JPH0410702Y2 - - Google Patents
Info
- Publication number
- JPH0410702Y2 JPH0410702Y2 JP1987139434U JP13943487U JPH0410702Y2 JP H0410702 Y2 JPH0410702 Y2 JP H0410702Y2 JP 1987139434 U JP1987139434 U JP 1987139434U JP 13943487 U JP13943487 U JP 13943487U JP H0410702 Y2 JPH0410702 Y2 JP H0410702Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting device
- receiving device
- resin
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 62
- 239000011347 resin Substances 0.000 claims description 62
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 description 17
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987139434U JPH0410702Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-14 | 1987-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987139434U JPH0410702Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-14 | 1987-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6444655U JPS6444655U (US20100268047A1-20101021-C00003.png) | 1989-03-16 |
| JPH0410702Y2 true JPH0410702Y2 (US20100268047A1-20101021-C00003.png) | 1992-03-17 |
Family
ID=31402688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987139434U Expired JPH0410702Y2 (US20100268047A1-20101021-C00003.png) | 1987-09-14 | 1987-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410702Y2 (US20100268047A1-20101021-C00003.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59214274A (ja) * | 1983-05-20 | 1984-12-04 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JPS61220483A (ja) * | 1985-03-27 | 1986-09-30 | Toshiba Corp | 光結合装置 |
-
1987
- 1987-09-14 JP JP1987139434U patent/JPH0410702Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59214274A (ja) * | 1983-05-20 | 1984-12-04 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JPS61220483A (ja) * | 1985-03-27 | 1986-09-30 | Toshiba Corp | 光結合装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6444655U (US20100268047A1-20101021-C00003.png) | 1989-03-16 |
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