JPH06104143A - Mounting device for electrolytic capacitor - Google Patents
Mounting device for electrolytic capacitorInfo
- Publication number
- JPH06104143A JPH06104143A JP27651192A JP27651192A JPH06104143A JP H06104143 A JPH06104143 A JP H06104143A JP 27651192 A JP27651192 A JP 27651192A JP 27651192 A JP27651192 A JP 27651192A JP H06104143 A JPH06104143 A JP H06104143A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- mounting device
- heat
- outer case
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、大形の電解コンデン
サを基板に固定する取付装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for fixing a large electrolytic capacitor to a substrate.
【０００２】[0002]
【従来の技術】電解コンデンサにリプル電流を印加する
と、コンデンサ素子は、電解コンデンサの抵抗損失や誘
電体損失により自己発熱を起こす。通常、この熱のほと
んどは、図６に示した電解コンデンサ１のコンデンサ素
子１４から、外装ケース１５に伝わって、外装ケース１
５及び外装ケース１５の外表面に絶縁スリーブ１６介し
て密接している金属からなる取付装置１７から外部に放
散されて行く。このため、電解コンデンサ１は、コンデ
ンサ素子１４が自己発熱するにもかかわらず、温度上昇
が一定限に抑制されて、適正な性能を発揮できる。2. Description of the Related Art When a ripple current is applied to an electrolytic capacitor, the capacitor element causes self-heating due to resistance loss and dielectric loss of the electrolytic capacitor. Usually, most of this heat is transmitted from the capacitor element 14 of the electrolytic capacitor 1 shown in FIG.
5 and the outer surface of the outer case 15 are diffused to the outside from a mounting device 17 made of metal, which is in close contact with the outer surface of the outer case 15 through the insulating sleeve 16. Therefore, in the electrolytic capacitor 1, the temperature rise is suppressed to a certain limit and proper performance can be exhibited even though the capacitor element 14 self-heats.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、電解コ
ンデンサに規定以上のリプル電流を長時間印加してしま
うと、コンデンサ素子は著しく発熱する。このような場
合の電解コンデンサは、外装ケース外部への放熱より
も、コンデンサ素子に蓄積される熱が上回って、コンデ
ンサ素子が許容範囲以上の高温になってしまう。その結
果、コンデンサ素子に含浸された電解液が気化して、電
解コンデンサの寿命が縮んだり、電気的な諸特性が劣化
したりすることがあった。However, when a ripple current exceeding a specified value is applied to the electrolytic capacitor for a long time, the capacitor element remarkably generates heat. In the electrolytic capacitor in such a case, the heat accumulated in the capacitor element exceeds the heat radiated to the outside of the outer case, and the temperature of the capacitor element exceeds the allowable range. As a result, the electrolytic solution impregnated in the capacitor element may be vaporized, and the life of the electrolytic capacitor may be shortened or various electrical characteristics may be deteriorated.
【０００４】そこで、たとえば電解コンデンサの放熱性
を改善するものとして実公昭６０−３８２７９号公報が
知られている。この提案では、底面にフィンを一体形成
した外装ケースにコンデンサ素子を収納し、このコンデ
ンサ素子の巻芯部に、ヒートパイプを挿入するととも
に、ヒートパイプの一端に形成したネジ部を、外装ケー
スの内底面に形成した雌ネジ部に嵌めてこれを固定して
いる。Therefore, for example, Japanese Utility Model Publication No. 60-38279 is known to improve the heat dissipation of an electrolytic capacitor. In this proposal, a capacitor element is housed in an outer case with a fin integrally formed on the bottom surface, a heat pipe is inserted into the core of the capacitor element, and a screw portion formed at one end of the heat pipe is attached to the outer case. It is fixed by fitting it into a female screw portion formed on the inner bottom surface.
