JPH04107504A - Transfer foil for diffraction grating - Google Patents
Transfer foil for diffraction gratingInfo
- Publication number
- JPH04107504A JPH04107504A JP22751190A JP22751190A JPH04107504A JP H04107504 A JPH04107504 A JP H04107504A JP 22751190 A JP22751190 A JP 22751190A JP 22751190 A JP22751190 A JP 22751190A JP H04107504 A JPH04107504 A JP H04107504A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mol
- layer
- molecular weight
- diffraction grating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 230000009477 glass transition Effects 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- -1 2-methylbutene-1 Chemical compound 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical group C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- SZTBMYHIYNGYIA-UHFFFAOYSA-M 2-chloroacrylate Chemical compound [O-]C(=O)C(Cl)=C SZTBMYHIYNGYIA-UHFFFAOYSA-M 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical compound CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- OZSIMMOMJRIWPI-UHFFFAOYSA-N 2-methylpropyl chlorate Chemical compound CC(C)COCl(=O)=O OZSIMMOMJRIWPI-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical class ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000779 poly(divinylbenzene) Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000182 polyphenyl methacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002102 polyvinyl toluene Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 238000009416 shuttering Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は回折格子の転写箔に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a transfer foil for a diffraction grating.
さらに詳しくは、本発明は、サーマルヘッドの押圧によ
り、任意の絵柄に転写できる回折格子の転写箔に関する
。More specifically, the present invention relates to a transfer foil of a diffraction grating that can be transferred to any pattern by pressing with a thermal head.
（従来の技術）
エンボス型ホログラム等のエンボス型の回折格子を形成
した転写箔は公知であり、例えば、特開昭６１−１９０
３７０号公報、特開昭６１−２０８０７２号公報、特開
昭６１−２０８０７３号公報、特開昭６１−２７３５６
８号公報、特開昭６２−２１１２８２号公報、特開昭６
２−２２２２８２号公報、特開昭６３−９６６８９号公
報、特開昭６３−１０６７７９号公報等に記載されてい
る。(Prior art) Transfer foils on which embossed diffraction gratings such as embossed holograms are formed are known, for example, as disclosed in Japanese Patent Laid-Open No. 61-190
370, JP 61-208072, JP 61-208073, JP 61-27356
8, JP-A-62-211282, JP-A-6
It is described in JP-A No. 2-222282, JP-A-63-96689, JP-A-63-106779, and the like.
（発明が解決しようとする課Ｈ）
しかしながら、回折格子をエンボスした樹脂層は比較的
硬い樹脂層であるため、転写の際に押圧された部分のみ
が正確に転写できず、いわゆる膜切れに劣るため、例え
ばサーマルヘッドの押圧により微細な文字等の形に正確
に転写することができなかった。(Problem H that the invention seeks to solve) However, since the resin layer on which the diffraction grating is embossed is a relatively hard resin layer, only the pressed part cannot be accurately transferred during transfer, resulting in poor so-called film breakage. Therefore, it was not possible to accurately transfer the shape of fine letters or the like by pressing with a thermal head, for example.
周知のように、回折格子は回折光を利用して芸飾効果を
発揮するほか、ホログラムにあっては広い範囲の三次元
情報を微細な部分に記録していることから、この微細な
部分のみを転写した場合であっても、この部分は極めて
多量の三次元情報を有しているのである。As is well known, diffraction gratings use diffracted light to create decorative effects, and in holograms, a wide range of three-dimensional information is recorded in minute areas. Even when transcribed, this part contains an extremely large amount of three-dimensional information.
従って、本発明は、サーマルヘッドの押圧等により、微
細な部分を正確に転写できる回折格子の転写箔を提供す
ることを目的とする。Therefore, it is an object of the present invention to provide a diffraction grating transfer foil that can accurately transfer minute portions by pressing with a thermal head or the like.
