JPH04106835A - Exposure light source device - Google Patents

Exposure light source device

Info

Publication number
JPH04106835A
JPH04106835A JP2224699A JP22469990A JPH04106835A JP H04106835 A JPH04106835 A JP H04106835A JP 2224699 A JP2224699 A JP 2224699A JP 22469990 A JP22469990 A JP 22469990A JP H04106835 A JPH04106835 A JP H04106835A
Authority
JP
Japan
Prior art keywords
exposure
light source
light
resist films
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2224699A
Other languages
Japanese (ja)
Inventor
Yasuhisa Otake
大竹 康久
Yasushi Magaki
曲木 安志
Nobuo Kita
喜多 信夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2224699A priority Critical patent/JPH04106835A/en
Publication of JPH04106835A publication Critical patent/JPH04106835A/en
Pending legal-status Critical Current

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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To carry out exposure within a short-period by which a printing pattern with little size unevenness is obtained by conducting exposure with beam scanning by movement of an exposure light source. CONSTITUTION:Linear light sources 20, 21 which are practically longer than one side of a mask pattern are moved reciprocally near photo-resist films 11, 12 to carry out local exposure of the photo-resist films 11, 12 and thus the photo-resist films 11, 12 are exposed by means of beam scanning. That is, pattern printing plates 16, 17 are completely and closely stuck to the photo-resist films 11, 12 of a shadow mask material 10 in vacuum and then the light sources 20, 21 which are put close the printing plates 16, 17 are turned on and moved up and down reciprocally to radiate light to the resist films 11, 12 locally to perform beam scanning. As a result, a light source device for exposure which is able to carry out exposure to form a latent image within a short period and by which size differences of the print of the mask become very small is obtained.

Description

【発明の詳細な説明】 「発明の目的」 (産業上の利用分野) 本発明のカラー受像管用シャドウマスク製造等の露光工
程に用いる露光光源装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Industrial Field of Application) The present invention relates to an exposure light source device used in an exposure process such as manufacturing a shadow mask for a color picture tube.

(従来の技術) カラー受像管用シャドウマスクはそれぞれ赤、緑、青に
発光する3色の蛍光体を持つスクリーンに、複数の電子
ビームを選択的に射突励起させる色選別電極であり、薄
い鉄板に多数の電子ビーム通過孔を形成している。
(Prior technology) A shadow mask for a color picture tube is a color-selecting electrode that selectively excites multiple electron beams onto a screen that has phosphors of three colors that emit red, green, and blue, respectively. A large number of electron beam passage holes are formed in the hole.

シャドウマスク孔は一般にフォトエツチング法で製造さ
れるが、その工程は薄い平坦な連続帯状金属板の両面に
フォトレジスト液を塗布、乾燥して所定の厚さのレジス
ト膜を形成する工程、その金属板の両生面に対応するシ
ャドウマスクパターン焼付は用ネガ版を密着配置し、紫
外線などの発光光源を用いてレジスト膜にシャドウマス
クパターンを焼付ける露光工程、レジスト膜の未露光部
を温水などをスプレーして溶解除去する工程、残ったレ
ジスト膜の耐エツチング性を高めるために高温熱処理を
施す工程、残存レジスト膜をマスクとしてエツチング液
をスプレーしてシャドウマスク孔を穿設する工程とから
なる。
Shadow mask holes are generally manufactured using a photoetching method, which involves applying a photoresist solution to both sides of a thin, flat continuous metal plate and drying it to form a resist film of a predetermined thickness. The shadow mask pattern corresponding to the ambidextrous surface of the plate is printed by placing a negative plate in close contact with the plate, and using a light source such as ultraviolet light to print the shadow mask pattern on the resist film. It consists of a step of spraying and dissolving and removing it, a step of subjecting the remaining resist film to high-temperature heat treatment to improve its etching resistance, and a step of spraying an etching solution using the remaining resist film as a mask to form a shadow mask hole.