【０００５】しかし、上記のような提案では、放熱性に
改善が望めるものの、通常の電解コンデンサの構成を大
幅に変更しなければならない。そのうえ、外装ケース底
面に形成した放熱フィンの容積の分だけ、電解コンデン
サの外寸を大きくする原因になり、近年の電子部品の低
背化、小型化の趨勢を考えると余り好ましくない。However, in the above proposal, although the heat dissipation can be improved, the structure of the usual electrolytic capacitor must be changed drastically. Moreover, the external dimensions of the electrolytic capacitor are increased by the volume of the heat radiation fins formed on the bottom surface of the outer case, which is not so preferable in view of the recent trend of reducing the height and downsizing of electronic components.
【０００６】この発明の目的は、電解コンデンサの放熱
性を良好にする電解コンデンサの取付装置を提供するこ
とにある。An object of the present invention is to provide a mounting device for an electrolytic capacitor which improves the heat dissipation of the electrolytic capacitor.
【０００７】[0007]
【課題を解決するための手段】この発明は、基板に電解
コンデンサを取付固定する取付装置に放熱具を設けたこ
とを特徴としている。The present invention is characterized in that a radiator is provided in a mounting device for mounting and fixing an electrolytic capacitor on a substrate.
【０００８】[0008]
【作用】本発明は、基板１１に電解コンデンサ１を取付
固定する取付装置７に放熱フィン１２等の放熱具を設け
ている。このため、電解コンデンサ１の外装ケース３内
部のコンデンサ素子２が自己発熱を起こした場合、コン
デンサ素子２から外装ケース３に伝わった熱は、外装ケ
ース３及び外装ケース３の外表面に、絶縁スリーブを介
して密接した放熱フィン１２等の放熱具を設けた取付装
置７から外部へと放散されるので、従来のような放熱具
のない取付装置１７に比べて、取付装置７に放熱フィン
１２等の放熱具を設けた分だけ、放熱効率が良好にな
る。According to the present invention, the heat dissipating tool such as the heat dissipating fins 12 is provided on the mounting device 7 for mounting and fixing the electrolytic capacitor 1 on the substrate 11. Therefore, when the capacitor element 2 inside the outer case 3 of the electrolytic capacitor 1 self-heats, the heat transferred from the capacitor element 2 to the outer case 3 is applied to the outer case 3 and the outer surface of the outer case 3 with an insulating sleeve. Since the heat is dissipated to the outside from the mounting device 7 provided with a heat sink such as the heat dissipating fin 12 which is closely contacted with the heat dissipating fin 12, the heat dissipating fins 12 and the like are attached to the mounting device 7 as compared with the conventional mounting device 17 having no heat sink. The heat radiation efficiency is improved because the heat radiator is provided.
【０００９】[0009]
【実施例】図１は本発明の実施例による取付装置を用い
て電解コンデンサを基板に取付けた状態を示す部分断面
図である。図２は図１の取付装置の上面図である。図３
は本発明の他の実施例による取付装置を用いて電解コン
デンサを基板に取付けた状態を示す部分断面図である。
図４は図３の取付装置の上面図である。図５は本発明の
他の実施例による取付装置を用いて電解コンデンサを基
板に取付けた状態を示す部分断面図である。図６は従来
の取付装置で電解コンデンサを基板に取付けた状態を示
す部分断面図である。1 is a partial sectional view showing a state in which an electrolytic capacitor is mounted on a substrate using a mounting device according to an embodiment of the present invention. 2 is a top view of the mounting device of FIG. Figure 3
FIG. 6 is a partial cross-sectional view showing a state in which an electrolytic capacitor is mounted on a substrate using a mounting device according to another embodiment of the present invention.
FIG. 4 is a top view of the mounting device of FIG. FIG. 5 is a partial cross-sectional view showing a state in which an electrolytic capacitor is mounted on a substrate using a mounting device according to another embodiment of the present invention. FIG. 6 is a partial cross-sectional view showing a state in which an electrolytic capacitor is attached to a substrate by a conventional attaching device.