（課題を解決するための手段）
この目的を達成するため、本発明は、耐熱性支持体上に
、軟化点６０〜１５０℃、分子量５００〜５０００の低
分子量樹脂の層であって、表面にエンボス型回折格子を
形成した樹脂層を積層し、さらに光反射層、ガラス転移
点５０〜１１０℃、分子量８００以上の高分子量樹脂ま
たはこの高分子量樹脂と上記低分子量樹脂の混合物の層
を順次積層して成る回折格子の転写箔を提供する。(Means for Solving the Problems) In order to achieve this object, the present invention provides a layer of a low molecular weight resin having a softening point of 60 to 150°C and a molecular weight of 500 to 5000 on a heat-resistant support, A resin layer on which an embossed diffraction grating is formed is laminated, and then a light reflecting layer, a high molecular weight resin with a glass transition point of 50 to 110°C and a molecular weight of 800 or more, or a mixture of this high molecular weight resin and the above low molecular weight resin are successively laminated. A transfer foil for a diffraction grating is provided.
（実施例）
第１同から分かるように、本発明にががる転写箔は、支
持体（１）、回折格子形成層（２）、光反射層（３）、
接着層（４）とから成る。(Example) As can be seen from the first example, the transfer foil according to the present invention includes a support (1), a diffraction grating forming layer (2), a light reflection layer (3),
It consists of an adhesive layer (4).
支持体（１）は、回折格子形成層（２）、光反射層（３
）、接着層（４）を支持するものである。転写時にサー
マルヘッドの熱ムこ耐えて変形しない耐熱性、寸法安定
性、及び表面平滑性を必要とする。The support (1) includes a diffraction grating forming layer (2) and a light reflecting layer (3).
), which supports the adhesive layer (4). It requires heat resistance, dimensional stability, and surface smoothness to withstand the heat of the thermal head during transfer and not deform.
支持体（１）としては任意のプラスチックフィルムが使
用できるが、耐熱性、寸法安定性等の点で、二軸延伸し
たポリエステルフィルムが好適である。厚さは２〜１０
μｍで良い。Although any plastic film can be used as the support (1), a biaxially stretched polyester film is preferred in terms of heat resistance, dimensional stability, etc. Thickness is 2-10
μm is fine.
支持体（１）背面にはサーマルヘッドが当接しまた巻き
取った状態では接着層（４）が接することから、サーマ
ルヘッドに対するステッキングを防ぎ、巻き取った時の
ブロッキングを防止するため、支持体（１）背面にはス
ティッキング防止層を設けることが望ましい。ステンキ
ング防止層としては、末端にアルコキシ基（メトキシ基
、エトキシ基等）を有するシリコーン中間締金物をアル
キッド樹脂、エポキシ樹脂、ポリエステル樹脂アクリル
樹脂等と縮合させたシリコーン変性樹脂が使用できる。The back surface of the support (1) is in contact with the thermal head and is in contact with the adhesive layer (4) when it is wound up, so in order to prevent sticking to the thermal head and to prevent blocking when wound up, the support (1) It is desirable to provide an anti-sticking layer on the back surface. As the antistenking layer, a silicone modified resin obtained by condensing a silicone intermediate fastener having an alkoxy group (methoxy group, ethoxy group, etc.) at the end with an alkyd resin, an epoxy resin, a polyester resin, an acrylic resin, etc. can be used.
例えば信越化学工業■性ＫＲ２１８などである。厚さは
０．１〜５．０ｇｍで良＜、クラビアコート、ロールコ
ート、リバースコート等の方法で形成可能である。For example, Shin-Etsu Chemical KR218. The thickness is preferably 0.1 to 5.0 gm, and can be formed by methods such as clavia coating, roll coating, and reverse coating.
回折格子形成層（２）はその表面にエンボス型の回折格
子を形成すると共に、支持体（１）から剥離するもので
ある。サーマルヘッドの熱により軟化して支持体（１）
がら容易に剥離する必要がら軟化点１５０°Ｃ以下であ
る必要がある。また、サーマルヘッドの熱により回折格
子の破壊が生しないため、軟化点６０ ’Ｃ以上である
必要がある。The diffraction grating forming layer (2) forms an embossed diffraction grating on its surface and is peelable from the support (1). The support body (1) is softened by the heat of the thermal head.
The softening point needs to be 150°C or less so that it can be easily peeled off. Further, in order to prevent the diffraction grating from being destroyed by the heat of the thermal head, the softening point must be 60'C or higher.
通常分子量５００〜５０００である。The molecular weight is usually 500 to 5,000.
かかる低分子量樹脂としては、軟化点６０〜１００℃、
分子量２０ｏｏ〜５ｏｏｏのポリエステル樹脂が使用で
きる。Such low molecular weight resins have a softening point of 60 to 100°C,
A polyester resin having a molecular weight of 20oo to 5ooo can be used.