前記露光工程では第7図に示すように、前工程でレジス
ト膜が塗布されてフープ状に巻き取られた鉄板40を相
対する2枚のマスクパターン焼付は版4142の間を通
し、鉄板にこれら焼付は版を密着させて、両面から光を
照射し焼付けるか、光源43.44には超高圧水銀ラン
プ(特開昭57−148859号公報参照)やメタルハ
ライドランプ(特開昭62−2471)85号公報参照
)が使用される。
In the exposure step, as shown in FIG. 7, two opposing mask patterns are printed on the iron plate 40, which has been coated with a resist film in the previous step and wound up into a hoop shape, through a plate 4142. For printing, place the plates in close contact with each other and irradiate light from both sides.For light source 43.44, use an ultra-high pressure mercury lamp (see JP-A-57-148859) or a metal halide lamp (JP-A-62-2471). 85) is used.

(発明が解決しようとする課題) 光源装置は、光源43.44周囲にアルミニウム反射板
45.4Bを配置したもので、焼付は版44.45より
も50c+a以上離れた距離に設置される。ランプは1
本または2本使用して光強度、を高め、配光の均一化を
はかっているが、反射板の角度や位置を調節しても焼付
は版の中央部と周辺部とで同一照度の配光分布を得るこ
とは不可能で、中央部に対して周辺部の照度は70〜8
0%である。この結果、高精細度管のシャドウマスクの
製造においては、照度差により焼付は寸法差が生じ、マ
スク孔むら品位の低下が避けられない。また、焼付は版
と鉄板40との微小な密着むらがあると斜入射光は焼付
は寸法を変化させることがあり、マスク孔むら品位の低
下を生ずるので平行光線を得ることと配光の均一化のた
めに光源装置を被露光体から離隔する方法もあるが、光
照度が低下し長時間露光が必要で生産効率が低下する一
方、装置が大型化する。
(Problems to be Solved by the Invention) The light source device has an aluminum reflector plate 45.4B arranged around the light source 43.44, and the printing plate is installed at a distance of 50c+a or more from the printing plate 44.45. The lamp is 1
A book or two are used to increase the light intensity and make the light distribution uniform, but even if the angle and position of the reflector are adjusted, the printing is still the same in the center and periphery of the plate. It is impossible to obtain light distribution, and the illuminance of the peripheral area is 70-8 compared to the central area.
It is 0%. As a result, in the production of shadow masks for high-definition tubes, dimensional differences occur due to differences in illuminance, and a decline in the quality of mask hole unevenness is unavoidable. In addition, if there is slight unevenness in the adhesion between the plate and the iron plate 40, obliquely incident light may change the dimensions of the printing, causing mask hole unevenness and degrading the quality. Although there is a method of separating the light source device from the object to be exposed in order to reduce the exposure, the light illuminance decreases and long exposure is required, which reduces production efficiency and increases the size of the device.

本発明はこのような不都合を解消し、マスクの焼付は寸
法差が非常に少なく、しかも短時間の露光で潜像形成が
可能な露光光源装置を得るもので本発明は、マスク材の
表面に被着したフォトレジスト膜に露光光源を用いてマ
スクパターンを焼き付ける露光光源装置において、前記
マスクパターンの1辺よりも長い露光光源と、この露光
光源を前記マスクパターンの他辺方向に往復移動する駆
動装置とを具備し、前記マスクパターンを光走査により
前記フォトレジスト膜に露光するようにしたことを特徴
とする露光光源装置にある。
The present invention solves these inconveniences and provides an exposure light source device that can print a mask with very little dimensional difference and can form a latent image in a short time exposure. An exposure light source device that prints a mask pattern on a deposited photoresist film using an exposure light source includes an exposure light source that is longer than one side of the mask pattern, and a drive that moves the exposure light source back and forth in the direction of the other side of the mask pattern. The exposure light source device is characterized in that the exposure light source device is characterized in that the mask pattern is exposed to the photoresist film by optical scanning.

(作用) マスクパターンの面に対してその1辺より長い実質的な
ライン状光源をフォトレジスト膜に近接して往復移動し
フォトレジスト膜に局部的な露光を付与して光走査によ
りフォトレジスト膜全体を露光することで、露光の焼付
は寸法にばらつきの少ない、しかも短時間露光が達成で
きる。
(Operation) A substantially linear light source that is longer than one side of the mask pattern is moved back and forth close to the photoresist film to apply local exposure to the photoresist film, and the photoresist film is exposed by light scanning. By exposing the entire area to light, exposure printing can achieve less variation in dimensions and a short exposure time.

