JPH0410699A - Manufacture of film carrier electronic parts - Google Patents

Abstract

PURPOSE:To manufacture various kinds of electronic parts easily employing a film carrier method without requirement of an expensive mold for each type of the electronic parts by conducting a punching and molding of a lead side by side successively. CONSTITUTION:A punching and molding member 5c is lowered to be set to the surface of a punching and molding member 5d facing the punching and molding member 5c. By this movement of the punching and molding members 5c, 5d, a group of leads 1c are molded into a specified shape and are separated from a film carrier 1. After a punching and molding is conducted for one side of the lead, a punching and molding mold 5 is returned to a position where it was. Then a pick-up head 4 which supports the film carrier 1 on which electronic parts 2 are mounted is rotated to rotate the film carrier 1 on which the electronic parts 2 are mounted in a 180-degree arc for positioning. The punching and molding mold 5 is operated again in the same manner as previously. By molding the lead into a specified shape and then separating it from the film carrier 1, a desired electronic part can be obtained.

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention is based on T A B (Tape Automated
The present invention relates to improvements in the manufacturing method of electronic components by means of bonding.

(Prior Art) As is well known, the following method is available as a means of manufacturing, for example, a semiconductor device. In other words, on a predetermined surface of the film on which the required lead pattern units are provided in advance,
A known method is to mount and attach a semiconductor chip and extend leads to opposing sides (lead attachment), then punch out each unit using a predetermined mold, and further mold the leads into a desired shape. . Accordingly, the punching and molding of each unit in the manufacturing of the semiconductor device uses a dedicated (predetermined) mold for each type of semiconductor device to be manufactured, and the leads extending on each side are punched out at once. This is done by punching and molding.

(Problem to be Solved by the Invention) The above method for manufacturing a film carrier type semiconductor device has advantages such as being able to perform semiconductor chip mounting, mounting, and lead attachment continuously, and being able to perform high-density packaging. However, it has the following disadvantages. That is,
The above-mentioned punching and molding requires a dedicated mold for each product type, and these molds are generally expensive and have a large impact on manufacturing costs. especially,
This kind of film carrier type electronic components tends to have a large number of pins, and there is also a tendency to produce a wide variety of products in small quantities.

Under these circumstances, the need for expensive and large numbers of dedicated molds for the above-mentioned punching and molding has become a serious problem from a cost standpoint.

The present invention has been made in response to the above-mentioned circumstances, and is
The purpose of the present invention is to provide a method for manufacturing desired film carrier type electronic components at low cost by using a general-purpose mold for molding.

[Structure of the Invention] (Means for Solving the Problems) The present invention includes a step of punching electronic component units at lead portions from a film carrier on which electronic components with leads extending on a plurality of sides are mounted and forming leads. In the method for manufacturing a film carrier type electronic component, the punching leads are formed in the lead portion sequentially for each side.

(Function) In the method for manufacturing a film carrier type electronic component according to the present invention, the lead portion extending on each side is
Punching and lead molding are performed in sequence. In other words, it is possible to easily achieve the required punching and molding by using a relatively simple mold, such as a configuration that targets only the - side, ignoring the presence or absence of lead parts extending to other sides. obtain. Here, performing punching and molding only on one side also expands the range of common or general use of the punching and molding dies.

(Example) The present invention will be described in detail below with reference to FIGS. 1 to 5.

Figure 1 shows the state before punching and molding of electronic components, that is, the state in which each electronic component unit is mounted on a film carrier, and Figures 2 to 5 show each electronic component mounted on a film carrier. FIG. 2 is a cross-sectional view schematically showing how the unit is punched and molded.

First, a rectangular area 1a where electronic components are mounted, this area 1
a base body having a resection region 1b that almost concentrically surrounds the resection region 1b, a group of lead ICs that are stretched and placed in the resection region 1b with one end supported by the region 1a, and sprocket holes 1d on both sides. A film 1, for example a polyimide resin film, is prepared. Next, the base film 1
A required electronic component 2, such as an IC chip, is mounted on 18 surfaces of a rectangular area on which electronic components are mounted. That is, the IC chip 2 is mounted or mounted on the rectangular area 18 of the base film 1 on which electronic components are mounted, and
Bonding is performed with the corresponding ten groups of leads. This operation is performed to mount the electronic component. For each rectangular area la, a so-called film carrier type as shown in plan view in FIG. 1 is constructed by repeating the process one after another.