【００１０】図１に示すコンデンサ素子２は、アルミニ
ウム等の弁作用金属からなる陽極箔と陰極箔との間にセ
パレータを介在させて、巻回して形成され、電解液が含
浸されている。このコンデンサ素子２は、アルミニウム
からなる有底円筒状の外装ケース３に収納されており、
その外装ケース３の開口端は、絞り加工及びカール加工
により封口部材４で密閉されている。また、外装ケース
３の外表面には、ポリ塩化ビニール等の合成樹脂からな
る絶縁スリーブ５が外装ケース３の底面の一部を除いて
被覆されている。The capacitor element 2 shown in FIG. 1 is formed by winding a positive electrode foil and a negative electrode foil made of a valve metal such as aluminum with a separator interposed therebetween and impregnated with an electrolytic solution. The capacitor element 2 is housed in a bottomed cylindrical outer case 3 made of aluminum.
The open end of the outer case 3 is closed by a sealing member 4 by drawing and curling. The outer surface of the outer case 3 is covered with an insulating sleeve 5 made of a synthetic resin such as polyvinyl chloride except for a part of the bottom surface of the outer case 3.
【００１１】表面に硬質ゴムを積層した合成樹脂からな
る封口部材４は、外部端子６をモールド成形により埋設
している。外装ケース３の内側に突出した外部端子６に
は、コンデンサ素子２から導出した電極端子を接続して
いて、外装ケース３の外側に突出した外部端子６には、
雌ネジ部を形成するとともに、雌ネジに係合するネジを
備えていて外部回路との電気的接続を可能にする。A sealing member 4 made of a synthetic resin having hard rubber laminated on the surface has an external terminal 6 embedded therein by molding. Electrode terminals derived from the capacitor element 2 are connected to the external terminals 6 protruding inside the outer case 3, and external terminals 6 protruding outside the outer case 3 are connected to the external terminals 6.
A female screw portion is formed and a screw that engages with the female screw is provided to enable electrical connection with an external circuit.
【００１２】鉄などの金属からなる取付装置７は、図２
にも示すように電解コンデンサ１を保持するための帯状
のバンド部８と、このバンド部８に一体成形されたバン
ド部８を締めるための締め付け部１０と、取付装置７を
基板１１に固定するための２点の取付足９とからなって
いる。そして、それぞれの取付足９にはネジが備えられ
ているとともに、締め付け部１０にもネジとナットが備
えられていて、これらのネジ、あるいはネジとナットを
締めることで、電解コンデンサ１を基板１１に安定して
固定できる。The mounting device 7 made of metal such as iron is shown in FIG.
As shown in FIG. 5, a band-shaped band portion 8 for holding the electrolytic capacitor 1, a tightening portion 10 for tightening the band portion 8 integrally formed with the band portion 8, and a mounting device 7 are fixed to the substrate 11. And two mounting feet 9 for Further, each mounting foot 9 is provided with a screw, and the tightening portion 10 is also provided with a screw and a nut. By tightening these screws or the screw and the nut, the electrolytic capacitor 1 is mounted on the substrate 11 Can be stably fixed to.
【００１３】そして、この取付装置７のバンド部８の締
め付け部１０の近傍を除いた外周面には、複数の板状の
放熱フィン１２を、縦、横に一定の間隔でバンド部８に
一体成形している。この板状の放熱フィン１２は、バン
ド部の外周面上にランダムに形成しても良い。また、本
実施例では、板状の放熱フィン１２をバンド部８に一体
成形しているが、放熱フィンは、別体に形成した後バン
ド部に溶接や接着剤などで取付けても良い。さらに、板
状の放熱フィン１２は、本実施例のように放熱フィン１
２の先端が取付装置７の取付足９よりも電解コンデンサ
１よりに位置するのが望ましい。この場合、基板上の他
の部品の配置を妨げることがないので、従来の取付装置
と全く同様の取り扱いができる。A plurality of plate-shaped heat radiation fins 12 are integrally formed on the band portion 8 on the outer peripheral surface of the mounting device 7 except the vicinity of the tightening portion 10 of the band portion 8 at regular intervals in the vertical and horizontal directions. Molded. The plate-shaped heat radiation fins 12 may be randomly formed on the outer peripheral surface of the band portion. Further, in the present embodiment, the plate-shaped radiating fin 12 is integrally formed with the band portion 8, but the radiating fin may be attached to the band portion after being formed separately by welding or adhesive. Further, the plate-shaped radiating fins 12 are the same as in the present embodiment.