(実施例) 以下、図面を参照して本発明の詳細な説明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図は本発明の実施例の構成を示すもので、第2図は
その一部拡大図である。帯状アルミキルド鋼シャドウマ
スク材10は両面に、lOμm厚の牛乳カゼインと重ク
ロム酸塩からなるフォトレジスト膜11.12が塗布工
程で塗布され乾燥後、巻き取り枠で巻き取られて、露光
装置13に装着される。
FIG. 1 shows the configuration of an embodiment of the present invention, and FIG. 2 is a partially enlarged view thereof. A photoresist film 11 , 12 made of milk casein and dichromate with a thickness of 10 μm is applied to both sides of the band-shaped aluminum killed steel shadow mask material 10 in a coating process, and after drying, it is wound up with a winding frame and exposed to an exposure device 13 . will be installed on the

この露光装置13はマスク材の巻取機構14、送り機構
15.2枚のシャドウマスクパターン焼付は版1B、1
7および露光光源20.21からなる。
This exposure device 13 includes a mask material winding mechanism 14 and a feeding mechanism 15. Two shadow mask patterns are printed on plates 1B and 1.
7 and an exposure light source 20.21.

一方の焼付は版1Bは小孔パターン焼付は版であり、他
方の焼付は版17は大孔パターン焼付は版で構成され、
ガラス板IEla 、 17aの一面に黒色のネガパタ
ーン16b 、 17bを形成している。シャドウマス
ク材に対する密着は例えば一方を固定枠で、他方を移動
枠で密着する特公昭5B−13298号公報の技術が用
いることができる。大小孔パターン焼付は版16.17
を真空を用いてシャドウマスク材10のレジスト膜に完
全に密着させた後、焼付は版に対して30cIIlに近
接させた光源20.21を点灯し、図示の矢印のように
上方Yu、下方Ydに上下運動してA位置からB、C位
置へ移動し、レジスト膜11.12を局部的に光照射し
ながら光走査する。露光時間は焼付は版に取付けられた
積算光量計18.19の受光量が設定光量になった時点
で消灯するようにして決められる。これにより、フォト
レジスト膜11.12には焼付は版16.17の透光部
16c117cに相当する部分が感光して不溶性に変化
したパターン像11a 、 12aが潜像として焼付け
られる。
One of the printings is plate 1B with a small hole pattern printed on it, and the other printing is plate 17 with a large hole pattern printed on it,
A black negative pattern 16b, 17b is formed on one side of the glass plate IEla, 17a. For example, the technique disclosed in Japanese Patent Publication No. 5B-13298, in which one side is in close contact with a fixed frame and the other side is in close contact with a movable frame, can be used for the close contact with the shadow mask material. Large and small hole pattern printing is plate 16.17
After completely adhering to the resist film of the shadow mask material 10 using a vacuum, the light source 20.21 placed close to the plate at 30cIIl is turned on, and the upper Yu and lower Yd are illuminated as shown by the arrows in the figure. It moves up and down from position A to positions B and C, and scans with light while locally irradiating the resist films 11 and 12 with light. The exposure time is determined in such a way that the light is turned off when the amount of light received by integrating light meters 18 and 19 attached to the printing plate reaches the set light amount. As a result, pattern images 11a and 12a are printed on the photoresist film 11.12 as latent images in which portions of the plate 16.17 corresponding to the transparent portions 16c117c are exposed to light and are rendered insoluble.

露光光源20.21の上下移動は駆動装置22によって
なされ、また走査速度は切換スイッチ23により可変す
ることが出来、走査範囲は光源移動支持台(図示せず)
に設けたリミットスイッチ24の位置を動かして調節す
る。
The exposure light sources 20 and 21 are moved up and down by a drive device 22, and the scanning speed can be varied by a changeover switch 23, and the scanning range is controlled by a light source moving support (not shown).
Adjust the limit switch 24 by moving the position of the limit switch 24 provided at the position.

