JPH0410742B2 - - Google Patents
Info
- Publication number
- JPH0410742B2 JPH0410742B2 JP59071653A JP7165384A JPH0410742B2 JP H0410742 B2 JPH0410742 B2 JP H0410742B2 JP 59071653 A JP59071653 A JP 59071653A JP 7165384 A JP7165384 A JP 7165384A JP H0410742 B2 JPH0410742 B2 JP H0410742B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- power transistor
- groove
- resin layer
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7165384A JPS6065553A (ja) | 1984-04-10 | 1984-04-10 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7165384A JPS6065553A (ja) | 1984-04-10 | 1984-04-10 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6065553A JPS6065553A (ja) | 1985-04-15 |
| JPH0410742B2 true JPH0410742B2 (US07714131-20100511-C00038.png) | 1992-02-26 |
Family
ID=13466778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7165384A Granted JPS6065553A (ja) | 1984-04-10 | 1984-04-10 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6065553A (US07714131-20100511-C00038.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230256A (ja) * | 1988-03-10 | 1989-09-13 | Fuji Electric Co Ltd | 半導体装置 |
| JP4702196B2 (ja) * | 2005-09-12 | 2011-06-15 | 株式会社デンソー | 半導体装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5643166B2 (US07714131-20100511-C00038.png) * | 1976-11-15 | 1981-10-09 | ||
| JPS5840848A (ja) * | 1981-09-04 | 1983-03-09 | Hitachi Ltd | 絶縁型半導体装置 |
| JPS6233330U (US07714131-20100511-C00038.png) * | 1985-08-15 | 1987-02-27 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5643166U (US07714131-20100511-C00038.png) * | 1979-09-10 | 1981-04-20 |
-
1984
- 1984-04-10 JP JP7165384A patent/JPS6065553A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5643166B2 (US07714131-20100511-C00038.png) * | 1976-11-15 | 1981-10-09 | ||
| JPS5840848A (ja) * | 1981-09-04 | 1983-03-09 | Hitachi Ltd | 絶縁型半導体装置 |
| JPS6233330U (US07714131-20100511-C00038.png) * | 1985-08-15 | 1987-02-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6065553A (ja) | 1985-04-15 |