It is desirable that the tip of 2 be positioned closer to the electrolytic capacitor 1 than the mounting foot 9 of the mounting device 7. In this case, since the arrangement of other components on the board is not hindered, the same handling as that of the conventional mounting device can be performed.
【００１４】本実施例は、基板１１に電解コンデンサ１
を取付固定する取付装置７のバンド部８の外周面に板状
の放熱フィン１２を、縦、横に一定の間隔で形成してい
る。このため、電解コンデンサ１の外装ケース３内部の
コンデンサ素子２が自己発熱を起こした場合、コンデン
サ素子２から外装ケース３に伝わった熱は、外装ケース
３及び外装ケース３の外表面に絶縁スリーブ５を介して
密接した板状の放熱フィン１２を設けた取付装置７から
外部へと放散されるので、従来のような放熱具のない取
付装置１７に比べて、取付装置７に板状の放熱フィン１
２を設けた分だけ放熱性が良好になる。In this embodiment, the electrolytic capacitor 1 is mounted on the substrate 11.
Plate-shaped radiating fins 12 are formed on the outer peripheral surface of the band portion 8 of the mounting device 7 for mounting and fixing at a fixed interval vertically and horizontally. Therefore, when the capacitor element 2 inside the outer case 3 of the electrolytic capacitor 1 self-heats, the heat transferred from the capacitor element 2 to the outer case 3 is applied to the outer case 3 and the outer surface of the outer case 3 with the insulating sleeve 5. Since the heat is dissipated to the outside from the mounting device 7 provided with the plate-shaped heat radiation fins 12 which are closely attached to each other, the plate-shaped heat radiation fins are attached to the mounting device 7 as compared with the conventional mounting device 17 having no heat sink. 1
The heat dissipating property is improved due to the provision of 2.
【００１５】なお、放熱フィンは本実施例のような板状
のものに限定されずに，たとえば図３及び図４のように
翼状の放熱フィンでも本発明の実施に差し支えない。The radiating fins are not limited to the plate-like radiating fins of this embodiment, and wing-shaped radiating fins as shown in FIGS. 3 and 4 may be used for implementing the present invention.
【００１６】さらに、取付装置７は、たとえば、図５の
ようにバンド部８の幅を高く形成して、バンド部８の放
熱フィン１２の数を多くしてもよい。この実施例では、
放熱フィンの表面積が増加するので、放熱効率を向上さ
せることができる。Further, in the mounting device 7, for example, as shown in FIG. 5, the band portion 8 may be formed to have a large width, and the number of the heat radiation fins 12 of the band portion 8 may be increased. In this example,
Since the surface area of the radiation fins is increased, the radiation efficiency can be improved.
【００１７】また、本実施例では放熱具として、放熱フ
ィンを例にとって説明したが、放熱具は、放熱効果を有
するものであればよい。Further, in the present embodiment, the heat radiating fin has been described as an example of the heat radiating member, but the heat radiating member may be any one having a heat radiating effect.