第3図は露光光源20の平面図で、焼付は版16側から
見た図であるが、長手方向の長さしを焼付け版の一辺の
幅Wより長く設定し、反射板枠25内に複数の2kw水
銀灯2Bを傾斜をもたせて配置する。
FIG. 3 is a plan view of the exposure light source 20, which is viewed from the printing plate 16 side. A plurality of 2kw mercury lamps 2B are arranged at an angle.

この場合、水銀灯の両端の光強度が弱いため水銀灯の有
効長を灯長の80%として配列を設定するのがよい。光
源21についても同様である。
In this case, since the light intensity at both ends of the mercury lamp is weak, it is preferable to set the arrangement so that the effective length of the mercury lamp is 80% of the lamp length. The same applies to the light source 21.

光源20の変形例として、第4図のように千鳥足状にす
なわち上下の移動方向に垂直にかつ交互にずらして複数
の水銀灯26を配置することもてきる。
As a modification of the light source 20, as shown in FIG. 4, a plurality of mercury lamps 26 may be arranged in a staggered manner, that is, perpendicular to the vertical movement direction and alternately shifted.

第5図に示すように、露光光源20の配光分布を均一に
するために、露光光源の前方に拡散板27とハニカムボ
ード28を設けると有効である。/Xニカムボード28
は6角形の光透過孔が隣接しながら多数形成された厚味
を有する板であり、光源からの斜光を遮断し面に垂直な
方向の光強度を強める配光分布制御板であり、配光の均
一化のみならず、焼付は版とレジスト膜間に隙間が生じ
たときに焼付は判に斜光が入射することによる潜像形成
のぼけを防ぐことができる。一方、拡散板27とノ\ニ
カムボード28の併用は光源の光強度を低下させるので
、その透過率、板厚はシャドウマスク品位や生産効率を
考慮して選定する必要がある。
As shown in FIG. 5, in order to make the light distribution of the exposure light source 20 uniform, it is effective to provide a diffuser plate 27 and a honeycomb board 28 in front of the exposure light source. /X Nikum board 28
is a thick board with a large number of adjacent hexagonal light transmission holes, and is a light distribution control board that blocks oblique light from the light source and increases the light intensity in the direction perpendicular to the surface. In addition to making the printing uniform, printing can prevent blurring of latent image formation due to oblique light incident on the printing plate when a gap occurs between the printing plate and the resist film. On the other hand, since the combination of the diffuser plate 27 and the non-nicum board 28 reduces the light intensity of the light source, its transmittance and plate thickness must be selected in consideration of the shadow mask quality and production efficiency.

また、露光光源はかなりの熱を発生し、この熱が焼付は
版を熱膨張させて焼付は精度を低めることがある。した
がって光源背後に空冷フィンや水冷機構を付設して光源
を冷却するか、光源前方に熱吸収フィルタを取り付けて
焼付は版への熱を防いでもよい。第1表に露光時間と2
1インチ矩形シャドウマスクのパターン焼付は寸法のば
らつきに対する、2kw水銀灯6灯とハニカムボードを
組合わせた本実施例と、5kw超高圧水銀灯1灯を用い
た従来装置の比較を示す。
Additionally, the exposure light source generates considerable heat, which can cause thermal expansion of the printing plate and reduce printing accuracy. Therefore, air cooling fins or a water cooling mechanism may be provided behind the light source to cool the light source, or a heat absorption filter may be provided in front of the light source to prevent heat from being applied to the plate during printing. Table 1 shows exposure time and 2
The pattern printing of a 1-inch rectangular shadow mask shows a comparison between this example, which combines six 2-kw mercury lamps and a honeycomb board, and a conventional device, which uses one 5-kw ultra-high-pressure mercury lamp, with regard to size variations.

第1表 第6図は本発明の他の実施例を示すもので、焼付は版の
上下方向に2連の露光光源30.31を一定の間隔で配
置した構造を有し、この光源をマスク材を挟んで両面に
それぞれ配置する。
Table 1 and FIG. 6 show another embodiment of the present invention, in which the printing has a structure in which two exposure light sources 30 and 31 are arranged at regular intervals in the vertical direction of the plate, and these light sources are masked. Place each on both sides with the material in between.