また、軟化点６０〜１５０″Ｃ１分子量６００〜６００
００石油樹脂も使用できる。例えば、スチレン、ビニル
トルエン、α−メチルスチレン、インデンの共重合体等
のＣ７系の軟化点８０〜１５０′ｃ、分子量６００がら
１５００の石油樹脂である。あるいは、イソプレン、ピ
ペリレン、２−メチルブテン−１，２−メチルブテンー
２の共重合体等の軟化点７０−１００ ’Ｃ１分子１１
８００〜２０００の０５系の石油樹脂である。Also, softening point 60-150'' C1 molecular weight 600-600
00 petroleum resin can also be used. For example, C7 petroleum resins having a softening point of 80 to 150'c and a molecular weight of 600 to 1,500, such as copolymers of styrene, vinyltoluene, α-methylstyrene, and indene. Alternatively, a copolymer of isoprene, piperylene, 2-methylbutene-1,2-methylbutene-2, etc. with a softening point of 70-100'C1 molecule 11
It is a 05 series petroleum resin with a weight of 800 to 2000.
また、エポキシ樹脂であっても良い。例えば、軟化点６
５〜１７０ ’Ｃ１分子量９００〜５０００のビスフェ
ノールＡとエピクロルヒドリンとの共重合体である。ま
た、臭素化エポキシ樹脂、エポキシノボランク樹脂であ
っても良い。Alternatively, it may be an epoxy resin. For example, softening point 6
5-170'C1 It is a copolymer of bisphenol A and epichlorohydrin with a molecular weight of 900-5000. Moreover, a brominated epoxy resin or an epoxy novolank resin may be used.
その外、低分子量スチレン樹脂、ポリアミド′樹脂、ア
クリル系樹脂も使用できる。In addition, low molecular weight styrene resins, polyamide resins, and acrylic resins can also be used.
回折格子形成層（２）は、樹脂を溶剤に溶解または分散
してコーティングして形成することができる。溶剤とし
てはトルエン等の芳香族炭化水素メチルエチルケトンや
メチルイソブチルケトン等のケトン系溶剤、イソプロピ
ルアルコール等のアルコール系溶剤が使用できる。厚さ
は０．５〜２．０μｍで良い。The diffraction grating forming layer (2) can be formed by dissolving or dispersing a resin in a solvent and coating it. As the solvent, aromatic hydrocarbons such as toluene, ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, and alcohol solvents such as isopropyl alcohol can be used. The thickness may be 0.5 to 2.0 μm.
被転写体に転写してその表面に回折格子を形成するため
、回折格子形成層（２）表面、すなわち支持体（１）の
反対面にはエンボス型回折格子が形成されている必要が
ある。回折格子は、樹脂の凹凸すなわち位相によって形
成したもので、軟化点以上に加熱した回折格子形成層（
２）の表面に周知のスタンバを押圧することによって形
成可能である。回折格子は、ホログラムであっても良い
ホログラムの場合にはかかる回折格子に三次元情報が記
録される結果となる。In order to form a diffraction grating on the surface of the transfer target by transferring it, an embossed diffraction grating must be formed on the surface of the diffraction grating forming layer (2), that is, on the opposite surface of the support (1). The diffraction grating is formed by the unevenness or phase of the resin, and the diffraction grating forming layer (
It can be formed by pressing a well-known stand bar on the surface of 2). The diffraction grating may be a hologram, in the case of a hologram resulting in three-dimensional information being recorded on such a diffraction grating.
光反射層（３）はこの回折格子を明瞭化するためのもの
である。金属の茶着層の外、高屈折率の透明材料が使用
できる。金属としては、例えば、アルミニウム、金、銀
、銅等が使用できる。高屈折率の透明材料としては、酸
化チタン、酸化珪素等が使用できる。いずれの場合も、
真空蒸着法、スハッタリング法等の方法で１００〜１０
０００オングストロームの厚さに設ければ良い。The light reflecting layer (3) is for making this diffraction grating clear. In addition to the metal brown layer, transparent materials with high refractive index can be used. As the metal, for example, aluminum, gold, silver, copper, etc. can be used. As the transparent material with a high refractive index, titanium oxide, silicon oxide, etc. can be used. In either case,
100 to 10 by methods such as vacuum evaporation method and shuttering method.