Thereafter, the film carrier on which the electronic components are mounted and mounted is brought into contact with and separated from each other in units of areas on which the electronic components are mounted and mounted. That is, for a film carrier on which required electronic components are mounted, the base film 1 is cut almost orthogonally to the length direction of the film carrier to obtain a film carrier electronic component for each electronic component unit.

Next, as shown in cross section in FIG. 2, the sheet is transported to a punching/molding section consisting of a holding table 3, a pickup head 4, and a punching/molding die 5. Here, the punching/forming die 5 includes holding members 5a and 5b, at least one of which moves up and down to hold down and support the free end side of the lead IC, and holding members 5a and 5b, which mold the lead IC into a predetermined shape and break at a predetermined position. It is composed of punched and molded members 5c and 5d, which have processed surfaces that face each other and engage with each other.

The punching and molding in the punching and molding section is performed as follows. That is, the electronic component unit transported to the punching/molding section is supported by the pickup head 4, aligned, and placed on the holding table 3. Since FIG. 3 shows this state in cross section, the free end side of the lead 1C is the holding member 5a.

5b.

After the above-mentioned positioning and holding, the punching/forming members 5c and 5d of the punching/forming section are operated. That is, as shown in cross section in FIG. 4, the punched/formed member 5c is lowered,
It is engaged with the opposing face of the punched/molded member 5d. By this operation of the punching/molding members 5c and 5d, the lead IC group is molded into a predetermined mold and is separated (stamped) from the film carrier 1.

After performing the required punching on the − side as described above, the punching mold 5 is returned to its original position, and the electronic component 2
The pickup head 4 supporting the film carrier 1 mounted with electronic components 2 is rotated, and the film carrier 1 mounted with electronic components 2 is rotated 180° and positioned. Then, by driving the punching die 5 in the same manner as described above, the leads are formed into a predetermined shape as shown cross-sectionally in FIG. 5, and the leads are separated from the film carrier 1 (
Desired electronic components can be obtained by punching) and molding.

In addition, although the case where the number of sides to be punched and molded is two was illustrated above, it is needless to say that the invention is not limited to this example.

[Effects of the Invention] As explained above, according to the method for manufacturing electronic components according to the present invention, it is possible to easily manufacture a wide variety of electronic components using a film carrier method without having to prepare expensive molds for each type. It can be manufactured to In other words, when performing punching and molding after mounting necessary electronic components such as IC chips using the film carrier method, the punching and molding is performed one side at a time, so the punching and molding die is If the longitudinal length is selected appropriately, a single punching/forming mold can be used to punch and mold various electronic parts regardless of the product type.
Can be molded. As described above, the present invention eliminates the need to prepare dedicated molds for each type of product and the work of attaching and detaching the molds, resulting in many advantages in terms of manufacturing process simplification and cost. I can say that.

[Brief explanation of drawings]

1 to 5 are explanatory diagrams schematically showing embodiments of the method for manufacturing electronic components according to the present invention. 1...Base film la...Electronic component mounting area 1b...Removal area 1c...Lead 1d...Sprocket hole 2... ...Electronic component 3...Support stand 4...Pickup head 5...Molding molds 5a, 5b...Suppressing members 5e, 5d...Punching molding member Applicant Toshiba Corporation Representative Patent Attorney Sasa Suyama −

Claims (1)

[Claims] In a method for manufacturing a film carrier type electronic component, the method includes the step of punching out electronic component units at lead portions from a film carrier mounted with electronic components having leads extending on a plurality of sides and forming leads, the step of punching at the lead portions. A method for manufacturing a film carrier type electronic component, characterized in that leads are sequentially formed on each side.