前記実施例では露光光源を一連設けて、この露光光源を
焼付は版の上端から下端にわたって往復移動させるが、
本実施例では、両光源か焼付は版32の辺の約1/2だ
け同時に往復運動する。すなわち、各光源がレジスト膜
露光の上半分と下半分を受は持つことで、露光時間の短
縮化をはかることができる。なお光源の数は2箇に限定
せず、それ以上にしてもよいことはいうまでもない。
In the embodiment described above, a series of exposure light sources are provided, and the exposure light sources are moved back and forth from the top to the bottom of the plate during printing.
In this embodiment, both light sources reciprocate about one half of the sides of plate 32 simultaneously. That is, each light source has an upper half and a lower half for exposing the resist film, so that the exposure time can be shortened. Note that the number of light sources is not limited to two, and it goes without saying that it may be more than two.

さらに、前記実施例のように、光源を上下方向に走査さ
せるばかりでなく、露光機の形態に応じてマスク材の走
行する水平方向に走査させることができることはもちろ
んである。
Furthermore, it is of course possible to scan the light source not only in the vertical direction as in the embodiment described above, but also in the horizontal direction in which the mask material travels, depending on the configuration of the exposure machine.

[発明の効果] 以上実施例で述べたように、本発明によれば、露光光源
の移動による光走査で露光することにより、焼付はパタ
ーンの寸法ばらつきの少ない、しかも短時間露光が可能
になるので、シャドウマスク品位、生産効率の向上をは
かることができ、しかも露光光源を被露光物に近接する
ことができるので、露光台周辺の空間を狭めることがで
きる。
[Effects of the Invention] As described in the embodiments above, according to the present invention, by performing exposure by light scanning by moving the exposure light source, it is possible to perform printing with less variation in pattern dimensions and to perform exposure for a short time. Therefore, the quality of the shadow mask and the production efficiency can be improved, and since the exposure light source can be placed close to the object to be exposed, the space around the exposure table can be narrowed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す斜視図、第2図は第1
図の実施例の動作を説明する一部拡大断面図、第3図は
第1図の光源の平面図、第4図は光源の変形例の平面図
、第5図は光源の断面図、第6図は本発明の他の実施例
を示す略側面図、第7図は従来例を説明する略図である
。 IO・・・シャドウマスク材、 11.12・・・フォトレジスト膜、 16.17・・・焼付は版、 20.21・・・露光光
源、22・・・駆動装置 代理人 弁理士 大 胡 典 夫 第 図 第 図
FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
3 is a plan view of the light source in FIG. 1; FIG. 4 is a plan view of a modified example of the light source; FIG. 5 is a sectional view of the light source; FIG. 6 is a schematic side view showing another embodiment of the present invention, and FIG. 7 is a schematic diagram illustrating a conventional example. IO... Shadow mask material, 11.12... Photoresist film, 16.17... Printing plate, 20.21... Exposure light source, 22... Drive device agent, patent attorney Nori Ogo Husband figure figure figure

Claims (1)

【特許請求の範囲】[Claims] (1)マスク材の表面に被着したフォトレジスト膜に露
光光源を用いてマスクパターンを焼き付ける露光光源装
置において、前記マスクパターンの1辺よりも長い露光
光源と、この露光光源を前記マスクパターンの他辺方向
に往復移動する駆動装置とを具備し、前記マスクパター
ンを光走査により前記フォトレジスト膜に露光するよう
にしたことを特徴とする露光光源装置
(1) In an exposure light source device that uses an exposure light source to print a mask pattern on a photoresist film deposited on the surface of a mask material, an exposure light source that is longer than one side of the mask pattern, and a an exposure light source device comprising: a drive device that reciprocates in the other side direction; the exposure light source device is configured to expose the photoresist film by light scanning the mask pattern;
JP2224699A 1990-08-27 1990-08-27 Exposure light source device Pending JPH04106835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2224699A JPH04106835A (en) 1990-08-27 1990-08-27 Exposure light source device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2224699A JPH04106835A (en) 1990-08-27 1990-08-27 Exposure light source device

Publications (1)

Publication Number Publication Date
JPH04106835A true JPH04106835A (en) 1992-04-08

Family

ID=16817859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2224699A Pending JPH04106835A (en) 1990-08-27 1990-08-27 Exposure light source device

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