It is sufficient to provide a thickness of 000 angstroms.
接着層（４）はサーマルヘッドの押圧により被転写体に
接着するためのものである。サーマルヘッドの熱により
接着力を発揮する必要からガラス転移点１１０°Ｃ以下
のものである必要がある。また、転写後の画像の安定性
を図るため、ガラス転移点５０°Ｃ以上である必要があ
る。この樹脂は通常分子量８０００以上である。The adhesive layer (4) is for adhering to the object to be transferred by the pressure of the thermal head. Since it is necessary to exhibit adhesive strength by the heat of the thermal head, it is necessary to have a glass transition point of 110° C. or lower. Further, in order to ensure the stability of the image after transfer, the glass transition point needs to be 50°C or higher. This resin usually has a molecular weight of 8,000 or more.
かかる高分子量樹脂としては、ポリエステル樹脂；ポリ
塩化ビニル、塩化ビニル−酢酸ビニル共重合樹脂、変性
した塩化ビニル−酢酸ビニル共重合樹脂等の塩化ビニル
系樹脂；ポリアクリル酸、ポリアクリル酸−２−メトキ
シエチル、ボリアクル酸メチ、ポリアクリル酸−２−ナ
フチル、ポリアクリル酸イソボルニル、ポリアクリロニ
トリル、ポリアクリロニトリル、ポリメチルクロロアク
リレート、ポリメタクリル酸メチル、ポリメタクリル酸
エチル、ポリメタクリル酸−ｔ−ブチルポリメタクル酸
イソブチル、ポリメタクリル酸フェニル、メタクリル酸
メチルとメタクリル酸アルキル（ただしアルキル基の炭
素数は２〜６個）のコポリマー等のアクリル系樹脂；ポ
リスチレンポリジビニルベンゼン、ポリビニルトルエン
、スチレン−ブタジェン共重合体、スチレン−メタクリ
ル酸アルキル（ただしアルキル基の炭素数は１〜６個）
のコポリマーなどのビニル系樹脂；ナイロン−６，６、
ナイロン−６，７、ナイロン６．８、ナイロン−６，１
０、ナイロン６．１２ナイロン−１０等のポリアミド系
樹脂；ポリビニルブチラール、ポリビルアセタール等の
ポリアセタール系樹脂等が使用できる。Such high molecular weight resins include polyester resins; vinyl chloride resins such as polyvinyl chloride, vinyl chloride-vinyl acetate copolymer resins, and modified vinyl chloride-vinyl acetate copolymer resins; polyacrylic acid, polyacrylic acid-2- Methoxyethyl, polymethacrylate, 2-naphthyl polyacrylate, isobornyl polyacrylate, polyacrylonitrile, polyacrylonitrile, polymethyl chloroacrylate, polymethyl methacrylate, polyethyl methacrylate, polymethacrylate-t-butyl polymethacrylate Acrylic resins such as isobutyl chlorate, polyphenyl methacrylate, copolymers of methyl methacrylate and alkyl methacrylate (however, the number of carbon atoms in the alkyl group is 2 to 6); polystyrene polydivinylbenzene, polyvinyltoluene, styrene-butadiene copolymer Combination, styrene-alkyl methacrylate (however, the number of carbon atoms in the alkyl group is 1 to 6)
Vinyl resins such as copolymers; nylon-6,6,
Nylon-6,7, Nylon-6.8, Nylon-6,1
Polyamide resins such as 0, nylon 6.12 and nylon-10; polyacetal resins such as polyvinyl butyral and polyvinyl acetal can be used.
なお、接着剤層（４）は、かかる高分子量樹脂に低分子
量樹脂を混合した混合物から形成することもできる。低
分子量樹脂の混合により熱応答性が向上し、転写精度が
向上する。低分子量樹脂としては、上述の軟化点６０〜
１５０ ’Ｃ１分子量５００〜５０００の樹脂が使用で
きる。混合比は、高分子量樹脂２０重量％以上に対し、
低分子量樹脂８０重量％以下で良い。Note that the adhesive layer (4) can also be formed from a mixture of such a high molecular weight resin and a low molecular weight resin. Mixing a low molecular weight resin improves thermal response and transfer accuracy. As a low molecular weight resin, the above-mentioned softening point is 60~
150'C1 resin having a molecular weight of 500 to 5000 can be used. The mixing ratio is 20% by weight or more of high molecular weight resin,
The content of the low molecular weight resin may be 80% by weight or less.