【００１８】[0018]
【発明の効果】この発明は、基板に電解コンデンサを取
付固定する取付装置に放熱具を設けているので、本発明
の取付装置で基板に取付けた電解コンデンサの外装ケー
ス内部のコンデンサ素子が自己発熱を起こした場合、こ
の熱は、外装ケース及び放熱具を備えた取付装置を経て
外部に放散されるので、放熱性が良好になる。このた
め、従来のように放熱性の悪化が原因であった部品寿命
の短縮、電気的諸特性の劣化を防止して、電解コンデン
サの信頼性を向上させることができる。According to the present invention, since a radiator is provided in the mounting device for mounting and fixing the electrolytic capacitor on the substrate, the capacitor element inside the outer case of the electrolytic capacitor mounted on the substrate by the mounting device of the present invention self-heats. In the case of causing the heat, this heat is dissipated to the outside through the mounting device provided with the outer case and the heat radiator, so that the heat dissipation becomes good. Therefore, it is possible to improve the reliability of the electrolytic capacitor by preventing the shortening of the component life and the deterioration of various electrical characteristics, which have been caused by the deterioration of heat dissipation as in the past.
【００１９】そのうえ、本発明では、取付装置に放熱具
を設けているので、通常の電解コンデンサの構造を全く
変更することなく、簡易に電解コンデンサの放熱性を良
好にすることができる。Moreover, in the present invention, since the radiator is provided in the mounting device, the heat dissipation of the electrolytic capacitor can be easily improved without changing the structure of the usual electrolytic capacitor.
【図１】本発明の実施例による取付装置を用いて電解コ
ンデンサを基板に取付けた状態を示す部分断面図であ
る。FIG. 1 is a partial cross-sectional view showing a state where an electrolytic capacitor is mounted on a substrate using a mounting device according to an embodiment of the present invention.
【図２】図１の取付装置の上面図である。FIG. 2 is a top view of the attachment device of FIG.
【図３】本発明の他の実施例による取付装置を用いて電
解コンデンサを基板に取付けた状態を示す部分断面図で
ある。FIG. 3 is a partial cross-sectional view showing a state in which an electrolytic capacitor is mounted on a substrate by using a mounting device according to another embodiment of the present invention.
【図４】図３の取付装置の上面図である。FIG. 4 is a top view of the attachment device of FIG.
【図５】本発明の他の実施例による取付装置を用いて電
解コンデンサを基板に取付けた状態を示す部分断面図で
ある。FIG. 5 is a partial cross-sectional view showing a state in which an electrolytic capacitor is mounted on a substrate using a mounting device according to another embodiment of the present invention.
【図６】従来の取付装置を用いて電解コンデンサを基板
に取付けた状態を示す部分断面図である。FIG. 6 is a partial cross-sectional view showing a state in which an electrolytic capacitor is mounted on a substrate using a conventional mounting device.
１、１３ 電解コンデンサ ２、１４ コンデンサ素子 ３、１５ 外装ケース ４ 封口部材 ５、１６ 絶縁スリーブ ６ 外部端子 ７、１７ 取付装置 ８ バンド部 ９ 取付足 １０ 締め付け部 １１ 基板 １２ 放熱フィン 1, 13 Electrolytic capacitor 2, 14 Capacitor element 3, 15 Exterior case 4 Sealing member 5, 16 Insulation sleeve 6 External terminal 7, 17 Mounting device 8 Band part 9 Mounting foot 10 Tightening part 11 Board 12 Radiating fin
Claims (1)
付装置に放熱具を設けたことを特徴とする電解コンデン
サの取付装置。1. A mounting device for an electrolytic capacitor, characterized in that a mounting device for mounting and fixing the electrolytic capacitor on a substrate is provided with a radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27651192A JPH06104143A (en) | 1992-09-21 | 1992-09-21 | Mounting device for electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27651192A JPH06104143A (en) | 1992-09-21 | 1992-09-21 | Mounting device for electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06104143A true JPH06104143A (en) | 1994-04-15 |
