
- Publication number
- JPH04109658A JPH04109658A JP22645990A JP22645990A JPH04109658A JP H04109658 A JPH04109658 A JP H04109658A JP 22645990 A JP22645990 A JP 22645990A JP 22645990 A JP22645990 A JP 22645990A JP H04109658 A JPH04109658 A JP H04109658A
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- plating
- gold
- base
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 56
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 52
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052737 gold Inorganic materials 0.000 claims abstract description 38
- 239000010931 gold Substances 0.000 claims abstract description 38
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 229910001260 Pt alloy Inorganic materials 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 150000002736 metal compounds Chemical class 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は電子部品パッケージ、特に金属部に金メッキ
が施される電子部品パッケージに関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an electronic component package, and particularly to an electronic component package in which metal parts are plated with gold.
〈従来の技術〉
セラミックパッケージ（電子部品パッケージ）には、「
金属部」としてのダイボンディング部、ワイヤボンディ
ング部、キャップ封止部、リード部等が備えられている
。このうち、ダイボンディング部、ワイヤボンディング
部、キャップ封止部の各部についてはセラミック表面に
形成したタングステン（又はモリブデン）−マンガン等
から成るメタライズ面となっており、このメタライズ面
に無電解メッキと電解メッキとが施されている。<Conventional technology> Ceramic packages (electronic component packages) have
A die bonding part, a wire bonding part, a cap sealing part, a lead part, etc. are provided as "metal parts". Among these, the die bonding part, wire bonding part, and cap sealing part are metallized surfaces made of tungsten (or molybdenum)-manganese, etc. formed on the ceramic surface, and electroless plating and electrolytic plating are applied to the metallized surfaces. It is plated.
また、リード部については電解メッキだけが施されてる
。そして、前記「金属部（表面処理用の電解メッキや無
電解メッキが施されている場合にはそのメッキ層も含む
）」の全てには金ストライクメッキを経た後に純金メッ
キが最終的に施される。Also, only electrolytic plating is applied to the lead parts. All of the above-mentioned "metal parts (including the plating layer if electrolytic plating or electroless plating has been applied for surface treatment)" are finally plated with pure gold after gold strike plating. Ru.
〈発明が解決しようとする課題〉
そして、前述の如きメッキ技術は従来より行われている
が、セラミックパッケージには出荷試験として過酷な加
熱試験（４５０℃で５〜１０分間）が課せられているた
め、この加熱処理の際に、下地層（金属部の表面層）で
あるニッケルメッキ被膜結晶の深さ程度によっては金メ
ッキがニッケルメッキ結晶の凹部まで十分に付き回らな
くなるおそれがあった。従って、結果的に下地層のニッ
ケルが純金メッキの表面に酸化ニッケルとして現れるこ
ととなり、表面の金メッキ層が具備すべきダイボンディ
ング性、ワイヤボンディング性、キャップ封止、半田ぬ
れ性等の性能を著しく悪化させていた。<Problem to be solved by the invention> Although the above-mentioned plating technology has been used in the past, ceramic packages are subjected to a severe heating test (450°C for 5 to 10 minutes) as a shipping test. Therefore, during this heat treatment, depending on the depth of the nickel-plated crystal, which is the base layer (surface layer of the metal part), there was a risk that the gold plating would not fully reach the recesses of the nickel-plated crystal. Therefore, as a result, the nickel in the base layer appears as nickel oxide on the surface of pure gold plating, which significantly impairs the performance of die bonding, wire bonding, cap sealing, solder wettability, etc. that the gold plating layer on the surface should have. It was making it worse.
このような加熱処理上における問題点を解決するための
対策技術として、ニッケルーコバルト合金を金の下地メ
ッキとして施す技術（特開昭５５−３４６９２号公報参
照）や、ロジウムを金の下地メッキとして施す技術（特
公昭６２−４３３４３号公報参照）が知られているが、
前者のニッケルーコバルト合金にあっては合金比率を一
定に操作する点が難しく、後者のロジウムメッキにあっ
てはクラック剥離が生じ易い等の別の課題を抱えていた
。Countermeasure techniques to solve such problems in heat treatment include a technique in which nickel-cobalt alloy is applied as a gold base plating (see Japanese Patent Application Laid-open No. 1983-34692), and a technique in which rhodium is applied as a gold base plating. Although a technique for applying this method (see Japanese Patent Publication No. 62-43343) is known,
With the former nickel-cobalt alloy, it is difficult to control the alloy ratio at a constant level, and with the latter rhodium plating, there are other problems such as easy cracking and peeling.
この発明はこのような従来の技術に着目してなされたも
のであり、金メッキの下地として、ニッケルーコバルト
合金やロジウム等よりも優れた金属をメッキした電子部
品パッケージを提供せんとするものである。This invention has been made by focusing on such conventional technology, and aims to provide an electronic component package plated with a metal that is superior to nickel-cobalt alloy, rhodium, etc. as a base for gold plating. .
く課題を解決するための手段〉
この発明に係る電子部品パッケージは、金メッキの下地
として白金又は白金合金メッキを採用したものである。Means for Solving the Problems> The electronic component package according to the present invention employs platinum or platinum alloy plating as the base for gold plating.
白金及び白金合金は金メッキの下地として酸化しに（く
、金属の拡散バリヤとして優れ、金と金属化合物を生成
しにくいという特性を兼ね備えている。従って、このよ
うな特性の白金又は白金合金メッキ層を、電子部品パッ
ケージの金属部と金メッキ層との間に「バリヤ」として
介在させることにより、電子部品パッケージに加熱処理
等を行っても金属部が金メッキの表面に現れたり、或い
は金メッキが変色を起こしたりすることがない。Platinum and platinum alloys have the characteristics of being resistant to oxidation as a base for gold plating, being excellent as a metal diffusion barrier, and being difficult to form metal compounds with gold. Therefore, platinum or platinum alloy plating layers with these characteristics are By interposing it as a "barrier" between the metal part of the electronic component package and the gold plating layer, even if the electronic component package is subjected to heat treatment, the metal part will not appear on the surface of the gold plating or the gold plating will change color. I never wake him up.
しかも、白金及び白金合金の前述の如き特性は０゜０５
μｍ程度という極薄なメッキ厚でも維持されるため、全
同様に高価である白金及び白金合金を使用する上でコス
ト的に大変に有利である。更に、白金及び白金合金メッ
キ層は内部ストレスが発生しにくいため金属部との密着
性も良く、クラック剥離等を起こすおそれもない。Moreover, the above-mentioned properties of platinum and platinum alloys are 0°05
Since it can be maintained even with an extremely thin plating thickness of about μm, it is very advantageous in terms of cost compared to using platinum and platinum alloys, which are also expensive. Furthermore, since the platinum and platinum alloy plating layers are less likely to generate internal stress, they have good adhesion to metal parts, and there is no risk of cracking or peeling.
この発明を実施する上で使用される代表的な白金メッキ
液組成及びその操作条件としては以下の通りである。Typical platinum plating solution compositions and operating conditions used in carrying out this invention are as follows.
・塩化白金塩 ０．１−１００ ｇ／Ａ（白金
量として）
・可溶性塩等 １００〜２００ｇ、／ｊ’−温
度 ３０〜８０°Ｃ・電流密度
３〜５ Ａ ／ ｄ ｒｎ’可溶性塩等として
は、カルボン酸、リン酸、硫酸、塩酸、又はそれらのナ
トリウム塩又はカリウム塩の少なくとも１つが含まれる
。カルボン酸としては、クエン酸、酢酸、シュウ酸、リ
ンゴ酸、プロピオン酸、乳酸、マロン酸、酒石酸などが
好適である。・Chlorinated platinum salt 0.1-100 g/A (as platinum amount) ・Soluble salt, etc. 100-200 g, /j'-Temperature 30-80°C ・Current density
The 3-5 A/d rn' soluble salts include at least one of carboxylic acid, phosphoric acid, sulfuric acid, hydrochloric acid, or their sodium or potassium salts. Suitable carboxylic acids include citric acid, acetic acid, oxalic acid, malic acid, propionic acid, lactic acid, malonic acid, and tartaric acid.
白金との合金化に好適な金属としては、金、銀、パラジ
ウム、イリジウム、ルテニウム、コバルト、ニッケル、
銅などを挙げることができる。例えば、白金と金との合
金化を行う場合には、前述の白金メッキ液組成にシアン
化第二金カリウムをＯ，１〜１０ｇ／Ｉｌ程度添加する
ことにより白金−金合金メッキ液が得られる。また、合
金化される金属は１つに限らず、例えば白金−金−パラ
ジウムのように２つの金属と合金化させても良い。Metals suitable for alloying with platinum include gold, silver, palladium, iridium, ruthenium, cobalt, nickel,
Examples include copper. For example, when alloying platinum and gold, a platinum-gold alloy plating solution can be obtained by adding about 1 to 10 g/Il of potassium cyanide to the above-mentioned platinum plating solution composition. . Further, the number of metals to be alloyed is not limited to one, and two metals may be alloyed, for example, platinum-gold-palladium.
尚、「電子部品パッケージＪとしては、セラミックパッ
ケージに限定されず、樹脂封止用リードフレーム、ハー
メチックシールしたキャン・タイプのパッケージ等など
も含まれる。The electronic component package J is not limited to ceramic packages, but also includes resin-sealed lead frames, hermetically sealed can-type packages, and the like.
く実 施 例〉 以下この発明の好適な実施例を説明する。Example of implementation Preferred embodiments of the present invention will be described below.
セラミックパッケージのメタライズ面（表面にニッケル
メッキ層）に対して以下のような組成の白金メッキ液を
用いてメッキ厚を変化させた各種の白金下地メッキを行
い、そしてその上に通常の金メッキをそれぞれ１．３μ
ｍの厚さで行った。Various types of platinum base plating with varying plating thicknesses are applied to the metallized surface (nickel plating layer on the surface) of the ceramic package using a platinum plating solution with the following composition, and then regular gold plating is applied on top of that. 1.3μ
A thickness of m was used.
白金メッキ液組成
・塩化白金塩 ２．０ｇ／ｌ（白
金量として）
・塩酸（３６％）
撤作条任
・ｐＨ
・温度
・電流密度
・時間
１００ｄ／ｆｆ１
１、０
７０°Ｃ
３Ａ／ｄｒｒｉ’
１５〜３０秒
そして、このような白金の下地メッキ及び金の本メッキ
をそれぞれメタライズ面に施した後に、セラミックパッ
ケージの「耐熱性」 「半田ぬれ性」「ダイボンディン
グ性」をそれぞれ評価してみた。Platinum plating solution composition - Chlorinated platinum salt 2.0g/l (as platinum amount) - Hydrochloric acid (36%) Removal conditions - pH - Temperature - Current density - Time 100d/ff1 1,0 70°C 3A/drri' After applying the platinum base plating and gold main plating to the metallized surface for 15 to 30 seconds, we evaluated the ceramic package's "heat resistance,""solderwettability," and "die bondability." .
◎最良 ○良好 ｘ不良
結果は、上記表のようにセラミックパッケージとして要
求される性能が、白金メッキ層を形成した方が白金メッ
キ層を形成しない場合（上記表の最下段）よりも優れて
いた。この実施例では金のメッキ厚サイズが１．３μｍ
程度と比較的大きい状態で試験したが、この金メッキ厚
サイズをもっと小さくした場合には、本願発明の白金（
又は白金合金）メッキ層を形成した場合と、形成しない
場合との違いは更に顕著となる。 また、このセラミッ
クパッケージに対して、４５０６Ｃ１５分間の耐熱テス
トを行ったが、金メッキ層に変色がなく、下地メッキで
ある白金メッキ層との密着性も良好であった。◎Best ○Good . In this example, the gold plating thickness size is 1.3 μm.
Although the test was conducted in a state where the gold plating thickness was relatively large, it was found that when the thickness of the gold plating was made smaller, the platinum (
The difference between the case where a plating layer (or platinum alloy) is formed and the case where it is not formed becomes even more remarkable. Further, this ceramic package was subjected to a heat resistance test of 4506C for 15 minutes, and there was no discoloration of the gold plating layer, and the adhesion to the platinum plating layer, which is the base plating, was good.
また、このように白金（又は白金合金）下地メッキが確
実な「バリヤ」として機能するため、表面に施される金
メッキのメッキ厚の低減化も同時に図れることとなる。Furthermore, since the platinum (or platinum alloy) base plating functions as a reliable "barrier", the thickness of the gold plating applied to the surface can be reduced at the same time.
すなわち、従来は金属部からの悪影響を回避するために
、金メッキのメッキ厚を大きくする必要があったが、こ
の発明の如き白金（又は白金合金）下地メッキを採用す
れば、そのようなおそれもなくなるため、表面の金メッ
キのメッキ厚サイズをを小さくすることができる。In other words, in the past, it was necessary to increase the thickness of gold plating in order to avoid adverse effects from metal parts, but if the platinum (or platinum alloy) base plating of this invention is adopted, such fear can be eliminated. Therefore, the thickness of the gold plating on the surface can be reduced.
〈発明の効果〉
この発明に係る電子部品パッケージは、以上説明して如
き内容のものであって、金の下地メッキとして白金又は
白金合金メッキを採用したので、この白金又は白金合金
下地メッキが電子部品パッケージの金属部と金メッキ層
との間の「バリヤ」となり、加熱処理によって金メッキ
層の耐熱性・半田ぬれ性・ダイボンディング性の性能が
阻害されるのを確実に防止することができる。<Effects of the Invention> The electronic component package according to the present invention has the content as explained above, and uses platinum or platinum alloy plating as the gold base plating. It acts as a "barrier" between the metal part of the component package and the gold plating layer, and can reliably prevent the heat resistance, solder wettability, and die bonding performance of the gold plating layer from being impaired by heat treatment.
Claims (2)
メッキが施されていることを特徴とする電子部品パッケ
ージ。(1) An electronic component package characterized in that the metal parts are plated with gold with platinum or platinum alloy plating as the base.
記載の電子部品パッケージ。(2) Claim 1, wherein the surface of the metal part is a nickel plating layer.
Electronic component package listed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22645990A JPH04109658A (en) | 1990-08-30 | 1990-08-30 | Electronic component package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22645990A JPH04109658A (en) | 1990-08-30 | 1990-08-30 | Electronic component package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04109658A true JPH04109658A (en) | 1992-04-10 |
Family
ID=16845430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22645990A Pending JPH04109658A (en) | 1990-08-30 | 1990-08-30 | Electronic component package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04109658A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066000A (en) * | 1992-06-23 | 1994-01-14 | Kyocera Corp | Ceramic wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628532A (en) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | Gold-plated electronic component package |
-
1990
- 1990-08-30 JP JP22645990A patent/JPH04109658A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628532A (en) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | Gold-plated electronic component package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066000A (en) * | 1992-06-23 | 1994-01-14 | Kyocera Corp | Ceramic wiring board |
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