接着層（４）は樹脂を溶剤に溶解または分散して、バー
コード、ブレードコート、エアナイフコート、グラビア
コート、ロールコート等の方法で塗布形成することがで
きる。厚さは０．５〜４゜０μｍで良い。The adhesive layer (4) can be formed by dissolving or dispersing a resin in a solvent and applying it by barcode coating, blade coating, air knife coating, gravure coating, roll coating, or the like. The thickness may be 0.5 to 4°0 μm.
本発明の転写箔は、任意の被転写体に重ね、背面からサ
ーマルヘッドで押圧することにより精度良く転写できる
。転写条件は従来のサーマルヘッドと同程度で良く、例
えば印加電力０．３Ｗ／ｄｏｔ、パルス幅２．５ｍｓ
ｅｃ （ＯＮｌｏＦＦ）ｄｏｔ密度６ｄＯｔ／ｍｍで良
い。The transfer foil of the present invention can be accurately transferred by stacking it on an arbitrary transfer target and pressing it from the back side with a thermal head. Transfer conditions may be similar to those of conventional thermal heads, such as applied power 0.3 W/dot and pulse width 2.5 ms.
ec (ONloFF) dot density of 6 dOt/mm is sufficient.
（効果）
以上のように、本発明によれば、サーマルヘッドの押圧
により、任意の形状に精度良く転写できる回折格子の転
写箔を得ることができる。(Effects) As described above, according to the present invention, it is possible to obtain a transfer foil of a diffraction grating that can be accurately transferred into any shape by pressing with a thermal head.
第１図は本発明の転写箔の断面図を示す。 FIG. 1 shows a sectional view of the transfer foil of the present invention.
Claims (1)
量５００〜５０００の低分子量樹脂の層であって、表面
にエンボス型回折格子を形成した樹脂層を積層し、さら
に光反射層、ガラス転移点５０〜１１０℃、分子量８０
０以上の高分子量樹脂またはこの高分子量樹脂と上記低
分子量樹脂の混合物の層を順次積層して成る回折格子の
転写箔。(1) A layer of a low molecular weight resin with a softening point of 60 to 150°C and a molecular weight of 500 to 5000, with an embossed diffraction grating formed on the surface, is laminated on a heat-resistant support, and a light reflecting layer is further layered. , glass transition point 50-110℃, molecular weight 80
A transfer foil for a diffraction grating formed by sequentially laminating layers of a high molecular weight resin of 0 or more or a mixture of this high molecular weight resin and the above low molecular weight resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22751190A JPH04107504A (en) | 1990-08-28 | 1990-08-28 | Transfer foil for diffraction grating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22751190A JPH04107504A (en) | 1990-08-28 | 1990-08-28 | Transfer foil for diffraction grating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04107504A true JPH04107504A (en) | 1992-04-09 |
Family
ID=16862050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22751190A Pending JPH04107504A (en) | 1990-08-28 | 1990-08-28 | Transfer foil for diffraction grating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04107504A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000065383A1 (en) * | 1999-04-21 | 2000-11-02 | Nippon Mitsubishi Oil Corporation | Optical laminate |
| WO2001023918A1 (en) * | 1999-09-27 | 2001-04-05 | Nippon Mitsubishi Oil Corporation | Optical device and security device |
| WO2001023917A1 (en) * | 1999-09-27 | 2001-04-05 | Nippon Mitsubishi Oil Corporation | Composite diffraction device |
-
1990
- 1990-08-28 JP JP22751190A patent/JPH04107504A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000065383A1 (en) * | 1999-04-21 | 2000-11-02 | Nippon Mitsubishi Oil Corporation | Optical laminate |
| US6875481B2 (en) | 1999-04-21 | 2005-04-05 | Nippon Oil Corporation | Optical laminate |
| WO2001023918A1 (en) * | 1999-09-27 | 2001-04-05 | Nippon Mitsubishi Oil Corporation | Optical device and security device |
| WO2001023917A1 (en) * | 1999-09-27 | 2001-04-05 | Nippon Mitsubishi Oil Corporation | Composite diffraction device |
| US6750941B2 (en) | 1999-09-27 | 2004-06-15 | Nippon Mitsubishi Oil Corporation | Complex diffraction device |
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