JPH04107890U - Heat dissipation structure of electronic equipment - Google Patents

Abstract

(57) [Summary] [Purpose] Heat-generating parts and an aluminum plate to which the heat-generating parts are attached are covered with a heat shielding member formed into a roughly cylindrical shape, and only the heat-generating air is efficiently exhausted to the outside using a heat dissipation fan. The purpose is to prevent the temperature from rising inside other devices. [Structure] An aluminum plate for attaching heat-generating parts inside an electronic device, and a roughly cylindrical heat shielding member that covers the aluminum plate and the heat-generating parts are provided, and a heat dissipation fan is attached to one end of this heat shielding member to dissipate heat. It is configured to do so.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This idea relates to the heat dissipation structure of heat-generating components inside electronic devices, and in particular uses a heat dissipation fan. The present invention relates to a heat dissipation structure for electronic equipment suitable for dissipating heat.

0002

[Prior art]

Conventionally, the heat dissipation structure of electronic equipment (hereinafter simply referred to as equipment) is shown in the perspective view of Figure 4 and Many of the devices shown in the plan view of FIG. 5 were provided. In the figure, 1 is the device panel , 2 is the chassis, 3 is the printed circuit board for assembling the internal parts of the device, and 4 is the main body of the device. 5 is a heat dissipation fan that radiates heat inside the device; 8 is a heat generating part inside the device; 9 is a This is a heat radiator to which a heat generating component 8 is attached.

0003 Heat-generating components 8 inside the device, such as power ICs, are mounted on the heat sink 9 provided on the back. The heat radiated from the power IC 8 is radiated from the heat radiator 9, which has good thermal conductivity. . On the other hand, the panel 1, chassis 2, and a case with ventilation holes (not shown) are sealed. The heated air from the power IC 8 inside the device is discharged to the outside by the heat dissipation fan 5. It will be done.

0004 The heated air discharged by the heat dissipation fan 5 is transferred to the case as shown in The airflow (arrow A) from the ventilation hole of the Airflow, arrow B), dissipates heat inside the device.

[0005]

[Problem that the idea aims to solve]

However, since the conventional heat dissipation structure described above requires a large heat sink 9, it is quite The disadvantage was that the cost was high.

[0006] In addition, the air flow (arrow B) discharged from the heat dissipation fan 5 is the air inside the entire device. It is possible to efficiently discharge only the hot air generated by the heat generated from the power IC8. There was also a drawback that the heat dissipation fan 5 could not be used effectively.

[0007] This idea was made in view of the above points, and its purpose is to Eliminates the drawbacks of the conventional example and generates heat by covering the heat generating component 8 with a heat shielding member formed into a substantially cylindrical shape. Provides a heat dissipation structure for equipment that efficiently dissipates only airflow using a heat dissipation fan 5. It is in.

[0008]

[Means to solve the problem]

The heat dissipation structure of electronic equipment of this invention attaches the heat-generating parts inside the equipment to a radiator, and dissipates it. In the heat dissipation structure of equipment that dissipates heat using a heat fan, aluminum is used to attach the above heat generating parts. heat dissipation by providing a heat shielding member with a substantially cylindrical shape that covers the aluminum plate on which heat-generating parts are attached. It is configured to dissipate heat using a fan.

[0009]

[Effect]

According to this idea, the heat-generating parts inside the device are attached to an aluminum plate, and the heat-generating parts are The aluminum plate on which the A heat dissipation fan is attached to one end of the heating element.

0010 The heat dissipation structure of a device configured in this way only releases heat from the heat-generating components inside the device. flows inside the approximately cylindrical heat shield member and is discharged to the outside by a heat dissipation fan, increasing efficiency. Good heat dissipation is possible.

[0011] In addition, the substantially cylindrical heat shielding member is made of, for example, a resin-based material with low thermal conductivity. Because of this, the inside of other devices separated by this heat shielding material will not be affected by the heat generated by the heat generating components. It is possible to maintain a low temperature environment without being exposed to heat.

0012

【Example】

An example of the heat dissipation structure for electronic equipment according to this invention will be explained based on FIGS. 1 to 3. Ru. Note that the same parts as in the conventional example are given the same reference numerals, and the explanation thereof will be omitted.

[0013] Figure 1 is a perspective view showing the inside of the device, Figure 2 is a side sectional view, and Figure 3 is a plan view from above. In the figure, 6 is a substantially cylindrical heat shielding member that covers a heat generating component 8, and 7 is a heat shielding member that covers a heat generating component 8. This is an aluminum plate to which part 8 is attached.

[0014] For example, the power IC8, which is a heat generating component, is relatively thick and has a roughly U-shaped shape as shown in the figure. It is attached in close contact with the shaped aluminum plate 7. In other words, this aluminum plate 7 -Although it also acts as a heatsink for IC8, it is smaller than the conventional heatsink 9. It has a unique shape and can be manufactured at extremely low cost.

[0015] The power IC 8 attached closely to the aluminum plate 7 has a substantially cylindrical shape together with the aluminum plate 7. It is covered with a heat shielding member 6 having a shape, and a heat dissipation fan 5 is attached to one end of this heat shielding member 6. The other end is open, and the case near this opening has many ventilation holes ( (not shown) is formed.

[0016] Further, the heat shielding member 6 is made of a material with poor thermal conductivity, for example, a resin-based material, The internal temperature of this heat shielding material is not transmitted to the inside of other separated devices, and the heat is shielded. can be done.

[0017] The heat dissipated from the power IC 8 inside the device configured in this way is from the ventilation holes in the case. The cool air flow (arrow A) is taken in, and the heat-generating air inside the approximately cylindrical shape is sent to the heat dissipation fan 5. It can be directly discharged to the outside with an air flow as shown by arrow B.

[0018] In other words, the heat generated from the power IC 8 can be exhausted extremely efficiently, and it can also be used as a heat shield. Since it is covered with the member 6, the temperature rise inside the device can be suppressed to a minimum.

[0019]

[Effect of the idea]

As mentioned above, the heat dissipation structure of the device according to this invention uses heat shielding materials with poor thermal conductivity. The heat is dissipated by a heat dissipation fan that covers the heat components and the heat dissipation mounting aluminum plate, resulting in high cost. This has the effect of eliminating the need for a molded heatsink and allowing efficient heat dissipation.

[0020] In other words, the heat dissipation structure of this invention can be used without increasing the size of the electronic device housing. It also has the effect of increasing the power of the motor.

[0021] Moreover, it has a simple structure and can be constructed at low cost, making it easy to implement. It has excellent features such as:

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of a heat dissipation structure for an electronic device according to the present invention.

FIG. 2 is a side sectional view of FIG. 1;

FIG. 3 is a plan view of FIG. 1;

FIG. 4 is a perspective view showing a conventional example.

FIG. 5 is a plan view of FIG. 4;

[Explanation of symbols]

1 panel 2 Chassis 3 Printed circuit board 4 Mechanical assembly department 5 Heat dissipation fan 6 Heat shielding material 7 Aluminum plate 8 Heat generating parts 9 Heat sink

Claims (1)

[Scope of utility model registration request] Claim 1: A heat dissipation structure for an electronic device in which a heat generating component inside the electronic device is attached to a radiator and the heat is radiated by a heat dissipation fan, an aluminum plate to which the heat generating component is attached, and a substantially cylindrical shape that covers the aluminum plate to which the heat generating component is attached. 1. A heat radiation structure for an electronic device, characterized in that the heat shielding member is provided, and the heat is radiated by a heat radiation fan.