JPH0410396U - - Google Patents
Info
- Publication number
- JPH0410396U JPH0410396U JP1990049882U JP4988290U JPH0410396U JP H0410396 U JPH0410396 U JP H0410396U JP 1990049882 U JP1990049882 U JP 1990049882U JP 4988290 U JP4988290 U JP 4988290U JP H0410396 U JPH0410396 U JP H0410396U
- Authority
- JP
- Japan
- Prior art keywords
- stake
- view
- feeder
- chip structure
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packaging Frangible Articles (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Automatic Assembly (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
第1図は本考案に係わるチツプ構造としてのソ
ケツトの平面図、第2図は同側面図、第3図は補
強用部材の斜視図、第4図は本考案に係わるチツ
プ構造としてのプラグの平面図、第5図は同側面
図、第6図は多数個のチツプを収容したステイツ
クの斜視図、第7図は互いに隣り合うチツプの配
列状態を示す説明図、第8図はステイツクフイー
ダの概略的な斜視図、第9図は従来のチツプ構造
としてのソケツトの平面図、第10は同側面図、
第11図は従来のチツプ構造としてのプラグの平
面図、第12図は同側面図、第13図は多数個の
チツプを収容したステイツクの斜視図、第14図
は互いに隣り合うチツプの配列で補強用部材を重
ね合わせた状態を示す説明図である。 14……ステイツクフイーダ、23,24……
補強用部材、33……チツプ、34……ステイツ
ク。
ケツトの平面図、第2図は同側面図、第3図は補
強用部材の斜視図、第4図は本考案に係わるチツ
プ構造としてのプラグの平面図、第5図は同側面
図、第6図は多数個のチツプを収容したステイツ
クの斜視図、第7図は互いに隣り合うチツプの配
列状態を示す説明図、第8図はステイツクフイー
ダの概略的な斜視図、第9図は従来のチツプ構造
としてのソケツトの平面図、第10は同側面図、
第11図は従来のチツプ構造としてのプラグの平
面図、第12図は同側面図、第13図は多数個の
チツプを収容したステイツクの斜視図、第14図
は互いに隣り合うチツプの配列で補強用部材を重
ね合わせた状態を示す説明図である。 14……ステイツクフイーダ、23,24……
補強用部材、33……チツプ、34……ステイツ
ク。
Claims (1)
- ステイツクフイーダに着脱可能に装着されるス
テイツクに一列にして収容される多数個のチツプ
のチツプ本体の両端部に設けられた補強用部材の
端部に衝接面部を形成したことを特徴とするチツ
プ構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990049882U JPH0726880Y2 (ja) | 1990-05-15 | 1990-05-15 | チップ構造 |
KR90018628U KR970004975Y1 (en) | 1990-05-15 | 1990-11-30 | Chip structure |
US07/666,613 US5145405A (en) | 1990-05-15 | 1991-03-08 | Chip connector structure |
EP91107807A EP0457283B1 (en) | 1990-05-15 | 1991-05-14 | Chip structure |
DE69105033T DE69105033T2 (de) | 1990-05-15 | 1991-05-14 | Chipstruktur. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990049882U JPH0726880Y2 (ja) | 1990-05-15 | 1990-05-15 | チップ構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0410396U true JPH0410396U (ja) | 1992-01-29 |
JPH0726880Y2 JPH0726880Y2 (ja) | 1995-06-14 |
Family
ID=12843412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990049882U Expired - Lifetime JPH0726880Y2 (ja) | 1990-05-15 | 1990-05-15 | チップ構造 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5145405A (ja) |
EP (1) | EP0457283B1 (ja) |
JP (1) | JPH0726880Y2 (ja) |
KR (1) | KR970004975Y1 (ja) |
DE (1) | DE69105033T2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4155545A1 (en) | 2021-09-27 | 2023-03-29 | Ogura Clutch Co., Ltd. | Roots blower |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5259789A (en) * | 1993-02-23 | 1993-11-09 | Molex Incorporated | Retention system for circuit board mounted electrical connector |
US6280248B1 (en) | 1993-04-19 | 2001-08-28 | Berg Technology, Inc. | Hold-down element for electrical and/or electronic components |
US6361332B1 (en) | 2001-04-06 | 2002-03-26 | Molex Incorporated | Retention system for electrical connectors |
CN101578013B (zh) * | 2008-05-06 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | 电路板镀铜装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4417095A (en) * | 1981-10-23 | 1983-11-22 | Northern Telecom Limited | Support member for electronic devices |
US4552267A (en) * | 1985-03-11 | 1985-11-12 | National Semiconductor Corporation | Ceramic semiconductor package chip prevention structure and method |
DE3704750A1 (de) * | 1985-11-11 | 1988-08-25 | Heigl Helmuth | Vereinzelungsvorrichtung |
JPS6437386A (en) * | 1987-07-28 | 1989-02-08 | Mitsubishi Electric Corp | Semiconductor receiving tube |
US4954088A (en) * | 1989-02-23 | 1990-09-04 | Matsushita Electric Works, Ltd. | Socket for mounting an IC chip package on a printed circuit board |
-
1990
- 1990-05-15 JP JP1990049882U patent/JPH0726880Y2/ja not_active Expired - Lifetime
- 1990-11-30 KR KR90018628U patent/KR970004975Y1/ko not_active IP Right Cessation
-
1991
- 1991-03-08 US US07/666,613 patent/US5145405A/en not_active Expired - Lifetime
- 1991-05-14 DE DE69105033T patent/DE69105033T2/de not_active Expired - Fee Related
- 1991-05-14 EP EP91107807A patent/EP0457283B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4155545A1 (en) | 2021-09-27 | 2023-03-29 | Ogura Clutch Co., Ltd. | Roots blower |
Also Published As
Publication number | Publication date |
---|---|
JPH0726880Y2 (ja) | 1995-06-14 |
EP0457283A1 (en) | 1991-11-21 |
DE69105033T2 (de) | 1995-03-23 |
EP0457283B1 (en) | 1994-11-09 |
DE69105033D1 (de) | 1994-12-15 |
KR970004975Y1 (en) | 1997-05-22 |
US5145405A (en) | 1992-09-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |