JPH04107888U - Heat sink mounting structure for electronic equipment - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a structure for attaching a heat radiator to an electronic device, which allows a heat radiator to be easily attached without using adhesive.

[Prior Art] Electronic devices that have various built-in electronic components and a predetermined circuit configuration are equipped with an external heat radiator in order to effectively dissipate heat generated during operation from the built-in electronic components. There are things that can be installed. FIG. 3 shows an outline of an electronic device having this type of structure.

In FIG. 3, the electronic device 1 includes a rectangular cylindrical insulating case 2, and both upper and lower surfaces of the insulating case 2 are open. A metal substrate 3 is fitted and fixed to one opening of the insulating case 2. Although not shown, a predetermined circuit pattern is formed on one main surface of the metal substrate 3 using conductive foil with an insulating layer interposed therebetween. Various electronic components such as semiconductor elements, resistors, and capacitors are mounted on this circuit pattern.
It is fixed, and a lead wire 4 for external connection is led out.

The metal substrate 3 forms the bottom of the rectangular cylindrical insulating case 2, and the insulating case 2 is filled with a sealing resin to complete the intended electronic device 1. This electronic device 1 has a metal substrate 3 side facing upward and lead wires 4 of electronic components protruding downward.
is inserted into the through hole of the printed circuit board 5 and fixed by solder.

The electronic device 1 is often used in this state, but when used at the upper limit of the electrical rating of the electronic device 1, the amount of heat dissipated from the built-in electronic components that generate heat may be insufficient for the metal substrate 3 alone. do. In such a case, the heat sink 6 may be attached to the metal substrate 3 via an adhesive.
It is used to supplement or promote heat dissipation.

[Problems to be Solved by the Invention] As described above, when a heat sink is used in a conventional electronic device, an adhesive is required to attach it. This adhesive deteriorates when used under heating for a long period of time, resulting in poor adhesion due to partial peeling between the heat radiating body 6 and the metal substrate 3, and a problem that must be solved is that the heat radiation efficiency decreases. Further, since the adhesive is used, the work efficiency is poor, and furthermore, if bubbles are formed during the work, the adhesion between the heat dissipating body 6 and the metal substrate 3 deteriorates, which are problems that need to be solved.

[Purpose of the invention] The present invention was made to solve the above-mentioned problems. It eliminates the need for adhesives, does not cause deterioration of heat dissipation even after long-term use, and can easily dissipate heat. An object of the present invention is to provide a structure for attaching a heat sink to an electronic device to which a body can be attached.

[Means for Solving the Problems] The heat sink mounting structure for electronic equipment of the present invention includes a metal substrate in which various electronic components are built, and a metal substrate that is fitted and fixed to one opening of the insulating case. In this heat sink mounting structure for an electronic device in which a heat sink is attached to the metal substrate side, dovetail grooves are formed at multiple locations on the outer surface of the insulating case, and mounting pieces are provided that are inserted and fixed into the dovetail grooves. , the heat sink and the metal substrate of the electronic device are fixed via this attachment piece.

[Function] In the heat sink mounting structure for electronic equipment of the present invention, when a heat sink is required, a mounting piece is inserted into a dovetail groove formed on a metal substrate, and the mounting piece is mounted on the metal substrate via this mounting piece. Fix the heat sink with screws. This allows the heat sink to be easily and efficiently attached to electronic equipment without using adhesives. Furthermore, since no adhesive is used, the adhesion between the heat sink and the metal substrate can be maintained for a long period of time, and the initial heat radiation efficiency can be maintained.

[Example] An example of the present invention is shown below in Figures 1 (A) and (B).
This will be explained with reference to FIG.

The feature of this invention is that when it is necessary to attach a heat dissipation body to an electronic device, a dovetail groove is provided in the rectangular cylindrical insulating case of the electronic device in order to facilitate the installation. Attach the mounting piece for body mounting.

That is, as shown in FIG. 1(A), a dovetail groove 7 is provided on the outer surface of the rectangular cylindrical insulating case 2 of the electronic device 1. In this embodiment, dovetail grooves 7 are provided at four corners of the short side of the rectangular cylindrical insulating case 2. Of course, the position and number of dovetail grooves 7 are not limited as long as they are two or more. Furthermore, when the rectangular cylindrical insulating case 2 is molded from resin, the dovetail groove 7 can be molded at the same time using a predetermined mold.

FIG. 1(B) shows an external view of the mounting piece 8 inserted into the dovetail groove 7. The mounting piece 8 has a tenon portion 9 formed at one end thereof having a shape matching the shape of the dovetail groove 7, and the base portion 10 is provided with a through hole 11 through which a screw is inserted. Also, this through hole 1
A recess 12 is formed on the back side of the nut 1 as a space for storing the nut.

Incidentally, since the internal structure of the electronic device 1 described above is the same as that shown in FIG. 3, detailed explanation thereof will be omitted.

Next, a case in which a heat sink is attached to the electronic device 1 will be explained based on FIG. 2.

The electronic device 1 is attached to a printed circuit board 5 via lead wires 4 as in the conventional case.

The tenon part 9 of the mounting piece 8 is inserted through the opening into the dovetail groove 7 of the rectangular cylindrical insulating case 2 of the electronic device 1, and is slid horizontally. Similarly, mounting piece 8
After attaching them at four locations, the heat sink 6 is placed on the metal substrate 3. A mounting portion 6a provided on the heat sink 6
A screw 13 is inserted into the mounting piece 8, a nut 14 is inserted into a recess 12 formed on the back side of the mounting piece 8, and the screw 13 is tightened to integrally fix the heat sink 6 and the electronic device 1.

In the above embodiment, the nut 14 is inserted into the recess 12 of the mounting piece 8, but the nut 12 may be fixed within the mounting piece 8 by insert molding. Alternatively, the mounting piece 8 may be formed of metal, the through hole 11 may be a screw hole, and the nut 14 may be omitted.

[Effects of the invention] According to the invention, since it is configured as described above, when a heat radiator is required, it can be easily attached to an electronic device using a mounting piece. In this case, since no adhesive is used, the adhesion between the heat sink and the metal substrate will not be impaired due to bubbles or the like. In addition, since there is no deterioration due to long-term use, the initial heat dissipation efficiency can be maintained.

[Brief Description of the Drawings] Figure 1A is an external view of an electronic device for explaining the structure for attaching a heat sink to an electronic device according to the present invention, and Figure 1B is an external view of an electronic device for attaching a heat sink to the electronic device. FIG. 2 is a partially cutaway sectional view showing the above-mentioned mounting structure, and FIG. 3 is an explanatory diagram showing a conventional heat sink mounting structure for electronic equipment. 1... Electronic equipment, 2... Rectangular tubular insulation case, 3
... Metal board, 4 ... Lead wire, 5 ... Printed circuit board, 6 ... Heat sink, 7 ... Dovetail groove, 8 ... Mounting piece.

Claims (1)

[Scope of Utility Model Registration Claim] An electronic device that includes a metal substrate in which various electronic components are built, a metal substrate that is fitted and fixed to one opening of this insulating case, and a heat sink attached to the metal substrate side. In the heat sink mounting structure, dovetail grooves are formed at a plurality of locations on the outer surface of the insulating case, and mounting pieces that are inserted and fixed into the dovetail grooves are provided, and the heat sink and the electronic device are attached to the electronic device through the mounting pieces. A structure for mounting a heat sink to an electronic device, characterized in that it is fixed to a metal substrate.