Family
ID=17570491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27651192A Pending JPH06104143A (en) | 1992-09-21 | 1992-09-21 | Mounting device for electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06104143A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0820078A1 (en) * | 1996-07-19 | 1998-01-21 | DORNIER GmbH | Multi-cell double layer capacitor |
| JP2002015950A (en) * | 2000-06-30 | 2002-01-18 | Denso Corp | Flat capacitor and capacitor device |
| WO2008026516A1 (en) * | 2006-08-28 | 2008-03-06 | Daikin Industries, Ltd. | Electric component unit |
| WO2013026645A3 (en) * | 2011-08-19 | 2013-04-11 | Robert Bosch Gmbh | Capacitor having a heat sink |
| JP2014050229A (en) * | 2012-08-31 | 2014-03-17 | Denso Corp | Rotary electric machine for vehicle |
| JP2014194963A (en) * | 2013-03-28 | 2014-10-09 | Mitsubishi Electric Corp | Heat radiation structure electrolytic capacitor, illumination lamp, luminaire, and method of manufacturing illumination lamp |
| CN106298234A (en) * | 2016-09-28 | 2017-01-04 | 铜陵市铜创电子科技有限公司 | Fixed structure installed by a kind of capacitor |
| CN107039175A (en) * | 2017-03-10 | 2017-08-11 | 铜陵市佳龙飞电容器有限公司 | A kind of new super-silent explosive-proof sealed capacitor |
| DE102018216646A1 (en) * | 2018-09-27 | 2020-04-02 | Robert Bosch Gmbh | Cooling and holding element |
| CN113782344A (en) * | 2021-09-01 | 2021-12-10 | 安徽联盈控电子科技有限公司 | Long-life aluminum electrolytic capacitor and manufacturing method thereof |
| FR3126278A1 (en) * | 2021-08-20 | 2023-02-24 | Psa Automobiles Sa | ELECTRICAL DEVICE PROTECTED AGAINST LIQUID SPRAYS |
-
1992
- 1992-09-21 JP JP27651192A patent/JPH06104143A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0820078A1 (en) * | 1996-07-19 | 1998-01-21 | DORNIER GmbH | Multi-cell double layer capacitor |
| JP2002015950A (en) * | 2000-06-30 | 2002-01-18 | Denso Corp | Flat capacitor and capacitor device |
| WO2008026516A1 (en) * | 2006-08-28 | 2008-03-06 | Daikin Industries, Ltd. | Electric component unit |
| WO2013026645A3 (en) * | 2011-08-19 | 2013-04-11 | Robert Bosch Gmbh | Capacitor having a heat sink |
| CN103748644A (en) * | 2011-08-19 | 2014-04-23 | 罗伯特·博世有限公司 | Capacitor having a heat sink |
| JP2014050229A (en) * | 2012-08-31 | 2014-03-17 | Denso Corp | Rotary electric machine for vehicle |
| JP2014194963A (en) * | 2013-03-28 | 2014-10-09 | Mitsubishi Electric Corp | Heat radiation structure electrolytic capacitor, illumination lamp, luminaire, and method of manufacturing illumination lamp |
| CN106298234A (en) * | 2016-09-28 | 2017-01-04 | 铜陵市铜创电子科技有限公司 | Fixed structure installed by a kind of capacitor |
| CN107039175A (en) * | 2017-03-10 | 2017-08-11 | 铜陵市佳龙飞电容器有限公司 | A kind of new super-silent explosive-proof sealed capacitor |
| DE102018216646A1 (en) * | 2018-09-27 | 2020-04-02 | Robert Bosch Gmbh | Cooling and holding element |
| FR3126278A1 (en) * | 2021-08-20 | 2023-02-24 | Psa Automobiles Sa | ELECTRICAL DEVICE PROTECTED AGAINST LIQUID SPRAYS |
| CN113782344A (en) * | 2021-09-01 | 2021-12-10 | 安徽联盈控电子科技有限公司 | Long-life aluminum electrolytic capacitor and manufacturing method thereof |
| CN113782344B (en) * | 2021-09-01 | 2022-06-14 | 安徽联盈控电子科技有限公司 | Long-life aluminum electrolytic capacitor and manufacturing method thereof |
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